WO1989004883A1 - Process for etching nickel - Google Patents

Process for etching nickel Download PDF

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Publication number
WO1989004883A1
WO1989004883A1 PCT/DE1988/000650 DE8800650W WO8904883A1 WO 1989004883 A1 WO1989004883 A1 WO 1989004883A1 DE 8800650 W DE8800650 W DE 8800650W WO 8904883 A1 WO8904883 A1 WO 8904883A1
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WO
WIPO (PCT)
Prior art keywords
etching
nickel
fecl
addition
ink
Prior art date
Application number
PCT/DE1988/000650
Other languages
German (de)
French (fr)
Inventor
Eva Bauersachs
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO1989004883A1 publication Critical patent/WO1989004883A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/28—Acidic compositions for etching iron group metals

Definitions

  • the invention relates to a method for nickel etching of structures or surfaces with particularly smooth etching surfaces, in particular of openings in nickel sheets, for. B. for the production of nickel molded parts for printheads of an inkjet printer.
  • a printhead is known for inkjet printers, the ink chambers and channels of which are composed of laminated metal foils.
  • the invention has for its object to design the method mentioned at the outset, which avoids pitting and roughened etching surfaces, ensures a sufficiently high etching speed and produces very smooth edges.
  • the main advantage of the method according to the invention is that the etched edges and surfaces are smooth.
  • the average roughness achieved is 0.56 ⁇ m. When using such sheets for inkjet printers, this has a very positive effect on the ink flow.
  • an iron III chloride etching solution between 1200 g / 1 FeCl 3 .6 H 2 O and 1450 g FeCl 3. 6 H 2 O / l is used.
  • the upper limit concentration is saturation at still acceptable storage temperatures - in our case 28oC. For technical reasons, it is therefore not advisable to etch with even higher concentrations.
  • the lower limit concentration is reached when the etching edges become rough or a deposit appears on the nickel surface.
  • Etching is preferably carried out with a solution which contains approx. 1300 to 1400 g FeCl 3 .6 H 2 O / l.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

The invention concerns a process for etching nickel structures or surfaces, in particular perforations in nickel sheet, which can be used for example to manufacture nickel etching molds for printing heads of an ink-jet printer. The etching material used is a highly concentrated iron (III) chloride etching solution without the addition of acids. The invention also concerns a printing head for ink-jet printers.

Description

Ätzverfahren für NickelEtching process for nickel
Die Erfindung betrifft ein Verfahren zum Nickelätzen von Strukturen oder Oberflächen mit besonders glatten Ätzflächen, insbesondere von Durchbrüchen in Nickelblechen, z. B. zur Herstellung von Nickelformätzteilen für Druckköpfe eines Tintenstrahldruckers.The invention relates to a method for nickel etching of structures or surfaces with particularly smooth etching surfaces, in particular of openings in nickel sheets, for. B. for the production of nickel molded parts for printheads of an inkjet printer.
Für Tintenstrahldrucker ist ein Druckkopf bekannt, dessen Tintenkammern und -kanäle aus zusammengeschichteten Metallfolien bestehen.A printhead is known for inkjet printers, the ink chambers and channels of which are composed of laminated metal foils.
Bisher werden hierfür Bleche aus Neusilber oder Chromnickelstahl verwendet, die ätztechnisch hergestellt wurden. Wegen wesentlich besserer Korrosions- und Schweißeigenschaften sollen diese Bleche jetzt in Nickel geätzt werden. Die bisher bekannten Ätzmittel sind für Nickel nicht gut geeignet, da sie sehr rauhe Kanten mit Rauhtiefen > 4 μm erzeugen.Up to now, sheets made of nickel silver or chrome nickel steel have been used for this, which were produced by etching. Because of much better corrosion and welding properties, these sheets are now to be etched in nickel. The etchants known to date are not well suited for nickel, since they produce very rough edges with roughness depths> 4 μm.
Es ist bekannt, Nickel mit Eisen-III-chloridätzlösung zu ätzen (siehe z. B. Galvanotechnik 63 (1972) Nr. 4, S. 337 -342). Bei einer in dieser Literaturstelle auf der Seite 340 angegebenen Konzentration von 580 - 620 g/1 FeCl2 · 6H2O erhält man aber nur rauhe Kanten.It is known to etch nickel with ferric chloride etching solution (see, for example, Galvanotechnik 63 (1972) No. 4, pp. 337-342). With a concentration of 580 - 620 g / 1 FeCl 2 .6H 2 O given in this reference on page 340, however, only rough edges are obtained.
Der Erfindung liegt die Aufgabe zugrunde, das eingangs genannte Verfahren zu konzipieren, das Lochfraß und stark aufgerauhte Ätzflächen vermeidet, eine ausreichend hohe Ätzgeschwindigkeit gewährleistet und sehr glatte Kanten erzeugt.The invention has for its object to design the method mentioned at the outset, which avoids pitting and roughened etching surfaces, ensures a sufficiently high etching speed and produces very smooth edges.
Diese Aufgabe wird nach dem Kennzeichen des Hauptanspruchs gelöst. Vorteilhafte Ausführungsformen und Weiterbildungen der Erfindung sind in den Unteransprüchen enthalten. Hoch konzentrierte Eisen-III-chloridätzlösung hat man bisher nicht verwendet, weil diese Mengen bei Raumtemperatur nicht löslich sind.This problem is solved according to the characteristic of the main claim. Advantageous embodiments and developments of the invention are contained in the subclaims. High Concentrated ferric chloride etching solution has not been used so far because these amounts are not soluble at room temperature.
Der wesentliche Vorteil des erfindungsgemäßen Verfahrens besteht darin, daß die geätzten Kanten und Flächen glatt sind. Die mittlere erzielte Rauhigkeit liegt bei 0.56 μm. Bei der Verwendung von derartigen Blechen für Tintenstrahldrucker wirkt sich das sehr positiv auf den Tintenfluß aus.The main advantage of the method according to the invention is that the etched edges and surfaces are smooth. The average roughness achieved is 0.56 μm. When using such sheets for inkjet printers, this has a very positive effect on the ink flow.
Bei dem Ätzverfahren nach der Erfindung wird mit einer Eisen-III-chloridätzlösung zwischen 1200 g/1 FeCl3 · 6 H2O und 1450 g FeCl3 · 6 H2O/l gearbeitet. Die Grenzkonzentration nach oben ist Sättigung bei noch vertretbaren Lagertemperaturen - in unserem Fall 28ºC. Aus technischen Gründen ist es deshalb nicht empfehlenswert, mit noch höheren Konzentrationen zu ätzen. Die untere Grenzkonzentration ist erreicht, wenn die Ätzkanten rauh werden bzw. ein Belag auf der Nickeloberfläche auftritt.In the etching process according to the invention, an iron III chloride etching solution between 1200 g / 1 FeCl 3 .6 H 2 O and 1450 g FeCl 3. 6 H 2 O / l is used. The upper limit concentration is saturation at still acceptable storage temperatures - in our case 28ºC. For technical reasons, it is therefore not advisable to etch with even higher concentrations. The lower limit concentration is reached when the etching edges become rough or a deposit appears on the nickel surface.
Ausführungsbeisoiel:Execution example:
Vorzugsweise wird mit einer Lösung, die ca. 1300 bis 1400 g FeCl3 · 6 H2O/l enthält, geätzt.Etching is preferably carried out with a solution which contains approx. 1300 to 1400 g FeCl 3 .6 H 2 O / l.
Eine Temperaturerhöhung bewirkt Beschleunigung des Ätzprozesses. Vorzugsweise wird bei 55ºC gearbeitet. Diese Temperatur macht den Einsatz einer handelsüblichen Leiterplattenätzmaschine (PVC) möglich. An increase in temperature accelerates the etching process. It is preferred to operate at 55 ° C. This temperature makes it possible to use a commercially available PCB etching machine (PVC).

Claims

Patentansprüche Claims
1. Verfahren zum Nickelätzen von Strukturen oder Oberflächen mit besonders glatten Ätzflächen, insbesondere von Durchbrüchen in Nickelblechen, z. B. zur Herstellung von Nickelformätzteilen für Druckköpfe eines Tintenstrahldruckers, dadurch g e k e n n z e i c h n e t , daß mit einer hochkonzentrierten Eisen-III-chloridätzlösung (vorzugsweise 1350 g/1 enthaltend) ohne Zusatz von Säuren geätzt wird.1. Method for nickel etching of structures or surfaces with particularly smooth etching surfaces, in particular of openings in nickel sheets, for. B. for the production of nickel molded parts for printheads of an inkjet printer, thereby g e k e n n z e i c h n e t that with a highly concentrated iron III chloride etching solution (preferably containing 1350 g / 1) is etched without the addition of acids.
2. Verfahren nach Anspruch 1, dadurch g e k e n n z e i c h n e t , daß eine Eisen-III-chloridätzlösung verwendet wird, die zwischen 1200 g/1 FeCl3 · 6 H2O und 1450 g/1 FeCl3 · 6 H2O ohne Zusatz von Säure arbeitet.2. The method according to claim 1, characterized in that an iron III chloride etching solution is used, which works between 1200 g / 1 FeCl 3 · 6 H 2 O and 1450 g / 1 FeCl 3 · 6 H 2 O without the addition of acid .
3. Verfahren nach Anspruch 1 und 2, dadurch g e k e n n - z e i c h n e t , daß der Ätzvorgang zwischen 28 und 60ºC vor sich geht. 3. The method according to claim 1 and 2, characterized in that the etching process takes place between 28 and 60 ° C.
PCT/DE1988/000650 1987-11-27 1988-10-24 Process for etching nickel WO1989004883A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP3740381.8 1987-11-27
DE19873740381 DE3740381A1 (en) 1987-11-27 1987-11-27 ETCHING PROCESS FOR NICKEL

Publications (1)

Publication Number Publication Date
WO1989004883A1 true WO1989004883A1 (en) 1989-06-01

Family

ID=6341474

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1988/000650 WO1989004883A1 (en) 1987-11-27 1988-10-24 Process for etching nickel

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DE (1) DE3740381A1 (en)
WO (1) WO1989004883A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1521931A1 (en) * 1965-11-12 1969-10-30 Photo Engravers Res Inc Process for powderless etching and etching bath for use in powderless etching of copper, copper alloys and nickel alloys
US4482426A (en) * 1984-04-02 1984-11-13 Rca Corporation Method for etching apertures into a strip of nickel-iron alloy
EP0158178A1 (en) * 1984-03-26 1985-10-16 Kabushiki Kaisha Toshiba Method of manufacturing shadow mask

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2349555C2 (en) * 1973-04-25 1983-04-07 Siemens AG, 1000 Berlin und 8000 München Print head for color liquid spray printers and the like
US4216477A (en) * 1978-05-10 1980-08-05 Hitachi, Ltd. Nozzle head of an ink-jet printing apparatus with built-in fluid diodes
JPS58167771A (en) * 1982-03-29 1983-10-04 Toshiba Corp Controlling method of etching liquid
DE3409420A1 (en) * 1984-03-15 1985-09-26 SWF Auto-Electric GmbH, 7120 Bietigheim-Bissingen Method for producing an electro-optical display device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1521931A1 (en) * 1965-11-12 1969-10-30 Photo Engravers Res Inc Process for powderless etching and etching bath for use in powderless etching of copper, copper alloys and nickel alloys
EP0158178A1 (en) * 1984-03-26 1985-10-16 Kabushiki Kaisha Toshiba Method of manufacturing shadow mask
US4482426A (en) * 1984-04-02 1984-11-13 Rca Corporation Method for etching apertures into a strip of nickel-iron alloy

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Chemical Abstracts, Band 101, Nr. 2, Juli 1984, (Columbus, Ohio, US), siehe Seite 222 *
Galvanotechnik, Band 63, Nr. 4, 15. April 1972, (Saulgau, DE), W. Stiehr: "Formteil{tzen ein Sonderverfahren der Galvanotechnik zur spaniosen Herstellung von Metallformteilen", Seiten 337-342 *

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Publication number Publication date
DE3740381A1 (en) 1989-06-08

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