WO1989008908A1 - Module d'affichage a diodes electroluminescentes - Google Patents

Module d'affichage a diodes electroluminescentes Download PDF

Info

Publication number
WO1989008908A1
WO1989008908A1 PCT/JP1989/000222 JP8900222W WO8908908A1 WO 1989008908 A1 WO1989008908 A1 WO 1989008908A1 JP 8900222 W JP8900222 W JP 8900222W WO 8908908 A1 WO8908908 A1 WO 8908908A1
Authority
WO
WIPO (PCT)
Prior art keywords
display
display module
led display
holding
circuit board
Prior art date
Application number
PCT/JP1989/000222
Other languages
English (en)
Japanese (ja)
Inventor
Michiya Inoue
Takashi Yamauchi
Original Assignee
Fanuc Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fanuc Ltd filed Critical Fanuc Ltd
Publication of WO1989008908A1 publication Critical patent/WO1989008908A1/fr

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Definitions

  • the present invention relates to an LED (light emitting diode) display module mounted on a printed circuit board by soldering, and more particularly, to an LED having a structure in which an LED display section and a soldering terminal section are arranged at right angles.
  • c relates to a display mode Joule. background technology
  • an LED is mounted at an end of a printed circuit board to display an operation state of an electronic circuit formed on the printed circuit board.
  • an LED display module configured with a plurality of L LIs]. Is used.
  • the printed circuit board is housed in a box with both sides parallel to each other, perpendicular to the back panel.
  • the boxes are manufactured with as small a width as possible, and they are generally mounted in close proximity to the I I0 modules next to each other without gaps.
  • the LED display is mounted on the surface of the I / O module at right angles to the printed circuit board.
  • the width of the LED display usually makes the display easier to see. Therefore, the size of the printed circuit board is almost equal to the width of this box, so the printed circuit board is inevitably located at the center of the width of the LED display module or at a position slightly off from the center of ⁇ . It will be located at a right angle to the display module.
  • the invention has been made in view of such a point, and an object of the invention is to provide an ED display module which can be automatically soldered when mounted on a printed circuit board.
  • a display unit having a plurality of LEDs, a base having a U-shaped holding unit capable of slidably holding the display unit and a soldering terminal, and the display unit and the soldering terminal.
  • a flexible conductive forest to be connected, at least one locking portion provided on the inner surface of the holding city, and a shape capable of engaging with the engaging portion;
  • An LED display module comprising: two or more locked parts provided, wherein the display device has two or more locked positions in a lumen of the holding part.
  • the display section is inserted into the lumen of the holding section, and the locked section on the side of the display section is locked by the locking section provided on the inner side surface of the holding section, and is stabilized at the locking position. Since two or more locked parts are provided on the side surface of the display part, it has two or more locking positions and can be selectively locked at any one of the locking positions. .
  • FIG. 1 is a perspective view of an LED display module according to an embodiment of the present invention.
  • FIG. 2 is a side view showing the LED display module of FIG. 1 in a state where the LED display module is locked at a locking position where automatic soldering is possible;
  • FIG. 3 is a side view showing the LED display module of FIGS. 1 and 2 housed in the box of the I / O module.
  • FIG. 1 shows a perspective view of an LED display module according to an embodiment of the present invention.
  • the base 2 includes a U-shaped holding member 4 and a soldering terminal 6.
  • the soldering terminal section 6 has a large number of terminals 8.
  • Numeral 0 has a shape and size corresponding to the shape and size of the lumen of the holding unit 4, and a large number of LEs 14 are arranged on the display surface 12.
  • ridges 20 serving as locking portions are provided (only one of them is shown).
  • An upper groove 22 and a lower groove 2 are provided on both side surfaces of the display 10 as locked cities.
  • the conductive member 26 is formed of a flexible circuit board, it can be pulled out to the back side of the holding member 4 through a rectangular hole 28 provided in the base 2.
  • FIG. 1 shows a state in which the display unit 10 is pulled out of the holding unit 4. If the display unit 10 is inserted into the holding unit 4, the upper groove 22 or When the lower groove 24 is located at the position where the lower groove 24 is engaged with the ridge 20 and the bar mark 10 is stable. That is, the display unit 10 has two locked positions in the lumen of the holding device 4 ⁇ 2 HI is a side view of the LED display module shown in FIG. No. 2 shows a state where it is locked to the ridge 20 of the holding portion 4. The terminal 8 of the soldering terminal section 6 is inserted into a hole of the printed board 30.
  • the display substrate 10 does not protrude to the solder surface 32 side of the printed circuit board 30, so that the printed circuit board 30 can be automatically soldered.
  • a flexible conductive Tsubayashi 26 is soldered to the terminal 8 on the opposite side of the printed circuit board 30.
  • FIG. 3 is a side view of the LED display module shown in FIGS. 1 and 2 and is mounted on a printed circuit board 30 and is a box of the programmable controller I / O module. It shows a state of being housed in 34. Since the ridge 20 is engaged with the upper 2 22 of the display portion i (), the lower end of the display portion 10 is printed on the printed circuit board 3. The force protruding into the 0 solder surface 32 case is more convenient to fit in the box 31. -The front of LED 14 is protected by a transparent cap 36-Note that for the sake of explanation, Figures 2 and 3 are referred to as the "--side view" of the LE ⁇ display module. The module itself is generally mounted so that both sides 38 of the box 34 and the surface of the cap 36 are perpendicular to each other.
  • a flexible circuit board is used as the conductive member 26, but a flat cable (parallel wire) formed by combining a large number of electric wires in parallel and forming them together is used. ) Etc. may be used.
  • the locking city and the locked part are not limited to the combination of the ridge and the groove, but may be a combination of a convex city such as a projection and a depression and a concave part having a shape that can be locked to the convex city. I just need.
  • the locking portion may be provided on any one of the inner surfaces of the holding portion forming the lumen, and the locked portion is provided on the display portion at a position where the locking portion is engaged with the locking portion. May be.
  • the present invention may be implemented so as to have three or more locking positions.
  • the invention is based on the programmable controller's 1.0 ⁇ 0 module as an example.
  • the LED display module of the invention is applicable to other electronic devices as well. It can be used for As described above, according to the present invention, when the printed board is half-ffl-attached, the display unit is locked at the locking position where the display unit does not protrude to the solder surface side of the printed board. However, after the soldering operation is completed, the display portion can be slid in the direction of the solder surface to be locked at another locking position, thereby enabling automatic soldering of the printed circuit board. Therefore, cost can be reduced and reliability can be improved.

Landscapes

  • Engineering & Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

Un module d'affichage à diodes électroluminescentes se compose d'une base (2) comprenant une partie d'affichage (10) comportant une pluralité de diodes électroluminescentes (14), d'un support approximativement en U (4) servant à maintenir de manière coulissante la partie d'affichage, et d'une partie de borne de soudage (6). Un conducteur flexible (26) relie la partie d'affichage (10) à la partie de borne de soudage (6). Lors du soudage, une protubérance (16) pénètre dans une rainure (24) et maintient la partie d'affichage (10) dans une position surélevée, de sorte que les diodes électroluminescentes (14) ne sont pas immergées dans la soudure.
PCT/JP1989/000222 1988-03-12 1989-03-02 Module d'affichage a diodes electroluminescentes WO1989008908A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63/59164 1988-03-12
JP63059164A JP2509660B2 (ja) 1988-03-12 1988-03-12 Ｌｅｄ表示モジュ―ル

Publications (1)

Publication Number Publication Date
WO1989008908A1 true WO1989008908A1 (fr) 1989-09-21

Family

ID=13105463

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1989/000222 WO1989008908A1 (fr) 1988-03-12 1989-03-02 Module d'affichage a diodes electroluminescentes

Country Status (2)

Country Link
JP (1) JP2509660B2 (fr)
WO (1) WO1989008908A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5247291A (en) * 1988-11-14 1993-09-21 Omron Tateisi Electronics Co. Display with improved frame surrounding display element
EP2072891A1 (fr) * 2007-12-18 2009-06-24 Foxsemicon Integrated Technology, Inc. Dispositif d'illumination

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002175022A (ja) * 2000-12-06 2002-06-21 Stanley Electric Co Ltd Ｌｅｄ表示器
DE602004028099D1 (de) 2003-02-07 2010-08-26 Panasonic Corp Beleuchtungseinrichtung, einen sockel verwendend, um ein flaches led-modul auf einen kühlkörper zu montieren
KR100858062B1 (ko) * 2007-03-05 2008-09-10 (주)엠라이트 아크릴 광고물

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619435Y2 (fr) * 1976-03-17 1981-05-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619435Y2 (fr) * 1976-03-17 1981-05-08

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5247291A (en) * 1988-11-14 1993-09-21 Omron Tateisi Electronics Co. Display with improved frame surrounding display element
EP2072891A1 (fr) * 2007-12-18 2009-06-24 Foxsemicon Integrated Technology, Inc. Dispositif d'illumination
US8016454B2 (en) 2007-12-18 2011-09-13 Foxsemicon Integrated Technology, Inc. Light emitting diode illuminator

Also Published As

Publication number Publication date
JP2509660B2 (ja) 1996-06-26
JPH01232383A (ja) 1989-09-18

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