JPH06105760B2 - Piezoelectric oscillator - Google Patents
Piezoelectric oscillatorInfo
- Publication number
- JPH06105760B2 JPH06105760B2 JP15748785A JP15748785A JPH06105760B2 JP H06105760 B2 JPH06105760 B2 JP H06105760B2 JP 15748785 A JP15748785 A JP 15748785A JP 15748785 A JP15748785 A JP 15748785A JP H06105760 B2 JPH06105760 B2 JP H06105760B2
- Authority
- JP
- Japan
- Prior art keywords
- oscillator
- cut
- piezoelectric oscillator
- piezoelectric
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、圧電振動子と半導体素子による発振回路とを
同一樹脂内に収納した圧電発振器の外形形状に関する。The present invention relates to an external shape of a piezoelectric oscillator in which a piezoelectric vibrator and an oscillation circuit formed of a semiconductor element are housed in the same resin.
先行の技術としての圧電発振器の構成を、水晶振動子を
用いた水晶発振器を例として第３図に示す。第３図は、
先行技術の平面図であり、半導体素子21と、半導体素子
21と金属細線22（この例では、Auワイヤー）によりワイ
ヤーボンディング接続されたリード端子23、24に水晶振
動子25が固着接続されてトランスファーモールド樹脂等
26で一体成形されている。The structure of a piezoelectric oscillator as a prior art is shown in FIG. 3 by taking a crystal oscillator using a crystal oscillator as an example. Figure 3 shows
FIG. 3 is a plan view of a prior art, showing a semiconductor element 21 and a semiconductor element.
A crystal oscillator 25 is fixedly connected to lead terminals 23 and 24 which are wire-bonded to each other by 21 and a fine metal wire 22 (Au wire in this example).
It is integrally molded with 26.
水晶振動子25の固着用リード端子23、24はトランスファ
ーモールド樹脂26の外側に引き出され切断されている
が、湿気に対して非常に敏感であり、高湿度状況下に置
かれると水晶振動子の発振停止等の異常が発生するた
め、防湿性（耐湿性）の防湿コーティング樹脂27で防湿
コーティングされた構成となっている。The fixing lead terminals 23, 24 of the crystal unit 25 are pulled out of the transfer mold resin 26 and cut, but they are very sensitive to moisture, and when placed in a high humidity condition, the crystal unit Since an abnormality such as oscillation stop occurs, a moisture-proof (moisture-resistant) moisture-proof coating resin 27 is used for moisture-proof coating.
しかし、前述の構成によれば、防湿コーティング樹脂27
が充分な防湿性を得るために突起を形成し、この突起が
トランスファーモールド樹脂26の外周より不定形に突出
し、圧電発振器の外形形状が一定しないことになり、外
形形状を一定化させるために注意深い作業が必要となっ
て、作業工数が増すという課題を有していた。However, according to the above configuration, the moisture-proof coating resin 27
Form protrusions to obtain sufficient moisture resistance, and these protrusions project indefinitely from the outer periphery of the transfer mold resin 26, and the external shape of the piezoelectric oscillator becomes inconsistent, so be careful to make the external shape constant. There is a problem that work is required and the number of work steps is increased.
さらに、圧電発振器の外形形状が各々異なるため、自動
挿入機等の使用が困難であるという課題を有していた。Furthermore, since the piezoelectric oscillators have different outer shapes, there is a problem that it is difficult to use an automatic insertion machine or the like.
本発明は、かかる課題を解決し、防湿性を向上させるた
めのコーティング作業を容易にし、さらに、圧電発振器
の外形を一定化し、安価な圧電発振器を提供することを
目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide a low cost piezoelectric oscillator by solving the above problems, facilitating the coating work for improving the moisture resistance, and making the outer shape of the piezoelectric oscillator constant.
本発明の圧電発振器は、 圧電振動子（８）と、 該圧電振動子を用いて発振回路を構成する半導体素子
（１）と、 前記圧電振動子を固着し、前記圧電振動子と電気的に接
続するリード端子（５、６）と、 前記半導体素子と前記リード端子とをワイヤーボンディ
ング接続する金属細線（３）と、 を樹脂（９）で一体成形し、リードフレーム（２）から
切断されてなる圧電発振器において、 前記樹脂は、前記リード端子が前記リードフレームから
切断される切断部分を含む凹部（10）を有し、 該凹部は、前記リード端子の前記切断部分を覆う防湿用
コーティング材（11）を有する ことを特徴とする。The piezoelectric oscillator of the present invention comprises: a piezoelectric vibrator (8); a semiconductor element (1) that constitutes an oscillation circuit using the piezoelectric vibrator; and the piezoelectric vibrator fixed to electrically connect to the piezoelectric vibrator. The lead terminals (5, 6) to be connected, and the thin metal wires (3) for wire-bonding and connecting the semiconductor element and the lead terminals are integrally molded with resin (9) and cut from the lead frame (2). In the piezoelectric oscillator according to the present invention, the resin has a recessed portion (10) including a cut portion where the lead terminal is cut from the lead frame, and the recessed portion covers the cut portion of the lead terminal. It is characterized by having 11).
本発明の圧電発振器の実施例を、水晶振動子を用いた水
晶発振器を例として、第１図（ａ）の平面図及び第１図
（ｂ）の正面断面図に示す。An embodiment of a piezoelectric oscillator of the present invention is shown in a plan view of FIG. 1 (a) and a front sectional view of FIG. 1 (b), taking a crystal oscillator using a crystal oscillator as an example.
発振回路を構成する半導体素子１がリードフレーム２の
半導体接着部２′に接着され、金属細線（例えばAuワイ
ヤー）３によりワイヤーボンディングされて各リード端
子４に接続されている。A semiconductor element 1 constituting an oscillation circuit is bonded to a semiconductor bonding portion 2'of a lead frame 2, wire-bonded with a fine metal wire (for example, Au wire) 3, and connected to each lead terminal 4.
水晶振動子固着用リード端子５、６の一方端はAuワイヤ
ー３で半導体素子１と接続されており、他端はリードフ
レーム外縁部７に延長されて水晶振動子８と固着し電気
的接続されている。リード端子５、６は、半導体素子１
と、Auワイヤー３と、リード端子４等と同時にエポキシ
樹脂等のモールド材によるトランスファーモールド成形
により一体成形され、その後、リードフレーム外縁部７
から切断される。One end of the crystal resonator fixing lead terminals 5 and 6 is connected to the semiconductor element 1 by the Au wire 3, and the other end is extended to the lead frame outer edge portion 7 and fixed to the crystal resonator 8 for electrical connection. ing. The lead terminals 5 and 6 are the semiconductor element 1
, The Au wire 3 and the lead terminal 4 and the like are integrally formed by transfer molding using a molding material such as epoxy resin, and then the lead frame outer edge portion 7
Disconnected from.
ここで、切断部分のトランスファーモールド成形された
トランスファーモールド樹脂９は、基準面15より内側に
凹部10を形成している。凹部10の内部で水晶振動子固着
用リード端子５、６が切断され、切断部分には、エポキ
シ樹脂、シリコーン樹脂等の防湿用コーティング材11が
凹部10内にコーティングされている。Here, the transfer mold resin 9 formed by transfer molding of the cut portion has a recess 10 formed inside the reference surface 15. The crystal resonator fixing lead terminals 5 and 6 are cut inside the recess 10, and the cut portion is coated with a moisture-proof coating material 11 such as epoxy resin or silicone resin inside the recess 10.
なお、凹部の形状は、第１図（ａ）の形状の他に、第２
図（ａ）、（ｂ）、（ｃ）に示すように、防湿用コーテ
ィング材が塗布できるスペースを確保できる形状であれ
ば、どのような形状であっても同等の効果を有する。The shape of the recess is not limited to the shape shown in FIG.
As shown in FIGS. (A), (b), and (c), any shape can have the same effect as long as it can secure a space in which the moisture-proof coating material can be applied.
さらに、本発明の圧電発振器は、実施例に示した水晶振
動子を用いた水晶発振器に限らず、タンタル酸リチウム
振動子、モリブデン酸リチウム振動子、セラミック振動
子等を用いた発振器でもよい。Furthermore, the piezoelectric oscillator of the present invention is not limited to the crystal oscillator using the crystal oscillator shown in the embodiments, but may be an oscillator using a lithium tantalate oscillator, a lithium molybdate oscillator, a ceramic oscillator, or the like.
以上述べた圧電発振器の外形形状によれば、防湿用コー
ティング材が凹部内に納まるため、第３図の先行技術に
おけるコーティング作業のトランスファーモールド面か
らの高さ（ｈ）管理が不要となり、作業工数が大幅に減
少する。また、コーティング材が基準面15から突出しな
いため、外形形状が一定に保たれ、自動挿入機の使用が
可能になる。According to the external shape of the piezoelectric oscillator described above, since the moisture-proof coating material is housed in the recess, it is not necessary to control the height (h) from the transfer mold surface of the coating work in the prior art of FIG. Is greatly reduced. Further, since the coating material does not protrude from the reference surface 15, the outer shape is kept constant, and the automatic insertion machine can be used.
本発明の圧電発振器は、樹脂で一体成形し、リードフレ
ームから切断されてなる圧電発振器において、 前記樹脂は、前記リード端子が前記リードフレームから
切断される切断部分を含む凹部を有し、 該凹部は、前記リード端子の前記切断部分を覆う防湿用
コーティング材を有するため、 防湿性を向上させるためのコーティング作業を容易に
し、さらに、圧電発振器の外形を一定化し、安価な圧電
発振器を提供することができるという効果を奏する。The piezoelectric oscillator of the present invention is a piezoelectric oscillator integrally molded of resin and cut from a lead frame, wherein the resin has a concave portion including a cut portion where the lead terminal is cut from the lead frame, Has a moisture-proof coating material for covering the cut portion of the lead terminal, thus facilitating the coating work for improving the moisture-proof property, and further stabilizing the outer shape of the piezoelectric oscillator to provide an inexpensive piezoelectric oscillator. There is an effect that can be.
第１図は、本発明の圧電発振器の実施例を示す図。 （ａ）……平面図。 （ｂ）……正面断面図。 第２図は、本発明の圧電発振器の他の実施例としての凹
部形状を示す図。 第３図は、先行技術の圧電発振器の平面図。 １……半導体素子 ２……リードフレーム ３……Auワイヤー ５、６……水晶振動子固着用リード端子 ８……水晶振動子 ９……トランスファーモールド樹脂 10……凹部 11……防湿用コーティング材FIG. 1 is a diagram showing an embodiment of a piezoelectric oscillator of the present invention. (A) ... Plan view. (B) ... Front sectional view. FIG. 2 is a diagram showing a recess shape as another embodiment of the piezoelectric oscillator of the invention. FIG. 3 is a plan view of a prior art piezoelectric oscillator. 1 ... Semiconductor element 2 ... Lead frame 3 ... Au wire 5,6 ... Crystal resonator fixing lead terminal 8 ... Crystal resonator 9 ... Transfer mold resin 10 ... Recess 11 ... Dampproof coating material
Claims (1)
と、 前記圧電振動子を固着し、前記圧電振動子と電気的に接
続するリード端子と、 前記半導体素子と前記リード端子とをワイヤーボンディ
ング接続する金属細線と、 を樹脂で一体成形し、リードフレームから切断されてな
る圧電発振器において、 前記樹脂は、前記リード端子が前記リードフレームから
切断される切断部分を含む凹部を有し、 該凹部は、前記リード端子の前記切断部分を覆う防湿用
コーティング材を有する ことを特徴とする圧電発振器。1. A piezoelectric vibrator, a semiconductor element that forms an oscillation circuit using the piezoelectric vibrator, a lead terminal that fixes the piezoelectric vibrator and electrically connects to the piezoelectric vibrator, and the semiconductor. In a piezoelectric oscillator in which a thin metal wire for wire bonding connection between an element and the lead terminal is integrally molded with resin and cut from a lead frame, the resin is a cut portion where the lead terminal is cut from the lead frame. A piezoelectric oscillator, comprising: a concave portion including a concave portion, and the concave portion having a moisture-proof coating material that covers the cut portion of the lead terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15748785A JPH06105760B2 (en) | 1985-07-17 | 1985-07-17 | Piezoelectric oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15748785A JPH06105760B2 (en) | 1985-07-17 | 1985-07-17 | Piezoelectric oscillator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6218803A JPS6218803A (en) | 1987-01-27 |
| JPH06105760B2 true JPH06105760B2 (en) | 1994-12-21 |
Family
ID=15650752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15748785A Expired - Lifetime JPH06105760B2 (en) | 1985-07-17 | 1985-07-17 | Piezoelectric oscillator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06105760B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4916413A (en) * | 1987-11-20 | 1990-04-10 | Matsushima Kogyo Kabushiki Kaisha | Package for piezo-oscillator |
| US5229640A (en) * | 1992-09-01 | 1993-07-20 | Avx Corporation | Surface mountable clock oscillator module |
-
1985
- 1985-07-17 JP JP15748785A patent/JPH06105760B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6218803A (en) | 1987-01-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |