JPS6214506A - Piezoelectric oscillator - Google Patents
Piezoelectric oscillatorInfo
- Publication number
- JPS6214506A JPS6214506A JP15322685A JP15322685A JPS6214506A JP S6214506 A JPS6214506 A JP S6214506A JP 15322685 A JP15322685 A JP 15322685A JP 15322685 A JP15322685 A JP 15322685A JP S6214506 A JPS6214506 A JP S6214506A
- Authority
- JP
- Japan
- Prior art keywords
- oscillator
- resin
- lead terminal
- crystal resonator
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は圧電振動子と発振回路とを同一パッケージに収
納し九圧電発振器に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a nine piezoelectric oscillator in which a piezoelectric vibrator and an oscillation circuit are housed in the same package.
本発明は、圧電発振器において、圧電振動子を発振させ
る機能を有する電子回路を構成する電子部品と、電子部
品を電気的接続して装着し７ｔ ＩＪ −ド端子に電気
的接続された圧電振動子とが樹脂により、同時に一体成
形されてパッケージングされていることによ、す、外部
からの水分の浸入を防止して、耐湿度性を大幅に向上さ
せ友ものである。In a piezoelectric oscillator, the present invention includes an electronic component constituting an electronic circuit having a function of oscillating a piezoelectric vibrator, and a piezoelectric vibrator that is electrically connected to a 7t IJ-de terminal. By being integrally molded and packaged with resin, it prevents moisture from entering from the outside and greatly improves moisture resistance.
従来の圧電発振器の構成を水晶振動子を用いｔ水晶発振
器を例として第２図に示す。第２図は正面断面図であり
、半導体素子２１と前記半導体素子２１と金属細線２２
（本例ではＡｕワイヤー）にエリワイヤーボンディング
接続され之リード端子２５が、トランファーモールド樹
脂２５で底型封止されている。この時水晶振動子２４の
固着位置は、予めトランスファーモールド型に工って、
中空状態となっており、トランスファーモールド樹脂硬
化後、前記中空部に水晶振動子を投入して水晶振動子接
続用リード端子２３′に半田付等で固着し、残りの中空
部はエポキシ樹脂２６等をボッティングにエリ充填して
硬化させ封止する構成となっていた。The configuration of a conventional piezoelectric oscillator is shown in FIG. 2 using a crystal resonator and using a t-crystal oscillator as an example. FIG. 2 is a front sectional view showing the semiconductor element 21, the semiconductor element 21, and the thin metal wire 22.
The lead terminal 25 connected to the wire (Au wire in this example) by wire bonding is sealed at the bottom with a transfer mold resin 25. At this time, the fixed position of the crystal resonator 24 is prepared in advance in a transfer mold type.
After the transfer mold resin hardens, the crystal resonator is inserted into the hollow part and fixed to the crystal resonator connection lead terminal 23' by soldering, etc., and the remaining hollow part is filled with epoxy resin 26, etc. The structure was such that the material was filled into the botting and then cured and sealed.
〔発明が解決しようとする問題点及び目的〕しかし前述
の従来技術では、中空部に充填しであるエポキシ等の樹
脂とトランスファーモールド樹脂との界面が大きな面積
で存在する九めに、その界面を浸透する水分に：つて、
圧電振動子の発振異常が発生する問題点を有してい九〇
そこで本発明はこのような問題を解決しようとするもの
でその目的とするところは水分の浸透を防止して耐湿性
の優れ九圧電発振器を提供することにある。[Problems and objects to be solved by the invention] However, in the above-mentioned prior art, the interface between the resin such as epoxy filled in the hollow part and the transfer mold resin exists over a large area. Penetrating moisture:
There is a problem that abnormal oscillation occurs in the piezoelectric vibrator.The present invention is intended to solve this problem. An object of the present invention is to provide a piezoelectric oscillator.
本発明の圧電発振器は圧電振動子を発振させる機能を有
する電子回路を構成する電子部品と、電子部品を電気的
接続して装着し７ｔ ＩＪ−ド端子に電気的接続され次
圧電振動子とが樹脂にエリ、同時に一体底形されてパッ
ケージングされていることを特徴としている。The piezoelectric oscillator of the present invention includes an electronic component constituting an electronic circuit having a function of oscillating a piezoelectric vibrator, and an electronic component that is electrically connected and installed, and then electrically connected to a 7t IJ-de terminal and then connected to the piezoelectric vibrator. It is characterized by being made of resin and packaged with an integral bottom shape.
本発明の上記の構成によれば、圧電振動子を発振させる
機能を有する電子部品、リード端子、水晶振動子等が同
一樹脂で一体底形されることにより、従来からの異樹脂
間の界面から浸透してい友水分ｔ−遮断する。According to the above configuration of the present invention, the electronic components, lead terminals, crystal resonators, etc. that have the function of making the piezoelectric vibrator oscillate are made of the same resin and have an integral bottom shape. Penetrates and blocks hydrophilic water.
本発明の圧電発振器の実施＠を水晶振動子を用い之水晶
発振器を例として第１図に示し詳細に説明する。第１図
は正面断面図であり、水晶振動子を発振させる機能を有
し九半導体素子１が金属薄板等から成るリードフレーム
３上に接着され金属＋Ｉｌ線（本例ではＡｕワイヤー）
２にＬカワイヤーボンディング接続されて各リード端子
７．８（リード端子は他にも数本〜数十率あるが本説明
では省略する）に接続されている。リード端子７は水晶
振動子４との接続用端子であり、一方端はＡｕワイヤー
２に工っで半導体素子１と接続されており、他の一方端
に水晶振動子４のリード線４′を固着している。さらに
リード端子８もリード端子７と同様、一方端にＡｕワイ
ヤー２に＝す半導体素子１と接続され、他の一方端にチ
ップコンデンサー５が導電性接着剤等で固着している。The implementation of the piezoelectric oscillator of the present invention using a crystal resonator is shown in FIG. 1 and will be described in detail by taking the crystal oscillator as an example. FIG. 1 is a front cross-sectional view, in which a semiconductor element 1 having the function of oscillating a crystal resonator is bonded onto a lead frame 3 made of a thin metal plate, etc., and is made of metal + Il wire (in this example, Au wire).
2 by wire bonding and connected to each lead terminal 7.8 (there are several to dozens of other lead terminals, but they will be omitted in this description). The lead terminal 7 is a terminal for connection to the crystal resonator 4, and one end is connected to the semiconductor element 1 through the Au wire 2, and the other end is connected to the lead wire 4' of the crystal resonator 4. It's stuck. Furthermore, like the lead terminal 7, the lead terminal 8 is connected to the semiconductor element 1 via the Au wire 2 at one end, and the chip capacitor 5 is fixed to the other end with a conductive adhesive or the like.
以上述べｔ、半導体素子１、Ａｕワイヤー２、リードフ
レーム３、水晶振動子４、チップコンデンサー５、リー
ド端子７．８等はエポキシ樹脂等のモールド材乙によっ
てトランスファーモールド成形によって、樹脂の内部に
含包されている。As mentioned above, the semiconductor element 1, Au wire 2, lead frame 3, crystal resonator 4, chip capacitor 5, lead terminal 7, 8, etc. are contained inside the resin by transfer molding using a molding material such as epoxy resin. It is wrapped.
尚、本例はトランスファーモールドによる底形を記しで
あるが、他の方式による樹脂の同時成形（例えばキャス
ティング方式、ボッティング方式、ディッピング方式等
）でも良い。Although this example shows the bottom shape by transfer molding, other methods of simultaneous molding of the resin (for example, casting method, botting method, dipping method, etc.) may be used.
さらに、本発明の圧電発振器は実施例に示す水晶振動子
を用いｔ水晶発振器に限らず、タンタル酸リチウム振動
子、モリブデン酸リチウム振動子、セラミック振動子等
を用い次発振器でも良い。Further, the piezoelectric oscillator of the present invention is not limited to a t-crystal oscillator using the crystal resonator shown in the embodiment, but may also be a next-order oscillator using a lithium tantalate resonator, a lithium molybdate resonator, a ceramic resonator, or the like.
以上述べ几圧電発振器の構成によれば、各々の素子類が
同−樹脂内に含包される文め、水分の浸入が防止され、
耐湿特注が大幅に向上した水晶元根器となる。ま九同一
時に成形が完了する九め、従来のボッティング加工が不
要となり、加工工数が減少し、さらに樹脂充填の九め中
空部等が不要となる几めに、樹脂肉厚が少なくて済み小
型化も可能となる。According to the configuration of the piezoelectric oscillator described above, each element is encapsulated in the same resin, which prevents moisture from entering.
This is a crystal root device with significantly improved moisture resistance. The molding is completed at the same time, and the conventional botting process is no longer required, reducing the number of processing steps.In addition, the resin wall thickness can be reduced as there is no need for hollow parts to be filled with resin. Downsizing is also possible.
第１図は本発明の圧電発振器の一実施例としての水晶発
振器の正面断面図。
１・・・半導体素子 ２・・・Ａｕワイヤー５・・
・リードフレーム ４・・・水晶振動子５・・・チップ
コンデンサー
６・・・成形され次トランスファーモールド樹脂７．８
・・・リード端子
４′・・・水晶振動子のリード線
第２図は従来の圧電発掘器の一実施例と・しての水晶発
振器の正面断面図。FIG. 1 is a front sectional view of a crystal oscillator as an embodiment of the piezoelectric oscillator of the present invention. 1... Semiconductor element 2... Au wire 5...
・Lead frame 4...Crystal resonator 5...Chip capacitor 6...Molded and then transfer molded resin 7.8
. . . Lead terminal 4' . . . Lead wire of crystal oscillator FIG. 2 is a front sectional view of a crystal oscillator as an example of a conventional piezoelectric excavator.
Claims (1)
る電子部品と、前記電子部品を電気的接続して装着した
リード端子に電気的接続された圧電振動子とが樹脂によ
り、同時に一体的成形されてパッケージングされている
ことを特徴とする圧電発振器。An electronic component constituting an electronic circuit having a function of causing the piezoelectric vibrator to oscillate, and a piezoelectric vibrator electrically connected to a lead terminal to which the electronic component is electrically connected and attached are integrally molded at the same time using resin. A piezoelectric oscillator characterized by being packaged in
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15322685A JPS6214506A (en) | 1985-07-11 | 1985-07-11 | Piezoelectric oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15322685A JPS6214506A (en) | 1985-07-11 | 1985-07-11 | Piezoelectric oscillator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6214506A true JPS6214506A (en) | 1987-01-23 |
Family
ID=15557812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15322685A Pending JPS6214506A (en) | 1985-07-11 | 1985-07-11 | Piezoelectric oscillator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6214506A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01135213A (en) * | 1987-11-20 | 1989-05-26 | Matsushima Kogyo Co Ltd | Piezo-oscillator |
| EP0705805A2 (en) | 1994-09-16 | 1996-04-10 | Honda Giken Kogyo Kabushiki Kaisha | Sintered body of silicon nitride for use as sliding member |
-
1985
- 1985-07-11 JP JP15322685A patent/JPS6214506A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01135213A (en) * | 1987-11-20 | 1989-05-26 | Matsushima Kogyo Co Ltd | Piezo-oscillator |
| EP0705805A2 (en) | 1994-09-16 | 1996-04-10 | Honda Giken Kogyo Kabushiki Kaisha | Sintered body of silicon nitride for use as sliding member |
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