JP2621828B2 - Piezoelectric oscillator - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a structure of a piezoelectric oscillator.

[0002]

2. Description of the Related Art A conventional piezoelectric oscillator is disclosed in Japanese Patent Laid-Open No. 61-19 / 1986.
No. 204, which has a structure as shown in FIG.
The electric oscillator 11 and the piezoelectric oscillator 11 are electrically oscillated.
Semiconductor 12 and metal leads for electrically connecting these
Was resin molded. The piezoelectric vibrator 11 used here
The case body and the plug body have a lead content of 4
Plated with 0% or less solder and shaken with solder of the above composition
The moving piece is soldered to the plug body, and the
The plug body is vacuum-pressed into the case body using
What was known was.

[0003]

However, in the above-mentioned prior art, an SMT (Surface Mount Tech) is used.
(nology) When used as a component, when mounted on a board
In some cases, the entire component reaches 220-260 ° C and has a lead content of 4
Basically, solder with a composition of 0% or less will melt
There is a problem.
The frequency of the piezoelectric vibrator
In addition, characteristic deterioration such as a shift in equivalent resistance value has occurred.

[0004] The present invention is intended to solve the above problems, and an object, 260 ° C. or more SMT actual
High temperature frequency aging with heat resistance to withstand equipment mounting
An object of the present invention is to provide a piezoelectric oscillator having excellent characteristics .

[0005]

According to the present invention, there is provided a piezoelectric oscillator comprising:
The piezoelectric vibrating reed is fixed to the plug body, and the plug body contains 90% lead.
% Airtight press-fit into the case via lead-tin solder
And a half vibrating the piezoelectric vibrator.
Electrically connecting the conductor element, the semiconductor element and the piezoelectric vibrator.
And a metal frame connected to the piezoelectric vibrator and
The semiconductor element is the metal on which the semiconductor element is mounted.
It is placed in front and back relation to the tab of the frame,
Is pushed out toward the piezoelectric vibrator and is brought into contact with the case body.
The piezoelectric vibrator, the semiconductor element, and the metal frame.
And the arm is integrally formed of resin .

[0006]

[0007]

[0008]

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1A is a perspective view of a piezoelectric oscillator according to an embodiment of the present invention, and FIG.
2 (a) is an assembly plan view showing an embodiment of the piezoelectric oscillator, FIG. 2 (b) is an assembly sectional view of FIG. 2 (a), and FIG. Sectional view of the vibrator,
FIG. 4 is a sectional view of a vibrating piece of the piezoelectric vibrator, FIG. 5 is a sectional view of a plug body of the piezoelectric vibrator, and FIG. 6 is a sectional view of a case body of the piezoelectric vibrator.

[0010] The description will be given of a configuration of the following examples. First piezoelectric vibrating piece 102 in which the electrode film 101 is more formed such as a vapor deposition shown in FIG. 4, the in-Na Rido 104 side which is a solder plating 103 of the plug body shown in FIG. 5, the solder 1
3 is soldered 106 as shown in FIG. 3 and hermetically press-fitted into a metal case 105 plated with solder 103 shown in FIG. 6 using the solder 103 shown in FIG. 3 as a shielding material. The solder 103 is a solder having a lead (Pb) content of 90% or more in the solder phase diagram shown in FIG. 7, and has a melting temperature of 260 ° C. or more. The solder 103
Is plated by a plating process as shown by the case body (FIG. 6) and the plug body (FIG. 5), but at this time, there is a problem that an organic component in the plating solution is introduced into the solder 103. If the piezoelectric vibrating piece 102 is sealed by airtight press-fitting as it is, a high temperature (normal temperature to 260 ° C.)
In the meantime, an extreme increase in the equivalent resistance value (which may reach 100% or more), significant frequency aging occurs,
Oscillation may stop. Therefore, when the plug body ( FIG. 5) is vacuum-pressed into the case body (FIG. 6), it is necessary to perform heating baking and release the plug body to the outside. At this time, the eutectic line ab in FIG.
The liquidus line ac is a temperature in a hatched portion surrounded by a line having a lead content of 90% or more. By baking and sealing in this state, sufficient organic components can be released. As a result, the increase in the equivalent resistance value at a high temperature is kept within several percent.

As a first embodiment of the structure of the piezoelectric oscillator, as shown in FIG.
A piezoelectric vibrator 1 shown in the embodiment and a semiconductor 2 for electrically oscillating the piezoelectric vibrator 1 are arranged in a plane, a thin metal wire 9 by wire bonding via a metal lead 5, and an alloy layer containing solder 103 by welding. 7, the piezoelectric vibrator 1 and the semiconductor 2 are electrically connected to form an oscillation circuit. Further, the piezoelectric vibrator 1, the semiconductor 2, the metal leads 5, and the fine metal wires 9 are formed of the resin 8.

As a second embodiment of the structure of the piezoelectric oscillator, as shown in FIGS. 2A and 2B, the piezoelectric vibrator FIG. 3 (1 in FIG. 2) and the piezoelectric vibrator 1 are electrically connected. The semiconductor 2 to be oscillated is arranged in a front-to-back relationship with respect to the metal frame 3, and the metal frame 3 to which the semiconductor 2 is fixed is attached.
The tab 4 is pushed out toward the piezoelectric vibrator 1 and comes into contact with the piezoelectric vibrator 1 in parallel to ensure electrical insulation clearance between the piezoelectric vibrator 1 and the plurality of metal leads 5. This prevents not only electrical conduction between the piezoelectric vibration 1 and the plurality of metal leads 5 but also short-circuit between the metal leads 5. According to this structure, as compared with the case where the piezoelectric vibrator and the semiconductor are arranged in the plane direction, the assembly is made to be １ ／ in the plane and the minimum total thickness of the components in the thickness direction.

Further, the lead 6 of the piezoelectric vibrator 1 is connected to the metal lead 5 related to the electric oscillation by the solder 1 shown in FIG.
03 is welded as an alloy layer 7 containing the same. Although the lead 6 does not necessarily require solder plating, the lead 6 is plated simultaneously with the inner side 104 when the solder plating 103 is performed on the plug body shown in FIG.
The solder 103 is welded to the metal lead 5 with the solder 103 attached as an alloy layer containing the solder 103.

Finally, the entire structure including the piezoelectric vibrator 1, the semiconductor 2, the metal leads 5 and the tabs 4 is formed of a heat-resistant resin 8.

[0015] Thus, assembly view 2 of piezoelectric oscillator has been described in the Examples, the gist of the assembly, the sealing unit (Fig soldering portion 106, case 105 and the plug body of the vibrator element 102 (FIG. 5) 3) The solder 103 and the connecting portion between the lead 6 of the piezoelectric vibrator and the metal lead 5 are all 260
It has a configuration having heat resistance of ゜ C or more.

The overall shape of the embodiment is an SMT-compatible flat package SOP type as shown in FIG. 1, but application to a DIP type as an insertion part is also mentioned as an embodiment.

An application of the flat package to a J-BEND lead type is also given as an embodiment.

[0018]

Since the present invention is configured as described above, it has the following effects. (1) Plug through lead-tin solder containing 90% or more lead
The housing and the case are hermetically press-fitted.
Withstands temperatures above 260 ° C when mounting the oscillator on the board
Piezoelectric with excellent high-temperature frequency aging characteristics
An oscillator can be provided. (2) Push the tab to the side of the piezoelectric vibrator to
By making contact, the piezoelectric vibrator becomes a thick ally of the piezoelectric oscillator.
Direction is restricted, and vibration is
The moving element is difficult to move, and highly reliable integral molding can be performed.
Furthermore, since the tab and the case are in contact, piezoelectric oscillation
The thickness of the vessel can be the minimum total thickness of the components. (3) The piezoelectric vibrator and the semiconductor element are
Because they are arranged in a relationship,
Can to about half a planar area as compared with the case in which a small
Can be provided.

[Brief description of the drawings]

FIG. 1A is a perspective view showing an embodiment of a piezoelectric oscillator according to the present invention, and FIG. 1B is a main cross-sectional view of FIG. 1A (first embodiment).

FIG. 2 (a) is a main plan view (second section) of the assembly of FIG. 1 (a).
Example), (b) is a main cross-sectional view of FIG.
Example).

FIG. 3 is a sectional view showing an embodiment of a piezoelectric vibrator which is a component of the piezoelectric oscillator of the present invention.

FIG. 4 is a sectional view of a vibrating piece of the piezoelectric vibrator shown in FIG.

FIG. 5 is a sectional view of a plug body of the piezoelectric vibrator shown in FIG. 3;

FIG. 6 is a sectional view of a case body of the piezoelectric vibrator shown in FIG. 3;

FIG. 7 is a state diagram showing an embodiment of solder used for assembling the piezoelectric vibrator shown in FIG. 3;

FIG. 8 is a perspective view of an unconventional piezoelectric oscillator.

FIG. 9 is a main cross-sectional view of an unconventional piezoelectric oscillator.

FIG. 10 is a cross-sectional view of a conventional piezoelectric vibrator.

[Explanation of symbols]

 1 ... Piezoelectric vibrator showing an embodiment of the present invention 2 ... Semiconductor 3 ... Metal lead frame 4 ... Tab of lead frame 5 ... Plural leads 6 of lead frame 6 ··· Lead terminals of piezoelectric vibrator 7 ··· Alloy layer containing solder 8 ··· Resin 9 ··· Fine metal wire 11 ··· Piezoelectric vibrator 12 ··· Semiconductor 18 ··· Resin 101 ··· Electrode 102 ··· Piezoelectric vibrating piece 103 ··· Solder containing 90% or more lead 104 ··· Inner lead of plug body 105 ··· Case body 106 ··· Soldering part 107 of piezoelectric vibrating piece Or welding tsuba

Claims (1)

(57) [Claims] A piezoelectric vibrating reed fixed to a plug body;
Through a lead-tin solder containing 90% or more lead
And a piezoelectric vibrator hermetically press-fitted into the body.
A semiconductor element for oscillating the piezoelectric element,
A metal frame for electrically connecting a moving element , wherein the piezoelectric vibrator and the semiconductor element are the same as the semiconductor element.
With the front and back relation to the tab of the metal frame to be placed
The tab is pushed out toward the piezoelectric vibrator and the case is pushed out.
Contacting the body, the piezoelectric vibrator, the semiconductor element, and the metal frame
Characterized by being integrally formed of resin .