JPH0691168B2 - Hybrid IC mounting structure with built-in piezoelectric vibrator and resin molding - Google Patents
Hybrid IC mounting structure with built-in piezoelectric vibrator and resin moldingInfo
- Publication number
- JPH0691168B2 JPH0691168B2 JP60267850A JP26785085A JPH0691168B2 JP H0691168 B2 JPH0691168 B2 JP H0691168B2 JP 60267850 A JP60267850 A JP 60267850A JP 26785085 A JP26785085 A JP 26785085A JP H0691168 B2 JPH0691168 B2 JP H0691168B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric vibrator
- hybrid
- metal lead
- mounting structure
- built
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49596—Oscillators in combination with lead-frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、圧電振動子と圧電振動子を発振させる半導体
素子を同時に樹脂成形したハイブリツドICの実装構造に
関する。Description: TECHNICAL FIELD The present invention relates to a hybrid IC mounting structure in which a piezoelectric vibrator and a semiconductor element for oscillating the piezoelectric vibrator are simultaneously resin-molded.
〔発明の概要〕 本発明は、圧電振動子を内蔵して樹脂成形したハイブリ
ツドICの実装構造に関するものであり、圧電振動子を発
振させる半導体素子と半導体素子から金属細線で接続さ
れた複数の金属端子（以降、これらを総称して電気回路
という。）と金属リード端子間に電気的に接続された圧
電振動子が、金属リード端子の１部を含んで同時に樹脂
成形されたハイブリツドICにおいて、ハイブリツドICの
電気回路に接続されておりかつハイブリツドICの電気的
特性に影響を与えない圧電振動子に隣接した金属リード
端子のバネ圧で圧電振動子の上下及び平面方向の位置決
めをすることにより、圧電振動子の装着位置を固定して
樹脂成形時における圧電振動子の位置ズレを防止し、圧
電振動子装着部周囲にあるハイブリツドICの他の金属リ
ード端子との接触をさけ、かつ樹脂成形したハイブリツ
ドICパツケージ外部への圧電振動子露出を防ぐものであ
る。[Summary of the Invention] The present invention relates to a mounting structure of a hybrid IC in which a piezoelectric vibrator is incorporated and resin-molded, and a semiconductor element that oscillates the piezoelectric vibrator and a plurality of metals connected from the semiconductor element by a thin metal wire In a hybrid IC in which a piezoelectric vibrator electrically connected between a terminal (hereinafter collectively referred to as an electric circuit) and a metal lead terminal is resin-molded including a part of the metal lead terminal, Piezoelectric vibrators are positioned by the spring pressure of the metal lead terminals that are connected to the electric circuit of the IC and that do not affect the electrical characteristics of the hybrid IC and that are adjacent to the piezoelectric vibrator. Fixing the mounting position of the vibrator to prevent displacement of the piezoelectric vibrator during resin molding, and other metal leads of the hybrid IC around the piezoelectric vibrator mounting part Avoid contact with the child, and is intended to prevent the piezoelectric vibrator exposure to Haiburitsudo IC bobbin outside the resin molding.
従来の圧電振動子を内蔵して樹脂成形したハイブリツド
ICの実装構造を、水晶振動子を用いた水晶発振器を例と
して第２図（ａ）（ｂ）に示す。第２図（ａ）は平面
図、第２図（ｂ）は正面断面図であり、水晶振動子を発
振させる半導体素子と半導体素子から金属細線で接続さ
れた複数の金属リード端子（以降、これらを総称して発
振回路21と言う。）と発振回路21の金属リード端子の内
２本の金属リード端子22,23に電気的接続して装着した
水晶振動子24がトランスフアーモールド樹脂25により、
同時に一体成形されている。この時前記水晶振動子24は
前記金属リード端子22,23との接続部のみで保持されて
いる。Hybrid molded with a built-in conventional piezoelectric vibrator
The mounting structure of the IC is shown in FIGS. 2 (a) and 2 (b), taking a crystal oscillator using a crystal oscillator as an example. 2 (a) is a plan view and FIG. 2 (b) is a front sectional view showing a semiconductor element for oscillating a crystal unit and a plurality of metal lead terminals connected from the semiconductor element with metal wires (hereinafter, these metal lead terminals). Is collectively referred to as an oscillator circuit 21) and a crystal oscillator 24 electrically connected to and attached to two metal lead terminals 22 and 23 of the metal lead terminals of the oscillator circuit 21 by a transfer mold resin 25.
It is integrally molded at the same time. At this time, the crystal oscillator 24 is held only at the connecting portions with the metal lead terminals 22 and 23.
しかし前述した従来技術の構成では、第２図に示した水
晶発振器のように水晶振動子24の保持が２本の金属リー
ド端子22,23との接続部のみでなされているため、前記
金属リード端子22,23への装着時及び樹脂成形時に前記
水晶振動子24の位置（特に水晶振動子24のケース体先端
部）が平面方向にズレて、水晶振動子24の周囲にある発
振回路21に接続された他の金属リード端子と接触して発
振異常を起こしたり、あるいは上下方向（厚み方向）に
ズレて樹脂成形したパツケージ外部へ露出してしまう危
険性が大きいためズレ量をさけて樹脂成形部（パツケー
ジ）の厚みを厚くしなければならない等の問題を有して
いた。そこで本発明はこのような問題点を解決しようと
するもので、その目的とするところは圧電振動子の保持
構造を改良して圧電振動子全体の装着位置を固定し、発
振回路に接続された他の金属リード端子と圧電振動子と
の接触による発振異常防止と、樹脂成形部（パツケー
ジ）の厚みを薄くして小型化を図つた圧電発振器を提供
することにある。However, in the above-mentioned configuration of the prior art, since the crystal oscillator 24 is held only at the connection portion with the two metal lead terminals 22 and 23 like the crystal oscillator shown in FIG. The position of the crystal unit 24 (particularly the tip of the case body of the crystal unit 24) is displaced in the plane direction during mounting to the terminals 22 and 23 and during resin molding, and the crystal unit is placed in the oscillation circuit 21 around the crystal unit 24. Since there is a high risk of contact with other connected metal lead terminals causing oscillation abnormalities, or exposure to the outside of the resin-molded package that is misaligned in the vertical direction (thickness direction), avoid resin misalignment. There was a problem that the thickness of the portion (package) had to be increased. Therefore, the present invention is intended to solve such a problem, and an object thereof is to improve the holding structure of the piezoelectric vibrator to fix the mounting position of the entire piezoelectric vibrator and connect it to the oscillation circuit. Another object of the present invention is to provide a piezoelectric oscillator in which abnormal oscillation is prevented due to contact between another metal lead terminal and a piezoelectric vibrator, and a resin molded portion (package) is thinned to be downsized.
本発明の圧電振動子を内蔵して樹脂成形したハイブリツ
ドICの実装構造は、ハイブリツドICの電気回路の内２本
の金属リード端子に電気的接続して装着した圧電振動子
の装着位置を、前記電気回路に接続されており、かつハ
イブリツドICの電気的特性に影響を与えない前記圧電振
動子に隣接した金属リード端子のバネ圧で強制的にはさ
み込むことにより固定することを特徴としている。The mounting structure of the hybrid IC resin-molded with the built-in piezoelectric vibrator of the present invention has the mounting position of the piezoelectric vibrator electrically connected to two metal lead terminals in the electric circuit of the hybrid IC as described above. It is characterized in that it is fixed by being forcibly sandwiched by the spring pressure of the metal lead terminal adjacent to the piezoelectric vibrator, which is connected to an electric circuit and does not affect the electric characteristics of the hybrid IC.
本発明の圧電振動子を内蔵して樹脂成形したハイブリツ
ドICの実装構造を、水晶振動子を用いた水晶発振器を例
として第１図（ａ）（ｂ）に示し説明する。第１図
（ａ）は平面図、第１図（ｂ）は正面断面図であり、発
振回路１と発振回路１の内２本の金属リード端子2,3に
電気的接続して装着した水晶振動子４がトランスフアー
モールド樹脂５により同時に一体成形されている。水晶
振動子４は前記金属リード端子2,3との接続部及び発振
回路１と接続されており、かつ水晶発振器の電気的特性
に影響を与えない水晶振動子に隣接した金属リード端子
６とのはさみ込み接合によつて保持されており、水晶振
動子４全体の装着位置が確実に固定される構造になつて
いる。前記金属リード端子６の水晶振動子４との接合部
には、水晶振動子４に対して締め代を持たせることでバ
ネ圧をつけてあり、水晶振動子４との接合を強固なもの
にしている。A mounting structure of a hybrid IC formed by resin-molding the piezoelectric vibrator of the present invention will be described with reference to FIGS. 1 (a) and 1 (b) by taking a crystal oscillator using the crystal vibrator as an example. FIG. 1 (a) is a plan view and FIG. 1 (b) is a front sectional view. A crystal mounted electrically connected to the oscillation circuit 1 and two metal lead terminals 2 and 3 of the oscillation circuit 1. The vibrator 4 is integrally molded with the transfer mold resin 5 at the same time. The crystal unit 4 is connected to the connection portion with the metal lead terminals 2 and 3 and the oscillation circuit 1, and is connected to the metal lead terminal 6 adjacent to the crystal unit that does not affect the electrical characteristics of the crystal oscillator. It is held by sandwiching, and the mounting position of the entire crystal unit 4 is securely fixed. Spring pressure is applied to the joint portion of the metal lead terminal 6 with the crystal oscillator 4 by providing a tightening margin with respect to the crystal oscillator 4 to strengthen the joint with the crystal oscillator 4. ing.
尚、本発明の圧電振動子を内蔵したハイブリツドICの実
装構造は、実施例に示す水晶振動子を用いた水晶発振器
に限らず、タンタル酸リチウム振動子、モリブデン酸リ
チウム振動子、セラミツク振動子等の圧電発振器、又は
これら圧電振動子と圧電振動子を発振させる電気回路を
内蔵したハイブリツドICでも良い。Incidentally, the mounting structure of the hybrid IC incorporating the piezoelectric vibrator of the present invention is not limited to the crystal oscillator using the crystal vibrator shown in the examples, but may be a lithium tantalate vibrator, a lithium molybdate vibrator, a ceramic vibrator, or the like. The piezoelectric oscillator, or a hybrid IC incorporating these piezoelectric vibrators and an electric circuit for oscillating the piezoelectric vibrators may be used.
さらに、圧電振動子に限らず抵抗，コンデンサー，コイ
ル等の電子部品への応用も可能である。Further, the invention is not limited to the piezoelectric vibrator, and can be applied to electronic parts such as resistors, capacitors and coils.
又、接合部の金属リード端子形状の例としては第１図に
示した実施例のように圧電振動子ケース体に対する締め
代を利用するものの他、第３図に示すように圧電振動子
胴部を固定すべく圧電振動子ケース体周囲に没わせてバ
ネ成形した保持腕を突起させた金属リード端子を用いる
方法及び第４図に示すように圧電振動子ケース体先端部
を固定すべくバネ成形した保持腕を突起させた金属リー
ド端子を用いる方法も可能である。Further, as an example of the shape of the metal lead terminal of the joint portion, as shown in FIG. 3, other than utilizing the tightening margin for the piezoelectric vibrator case body as in the embodiment shown in FIG. Method of using a metal lead terminal with a retaining arm formed by spring-molding the piezoelectric vibrator case body so as to fix it and spring-molding the piezoelectric vibrator case body tip as shown in FIG. It is also possible to use a metal lead terminal having a protruding holding arm.
以上述べてきたように本発明によれば、圧電振動子をハ
イブリツドICの電気回路に接続されており、かつハイブ
リツドICの電気的特性に影響を与えない圧電振動子に隣
接した金属リード端子のバネ圧で上下及び平面方向に位
置決めすることにより、圧電振動子周囲にある他の金属
リード端子と圧電振動子との接触及び樹脂成形部（パツ
ケージ）外部への圧電振動子露出を防ぐことが可能とな
り、圧電振動子を内蔵して樹脂成形されたハイブリツド
ICの発振異常防止と薄型パツケージ化と言う効果を有す
る。As described above, according to the present invention, the piezoelectric vibrator is connected to the electric circuit of the hybrid IC, and the spring of the metal lead terminal adjacent to the piezoelectric vibrator does not affect the electrical characteristics of the hybrid IC. By positioning in the vertical and planar directions by pressure, it is possible to prevent contact between the piezoelectric vibrator and other metal lead terminals around the piezoelectric vibrator and to prevent the piezoelectric vibrator from being exposed to the outside of the resin molding part (package). , A hybrid molded with a built-in piezoelectric vibrator
It has the effects of preventing oscillation abnormalities of the IC and making it a thin package.
さらに、電気回路のGND又はVDDの金属リード端子を用い
れば、圧電振動子ケース体をアース固定することができ
るため、圧電振動子発振の安定化に一層の効果を有する
ことができる。Furthermore, by using the GND or VDD metal lead terminal of the electric circuit, the piezoelectric vibrator case body can be grounded and fixed, so that it is possible to further stabilize the oscillation of the piezoelectric vibrator.
第１図（ａ）は、本発明の圧電振動子を内蔵して樹脂成
形したハイブリツドICの実装構造の実施例としての水晶
発振器平面図、第１図（ｂ）は前記水晶発振器正面断面
図。 １……発振回路 2,3……水晶振動子接続用金属リード端子 ４……水晶振動子 ５……トランスフアーモールド樹脂 ６……水晶振動子固定用金属リード端子 第２図（ａ）は、従来の圧電振動子を内蔵して樹脂成形
したハイブリツドICの実装構造の実施例としての水晶発
振器平面図、第２図（ｂ）は前記水晶発振器正面断面図 21……発振回路 22,23……水晶振動子接続用金属リード端子 24……水晶振動子 25……トランスフアーモールド樹脂 第３図は、本発明による圧電振動子固定用金属リード端
子の、固定部形状の他の実施例を示す斜視図。 34……圧電振動子 36a……圧電振動子胴部固定用突起腕 第４図は、本発明による圧電振動子固定用金属リード端
子の、固定部形状のさらに他の実施例を示す斜視図。 44……圧電振動子 46b……圧電振動子先端部固定用突起腕FIG. 1 (a) is a plan view of a crystal oscillator as an embodiment of a mounting structure of a hybrid IC resin-molded with the piezoelectric vibrator of the present invention built therein, and FIG. 1 (b) is a front sectional view of the crystal oscillator. 1 …… Oscillation circuit 2,3 …… Metal lead terminal for connecting crystal unit 4 …… Crystal unit 5 …… Transfer molding resin 6 …… Metal lead terminal for fixing crystal unit Fig. 2 (a) A crystal oscillator plan view as an embodiment of a hybrid IC mounting structure in which a conventional piezoelectric vibrator is built in and molded by resin. FIG. 2 (b) is a front sectional view of the crystal oscillator 21 ... Oscillation circuit 22, 23. Crystal resonator connecting metal lead terminal 24 .. Crystal resonator 25 .. Transfer mold resin. FIG. 3 is a perspective view showing another embodiment of the fixing portion shape of the piezoelectric resonator fixing metal lead terminal according to the present invention. Fig. 34 ... Piezoelectric vibrator 36a ... Piezoelectric vibrator body fixing protrusion arm FIG. 4 is a perspective view showing still another embodiment of the fixing portion shape of the piezoelectric vibrator fixing metal lead terminal according to the present invention. 44 …… Piezoelectric vibrator 46b …… Piezoelectric vibrator tip fixing protrusion arm
Claims (1)
の一部を含んで樹脂成形されたハイブリツドICの実装構
造において、前記圧電振動子が前記ハイブリツドICの電
気回路に接続されており、かつ前記ハイブリツドICの電
気的特性に影響を与えない前記圧電振動子に隣接した前
記金属リード端子のバネ圧によつて上下及び平面方向の
位置を固定されていることを特徴とした圧電振動子を内
蔵して樹脂成形したハイブリツドICの実装構造。1. A mounting structure of a hybrid IC formed by resin molding, comprising a piezoelectric vibrator, a semiconductor element and a part of a metal lead terminal, wherein the piezoelectric vibrator is connected to an electric circuit of the hybrid IC, and Built-in piezoelectric vibrator characterized in that its position in the vertical and planar directions is fixed by the spring pressure of the metal lead terminal adjacent to the piezoelectric vibrator that does not affect the electrical characteristics of the hybrid IC Mounting structure of hybrid IC resin molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60267850A JPH0691168B2 (en) | 1985-11-28 | 1985-11-28 | Hybrid IC mounting structure with built-in piezoelectric vibrator and resin molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60267850A JPH0691168B2 (en) | 1985-11-28 | 1985-11-28 | Hybrid IC mounting structure with built-in piezoelectric vibrator and resin molding |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29449395A Division JPH08213514A (en) | 1995-11-13 | 1995-11-13 | Piezoelectric oscillator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62126657A JPS62126657A (en) | 1987-06-08 |
| JPH0691168B2 true JPH0691168B2 (en) | 1994-11-14 |
Family
ID=17450495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60267850A Expired - Lifetime JPH0691168B2 (en) | 1985-11-28 | 1985-11-28 | Hybrid IC mounting structure with built-in piezoelectric vibrator and resin molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0691168B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3072632B2 (en) * | 1988-10-03 | 2000-07-31 | セイコーエプソン株式会社 | Piezoelectric oscillator |
| JPH02188946A (en) * | 1989-01-17 | 1990-07-25 | Sharp Corp | Resin-sealed semiconductor device and manufacture thereof |
| JPH02108426U (en) * | 1989-02-16 | 1990-08-29 | ||
| JPH0384628U (en) * | 1989-12-01 | 1991-08-28 | ||
| JP2621828B2 (en) * | 1995-06-26 | 1997-06-18 | セイコーエプソン株式会社 | Piezoelectric oscillator |
-
1985
- 1985-11-28 JP JP60267850A patent/JPH0691168B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62126657A (en) | 1987-06-08 |
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