WO1988006818A1 - Press-fit type piezoelectric vibrator and piezoelectric oscillator - Google Patents

Press-fit type piezoelectric vibrator and piezoelectric oscillator Download PDF

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Publication number
WO1988006818A1
WO1988006818A1 PCT/JP1988/000170 JP8800170W WO8806818A1 WO 1988006818 A1 WO1988006818 A1 WO 1988006818A1 JP 8800170 W JP8800170 W JP 8800170W WO 8806818 A1 WO8806818 A1 WO 8806818A1
Authority
WO
WIPO (PCT)
Prior art keywords
press
solder
stem
piezoelectric vibrator
case
Prior art date
Application number
PCT/JP1988/000170
Other languages
French (fr)
Japanese (ja)
Inventor
Tatsuo Ikeda
Hiroyuki Ogiso
Kazushige Ichinose
Original Assignee
Matsushima Kogyo Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2864087U external-priority patent/JPS63136422U/ja
Priority claimed from JP62224425A external-priority patent/JPH07105689B2/en
Priority claimed from JP29356287A external-priority patent/JPH01135214A/en
Priority claimed from JP29356087A external-priority patent/JPH01135212A/en
Application filed by Matsushima Kogyo Kabushiki Kaisha filed Critical Matsushima Kogyo Kabushiki Kaisha
Publication of WO1988006818A1 publication Critical patent/WO1988006818A1/en
Priority to US08/268,406 priority Critical patent/US5607236A/en
Priority to US08/473,874 priority patent/US5541557A/en

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49596—Oscillators in combination with lead-frames
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H03H9/0552—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the device and the other elements being mounted on opposite sides of a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Definitions

  • the present invention relates to a press-fit type piezoelectric vibrator in which a quartz-crystal vibrating piece is sealed using a system that is press-fitted into a case, a resin-molded piezoelectric vibrator in which the press-fit type piezoelectric vibrator is packaged in a resin, and a press-fit type.
  • the present invention relates to a case-inserted piezoelectric vibrator in which a piezoelectric vibrator is inserted in another case, and a piezoelectric oscillator in which a press-fit type piezoelectric vibrator is resin-sealed together with an IC having an oscillation circuit.
  • conventional press-fit type piezoelectric vibrators use a bonding method with an adhesive 101 or solder with a Sn: Pb ratio of 6: 4 or 9: 1 as shown in Fig. 15
  • the fixing method was used.
  • a press-fitting method in which the solder 102 or gold is pressed into a case, a welding or pressure welding method, and the like have been used.
  • a conventional resin-molded press-fit type piezoelectric vibrator had a structure as shown in FIG. This is done by using an adhesive such as polyimide to fix the piezoelectric vibrating piece 103 to the inner lead 105 of the stem 104.
  • the stem 104 and the case 106 The seal is made of gold as the shield material 10 mm, and the press-fit type piezoelectric vibrator of the above precaution is fixed to the lead frame by welding, and a piezoelectric vibrator integrally molded with resin is used. there were.
  • a conventional piezoelectric oscillator has a structure as shown in FIG. 17 and uses a press-fit piezoelectric vibrator 109 described above to electrically oscillate the press-fit piezoelectric vibrator i09.
  • the resin and the lead frame that electrically connects them are made of resin. Was shaped.
  • the basic problem is that the entire component reaches 220 to 260, and if the solder has a lead content of 40% or less, it will melt. And other organic components released from the solder paste during high-temperature aging
  • the case and the stem are soldered with 90-% or more lead.
  • the piezoelectric vibrating reed is fixed to the half of the stem
  • a press-fit type piezoelectric vibrator hermetically sealed by a press-fit method as a material.
  • the electric vibrating reed is fixed by melting the solder that is inserted into the inner lead of the stem.
  • the case and the stem are further formed by using the solder as a shield material.
  • the press frame is fixed, and the press-fit type piezoelectric vibrator and the lead frame are connected.
  • the case and the stem are soldered with 90% or more lead.
  • the piezoelectric vibrating reed is fixed to the half of the stem
  • the case and the stem are hermetically sealed by a press-fitting method using the solder as a shield material.
  • Case insertion type with a rectangular case with a cross section of at least one corner and a thickness in the range of 0.05 to 1.5 on the outer peripheral part other than the lead part of the cylindrical press-fit type piezoelectric vibrator. It becomes a piezoelectric vibrator.
  • the case and the stem are soldered with 90% or more lead, and the fixing of the piezoelectric vibrating reed is performed by melting the solder fixed to the inner lead of the stem.
  • the case and the stem further include a press-fit type piezoelectric vibrator hermetically sealed by a press-fitting method using the solder as a shield material, a semiconductor (IC) for electrically oscillating the press-fit type piezoelectric vibrator, and a lead frame.
  • the frame becomes a resin-molded piezoelectric oscillator.
  • FIG. 1 is a structural view of a press-fit type piezoelectric vibrator of the present invention.
  • Fig. 2 shows the solder state diagram
  • FIG. 3 is a structural view showing another embodiment of the press-fit type piezoelectric vibrator of the present invention.
  • FIG. 4 is a structural view showing another embodiment of the press-fit type piezoelectric vibrator of the present invention.
  • FIG. 5 is a structural view of a resin-molded piezoelectric vibrator of the present invention.
  • FIG. 6 is a perspective view of a resin-molded piezoelectric vibrator of the present invention.
  • FIG. 7 is a structural diagram of an application example of the tree-shaped piezoelectric vibrator of the present invention.
  • FIG. 8 is a perspective view of an application example of the resin-molded piezoelectric vibrator of the present invention.
  • FIG. 9 is a perspective view showing another embodiment of the resin-molded piezoelectric vibrator of the present invention.
  • FIG. 10 is a structural view of a case insertion type piezoelectric vibrator of the present invention.
  • FIG. 11 (a) is a cross-sectional view of a case insertion type piezoelectric vibrator of the present invention.
  • FIG. 11 (b) is a cross-sectional view showing another example of the case-inserted piezoelectric vibrator of the present invention.
  • FIG. 11 (c) is a cross-sectional view showing another example of the case-inserted piezoelectric vibrator of the present invention.
  • FIG. 12 is a perspective view of a piezoelectric oscillator using the press-fit type piezoelectric vibrator of the present invention.
  • FIG. 13 (a) is a sectional view of a piezoelectric oscillator using a press-fit type piezoelectric vibrator of the present invention.
  • Fig. 13 is a main plan view of the assembly of a piezoelectric oscillator using the press-fit type piezoelectric vibrator of the present invention.
  • Fig. 14 is a plan view of the main components of the piezoelectric oscillator of this study.
  • FIG. 14 (b) is a main sectional view of the piezoelectric oscillator of the present invention.
  • FIG. 15 is a cross-sectional view of a conventional press-fit type piezoelectric vibrator.
  • Fig. 16 is a structural view of a conventional resin-molded piezoelectric vibrator.
  • Fig. 17 is a main sectional view of a conventional piezoelectric oscillator. BEST MODE FOR CARRYING OUT THE INVENTION
  • FIG. 1 is a structural view of a quartz oscillator as one embodiment of a press-fit type piezoelectric oscillator of the present invention.
  • a tuning fork-type quartz vibrating piece 1 made by photolithography from a quartz plate was attached to a lead 3 of a stem 2 in which a lead 3 was sealed to a metal ⁇ 7 by glass, and an Sn pair shown in a soldering state diagram of FIG.
  • the case 6 in which the high-temperature solder 5 is plated on the stem 2 is vacuum-sealed by a press-fitting method to complete the crystal unit. ⁇
  • the solder When the amount of Pb is large, the solder not only improves the heat resistance-it is stable even at extremely low temperatures. This is because Sn can be cracked and cracked by an extremely low-grade phoenix. Since heat resistance and workability are important for solder, high-temperature solder containing not only Sn and Pb but also a third metal such as Ag may be used.
  • the soldering method of the press-fit type stem and the case uses the face-turning method, so that the solder is adhered to the entire metal part of the stem 2 and the case 6.
  • the solder when the solder is melted, the organic components of the solder are released as a gas, and the adhesion of the gas causes vibration. This may occur on the moving piece or the degree of vacuum may be reduced to cause deterioration of characteristics. This characteristic deterioration occurs even when the solder plating is applied only to the inner peripheral portion, not the entire metal portion of the case 6, as shown in FIG. For this reason, as shown in FIG. 4, the high-temperature solder 4 is used only for the fixing portion between the crystal resonator element 1 and the lead 3, and the high-temperature solder 5 is used only for the sealing portion 5 of the stem 2 and the case 6. It is more desirable.
  • the crystal vibrating piece 1 If the solder is plated over the entire metal part of the case and stem by plating, if the crystal vibrating piece 1 is hermetically sealed, it will remain at a high temperature (from room temperature to 260 ° C.). As a result, the equivalent resistance value increases extremely (sometimes reaches 100% or more), causing significant frequency aging, which may cause oscillation to stop.
  • the baking temperature is the temperature in the shaded area surrounded by the eutectic line ab, liquidus line ac, and lead content of 90% or more in Fig. 2, and baking is performed in this state. By doing so, it is possible to sufficiently release the organic components. As a result, the increase in the equivalent resistance value at a high temperature can be suppressed to several percent or less.
  • the high-temperature solder is plated only on the case side of the sealing portion, so that the airtightness can be maintained.
  • the metal ring of the stem may be not only a high-temperature solder but also a metal such as Ni or Cu.
  • the manufacturing technology can be the same as that of the conventional one, the material can be inexpensive and mass production is possible, and miniaturization can be easily achieved. This is because a load is likely to be applied to the step of fixing the quartz-crystal vibrating piece 0, so that the solder melting method simplifies the manufacturing.
  • the press-fitting method for the encapsulation method it is easy to manufacture with inexpensive materials.
  • the tree-shaped piezoelectric vibrator is fixed to the lead frame 10 by, for example, melting the solder of the outer leads 9 of the press-fit type piezoelectric vibrator 8 as shown in FIG. At this time, it is preferable that welding is performed because stronger bonding can be achieved.
  • These are integrally molded with an epoxy-based resin 11 to complete a resin-molded piezoelectric vibrator.
  • Fig. 6 shows this perspective view. This is the lead on the end face
  • FIG. 8 is this perspective view.
  • the markings such as the corners of a square, should be marked.
  • FIG. 9 is a perspective view showing another embodiment of the resin-molded piezoelectric vibrator of the present invention.
  • the structure of the surface mount type is adopted, but the insert lead type may be used in this way.
  • the case-insertable piezoelectric vibrator has a rectangular case 36 attached to the outer periphery of the above-described press-fit piezoelectric vibrator zo, and the lead 34 is bent. .
  • the thickness of the square case 36 is in the range of 0.05 sm to 1.5 ⁇ m, and if it is thick, it can be easily formed by a method such as pressing.
  • the square case 36 is not limited to metal, but may be resin or the like.
  • the square case is fixed to the press-fit type piezoelectric vibrator by welding, fixing with an adhesive or fitting.
  • the square case of Z5 shape can be not only four sides but also three-sided and eight-sided polygons. Good. If the square case is made of metal, it can be used as a ground.
  • FIGS. 12 and 13 a press-fit type piezoelectric vibrator 12 and a press-fit type piezoelectric vibrator are shown.
  • a semiconductor 13 for electrically oscillating the rotor 12 is arranged in a plane, and the wire bonding of the fine metal wire 15 and the press-fit type piezoelectric vibrator 12 are performed via a lead frame 14.
  • the press-fit type piezoelectric vibrator 12 and the semiconductor 13 are electrically connected by a method such as melting the solder of the outer lead 16 to form an oscillation surface.
  • a press-fit type piezoelectric vibrator 12, a semiconductor 13, a lead frame 14, and a thin metal wire 15 are formed of resin 17.
  • the press-fit type piezoelectric vibrator 1 2 The press-fit type piezoelectric vibrator 1 2
  • the lead frame 14 When the lead frame 14 is fixed to the drum 14, the lead frame 14 may not be strong enough to cause wire cutting. Therefore, as shown in FIG. 13 (b), the lead frame 14 is located on the opposite side of the semiconductor 13. It is desirable to place the lead 41 near the outer frame 42 of the frame.
  • a press-fit type piezoelectric vibrator 18 and a semiconductor for electrically oscillating the press-fit type piezoelectric vibrator 18 The tabs 19 of the lead frame 20 to which the semiconductor 19 is fixed are pushed out toward the piezoelectric vibrator 18 side, and the press-fit type piezoelectric
  • the press-fit type piezoelectric vibrator 18 is in parallel with the vibrator 18 to ensure electrical insulation clarity between the press-fit type piezoelectric vibrator 18 and the plurality of lead frames 20. This not only prevents electrical continuity between the piezoelectric vibrator 18 and the plurality of lead frames 20, but also prevents shorts between the lead frames 20.
  • the assembly is made to be about 1 ⁇ 2 in the plane and the minimum total thickness of the components in the thickness direction.
  • the piezoelectric vibrator 1 8, semiconductor 1 9, the entire Nde Complex 5 Lee Zadoff frame 2 0 and 2 1 are molded Ri by the heat-resistant resin 2 2.
  • the piezoelectric oscillator described in the embodiment is a key point of assembly.
  • the soldering part of the mounting piece, the case and the stem, and the connection between the lead of the press-fit type piezoelectric vibrator and the lead frame all have a heat resistance of 260 ° C or more, including the components. It has a configuration.
  • the overall shape of the embodiment is a lead frame shape called a gull wing of a flat package compatible with SMT as shown in Fig. 12, application to a lead shape as a plug-in component is also considered.
  • a lead frame shape called a gull wing of a flat package compatible with SMT as shown in Fig. 12
  • application to a lead shape as a plug-in component is also considered.
  • Another example is the application of a flat package to a J-bend lead frame shape.
  • the press-fit type piezoelectric vibrator of the present invention 90% or more of lead is soldered to the case and the stem, and the piezoelectric vibrating reed is fixed to the inner lead of the stem.
  • the solder and the case are melted, and the case and the stem are hermetically sealed by a press-fitting method using the solder as a shielding material, so that an adhesive or the like is used for fixing the piezoelectric vibrator. Without using it, it is performed directly by the solder 15 plated on the lead, and it is directly press-fitted by the solder plated on the case and the stem, so material cost and manufacturing cost are low, and heat resistance is low.
  • a sufficient press-fit type piezoelectric vibrator can be obtained.
  • the resin-molded piezoelectric vibrator of the present invention 90% or more lead is soldered to the case and the stem, and the piezoelectric vibrating reed is fixed to the stem inner lead.
  • the case and stem are solder-sealed, and the solder and the shield are sealed by a press-fit type piezoelectric vibrator.
  • One lead and lead frame are fixed, press-fit type piezoelectric vibrator and lead frame It is said that by integrally molding the resin with the resin, an inexpensive, high-quality, sufficiently heat-resistant piezoelectric vibrator can be obtained, and it is easy to handle, such as by automatic mounting. According to the type piezoelectric vibrator, 90% or more lead is soldered on the case and the stem, and the sticking of the piezoelectric vibrating reed is performed by melting the solder attached to the inner lead of the stem.
  • case and the stem have a cross-section of one or more corners on the outer peripheral part other than the lead part of the press-fit type piezoelectric vibrator hermetically sealed by the press-fitting method using solder as a shield material and have a thick wall.
  • solder having a lead content of 90% or more is applied to the case and the stem of the piezoelectric vibrator, and is used as a mounting material of the vibrating piece and a sealing material.
  • the press-fit type piezoelectric vibrator and the semiconductor are arranged on both sides of the lead frame, and the tab of the lead frame is pushed out to secure insulation between the press-fit type piezoelectric vibrator and the metal lead. This has the effect of providing a compact piezoelectric oscillator with excellent heat resistance.

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)

Abstract

A piezoelectric vibrator in which the case and the stem are plated with solder containing more than 90 % of lead, an inner lead for fastening a piezoelectric vibrator piece is plated with solder, and the solder is melted to fasten the piezoelectric vibrator piece. The invention further relates to a piezoelectric vibrator which is enclosed in a resin or metal plate case, and a piezoelectric oscillator in which an IC and the piezoelectric vibrator are molded as a unitary structure so that it can be efficiently mounted on the surface without defect.

Description

明 細 書 圧入型圧電振動子及び圧電発振器 技 術 分 野  Description Press-fit type piezoelectric vibrator and piezoelectric oscillator
本発明はケースに圧入されるシステムを用いて水晶振動子片を封止してな る圧入型圧電振動子と、 その圧入型圧電振動子を樹脂パッケージ した樹脂成 形型圧電振動子及び圧入型圧電振動子を別ケースに挿入したケース挿入型圧 電振動子に閟し、 更に圧入型圧電振動子を発振回路をもつ I Cとともに樹脂 封止してなる圧電発振器に関する。 背 景 技 術  The present invention relates to a press-fit type piezoelectric vibrator in which a quartz-crystal vibrating piece is sealed using a system that is press-fitted into a case, a resin-molded piezoelectric vibrator in which the press-fit type piezoelectric vibrator is packaged in a resin, and a press-fit type. The present invention relates to a case-inserted piezoelectric vibrator in which a piezoelectric vibrator is inserted in another case, and a piezoelectric oscillator in which a press-fit type piezoelectric vibrator is resin-sealed together with an IC having an oscillation circuit. Background technology
従来の圧入型圧電振動子は、 第 1 5図に示すよ う に圧電振動片の固着には 接着剤 1 0 1 による固着方式や S n対 P b比が 6対 4や 9対 1 の半田による 固着方式が使われていた。 また、 封止にも前記半田 1 0 2や金をケースにメ ッキした圧入方式、 溶接や圧接方式などが使われていた。  As shown in Fig. 15, conventional press-fit type piezoelectric vibrators use a bonding method with an adhesive 101 or solder with a Sn: Pb ratio of 6: 4 or 9: 1 as shown in Fig. 15 The fixing method was used. Also, for the sealing, a press-fitting method in which the solder 102 or gold is pressed into a case, a welding or pressure welding method, and the like have been used.
また、 従来の樹脂成形された圧入型圧電振動子は第 1 6図に示すような構 造をしていた。 これは、 圧電振動片 1 0 3 とステム 1 0 4 のイ ンナー リ ー ド 1 0 5 との固着にポ リ ィ ミ ド系などの接着剤を用い、. ステム 1 0 4 とケース 1 0 6 との封止はシール ド材 1 0 Ί として金を用い、 以上の構戒の圧入型圧 電振動子とリー ドフ レーム との固着が溶接で行われ、 一体に樹脂成形された 圧電振動子であった。  Further, a conventional resin-molded press-fit type piezoelectric vibrator had a structure as shown in FIG. This is done by using an adhesive such as polyimide to fix the piezoelectric vibrating piece 103 to the inner lead 105 of the stem 104. The stem 104 and the case 106 The seal is made of gold as the shield material 10 mm, and the press-fit type piezoelectric vibrator of the above precaution is fixed to the lead frame by welding, and a piezoelectric vibrator integrally molded with resin is used. there were.
従来の圧電発振器は、 第 1 7図に示す様な構造で、 先に述べた圧入型圧電 振動子 1 0 9を用いて前記圧入型圧電振動子 i 0 9を電気的に発振させる半 導体 1 1 0 とこれらを電気的に接続する リー ドフ レームとを樹脂 1 1 1 で成 形していた。 A conventional piezoelectric oscillator has a structure as shown in FIG. 17 and uses a press-fit piezoelectric vibrator 109 described above to electrically oscillate the press-fit piezoelectric vibrator i09. The resin and the lead frame that electrically connects them are made of resin. Was shaped.
しかし前述の従来技術では、 S M T (Surface Mount Techno l ogy) 部品と  However, in the above-mentioned conventional technology, SMT (Surface Mount Technology) parts and
して用いる場合、 基板への実装時には、 部品全体が 2 2 0〜 2 6 0てに達し、 鉛含有量 4 0 %以下の組成の半田では溶解してしまうという基本的問題点を , 有し、 他に高温エージ ングにおいて、 半田メ ツキ内から放出される有機成分  When mounted on a board, the basic problem is that the entire component reaches 220 to 260, and if the solder has a lead content of 40% or less, it will melt. And other organic components released from the solder paste during high-temperature aging
のガスによつて圧入型圧電振動子の周波数および等価抵抗値のシフ トという  Shift of the frequency and equivalent resistance of the press-fit type piezoelectric vibrator
特性劣化を生じていた。  Characteristic degradation has occurred.
そこで本発明は、 以上述べた様な問題点を薛決するもので、 その目的とす  Therefore, the present invention seeks to solve the problems described above,
るところは、 2 6 0 'C 上の S M T実装対応に耐え得る耐熱性を有し、 高温  Where heat resistance to withstand SMT mounting on 260'C
周波数エージング特性の優れた、 圧入型圧電振動子と樹脂成形型圧電振動子  Press-fit type piezoelectric vibrator and resin molded type piezoelectric vibrator with excellent frequency aging characteristics
- 及び圧電発振器を提供するところにある。 発 明 の 開 示 -And piezoelectric oscillators. Disclosure of the invention
即ち本発明は、 ケースとステムに鉛が 9 0- %以上の半田がメ ッキされてお  That is, in the present invention, the case and the stem are soldered with 90-% or more lead.
り、 圧電振動片の固着は前記ステムのィ ンナーリードにヌ ッキされた前記半  The piezoelectric vibrating reed is fixed to the half of the stem
田を溶融して行われ、 さらに前記ケースと前記ステムは前記半田をシールド  The case and the stem shield the solder
材として圧入方式で気密封入されている圧入型圧電振動子になる。  A press-fit type piezoelectric vibrator hermetically sealed by a press-fit method as a material.
本発明はケースとステムに鉛が 9 0 %以上の半田がメ ッキされており、 圧  In the present invention, 90% or more lead is soldered to the case and stem,
電振動片の固着は前記ステムのイ ンナ一リードにメ ッキされた前記半田を溶  The electric vibrating reed is fixed by melting the solder that is inserted into the inner lead of the stem.
融して行われ、 さらに前記ケースと前記ステムは前記半田をシール ド材とし  The case and the stem are further formed by using the solder as a shield material.
て圧入方式で気密封入されている圧入型圧電振動子のアウターリ一ドとリー  The outer lead and lead of a press-fit type piezoelectric vibrator
ドフ レームが固着され、 前記圧入型圧電振動子と前記リ一 ドフ レームとを一  The press frame is fixed, and the press-fit type piezoelectric vibrator and the lead frame are connected.
体に樹脂成形した樹脂成形型圧電振動子になる。  It becomes a resin-molded type piezoelectric vibrator formed by resin-molding the body.
更に本発明は、 ケースとステムに鉛が 9 0 %以上の半田がメ ツキされてお  Further, according to the present invention, the case and the stem are soldered with 90% or more lead.
り、 圧電振動片の固着は前記ステムのィ ンナーリ 一 ドにメ ッキされた前記半 田を瑢融して行われ、 さらに前記ケース と前記ステムは前記半田をシール ド 材として圧入方式で気密封入されている。 The piezoelectric vibrating reed is fixed to the half of the stem The case and the stem are hermetically sealed by a press-fitting method using the solder as a shield material.
円筒形圧入型圧電振動子のリ一ド部以外の外周部に断面が一角以上を有し、 かつ厚味が 0 . 0 5 〜 1 . 5 の範囲の角型ケースを取付けたケース揷入 型圧電振動子になる。  Case insertion type with a rectangular case with a cross section of at least one corner and a thickness in the range of 0.05 to 1.5 on the outer peripheral part other than the lead part of the cylindrical press-fit type piezoelectric vibrator. It becomes a piezoelectric vibrator.
更に本発明は、 ケースとステムに鉛が 9 0 %以上の半田がメ ツキされてお り、 圧電振動片の固着は前記ステムのィ ンナーリー ドにメ ッキされた前記半 田を溶融して行われ、 さら ί 前記ケースと前記ステムは前記半田をシールド 材として圧入方式で気密封入されている圧入型圧電振動子と前記圧入型圧電 振動子を電気的に発振させる半導体 （ I C ) とリー ドフ レームが樹脂成形さ れた圧電発振器になる。  Further, according to the present invention, the case and the stem are soldered with 90% or more lead, and the fixing of the piezoelectric vibrating reed is performed by melting the solder fixed to the inner lead of the stem. The case and the stem further include a press-fit type piezoelectric vibrator hermetically sealed by a press-fitting method using the solder as a shield material, a semiconductor (IC) for electrically oscillating the press-fit type piezoelectric vibrator, and a lead frame. The frame becomes a resin-molded piezoelectric oscillator.
. 図 面 の 簡 単 な -説 明 Brief description of the drawing
第 1図は本発明の圧入型圧電振動子の構造図。 FIG. 1 is a structural view of a press-fit type piezoelectric vibrator of the present invention.
第 2図は半田状態図。 Fig. 2 shows the solder state diagram.
第 3図は本発明の圧入型圧電振動子の他の実施例を示す構造図。 FIG. 3 is a structural view showing another embodiment of the press-fit type piezoelectric vibrator of the present invention.
第 4図は本発明の圧入型圧電振動子の他の実施例を示す構造図。 FIG. 4 is a structural view showing another embodiment of the press-fit type piezoelectric vibrator of the present invention.
第 5図は本発明の樹脂成形型圧電振動子の構造図。 FIG. 5 is a structural view of a resin-molded piezoelectric vibrator of the present invention.
第 6図は本発明の樹脂成形型圧電振動子の斜視図。 FIG. 6 is a perspective view of a resin-molded piezoelectric vibrator of the present invention.
第 7図は本発明の樹成形型圧電振動子の応用例の構造図。 FIG. 7 is a structural diagram of an application example of the tree-shaped piezoelectric vibrator of the present invention.
第 8図は本発明の樹脂成形型圧電振動子の応用例の斜視図。 FIG. 8 is a perspective view of an application example of the resin-molded piezoelectric vibrator of the present invention.
第 9図は本発明の樹脂成形型圧電振動子の他の実施例を示す斜視図。 FIG. 9 is a perspective view showing another embodiment of the resin-molded piezoelectric vibrator of the present invention.
第 1 0図は本発明のケース挿入型圧電振動子の構造図。 FIG. 10 is a structural view of a case insertion type piezoelectric vibrator of the present invention.
第 1 1図 (a)は本発明のケース挿入型圧電振動子の断面図。 FIG. 11 (a) is a cross-sectional view of a case insertion type piezoelectric vibrator of the present invention.
第 1 1図 (b)は本発明のケース挿入型圧電振動子の他の例を示す断面図。 第 1 1図 (c)は本発明のケース挿入型圧電振動子の他の例を示す断面図。 FIG. 11 (b) is a cross-sectional view showing another example of the case-inserted piezoelectric vibrator of the present invention. FIG. 11 (c) is a cross-sectional view showing another example of the case-inserted piezoelectric vibrator of the present invention.
第 1 2図は本発明の圧入型圧電振動子を用いた圧電発振器の斜視図。 FIG. 12 is a perspective view of a piezoelectric oscillator using the press-fit type piezoelectric vibrator of the present invention.
第 1 3図 (a)は本癸明の圧入型圧電振動子を用いた圧電発振器の断面図。 FIG. 13 (a) is a sectional view of a piezoelectric oscillator using a press-fit type piezoelectric vibrator of the present invention.
第 1 3図 は本発明の圧入型圧電振動子を用いた圧電発振器の組立主要平面 図 Fig. 13 is a main plan view of the assembly of a piezoelectric oscillator using the press-fit type piezoelectric vibrator of the present invention.
第 1 4図 )は本究明の圧電発振器の組立主要平面図。 Fig. 14) is a plan view of the main components of the piezoelectric oscillator of this study.
第 1 4図 (b)は本発明の圧電発振器の主要断面図。 FIG. 14 (b) is a main sectional view of the piezoelectric oscillator of the present invention.
第 1 5図は従来の圧入型圧電振動子の断面図。 FIG. 15 is a cross-sectional view of a conventional press-fit type piezoelectric vibrator.
第 1 6図は従来の樹脂成形型圧電振動子の構造図。 Fig. 16 is a structural view of a conventional resin-molded piezoelectric vibrator.
第 1 7図は従来の圧電発振器の主要断面図。 発明を実施するための最良の形態 Fig. 17 is a main sectional view of a conventional piezoelectric oscillator. BEST MODE FOR CARRYING OUT THE INVENTION
第 1図は本発明の圧入型圧電振動子の 1実施例として水晶振動子の構造図 を示す。 水晶板からフォ ト リ ゾグラフィによって作られた音叉型水晶振動片 1を金属璟 7にリード 3をガラスにより封着したステム 2のリード 3に、 第. 2図の半田状態図に示す S n対 P b比がほぼ 1 ： 9 となる融点が 2 6 0 °c以 上の高温半田 4をメ ツキにより設け固着する。 さらにステム 2に高温半田 5 をメ ツキしたケース 6を圧入方式により真空封止することにより水晶振動子 が完成する。 简、 半田は P b量が多い場合、 耐熱性が向上するばかりでなく - 極低温においても安定する。 というのは S nは極低瘟で割れてヒビが入るこ とがあるためである。 半田は耐熱性と作業性が重視されるため S n、 P bば かりでなく A gなどの第 3金属が含まれる高温半田でもよい。 通常、 圧入方 式のステムとケースの半田メ ッキ方式は面転式メ ッキ方法を用いるため、 ス テム 2 とケース 6は金属部全体に半田が付着する。 このとき、 半田が溶ける とメ ツキ內の有機成分がガスとして放出されるため、 このガスの付着が振動 動片に生じたり真空度が低下し特性劣化の原因となる。 この特性劣化は、 第 3図に示すようにケース 6の金属部全体でなく内周部にのみ半田メ ツキがさ れている場合でも生じる。 このため第 4図のように高温半田 4が水晶振動片 1 とリー ド 3の固着部のみ、 高温半田 5がステム 2 とケース 6の封止部のみ 5 に使用されるような部分メ ツキの方がより望ま しい。 また前記半田がメ ツキ 加工によりケースおよびステムの金属部の全体にメ ツキされる場合はこのま ま水晶振動片 1を気密封入してしまうと、 高温 （常温〜 2 6 0 °c閭） におい て等価抵抗値の極端な増大 （ 1 0 0 %以上に達する場合もある〉 、 著しい周 波数エージングを生じ、 発振の停止に至ることもある。 従ってステム 2を剪FIG. 1 is a structural view of a quartz oscillator as one embodiment of a press-fit type piezoelectric oscillator of the present invention. A tuning fork-type quartz vibrating piece 1 made by photolithography from a quartz plate was attached to a lead 3 of a stem 2 in which a lead 3 was sealed to a metal 璟 7 by glass, and an Sn pair shown in a soldering state diagram of FIG. A high-temperature solder 4 with a melting point of 260 ° C or higher, with a Pb ratio of approximately 1: 9, is provided and fixed by plating. Furthermore, the case 6 in which the high-temperature solder 5 is plated on the stem 2 is vacuum-sealed by a press-fitting method to complete the crystal unit.简, When the amount of Pb is large, the solder not only improves the heat resistance-it is stable even at extremely low temperatures. This is because Sn can be cracked and cracked by an extremely low-grade phoenix. Since heat resistance and workability are important for solder, high-temperature solder containing not only Sn and Pb but also a third metal such as Ag may be used. Normally, the soldering method of the press-fit type stem and the case uses the face-turning method, so that the solder is adhered to the entire metal part of the stem 2 and the case 6. At this time, when the solder is melted, the organic components of the solder are released as a gas, and the adhesion of the gas causes vibration. This may occur on the moving piece or the degree of vacuum may be reduced to cause deterioration of characteristics. This characteristic deterioration occurs even when the solder plating is applied only to the inner peripheral portion, not the entire metal portion of the case 6, as shown in FIG. For this reason, as shown in FIG. 4, the high-temperature solder 4 is used only for the fixing portion between the crystal resonator element 1 and the lead 3, and the high-temperature solder 5 is used only for the sealing portion 5 of the stem 2 and the case 6. It is more desirable. If the solder is plated over the entire metal part of the case and stem by plating, if the crystal vibrating piece 1 is hermetically sealed, it will remain at a high temperature (from room temperature to 260 ° C.). As a result, the equivalent resistance value increases extremely (sometimes reaches 100% or more), causing significant frequency aging, which may cause oscillation to stop.
, ο 記ケース 6に真空圧入する際、 加熱べ一キングを行いガスを外部に放出させ てしまう必要性がある。 この時べ一キング温度としては、 第 2図の共晶線 a b、 液相線 a c、 鉛含有量 9 0 %以上の線で囲われた斜線部内の温度であり、 この状態でベ一キングすることにより十分有機成分を放出させることが可能 である。 これにより等価抵抗値の高温での增加は、 数％以內に収められる。 , ο When vacuum-pressing into case 6, it is necessary to perform heating baking to release gas to the outside. At this time, the baking temperature is the temperature in the shaded area surrounded by the eutectic line ab, liquidus line ac, and lead content of 90% or more in Fig. 2, and baking is performed in this state. By doing so, it is possible to sufficiently release the organic components. As a result, the increase in the equivalent resistance value at a high temperature can be suppressed to several percent or less.
, 5 なお、 圧入方法の場合、 高温半田は封止部のケース側にのみメ ツキされて いわば、 気密性を保つこ とができ る。 このとき、 ステムの金属環は、 高温半 田でな く N i や C uなどのメ ツキでもかまわない。  In the case of the press-fitting method, the high-temperature solder is plated only on the case side of the sealing portion, so that the airtightness can be maintained. At this time, the metal ring of the stem may be not only a high-temperature solder but also a metal such as Ni or Cu.
以上の構造を成す場合、 製造技術上は従来のそれと同様にでき材料も安価 で大量生産が可能であり、 小型化も安易にできる。 というのは、 水晶振動片 0 を固着する工程に負荷がかかりやすいため、 半田溶融方法をとるこ とによつ て製造が安易になる。 また、 封入方法も圧入方法をとることによって、 安価 な材料で製造も容易となるためである。  With the above structure, the manufacturing technology can be the same as that of the conventional one, the material can be inexpensive and mass production is possible, and miniaturization can be easily achieved. This is because a load is likely to be applied to the step of fixing the quartz-crystal vibrating piece 0, so that the solder melting method simplifies the manufacturing. In addition, by adopting the press-fitting method for the encapsulation method, it is easy to manufacture with inexpensive materials.
従来の水晶振動子は耐熱性がないため最近発達してきた S M T部品と同様 の実装が行われなかった。 しかし、 本発明の圧入型水晶振動子は、 S M T部 5 品との同時実装が可能となる。 この水晶振動子は、 実装温度 2 6 0 °c、 保存 温度 1 5 0 °cにおいて特性务化のないこ とが確認できた。 Conventional quartz resonators do not have the heat resistance, so they were not mounted in the same way as recently developed SMT components. However, the press-fit type crystal unit of the present invention can be mounted simultaneously with five SMT parts. This crystal unit has a mounting temperature of 260 ° C, It was confirmed that the characteristics did not change at a temperature of 150 ° C.
以上、 音叉型水晶振動片において説明したが、 機械的外形加工で作られた 矩形扰 A T力 ッ ト水晶振動片及びタ ンタル酸リチウム振動片など他形状他材 料の圧電振動片においても耐熱性において特性劣化のないことが確認された。  As described above, the tuning fork type quartz vibrating reed was described. However, heat resistance is also achieved for piezoelectric vibrating reeds of other shapes, such as rectangular AT vibrating vibrating reed and lithium tantalate vibrating reed made by mechanical external processing. It was confirmed that there was no deterioration in the characteristics.
5 樹腊成形型圧電振動子は第 5図に示すように前述の圧入型圧電振動子 8の アウターリード 9の半田を溶融する等の方法でリードフ レーム 1 0に固着す る。 このとき、 溶接ならば、 より強固な固着ができ望ましい。 これらをェポ キシ系ゃフヱノール系の樹脂 1 1で一体成形することによって樹脂成形型圧 電振動子が完成する。 尙、 第 6図にこの斜視図を示す。 これは端面にリー ド 5. The tree-shaped piezoelectric vibrator is fixed to the lead frame 10 by, for example, melting the solder of the outer leads 9 of the press-fit type piezoelectric vibrator 8 as shown in FIG. At this time, it is preferable that welding is performed because stronger bonding can be achieved. These are integrally molded with an epoxy-based resin 11 to complete a resin-molded piezoelectric vibrator. Fig. 6 shows this perspective view. This is the lead on the end face
1 0 フ レームを出した構造であり、 Jベン ドと呼ばれる底面内側にリードフ レー ムを曲げた：形にしてあるが、 ガルゥ イ ングと呼ばれるように外側に曲げても 構わない。 また第 7図のように、 リードフ レームを側面に出してもよい。 第 8図はこの斜視図である。 このとき、 圧電振動子を動作させるのに必要な導 通すべきリードをわかるようにするため、 タ 形の角をとる等のマーキングをIt has a 10-frame structure, in which the lead frame is bent inside the bottom called the J-bend: It is shaped, but it may be bent outward as it is called a gull. Also, as shown in FIG. 7, the lead frame may be exposed to the side. FIG. 8 is this perspective view. At this time, in order to identify the leads that are required to operate the piezoelectric vibrator, the markings, such as the corners of a square, should be marked.
1 5 するのが良い。 1 5 is good.
第 9図は、 本発明の樹脂成形型圧電振動子の他の実施例を示す斜視図であ る。 前逮の例は、 表面実装型の構造をとつているが、 このように挿入リード 型にしても構わない。  FIG. 9 is a perspective view showing another embodiment of the resin-molded piezoelectric vibrator of the present invention. In the case of the former arrest, the structure of the surface mount type is adopted, but the insert lead type may be used in this way.
ケース揷入型圧電振動子は、 第 1 0 に示すように、 前述の圧入型圧電振 z o 動子の外周部に角型ケース 3 6を取り付け、 リード 3 4を折り曲げた形を!と つている。 角型ケース 3 6は、 金属の場合厚味は 0 . 0 5 sm〜 l . 5 ¾mの範 囲とし、 この厚味ならばプレス等の方法により簡単に成形できる。 また、 角 型ケース 3 6ば金属に限らず樹脂などでもよい。 角型ケースは圧入型圧電振 動子と溶接や接着剤固定又ははめ合いなどの方法で固定する。 角型ケースの Z 5 形は、 第 1 1図に示すように 4面ばかりでなく 3面や 8面などの多角形でも よい。 角型ケースは金属の場合、 アースとして用いることも.できる。 As shown in FIG. 10, the case-insertable piezoelectric vibrator has a rectangular case 36 attached to the outer periphery of the above-described press-fit piezoelectric vibrator zo, and the lead 34 is bent. . In the case of metal, the thickness of the square case 36 is in the range of 0.05 sm to 1.5 μm, and if it is thick, it can be easily formed by a method such as pressing. The square case 36 is not limited to metal, but may be resin or the like. The square case is fixed to the press-fit type piezoelectric vibrator by welding, fixing with an adhesive or fitting. As shown in Fig. 11, the square case of Z5 shape can be not only four sides but also three-sided and eight-sided polygons. Good. If the square case is made of metal, it can be used as a ground.
次に本発明の圧入型圧電振動子を用いた圧電発振器の第 1 の実施例として は、 第 1 2図、 第 1 3図で示す様に、 圧入型圧電振動子 1 2 と圧入型圧電振 動子 1 2を電気的に発振させる半導体 1 3が平面的に配置され、 リ ー ドフ レ 5 ーム 1 4を介して金属細線 1 5 のワ イ ヤーボンディ ングと圧入型圧電振動子 1 2のアウターリー ド 1 6の半田を溶融する等の方法により圧入型圧電振動 子 1 2 と半導体 1 3を電気的に接続し発振面路を構成している。 さ らに圧入 型圧電振動子 1 2、 半導体 1 3、 リー ドフ レーム 1 4、 金属細線 1 5を舍ん で樹脂 1 7により成形されている。 圧入型圧電振動子 1 2は、 リー ドフ レー Next, as a first embodiment of the piezoelectric oscillator using the press-fit type piezoelectric vibrator of the present invention, as shown in FIGS. 12 and 13, a press-fit type piezoelectric vibrator 12 and a press-fit type piezoelectric vibrator are shown. A semiconductor 13 for electrically oscillating the rotor 12 is arranged in a plane, and the wire bonding of the fine metal wire 15 and the press-fit type piezoelectric vibrator 12 are performed via a lead frame 14. The press-fit type piezoelectric vibrator 12 and the semiconductor 13 are electrically connected by a method such as melting the solder of the outer lead 16 to form an oscillation surface. Further, a press-fit type piezoelectric vibrator 12, a semiconductor 13, a lead frame 14, and a thin metal wire 15 are formed of resin 17. The press-fit type piezoelectric vibrator 1 2
, ο ム 1 4への固着時にリー ドフ レーム 1 4の刚性がなく ヮィヤー切断が起きる こともあるため、 第 1 3図 (b)に示すように半導体 1 3のある反対側でリ ー ド フ レームの外枠 4 2 の近く にリー ド 4 1を配置することが望ま しい。 , ο When the lead frame 14 is fixed to the drum 14, the lead frame 14 may not be strong enough to cause wire cutting. Therefore, as shown in FIG. 13 (b), the lead frame 14 is located on the opposite side of the semiconductor 13. It is desirable to place the lead 41 near the outer frame 42 of the frame.
圧電発振器の構造の第 2の実施例としては、 第 1 4図 (a)、 （b)に示すように 圧入型圧電振動子 1 8 と圧入型圧電振動子 1 8を電気的に発振させる半導体 5 1 9がリー ドフ レーム 2 0に対して各々表裏の関係に配置され、 半導体 1 9 が固着されたリードフ レーム 2 0 のタブ 2 1が圧電振動子 1 8側へ押し出さ れて、 圧入型圧電振動子 1 8 と平行に接触して圧入型圧電振動子 1 8 と複数 のリー ドフ レーム 2 0 との電気的絶縁のク リアラ ンスを確保している。 これ は圧電振動子 1 8 と複数のリー ドフ レーム 2 0 との電気的導通を防止するだ0 けでなく、 リ ー ドフ レーム 2 0相互間のシ ョー トをも防止している。 この構 造により、 圧入型圧電振動子と半導体を平面方向に配置するのに比べ、 平面 的には約 ½、 厚み方向では、 構成部品の最少合計厚みとなって組み立てられ ている。  As a second embodiment of the structure of the piezoelectric oscillator, as shown in FIGS. 14A and 14B, a press-fit type piezoelectric vibrator 18 and a semiconductor for electrically oscillating the press-fit type piezoelectric vibrator 18 The tabs 19 of the lead frame 20 to which the semiconductor 19 is fixed are pushed out toward the piezoelectric vibrator 18 side, and the press-fit type piezoelectric The press-fit type piezoelectric vibrator 18 is in parallel with the vibrator 18 to ensure electrical insulation clarity between the press-fit type piezoelectric vibrator 18 and the plurality of lead frames 20. This not only prevents electrical continuity between the piezoelectric vibrator 18 and the plurality of lead frames 20, but also prevents shorts between the lead frames 20. With this structure, as compared with the case where the press-fit type piezoelectric vibrator and the semiconductor are arranged in the plane direction, the assembly is made to be about ½ in the plane and the minimum total thickness of the components in the thickness direction.
最後に圧電振動子 1 8、 半導体 1 9、 リー ドフ レーム 2 0および 2 1を舍5 んで全体が耐熱性樹脂 2 2 によ り成形されている。 以上により、 実施例で説明してきた圧電発振器は、 組立の要点となる。 振 敷片の半田付部、 ケースとステム、 圧入型圧電振動子のリ ー ドと リ ー ドフ レ ームとの接続部は、 構成部品を含めて全て 2 6 0 °c以上の耐熱を有する構成 となっている。 Finally the piezoelectric vibrator 1 8, semiconductor 1 9, the entire Nde Complex 5 Lee Zadoff frame 2 0 and 2 1 are molded Ri by the heat-resistant resin 2 2. As described above, the piezoelectric oscillator described in the embodiment is a key point of assembly. The soldering part of the mounting piece, the case and the stem, and the connection between the lead of the press-fit type piezoelectric vibrator and the lead frame all have a heat resistance of 260 ° C or more, including the components. It has a configuration.
5 また実施例での全体の形状は第 1 2図に示すとおり S M T対応のフラ ッ ト パッケージのガルウイ ングと呼ばれるリードフレーム形状であるが、 差し部 品としての揷入リード形状への応用も考えられる。  5 Although the overall shape of the embodiment is a lead frame shape called a gull wing of a flat package compatible with SMT as shown in Fig. 12, application to a lead shape as a plug-in component is also considered. Can be
またフラッ トパッケージの Jベン ドリー ドフレ ム形状への応用も実施例 としてあげられる。  Another example is the application of a flat package to a J-bend lead frame shape.
t o 以上述べたように本発明の圧入型圧電振動子によれば、 ケースとステムに 鉛が 9 0 %以上の半田がメ ッキされており、 圧電振動片の固着はステムのィ ンナ一リードにメ ッキされた前記半田を溶融して行われ、 さらにケースとス テムは前記半田をシールド材として圧入方式で気密封入されていることによ り、 圧電振動子の固着に接着剤等を用いず、 リードにメ ツキされた前記半田 1 5 により直接行われること、 及びケースとステムにメ ツキされた前記半田によ り直接圧入されるので、 材料費及び製造コス トの安く、 耐熱性の十分な圧入 型圧電振動子が得られる。 さらに、 ケースと圧電振動片が半田を溶融して固 着されたステムとを、 半田の溶融状態温度において圧入方式で気密封止した ことにより等価抵抗が小さく、 高温エージング特性の優れた高信頼性の圧電to As described above, according to the press-fit type piezoelectric vibrator of the present invention, 90% or more of lead is soldered to the case and the stem, and the piezoelectric vibrating reed is fixed to the inner lead of the stem. The solder and the case are melted, and the case and the stem are hermetically sealed by a press-fitting method using the solder as a shielding material, so that an adhesive or the like is used for fixing the piezoelectric vibrator. Without using it, it is performed directly by the solder 15 plated on the lead, and it is directly press-fitted by the solder plated on the case and the stem, so material cost and manufacturing cost are low, and heat resistance is low. A sufficient press-fit type piezoelectric vibrator can be obtained. Furthermore, the case and the stem, to which the piezoelectric vibrating reed is melted and fixed, are hermetically sealed by the press-fit method at the temperature of the molten state of the solder, resulting in low equivalent resistance and high reliability with excellent high-temperature aging characteristics. Piezoelectric
2 0 振動子が得られる。 20 oscillators are obtained.
また、 本発明の樹脂成形型圧電振動子によればケースとステムに鉛が 9 0 %以上の半田がメ ッキされており、 圧電振動片の固着はステムめィ ンナーリ 一ドにメ ツキされた半田を溶 Sして行われ、 さらにケースとステムは半田を シールド材として庄入方式で気密封入されている圧入型圧電振動子のァゥタ According to the resin-molded piezoelectric vibrator of the present invention, 90% or more lead is soldered to the case and the stem, and the piezoelectric vibrating reed is fixed to the stem inner lead. The case and stem are solder-sealed, and the solder and the shield are sealed by a press-fit type piezoelectric vibrator.
2 5 一リードとリードフ レームが固着され、 圧入型圧電振動子とリードフ レーム とを一体に樹脂成形したことにより、 安価で高品質な耐熱性の十分な圧電振 動子が得られ、 かつ自動実装など取り扱いが容易であるという.効果を有する < また、 本究明のケース挿入型圧電振動子によればケース とステムに鉛が 9 0 %以上の半田がメ ツキされており、 圧電振動片の固着はステムのィ ンナ一 リ一ドにメ ッキされた半田を溶融して行われ、 さ らにケースとステムは半田 をシールド材として圧入方式で気密封入されている圧入型圧電振動子のリ一 ド部以外の外周部に断面が一角以上を有しかつ厚味が 0 . 0 5 SB〜 1 . 5™ の範囲の角型ケースを取り付けたことにより、 安価で高品質な耐熱性の十分 な圧電振動子が得られ、 かつ自動実装など取り扱いが容易であるという効果 を有する。 2 5 One lead and lead frame are fixed, press-fit type piezoelectric vibrator and lead frame It is said that by integrally molding the resin with the resin, an inexpensive, high-quality, sufficiently heat-resistant piezoelectric vibrator can be obtained, and it is easy to handle, such as by automatic mounting. According to the type piezoelectric vibrator, 90% or more lead is soldered on the case and the stem, and the sticking of the piezoelectric vibrating reed is performed by melting the solder attached to the inner lead of the stem. In addition, the case and the stem have a cross-section of one or more corners on the outer peripheral part other than the lead part of the press-fit type piezoelectric vibrator hermetically sealed by the press-fitting method using solder as a shield material and have a thick wall. By mounting a square case in the range of 0.05 SB to 1.5 ™, an inexpensive, high-quality piezoelectric vibrator with sufficient heat resistance can be obtained, and the handling is easy, such as automatic mounting. Having.
また本発明の圧電発振器によれば、 鉛含有量 9 0 %以上の半田を圧電振動 子のケース、 ステムにメ ツキし、 振動片のマゥ ン ト材、 密封シールド材とし て用いること及び、 圧電振動子のリ一 ドをリ一 ドフ レームの金属リー ドに鉛 含有量 9 0 %以上の半田を含んだ合金層として溶接することにより、 1 6 0 °c以上の耐熱性に耐え得る圧電発振器を提供するという効果を有する。  Further, according to the piezoelectric oscillator of the present invention, solder having a lead content of 90% or more is applied to the case and the stem of the piezoelectric vibrator, and is used as a mounting material of the vibrating piece and a sealing material. A piezoelectric oscillator that can withstand heat resistance of 160 ° C or more by welding the lead of the vibrator to the metal lead of the lead frame as an alloy layer containing solder with a lead content of 90% or more. Has the effect of providing
また、 圧入型圧電振動子と半導体をリ一 ドフ レームの両側に各々配置し、 リ一ドフレームのタブを押し出して圧入型圧電振動子と金属リ一ドとの絶縁 を確保するという構造をとることにより、 小型の耐熱性の優れた圧電発振器 を提供するという効果を有する。  In addition, the press-fit type piezoelectric vibrator and the semiconductor are arranged on both sides of the lead frame, and the tab of the lead frame is pushed out to secure insulation between the press-fit type piezoelectric vibrator and the metal lead. This has the effect of providing a compact piezoelectric oscillator with excellent heat resistance.

Claims

請 求 の 範 囲 The scope of the claims
1 . ケースとステムの少なく とも 1部に耐熱性半田がメ ツキされるとともに、 前記ステムを貫通するイ ンナーリ一ドの少なく とも 1部に耐熱性半田がメ ッ キされ、 圧電振動片と前記ィ ンナーリ ー ドが前記半田を介して固着され、 且 1. At least one part of the case and the stem is coated with heat-resistant solder, and at least one part of the inner lead penetrating the stem is plated with the heat-resistant solder. The inner lead is fixed via the solder, and
5 前記ケースと前記ステムが前記半田を介して圧入結合されたことを特徵とす る圧入型圧電振動子。 5 A press-fit type piezoelectric vibrator characterized in that the case and the stem are press-fitted via the solder.
2 . ケースの少なく とも封止部とステムの少なく ともィ ンナ一 一 ドに鉛が 9 0 %以上の半田がズッキされており、 圧電振動片の固着は前記ステムのィ ンナ一リードにメ ッキされた前記半田を溶融して行われ、 さらに前記ケース 2. At least 90% of lead is soldered on the inner part of at least the sealing part and the stem of the case, and the piezoelectric vibrating reed is fixed to the inner lead of the stem by the solder. Is performed by melting the solder that has been soldered.
1 0 と前記ステムは前記半田をシールド材として圧入方式で気密封入されている ことを特徴とする圧入型圧電振動子。 1 0 and the stem is press-fit type piezoelectric vibrator, characterized in that it is hermetically sealed by press-the solder as a shielding material.
3 . 前記ケースと前記圧電振動片が前記半田を溶融して固着されたステムと を、 前記半田 < 半溶融状態温度において圧入方式 気密封止したことを特徴 とする特許請求の範屈第一項記載の圧入型圧電振動子。  3. The case wherein the case and the stem to which the piezoelectric vibrating piece is fixed by melting the solder are hermetically sealed by a press-fit method at a temperature of the solder <half-molten state. The press-fit type piezoelectric vibrator as described.
1 5 4 . ケースの少なく とも封止部ととステムの少なく ともイ ンナーリードに鉛 が 9 0 %以上の半田がメ ツキされており、 圧電振動片の面着は前記ステムの ィ ンナーリードにメ ッキされた前記半田を溶融して行われ、 さらに前記ケ一 スと前記ステムは前記半田をシールド材として圧入方式で気密封入されてい る圧入型圧電振動子のアウターリードと.リードフ レームが固着され、 前記圧 z o 入型圧電振動子と前記リードフレームとを 体に樹脂成形したこ と 特徴と する樹脂成形型圧電振斷子。 1 5 4. At least of the case have been solder turtles luck lead less also called N'narido between the sealing portion and the stem is 90% or more, the surface deposition of the piezoelectric vibrating piece main to I N'narido of the stem Tsu The solder is melted, and the case and the stem are fixed to the outer lead of a press-fit type piezoelectric vibrator hermetically sealed by a press-fit method using the solder as a shield material. A resin-molded piezoelectric vibrator characterized in that the press-fit type piezoelectric vibrator and the lead frame are resin-molded into a body.
5 . ケースの少なく とも封止部とステムの少なく ともィ ンナーリ ー ドに鉛が 9 ひ％以上の半田がメ ッキされており、 圧電振動片の固着は前記ステムのィ ンナーリードにメ ッキされた前記半田を溶融して行われ、 さらに前記ケース 5. Solder of 9% or more lead is soldered to at least the sealing part and the inner lead of the stem, and the piezoelectric vibrating reed is fixed to the inner lead of the stem by the lead. Is performed by melting the solder,
2 5 と前記ステムは前記半田をシールド材として圧入方式で気密封入されている 円筒形圧入型圧電振動子のリ一ド部以外の外周部に断面が一角以上を有し、 かつ厚味が 0 . 0 5 M！〜 1 . 5 Mの範囲の角型ケースを取付けたことを特徴 とするケース挿入型圧電振動子。 25 and the stem are hermetically sealed by press-fitting using the solder as a shielding material. The outer peripheral portion of the cylindrical press-fit type piezoelectric vibrator other than the lead has a cross section of one or more corners and a thickness of 0.05 M! A case-insertion type piezoelectric vibrator characterized by mounting a square case in the range of 1.5 M.
6 . ケースの少なく と も封止部とステムの少なく と も ィ ンナー リ ー ドに鉛が 9 0 %以上の半田がメ ツキされており、 圧電振動片の固着は前記ステムのィ ンナーリー ドにメ ツキされた前記半田を溶融して行われ、 さ らに前記ケ一ス と前記ステムは前記半田をシールド材として圧入方式で気密封入されている 圧入型圧電振動子と前記圧入型圧電振動子を電気的に発振させる半導体 （ I C ) とリー ドフ レームが樹脂成形されたことを特徴とする圧電発振器。  6. At least 90% of lead is soldered on the inner lead of at least the sealing part and the stem of the case, and the attachment of the piezoelectric vibrating reed is to the inner lead of the stem. The press-fitting type piezoelectric vibrator and the press-fitting type piezoelectric vibrator are performed by melting the plated solder, and the case and the stem are hermetically sealed by a press-fitting method using the solder as a shield material. A piezoelectric oscillator characterized in that a semiconductor (IC) that electrically oscillates and a lead frame are resin-molded.
7 . 前記圧入型圧電振動子と前記半導体が、 前記リー ドフ レームに対して各 表裏の関係に配置されており、 前記半導体の固着された前記リー ドフ レー ムのタブが、 前記圧入型圧電振動子側へ、 平行に押し出されて、 前記圧入型 圧電振動子のケースと平行に接触していることを特徵とする特許請求の範囲 第 5項記載の圧電発振器。  7. The press-fit type piezoelectric vibrator and the semiconductor are arranged in a front-to-back relationship with respect to the lead frame, and the tab of the lead frame to which the semiconductor is fixed is attached to the press-fit type piezoelectric vibrator. 6. The piezoelectric oscillator according to claim 5, wherein the piezoelectric oscillator is extruded in parallel to a transducer side and is in parallel contact with a case of the press-fit type piezoelectric vibrator.
8 . 少なく ともケースとステムの係合部において前記ケースの 1部に耐熱半 田がメ ツキされるとともに、 前記ステムを貫通するイ ンナ一リー ドに固着さ れ、 前記ケース とステムが前記耐熱半田を介して圧入結合されたこ とを特徴 とする圧入型圧電振動子。  8. A heat-resistant solder is applied to at least a part of the case at an engaging portion between the case and the stem, and is fixed to an inner lead penetrating the stem, so that the case and the stem are connected to each other. A press-fit type piezoelectric vibrator characterized by being press-fit coupled via solder.
PCT/JP1988/000170 1987-02-27 1988-02-19 Press-fit type piezoelectric vibrator and piezoelectric oscillator WO1988006818A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US08/268,406 US5607236A (en) 1987-02-27 1994-06-30 Quartz oscillator temperature sensor
US08/473,874 US5541557A (en) 1987-02-27 1995-06-07 Resin mold type piezoelectric resonator and resin mold type piezoelectric oscillator

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP62/28640U 1987-02-27
JP2864087U JPS63136422U (en) 1987-02-27 1987-02-27
JP62/224425 1987-09-08
JP62224425A JPH07105689B2 (en) 1987-09-08 1987-09-08 Piezoelectric vibrator
JP62/293562 1987-11-20
JP62/293560 1987-11-20
JP29356287A JPH01135214A (en) 1987-11-20 1987-11-20 Piezo-oscillator
JP29356087A JPH01135212A (en) 1987-11-20 1987-11-20 Piezoelectric vibrator

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US5392006A (en) * 1987-02-27 1995-02-21 Seiko Epson Corporation Pressure seal type piezoelectric resonator
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US5265316A (en) * 1987-02-27 1993-11-30 Seiko Epson Corporation Method of manufacturing a pressure seal type piezoelectric oscillator
US5325574A (en) * 1987-02-27 1994-07-05 Seiko Epson Corporation Method of forming a quartz oscillator temperature sensor
FR2743225B1 (en) * 1995-12-28 1998-02-06 Ebauchesfabrik Eta Ag PIEZOELECTRIC RESONATOR

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