WO1992019090A1 - Alimentation electrique - Google Patents

Alimentation electrique Download PDF

Info

Publication number
WO1992019090A1
WO1992019090A1 PCT/GB1992/000688 GB9200688W WO9219090A1 WO 1992019090 A1 WO1992019090 A1 WO 1992019090A1 GB 9200688 W GB9200688 W GB 9200688W WO 9219090 A1 WO9219090 A1 WO 9219090A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
cell
layer
vapour
electrically conductive
Prior art date
Application number
PCT/GB1992/000688
Other languages
English (en)
Inventor
Paul Radmall
Original Assignee
Dowty Electronic Components Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowty Electronic Components Ltd. filed Critical Dowty Electronic Components Ltd.
Publication of WO1992019090A1 publication Critical patent/WO1992019090A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10037—Printed or non-printed battery

Definitions

  • This invention relates to electrical power supplies for circuit boards.
  • a further problem associated with batteries is the need to connect by clips or wires soldered to the battery the circuit it is to power. This adds undesirably to the component count and the number of operations to be performed to make the circuit.
  • a circuit board with an electrical power supply comprising a cell formed integrally in the circuit board.
  • the cell By forming the cell integrally in the circuit board, it is possible to eliminate the requirement for a separate casing, since in effect the circuit board performs that function. This allows a reduction in size and weight of the power supply, and allows it to be readily accommodated in the available space provided by the board.
  • the cell may be rechargeable or nonrechargeable.
  • the electrically conductive surface will be that provided to be etched to a required circuit pattern and to which electronic components are soldered to form a circuit. Commonly these surfaces are made of copper because of its good electrical conductivity.
  • the circuit board may be rigid or, where it is to conform to another shape, such as an inside surface of a case, it may be made flexible. Where it is flexible, the cell is also preferably flexible.
  • the cell may be formed in a cavity, depression, aperture or blind hole made in the surface of the circuit board by, for example, drilling or grinding. Where a hole is made through one of the surfaces, a vapour or gas proof layer may be provided to seal the hole against the ingress of contaminants and/or the leakage of vapour of gas as the cell operates.
  • the vapour proof layer is electrically conductive to provide an electrical connection to the cell.
  • the vapour proof layer is preferably sealed at its junction with an adjacent electrically conductive layer of the circuit board by an electrically conductive sealant serving to provide a vapour proof seal and to electrically connect the layers.
  • the cell is formed within the board before addition of the electrically conductive surface or surfaces.
  • the electrically conductive surfaces will then provide vapour proof layers eliminating the requirement for an additional layer and sealant.
  • Figure 1 shows a plan view of an electrical power cell and a circuit board in accordance with a first embodiment of the invention
  • Figure 2 is a section along line II-II of Figure 1; and Figure 3 is a section through an electrical power cell and circuit board in accordance with a second embodiment of the invention.
  • a printed circuit board 1 has an electrically insulating resin core 2 clad by upper and lower electrically conductive copper layers 3 and 4 respectively.
  • the copper layers 3 and 4 are selectively etched, in a manner well known, to provide a network or circuit pattern of electrically conductive tracks (not shown).
  • Circuit components 5 are soldered to these tracks to form a circuit.
  • the components 5 may include microprocessors, resistors or other electronic/electrical components to suit the electrical application for which it is designed.
  • the electrical power cell 7 is a lithium solid state battery and comprises an anode of lithium metal foil 8 placed in the hole in good electrical face-to-face contact with the lower copper layer 4.
  • a layer of polymer electrolyte 9 is provided over the upper surface of the lithium foil 8.
  • the aluminium foil backing 11 provides a vapour proof covering as well as an electrical pick up from the cell 7.
  • a fillet 12 of conductive epoxy sealant completes the vapour proofing of the cell 7 and additionally electrically connects the cell 7 to the upper copper layer 3.
  • connection between the cell 7 and the circuit components 5 is completed by through hole plating (not shown) to the lower copper layer 4.
  • a second embodiment of the invention is shown in Figure 3 in which like parts are given the same reference numbers as for the first embodiment.
  • a cell 7 is in this case formed in an aperture in a core 2 of a circuit board 1 prior to a cladding process in which copper layers 3 and 4 are glued to the core 2.
  • the layers 3 and 4 encapsulate the cell 7 preventing ingress of contaminants.
  • the copper layers 3 and 4 are then etched in a manner well known to provide a network of conductive tracks to which electronic components 5 are soldered to complete the board 1.
  • a number of cells may be provided at different locations in the circuit board and electrically linked in series or parallel to give the required voltage and capacity.
  • vapour proof layer and sealant may be dispensed with, their function being performed by the conductive layers alone.

Abstract

L'invention concerne une carte à circuits imprimés (1) incorporant une cellule électrique (7) faisant partie de la carte. L'incorporation de la cellule dans la carte (1) évite la nécessité de prévoir un boîtier pour la cellule (7) et des câbles de liaison, ce qui réduit le poids de l'ensemble et le nombre de composants par rapport aux configurations de l'antériorité.
PCT/GB1992/000688 1991-04-16 1992-04-15 Alimentation electrique WO1992019090A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9108101A GB2255450A (en) 1991-04-16 1991-04-16 Electrical power supply
GB9108101.8 1991-04-16

Publications (1)

Publication Number Publication Date
WO1992019090A1 true WO1992019090A1 (fr) 1992-10-29

Family

ID=10693379

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1992/000688 WO1992019090A1 (fr) 1991-04-16 1992-04-15 Alimentation electrique

Country Status (2)

Country Link
GB (1) GB2255450A (fr)
WO (1) WO1992019090A1 (fr)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999039554A2 (fr) * 1998-01-29 1999-08-05 Energenius, Inc. Dispositif d'accumulation d'electricite noye
WO2001073866A3 (fr) * 2000-03-24 2002-06-06 Cymbet Corp Procede et appareil a batterie integree
WO2004045260A1 (fr) * 2002-11-11 2004-05-27 Schweizer Electronic Ag Procede de production d'une carte de circuits imprimes semi-finie, carte de circuits imprimes semi-finie produite par un tel procede et carte de circuits imprimes multicouche formee a partir de celle-ci
FR2871333A1 (fr) * 2004-06-02 2005-12-09 Antig Tech Co Ltd Carte a circuit electronique integrant une pile a combustible
EP2474056A1 (fr) * 2009-09-01 2012-07-11 Infinite Power Solutions, Inc. Carte de circuit imprimé avec une batterie à film mince intégrée
USRE43868E1 (en) 2004-03-18 2012-12-25 Nanosys, Inc. Nanofiber surface based capacitors
CN107241850A (zh) * 2016-03-29 2017-10-10 中兴通讯股份有限公司 一种电路板及终端
US9853325B2 (en) 2011-06-29 2017-12-26 Space Charge, LLC Rugged, gel-free, lithium-free, high energy density solid-state electrochemical energy storage devices
US10601074B2 (en) 2011-06-29 2020-03-24 Space Charge, LLC Rugged, gel-free, lithium-free, high energy density solid-state electrochemical energy storage devices
US10658705B2 (en) 2018-03-07 2020-05-19 Space Charge, LLC Thin-film solid-state energy storage devices
US11527774B2 (en) 2011-06-29 2022-12-13 Space Charge, LLC Electrochemical energy storage devices

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09191936A (ja) * 1996-01-23 1997-07-29 Hiroshi Fukuba イオン歯ブラシ
US6137192A (en) * 1998-05-15 2000-10-24 Energenius, Inc. Embedded backup energy storage unit
DE10155393A1 (de) * 2001-11-10 2003-05-22 Philips Corp Intellectual Pty Planarer Polymer-Kondensator
EP1635416A1 (fr) * 2004-09-09 2006-03-15 Antig Technology Co., Ltd. Batterie secondaire avec la caisse de paquet faite de produit de carte électronique
CN1755972A (zh) * 2004-09-29 2006-04-05 胜光科技股份有限公司 二次可充电电池的制造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0353584A (ja) * 1989-07-21 1991-03-07 Nec Corp 全固体二次電池付積層プリント配線板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63211556A (ja) * 1987-02-26 1988-09-02 Toshiba Corp 電池収納部構造
JPH02121385A (ja) * 1988-10-31 1990-05-09 Brother Ind Ltd 蓄電池内蔵型プリント配線板
US5019468A (en) * 1988-10-27 1991-05-28 Brother Kogyo Kabushiki Kaisha Sheet type storage battery and printed wiring board containing the same
JP2808660B2 (ja) * 1989-05-01 1998-10-08 ブラザー工業株式会社 薄膜電池内蔵プリント基板の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0353584A (ja) * 1989-07-21 1991-03-07 Nec Corp 全固体二次電池付積層プリント配線板

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 15, no. 200 22 May 1991 & JP,A,3 053 584 ( NEC CORPORATION ) 7 March 1991 *

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999039554A3 (fr) * 1998-01-29 2000-08-24 Energenius Inc Dispositif d'accumulation d'electricite noye
US6137671A (en) * 1998-01-29 2000-10-24 Energenius, Inc. Embedded energy storage device
WO1999039554A2 (fr) * 1998-01-29 1999-08-05 Energenius, Inc. Dispositif d'accumulation d'electricite noye
WO2001073866A3 (fr) * 2000-03-24 2002-06-06 Cymbet Corp Procede et appareil a batterie integree
WO2004045260A1 (fr) * 2002-11-11 2004-05-27 Schweizer Electronic Ag Procede de production d'une carte de circuits imprimes semi-finie, carte de circuits imprimes semi-finie produite par un tel procede et carte de circuits imprimes multicouche formee a partir de celle-ci
USRE43868E1 (en) 2004-03-18 2012-12-25 Nanosys, Inc. Nanofiber surface based capacitors
FR2871333A1 (fr) * 2004-06-02 2005-12-09 Antig Tech Co Ltd Carte a circuit electronique integrant une pile a combustible
EP2474056A4 (fr) * 2009-09-01 2013-04-17 Infinite Power Solutions Inc Carte de circuit imprimé avec une batterie à film mince intégrée
EP2474056A1 (fr) * 2009-09-01 2012-07-11 Infinite Power Solutions, Inc. Carte de circuit imprimé avec une batterie à film mince intégrée
US9532453B2 (en) 2009-09-01 2016-12-27 Sapurast Research Llc Printed circuit board with integrated thin film battery
US9853325B2 (en) 2011-06-29 2017-12-26 Space Charge, LLC Rugged, gel-free, lithium-free, high energy density solid-state electrochemical energy storage devices
US10199682B2 (en) 2011-06-29 2019-02-05 Space Charge, LLC Rugged, gel-free, lithium-free, high energy density solid-state electrochemical energy storage devices
US10601074B2 (en) 2011-06-29 2020-03-24 Space Charge, LLC Rugged, gel-free, lithium-free, high energy density solid-state electrochemical energy storage devices
US11527774B2 (en) 2011-06-29 2022-12-13 Space Charge, LLC Electrochemical energy storage devices
CN107241850A (zh) * 2016-03-29 2017-10-10 中兴通讯股份有限公司 一种电路板及终端
US10658705B2 (en) 2018-03-07 2020-05-19 Space Charge, LLC Thin-film solid-state energy storage devices

Also Published As

Publication number Publication date
GB2255450A (en) 1992-11-04
GB9108101D0 (en) 1991-06-05

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