JPH04334202A - Piezoelectric oscillator - Google Patents

Abstract

PURPOSE:To freely change a piezoelectric vibrator by providing a means which loads/unloads the piezoelectric vibrator for a semiconductor package sealing a semiconductor element. CONSTITUTION:The semiconductor element 1 incorporating an oscillation circuit is mounted at the island 3 of a lead frame 2, is connected to the plural lead terminals 4 of the lead frame 2 with wires 5 such as golden wire. They respectively function as VDD, GND, output or a control terminal. The oscillation circuit of the semiconductor element 1 and the connection terminal 6 of the lead frame 2 are similarly connected with the wires 5, and a socket 9 to be engaged with the lead 8 of a crystal resonator 7 is conducted and fixed at the connection terminal 6. Then, the whole is packaged with a resin package 10 except for the lead terminals 4 and the socket 9. Consequently, the piezoelectric oscillator of a desired oscillation frequency can be obtained by inserting the crystal resonator of the desired oscillation frequency into the socket 9.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to piezoelectric oscillators.

0002

2. Description of the Related Art FIG. 6 shows a perspective view of a conventional piezoelectric oscillator.

A piezoelectric oscillator according to the prior art has 31 semiconductor elements and 32 piezoelectric vibrators mounted on 34 lead frames, and each connection is made by bonding with 36 wires, and is packaged in a metal package, plastic mold package, etc. It was a piezoelectric oscillator with an integrated structure.

0004

[Problem to be Solved by the Invention] However, according to conventional piezoelectric oscillators, the frequency of each piezoelectric oscillator can only be obtained from the reference frequency output of the piezoelectric oscillation element attached to the piezoelectric oscillator. It had some problems.

It is also possible to obtain another frequency with respect to the reference frequency of the piezoelectric oscillation element attached to the piezoelectric oscillator using a frequency dividing circuit provided in the piezoelectric oscillating element, but in this case as well, depending on the configuration of the frequency dividing circuit, The problem is that it is only possible to obtain a certain fixed frequency dividing circuit frequency, and it is not possible to freely obtain various frequencies.

SUMMARY OF THE INVENTION The present invention aims to solve these problems, and its purpose is to provide a piezoelectric oscillator in which the piezoelectric vibrator can be freely replaced.

[0007]

[Means for Solving the Problems] The piezoelectric transmitter of the present invention includes:
It is characterized by having means for freely attaching and detaching a piezoelectric vibrator to a semiconductor package in which a semiconductor element is sealed.

[0008] Also, it is characterized in that a socket is used as a means for attaching and detaching.

A further feature is that terminals having different oscillation constants are connected to a plurality of sockets.

0010

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a piezoelectric oscillator according to the present invention will be described using a crystal oscillator as an example, with reference to an assembled diagram in FIG. 1 and a completed diagram in FIG. 2.

Reference numeral 1 denotes a semiconductor element having a built-in oscillation circuit, which is mounted on an island 3 of a lead frame 2 and connected to a plurality of lead terminals 4 of the lead frame 2 by wires 5 such as gold wires, each of which has a VDD , GND, which functions as an output or control terminal. Further, the oscillation circuit of the semiconductor element 1 and the connection terminal 6 of the lead frame 2 are similarly connected by a wire 5, and a ricket 9 to which the lead 8 of the crystal resonator 7 is fitted is attached to the connection terminal 6 by welding or soldering. Conductive and fixed by a method such as attaching.

Thereafter, the entire structure is packaged in a resin package 10 by a transfer molding method or the like, leaving openings for the lead terminals 4 and sockets 9.

Next, the crystal resonator 7 having the required oscillation frequency is connected by inserting the lead 8 into the socket 9, and the crystal oscillator is completed. As shown in FIG.
By abutting against the end face of 0, mechanical fixation is also stabilized.

[0014] If necessary, secure fixing can be achieved by fixing with an adhesive or the like. Further, if necessary, a recessed portion that fits into the case of the crystal resonator 7 may be provided on the end face of the resin package, thereby making it possible to secure the resin package more firmly.

[0015] When it becomes necessary to change the oscillation frequency,
This can be easily done by simply removing the crystal resonator 7 from the socket 9 and replacing it with another crystal resonator having the desired oscillation frequency.

Note that when changing the oscillation frequency of the crystal resonator 7, it is necessary to change the oscillation constant of the oscillation circuit depending on the oscillation frequency band of the crystal resonator. In the example of the crystal oscillator shown in the above embodiment, since the constants of the oscillation circuit are fixed, only the crystal oscillator group having the oscillation frequency within a predetermined range can be changed.

An example of a crystal oscillator to which a crystal resonator having a wider oscillation frequency range is connected will be explained with reference to FIG. In FIG. 3, at least three or more sockets 19 are provided instead of two. Two of them are connected to the semiconductor element 11 as in the previous embodiment, but a capacitor 12 with a different capacity is added to the remaining terminal in the semiconductor element, and when a crystal resonator 17 is connected to this terminal, Crystal resonators with different oscillation frequency bands can be oscillated optimally.

In the above explanation, an example has been described in which a capacitor is changed and added to the socket 19 in order to change the oscillation conditions. may be provided. At this time, the predetermined number of one oscillation circuit may be changed, or furthermore, a plurality of oscillation circuits may be provided, and the necessary terminals of each may be made into sockets, and the oscillation circuits may be used by switching. Note that the mounting position of the socket at this time is not limited to one side of the resin package, but may be placed on other surfaces such as the opposing surface.

Furthermore, although the above embodiments have shown examples in which the socket is placed on the end surface of the resin package, the present invention is not limited to this, and as shown in FIG. 4, the socket is placed on the top or bottom surface of the resin package. It can be provided at any position depending on the purpose of use.

Furthermore, the sockets 9 and 19 have a springy contact structure inside, and the crystal oscillators 7 and 17
The structure is such that the leads 8 and 18 are reliably electrically connected. Therefore, reliability can be maintained even when the crystal oscillators 7 and 17 are replaced.

Furthermore, in the above embodiments, a cylinder-type crystal resonator was described, but the present invention is not limited to this, and may be applied to other metal case resonators such as HC-49V, UM-1, etc. Crystal resonators of other shapes may be used, such as connecting an SMD type resonator manufactured with a case of glass, ceramic, etc. to a socket.Furthermore, the vibration form may be a bending vibration type such as a tuning fork type, a longitudinal vibration type, It may be a contour vibration type or a thickness shear vibration type such as an AT vibrator, and furthermore, other piezoelectric vibrators such as LiTaO3, LiNbO3, or ceramic vibrators may be used instead of just crystal.

FIG. 5 shows an example in which a surface mount type (SMD type) vibrator 20 is used. Here, instead of the lead socket, a socket 22 is provided that maintains conductivity of the electrode 21 of the surface-mounted vibrator 20.

Furthermore, although this embodiment has been explained using a resin package, the present invention is not limited thereto; ceramic,
It may be a package made of metal or the like.

[0024]

[Effects of the Invention] As described above, according to the present invention, several piezoelectric oscillators with one fixed oscillation frequency can be freely used by a semiconductor element mounted in one semiconductor package, without using several piezoelectric oscillators. By replacing the piezoelectric vibrator, a piezoelectric oscillator with the desired frequency can be obtained.

Furthermore, since the connection socket of the piezoelectric vibrator can be taken out in any direction, the mounting direction of the piezoelectric vibrator can be freely selected.

[Brief explanation of drawings]

[Figure 1]

FIG. 2 is a perspective view showing a positional embodiment of the piezoelectric oscillator of the present invention.

FIG. 3 is a perspective view showing an example of the piezoelectric oscillator of the present invention in which piezoelectric vibrators with different oscillation frequency bands are used under optimal conditions.

FIG. 4 is a perspective view showing an example in which the mounting position of the socket of the piezoelectric oscillator of the present invention is arbitrarily changed.

FIG. 5 is a perspective view showing an example in which a surface mount type (SMD type) piezoelectric vibrator is used as the piezoelectric vibrator of the piezoelectric oscillator of the present invention.

FIG. 6 is a diagram showing an example of a conventional piezoelectric oscillator.

[Explanation of symbols]

1, 11, 32 Semiconductor element 2, 34 Lead frame 3 Island 4 Lead terminal 5, 36 wire 6 Connection terminal 7, 17 Crystal resonator 8, 18 lead 9, 19, 22 socket 10 Resin package 12 Capacitor 20　Surface mount type resonator 21 Electrode

Claims (3)

[Claims] 1. A piezoelectric oscillator comprising means for attaching and detaching a piezoelectric vibrator to a semiconductor package in which a semiconductor element is sealed. 2. The piezoelectric oscillator according to claim 1, wherein a socket is used as a means for attaching and detaching the piezoelectric oscillator. 3. The piezoelectric oscillator according to claim 2, wherein terminals having different oscillation constants are connected to a plurality of sockets.