WO1988003962A1 - Procede pour le traitement chimique de corps ceramiques avec metallisation ulterieure - Google Patents

Procede pour le traitement chimique de corps ceramiques avec metallisation ulterieure Download PDF

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Publication number
WO1988003962A1
WO1988003962A1 PCT/EP1987/000720 EP8700720W WO8803962A1 WO 1988003962 A1 WO1988003962 A1 WO 1988003962A1 EP 8700720 W EP8700720 W EP 8700720W WO 8803962 A1 WO8803962 A1 WO 8803962A1
Authority
WO
WIPO (PCT)
Prior art keywords
ceramic bodies
ceramic
chemical treatment
melt
alkali hydroxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP1987/000720
Other languages
German (de)
English (en)
French (fr)
Inventor
August Friedrich BOGENSCHÜTZ
Robert Ostwald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Bayer Pharma AG
Original Assignee
Licentia Patent Verwaltungs GmbH
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH, Schering AG filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE8787907598T priority Critical patent/DE3773488D1/de
Priority to AT87907598T priority patent/ATE68018T1/de
Publication of WO1988003962A1 publication Critical patent/WO1988003962A1/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1855—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by mechanical pretreatment, e.g. grinding, sanding
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
    • C23C18/1865—Heat
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Definitions

  • the invention relates to a method for the chemical treatment of ceramic bodies with subsequent metallization according to the preamble of patent claim 1
  • the invention has for its object to provide a further embodiment of the invention according to the main patent.
  • the invention is based on the knowledge that a decisive prerequisite for a uniform and reliably high occupancy density of catalytic nuclei and a uniformly high adhesive strength of the electrolessly chemically deposited copper layer is to achieve a reproducible pretreatment with regard to cleaning, wettability and roughening of the ceramic surface what is not considered in known methods.
  • the invention is based on the fact that, in particular, the so-called "glass-like burning skin", which makes most ceramic qualities chemically inert, is reproducibly removed.
  • the ceramic surfaces not only cleaned, but rather activated by a chemical removal process so that chemical bonds to the surfaces of exposed ceramic crystals can take place.
  • this removal process must neither roughen the surfaces too much nor loosen the material structure, since otherwise the required mechanical anchoring will break out too easily.
  • a chemical etching process that primarily removes the "glassy burning skin” is therefore the most suitable.
  • a number of etchants are known from the literature for the ceramic substrate material aluminum oxide most commonly used in electronics (cf., for example, R.
  • the small amounts of alkali metal hydroxide being distributed unevenly and reacting rapidly with the substrate, so that no further etching attack can take place.
  • a freshly applied NaOH melt with a few percent water causes quite good roughening, but its effect is very difficult to reproduce.
  • a constant and at the same time higher water content of the NaOH melt can be achieved by a gas atmosphere pair with a certain water vapor partial pressure (as described in P 3523 961.1) above the melt. If this atmosphere also ensures that no carbon dioxide can melt, its carbonation is also effectively prevented.
  • the process can also be carried out just as well with the other alkali hydroxides such as LiOH and KOH or mixtures thereof.
  • the process is not limited to oxide ceramics but also to other types of ceramics such as Aluminum nitride, silicon nitride or silicon carbide applicable.
  • the substrate is successively immersed in a tin (II) chloride solution, in water and in a palladium chloride solution and finally rinsed in water in order to be coated with catalytic germs in a known manner. Then there is the electroless chemical deposition of an approximately 0.3 ⁇ m thick copper base layer from a currently commercially available chemical copper-formaldehyde bath and after rinsing the copper layer is strengthened to approximately 15 ⁇ m in a currently commercially available galvanic copper sulfate bath.
  • Peeling of these strips was measured. It will be one Peeling force of approximately 0.7 N / mm was found. Without pretreatment in the KOH-NaOH melt, the adhesion of the copper layer is non-uniform and at most has a peeling force of 0.1 N / mm.
  • Aluminum nitride ceramic substrates as in Example 1, are immersed in a sodium hydroxide melt for 10 minutes after preheating to 300 ° C., over which a nitrogen water vapor stream has been passed for 2 hours beforehand.
  • the temperature of the melt was 320 ° C.
  • the ceramic samples had an average roughness of approximately 1.5 ⁇ m after rinsing and drying.
  • pre-metallization was carried out with approximately 0.1 ⁇ m nickel phosphorus from a currently commercially available nickel hypophosphite bath and, after rinsing in a copper sulfate bath, galvanically reinforced to a layer thickness of approximately 15 ⁇ m with copper. After the photo-etching production of 1 mm wide strips, peeling forces of 1.0 N / mm were measured.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
PCT/EP1987/000720 1985-07-04 1987-11-20 Procede pour le traitement chimique de corps ceramiques avec metallisation ulterieure Ceased WO1988003962A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE8787907598T DE3773488D1 (de) 1985-07-04 1987-11-20 Verfahren zur chemischen behandlung von keramikkoerpern mit nachfolgender metallisierung.
AT87907598T ATE68018T1 (de) 1985-07-04 1987-11-20 Verfahren zur chemischen behandlung von keramikkoerpern mit nachfolgender metallisierung.

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19853523958 DE3523958A1 (de) 1985-07-04 1985-07-04 Verfahren zur chemischen behandlung von keramikkoerpern mit nachfolgender metallisierung
DEP3639642.7 1986-11-20
DE19863639642 DE3639642A1 (de) 1985-07-04 1986-11-20 Verfahren zur chemischen behandlung von keramikkoerpern mit nachfolgender metallisierung

Publications (1)

Publication Number Publication Date
WO1988003962A1 true WO1988003962A1 (fr) 1988-06-02

Family

ID=39327167

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1987/000720 Ceased WO1988003962A1 (fr) 1985-07-04 1987-11-20 Procede pour le traitement chimique de corps ceramiques avec metallisation ulterieure

Country Status (6)

Country Link
US (1) US4913784A (https=)
EP (2) EP0209748B1 (https=)
JP (2) JPS627685A (https=)
AT (2) ATE48287T1 (https=)
DE (4) DE3523958A1 (https=)
WO (1) WO1988003962A1 (https=)

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* Cited by examiner, † Cited by third party
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DE3523958A1 (de) * 1985-07-04 1987-01-08 Licentia Gmbh Verfahren zur chemischen behandlung von keramikkoerpern mit nachfolgender metallisierung
US4821674A (en) * 1987-03-31 1989-04-18 Deboer Wiebe B Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment
US5234562A (en) * 1988-11-07 1993-08-10 Matsushita Electric Industrial Co., Ltd. Electroplating apparatus for coating a dielectric resonator
SG48729A1 (en) * 1993-05-14 1998-05-18 Kyokawa Mekki Kogyo Kk Metal film resistor having fuse function and method for producing the same
DE4436903C2 (de) * 1994-10-15 2003-10-30 Daimler Chrysler Ag Anordnung zur elektromagnetischen Abschirmung von elektronischen Schaltungen und Verfahren zur Herstellung einer solchen Anordnung
DE19541299C1 (de) * 1995-11-06 1997-03-13 Siemens Ag Verfahren zum Auflösen eines ausgehärteten Glaslotes
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
US7910218B2 (en) 2003-10-22 2011-03-22 Applied Materials, Inc. Cleaning and refurbishing chamber components having metal coatings
US7618769B2 (en) * 2004-06-07 2009-11-17 Applied Materials, Inc. Textured chamber surface
US7670436B2 (en) 2004-11-03 2010-03-02 Applied Materials, Inc. Support ring assembly
FR2885995B1 (fr) * 2005-05-20 2007-07-06 Eurokera Plaque vitroceramique et son procede de fabrication
US8617672B2 (en) 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
US7762114B2 (en) * 2005-09-09 2010-07-27 Applied Materials, Inc. Flow-formed chamber component having a textured surface
US9127362B2 (en) 2005-10-31 2015-09-08 Applied Materials, Inc. Process kit and target for substrate processing chamber
US8647484B2 (en) * 2005-11-25 2014-02-11 Applied Materials, Inc. Target for sputtering chamber
US20070283884A1 (en) * 2006-05-30 2007-12-13 Applied Materials, Inc. Ring assembly for substrate processing chamber
US7981262B2 (en) 2007-01-29 2011-07-19 Applied Materials, Inc. Process kit for substrate processing chamber
US7942969B2 (en) * 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
US20080318071A1 (en) * 2007-06-21 2008-12-25 Moen Incorporated Metallic coating on substrate
US9101954B2 (en) 2013-09-17 2015-08-11 Applied Materials, Inc. Geometries and patterns for surface texturing to increase deposition retention
EP3170228B1 (en) * 2014-07-16 2019-05-01 Siemens Aktiengesellschaft Subsea electrical connector component and method of manufacturing thereof
US11827574B2 (en) 2018-09-14 2023-11-28 Honeywell International Inc. Method of pressure sintering an environmental barrier coating on a surface of a ceramic substrate
US11084761B2 (en) 2018-09-14 2021-08-10 Honeywell International Inc. Method of pressure sintering an environmental barrier coating on a surface of a ceramic substrate
KR102335531B1 (ko) * 2019-05-17 2021-12-07 주식회사 아모센스 세라믹 기판 제조 방법
RU2723475C1 (ru) * 2019-11-01 2020-06-11 Акционерное общество "Научно-производственное предприятие "Пульсар" Способ подготовки поверхности подложки из алюмонитридной керамики с отверстиями, сформированными лазерной резкой, под тонкоплёночную металлизацию
CN118486868B (zh) * 2024-05-24 2025-01-24 太原工业学院 双面粗糙的固体氧化物燃料电池电解质薄膜的水解法制备工艺

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EP0128476A2 (en) * 1983-06-09 1984-12-19 Kollmorgen Technologies Corporation Metallization of ceramics
EP0133201A2 (en) * 1983-06-09 1985-02-20 Kollmorgen Technologies Corporation Metallization of ceramics

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EP0128476A2 (en) * 1983-06-09 1984-12-19 Kollmorgen Technologies Corporation Metallization of ceramics
EP0133201A2 (en) * 1983-06-09 1985-02-20 Kollmorgen Technologies Corporation Metallization of ceramics

Also Published As

Publication number Publication date
US4913784A (en) 1990-04-03
DE3523958A1 (de) 1987-01-08
DE3667182D1 (de) 1990-01-04
JPH01502679A (ja) 1989-09-14
JPS627685A (ja) 1987-01-14
DE3773488D1 (de) 1991-11-07
ATE68018T1 (de) 1991-10-15
EP0290539A1 (de) 1988-11-17
EP0290539B1 (de) 1991-10-02
EP0209748B1 (de) 1989-11-29
EP0209748A1 (de) 1987-01-28
JPH037635B2 (https=) 1991-02-04
DE3639642A1 (de) 1988-05-26
ATE48287T1 (de) 1989-12-15

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