Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K1/00—Soldering, e.g. brazing, or unsoldering
  • B23K1/018—Unsoldering; Removal of melted solder or other residues
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
  • H05K13/04—Mounting of components, e.g. of leadless components
  • H05K13/0486—Replacement and removal of components
  • H05K13/0491—Hand tools therefor

Definitions

• the present invention relates to a method and an apparatus for removing defective solder.
• the present invention relates to a method and an apparatus for removing defective solder that can easily and reliably remove defective solder when soldering on a printed circuit board for mounting various electronic components and the like fails.
• Pins for electronic components are mounted on the printed circuit board by soldering. And this soldering work is performed by manual work by workers or mechanical work by automatic soldering equipment, but inevitably there are defective parts of solder.
• the present invention has been made by paying attention to such a conventional technique, and a method and a device for removing defective solder which can surely remove defective solder. The company will not provide a device.
• a method and an apparatus for removing defective solder according to the present invention are to reliably remove molten defective solder by utilizing a capillary phenomenon of a suction wire.
• the suction wire is pressed against the defective solder on the print substrate, and while applying a small amount of molten solder to the suction wire, the defective solder is heated and melted, and the melted defective solder is sucked. It is designed to absorb and remove by utilizing the capillary action of the wire (first invention).
• the suction wire After the suction wire is pressed against the defective solder, if a small amount of molten solder is applied to the suction wire and a heat treatment is performed on the defective solder by using a soldering iron or a laser beam, the defective solder is melted and melted. At the same time, it is sucked into the sucking wire by capillary action. The melted defective solder has a large surface tension, and is reliably and completely sucked into the sucking wire. In addition, since a small amount of molten solder is applied to the suction wire, the small amount of molten solder becomes "water", and the heat transfer efficiency of the suction wire increases, and the heating is directly transmitted to the defective solder. The solder is easily melted, and the melted defective solder is easily absorbed by the suction wire.
• a suction wire supply unit that can supply a suction wire to the tip of the iron tip is provided integrally with a soldering iron body having a tip at the tip.
• a solder wire removing unit capable of supplying a suction wire to a tip of a soldering iron tip to a soldering iron body having a soldering iron tip at the tip thereof;
• Ko A device for removing defective solder characterized in that the device is provided with a thread solder supply unit capable of supplying thread solder to the tip of the tip (3rd invention);
• a suction wire supply unit having a suction wire cutter mechanism for freely supplying a suction wire to the tip of the soldering tip and cutting the supplied suction wire to a soldering iron body having a soldering tip at the tip;
• the present invention provides a thread solder supply unit capable of freely supplying thread solder to the tip of the present invention, and a defective solder removing device (fourth invention) characterized in that the thread solder supply unit is provided physically.
• a fifth embodiment of the present invention provides a combination of a set finger unit for pressing against defective solder and a solder cottage for applying heat treatment to the defective solder.
• FIG. I is a schematic explanatory view of a manual defective solder removing device showing one embodiment of the present invention
• FIG. 2 is an explanatory view showing a force-pumping mechanism for a suction wire
• FIGS. 3 (a), (b) and (c) are enlarged cross-sectional views of a printed circuit board showing a step of removing defective solder in a manual defective solder removing apparatus, respectively.
• FIG. 4 is a plan view of an automatic defective solder removing apparatus showing another embodiment of the present invention.
• FIG. 5 is a side view of an automatic defective solder removing device: FIG. 6 is a schematic explanatory view showing a wire feeder blotting, and FIG. 7 (a) (b) (c ) is, in each automatic bad solder removing device Bad half
• FIG. 4 is an enlarged cross-sectional view of a printed circuit board showing a step of removing a field and a soldering process.
• the manual defective solder removing device 1 mainly includes a bistor-shaped solder iron body 2, a suction wire supply unit 4 capable of freely supplying a suction wire 3, and a thread solder supply unit 7.
• the soldering iron body 2 has a heater part 5 at the upper part, and a bent iron tip 6 is provided at the tip of the heater part 5. Further, a guide cylinder 8 extending toward the tip of the iron tip 6 is attached to the tip of the thread solder supply unit 7 fixing the heater 5. A winding roll 10 around which the flux-containing thread solder 9 is wound is disposed at the rear of the heater section 5. The thread solder 9 passes through the inside of the thread solder supply unit 7 to form a pair of delivery rollers 11. The guide tube 8 can be supplied from the front end while being held between the guide tubes.
• a suction wire supply unit 4 is provided at the lower end of the thread solder supply unit 7.
• a winding roll 12 around which a strip-shaped suction wire 3 made of a thin steel wire is wound is disposed below the suction wire supply unit 4, and the suction wire 3 is sucked by the wire supply unit.
• the thread solder 9 it can be supplied to the tip of the iron tip 6 from the gun barrel 14, which is formed to project from the tip, while being sandwiched between the pair of sending rollers 13 through the inside of the I'm sorry.
• Figure 7 shows the thread solder supply unit 7.
• switch buttons 15 are arranged in parallel, and by pressing these switch buttons 15, a certain amount of the thread solder 9 and the suction wire 3 can be supplied.
• the iron tip 6 of the heater section 5 is heated when the power cord 16 at the end of the thread solder supply unit 7 is connected to the power supply.
• the suction wire supply unit 4 is provided with a suction wire force cutter mechanism 50. That is, a bar-shaped piston is attached to the nail cutter-shaped force cutter body 52 fixed with the cutting edge 51 facing the tip of the guide cylinder 14 and the stepped portion 53 of the cutter body 52. A cylinder 55 is provided for closing the cutting edge 51 by pressing the button 54.
• Reference numeral 17 denotes a printed circuit board to which pins 19 of an IC 18 as an electronic component are soldered in a state of protruding to the other side.
• the solder fixing this pin 19 is not shown in the drawing, but is defective solder 20 which has caused a bridge with the adjacent pin (a phenomenon in which the solder and the solder are connected).
• the suction wire 3 supplied from the thread solder supply unit 7 is placed on the defective solder 20.
• the iron tip 6 of the manual defective solder removing device 1 is pressed against the suction wire 3 and simultaneously, the thread solder 9 is sent out to the iron tip 6 [see FIG. 3 (a)]. By doing so, the solder wire 9 is slightly melted at the iron tip 6 and absorbed by the suction wire 3.
• the defective solder 20 Since the heat from the iron tip 6 is transmitted to the defective solder 20 via the suction wire 3, the defective solder 20 is immediately melted. Defective solder 20 melted is absorbed by capillary action Is absorbed by the wire 3 [see FIG. 3 (b)]. None remains after the defective solder 20 is absorbed by the suction wire 3. Then, the switch of the suction wire cutter mechanism 50 (not shown) is pushed, the barbed piston 54 is protruded, the cutting edge 51 is closed, and the tip of the suction wire 3 that has absorbed the bad solder 20 The portion is cut (see FIG. 3 (c)), and the next removal operation can be performed at the tip of the new suction pipe 3.
• the manual defective solder removing device 1 can not only remove the defective solder 20 as described above, but also perform accurate soldering again after the defective solder 20 is removed.
• the pin 19 can be soldered by pressing the iron tip 6 against the pin 19 and supplying only the thread solder 9. Therefore, when the defective solder 20 is generated, the defective solder 20 can be removed and re-soldering can be performed by the manual defective solder removing device 1.
• the automatic defective solder removing device 21 is mounted on a printed circuit board 17 with a suction wire 23 attached to a head 22 of a robot arm that is freely movable and rotatable. It is a combination of a set finger unit 24 facing the bad solder 20 fixing the pin 19 and a solder cot unit 25 heating the bad solder 20.
• the set finger unit 24 and the solder connector 25 both vertically move the finger unit 28 and the iron unit 29 independently by the cylinder 26.27. It is possible, and it is inclined in a V-shape around a point (pin 19) on the printed board 17.
• Reference numeral 30 denotes a suction wire supply device for sequentially supplying suction wires 23 of a fixed length.
• the suction wire supply device 30 is disposed beside the stage 31 to which the printed circuit board 17 is fixed.
• the automatic defective solder removing device 21 is electrically connected to an automatic solder inspection device (not shown), and a signal from the automatic solder inspection device determines the defective solder 20 determined to be “defective”. It can be automatically positioned and moved to the position.
• a pair of left and right claws 3 that can freely open and close the toes 33 at the center of the shaft 32 is provided on the finger part 28 that can move up and down of the set finger unit 24.
• the toes 33 are opened, and when removed, the toes 33 are closed by a constant urging force of a constant spring (not shown). It has become. Therefore, the suction wire 23 having a certain length can be held between the toes 33.
• An iron tip 36 is provided at the tip of the iron part 29 of the solder iron kit 25, and a guide tube 3 which can supply a flux-containing thread solder 9 to the tip of the iron tip 36 is provided. 7 are provided.
• the guide cylinder 37 is connected to a not-shown thread solder supply device to supply a certain amount of thread solder 9.
• the suction wire supply device 30 includes a take-up roll 38 around which the suction wire 23 is wound, a delivery roller 39 for sending a predetermined amount of the suction wire 23, and a pair of upper and lower force meters 40. '(See Fig. 6). Then, the suction wire 23 wound around the winding roll 38 is sent out, and is protruded from the outlet by a certain amount by the roller 39.
• the set finger unit 24 moved by the head 22 of the robot arm comes to grasp the suction wire 23, it is cut by the cutter 40, and the suction wire 23 of a fixed length is formed. Can be transferred to the set finger unit 24.
• the set fin garnet 24 and the solder cot nit 25 are moved above the suction wire feeder 30 and the toe of the set fin garnet 24 is moved.
• the set finger fin 24 and the solder cot nit 25 are moved above the printed circuit board 17, and the defective solder 20, which is a work target, is transferred to the work board 20.
• the iron part 29 and the finger part 28 are lowered by the cylinders 26 and 27, respectively, along the inclination direction.
• the suction wire 23 is put on the defective solder 20, and the iron tip 36 is pressed on the suction wire 23, and at the same time, a small amount of thread solder 9 is sent to the iron tip 36. See Fig. 7 (a)].
• the solder wire 9 is slightly melted at the iron tip 36 and absorbed by the suction wire 23. Since the heat from the iron tip 36 is transmitted to the defective solder 20 via the suction wire 23, the defective solder 20 is immediately melted.
• the molten defective solder 20 is absorbed by the suction wire 23 by capillary action: [see FIG. 1 (b)].
• the heating process only heating using a soldering iron is used, but irradiation heating using a YAG laser beam or the like may be used.
• a strip-shaped braided thin steel wire is taken as an example of the “suction wire”, but the invention is not limited to this.
• the supply of the suction wire may be performed by the separate-type suction wire supply device 30 as in the above-described embodiment, but the set finger unit 24 itself is used. You may make it attach a suction wire supply mechanism.
• the method and apparatus for removing defective solder according to the present invention have the contents as described above. Therefore, even if defective solder fails to be soldered, the defective solder can be easily and reliably removed. The soldering can be easily re-executed and the overall workability of the soldering work can be improved. • i> o
• the defective solder is removed by utilizing the physical phenomenon called the capillary phenomenon of the suction wire, there are few troubles in the removing operation, which is advantageous in maintenance.

Landscapes

• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Molten Solder (AREA)
• Electric Connection Of Electric Components To Printed Circuits (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=13188360

Family Applications (1)

Country Status (2)

Cited By (3)

Families Citing this family (2)

Citations (4)

Family Cites Families (5)

• 1988
  • 1988-03-17 JP JP6203088A patent/JPH01237073A/ja active Granted
• 1989
  • 1989-02-23 WO PCT/JP1989/000190 patent/WO1989008527A1/ja unknown

Patent Citations (4)

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