WO1987005243A1 - Process and device for microsoldering - Google Patents
Process and device for microsoldering Download PDFInfo
- Publication number
- WO1987005243A1 WO1987005243A1 PCT/EP1987/000122 EP8700122W WO8705243A1 WO 1987005243 A1 WO1987005243 A1 WO 1987005243A1 EP 8700122 W EP8700122 W EP 8700122W WO 8705243 A1 WO8705243 A1 WO 8705243A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solder
- laser
- melting point
- soldering
- workpiece
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/034—Observing the temperature of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
Definitions
- the invention relates to a method for micro soldering, in which a solder joint and the solder applied to it are heated on a workpiece with the aid of a laser beam, and a device for carrying it out.
- the known and widespread laser welding process is characterized by non-contact or pressure-free, thermally closely localized, dimensionally exact and very finely structured, easily automatable working method and is therefore becoming increasingly important in precision engineering, micromechanics and microtechnology.
- micro plotting with the laser has so far not been widely used.
- laser micro soldering with metal or glass solders would solve many design problems wherever small parts of different materials need to be thermally soldered to one another. Areas of application include e.g. the pressure-free contacting and joining of thermally and mechanically highly sensitive micromechanical sensors, the connection of glass fiber light guides or composite elements made of glass, ceramic and metal such as quartz crystals, piezo elements, photodiodes, optocouplers, mini-electrolytic capacitors, luminescence diodes, micromagnets, toroidal cores with amorphous metals and the like .
- quartz crystals glass, ceramic and metal
- photodiodes e.g. the connection of glass fiber light guides or composite elements made of glass, ceramic and metal
- photodiodes e.g. the connection of glass fiber light guides or composite elements made of glass, ceramic and metal such as quartz crystals, piezo elements, photodiodes, optocouplers, mini-electr
- CC soldering lasers have only recently been offered for micro soldering.
- COg lasers cannot be focused finely enough and reflect more strongly on metals than, for example, shorter-wave solid-state YAG lasers.
- the extremely strong absorption differences in CO 2 lasers - for example approx. 951 for plastic substrates and approx. 5% for metals such as gold - lead to correspondingly extreme temperature differences at the material boundaries and thus to overheating, blistering and cracking and tension.
- microlotting using solid-state lasers did not lead to use in the Series production, although attempts have been made to solve the problem via energy control.
- a tightly tolerated temperature is a key requirement for perfect soldering.
- a contactless online temperature control and control with IR detector is possible, but is difficult because of the different IR radiation / emissivity of the different materials.
- this is achieved in that the heat radiation of the heated solder is measured with an infrared detector and the discontinuity which occurs when the melting point of the solder is reached is determined from the measurement signal with the aid of an electronic device and that after the melting point determined in this way is reached, the heating process for the solder joint is canceled.
- the heating process can expediently also be terminated after an adjustable delay time, so that the solder is heated further beyond the melting point in a definable manner.
- the termination of the heating process is advantageously effected by moving the workpiece further.
- This has the advantage that the laser itself can be operated at a constant power or pulse frequency. Since the workpiece must be movable relative to the laser beam anyway and therefore mounted on an xy table, its drive can be controlled directly by the electronics, which detect the melting point and deliver a possibly delayed signal when it is reached. This has an advantageous effect that the AL 2 0 3 substrates used in microelectronics hardly absorb the 1.06 ⁇ m light of the Nd-YAG laser and are therefore not heated. The direction of the further movement is determined by the workpiece or by the programming of the solder path.
- the solder joint is pulsed with the laser beam or heated until the required temperature is reached.
- the further movement of the workpiece when the temperature has been reached results in a particularly simple regulation since the laser itself does not have to be influenced.
- the level of the laser power is set beforehand for the material and the respective melting or Soldering temperature, which also depends on the flux and the amount of solder, layer thickness and shape of the solder pad, is reached over the respective exposure time. Over and under temperatures are reliably avoided, so that real soldering is achieved.
- the accuracy of the temperature setting increases with the laser beam diameter and is inversely proportional to the radiation energy density and the working speed, which enables a comprehensive response to the specific needs of the workpiece.
- a more precise temperature setting can also be achieved by preheating (- 30 ⁇ C) and matting the solder joints or contact materials.
- Fig. 3 shows the heat absorption of the solder as a function of the temperature.
- FIG. 1 shows a schematic representation of the plant used to carry out the method according to the invention.
- the workpiece W to be machined is located on an xy coordinate table K, which can be moved in the workpiece plane in a known manner by means of a coordinate path control KS.
- the coordinate control KS has a computer interface RS and a program memory PA and can in turn be programmed with respect to the coordinates to be controlled via a program input PE.
- a continuous wave YAG laser L is arranged above it, which supplies the laser beam LS.
- This laser is controlled by a supply device VG, which contains the clock generator and the pulse duration control for the laser L. It also expediently contains a device for measuring power for the laser L.
- the measuring beam path MS of which is aligned with the soldering point on the workpiece W.
- This measures the heat radiation emanating from the solder joint and generates in the amplifier IV a corresponding digital signal for the surface temperature of the solder joint, which is passed on to a microprocessor MIR.
- a microprocessor MIR To monitor the amplifier IV expediently contains a digital display for the solder joints temperature.
- the spectral sensitivity of the IR detector is adapted to the measuring temperature range.
- the microprocessor MIR contains the measured value interpretation and control software, which determines the melting point of the solder at the soldering point from the temperature curve supplied by the amplifier IV.
- the pulse is sent to the coordinate route control KS via its computer interface RS.
- the coordinate path control KS in turn delivers a signal back to the microprocessor MIR after the workpiece movement has been completed.
- the microprocessor MIR has a connection to the supply device VG for the laser L, via which the laser L can be switched off, for example, during a longer distance feed.
- FIG. 2 shows a measurement curve with the IR emission behavior as a function of the temperature in the case of a heated solder made of Sn / PB alloy
- FIG. 3 shows the heat absorption of the solder as a function of the temperature.
- the curve according to FIG. 2 was measured with an IR spectral pyroeter during heating and cooling. With constant supply of heat, the emission increases until a flattening occurs when the melting point is reached. At the point t A at which the solder is completely liquefied and the temperature or IR emission increases again, the heat supply is switched off. Due to the inertia of the system used for the measurement, the emission is increased until the maximum is exceeded and the solidification point is reached after cooling.
- the additional increase in temperature beyond the melting point can, if desired, be programmed to be fixed or changeable by delaying the transmission of the signal or by subtracting the value corresponding to the temperature increase from the measured variable.
- FIG. 3 shows the heat absorption of the solder as a function of the temperature.
- the increased absorption at the melting point which leads to the discontinuity used in the infrared emission, can be clearly seen.
- the calorimetric measurement was carried out using a differential scanning calorimeter (DSC 2 from Perkin-Elmer).
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Laser Beam Processing (AREA)
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT87901471T ATE65198T1 (de) | 1986-03-01 | 1987-02-28 | Verfahren und vorrichtung zum mikroloeten. |
DE8787901471T DE3771416D1 (de) | 1986-03-01 | 1987-02-28 | Verfahren und vorrichtung zum mikroloeten. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19863606764 DE3606764A1 (de) | 1986-03-01 | 1986-03-01 | Verfahren und vorrichtung zum mikroloeten |
DEP3606764.4 | 1986-03-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1987005243A1 true WO1987005243A1 (en) | 1987-09-11 |
Family
ID=6295296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP1987/000122 WO1987005243A1 (en) | 1986-03-01 | 1987-02-28 | Process and device for microsoldering |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0257076B1 (de) |
DE (2) | DE3606764A1 (de) |
WO (1) | WO1987005243A1 (de) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0364422A1 (de) * | 1988-10-14 | 1990-04-18 | Aktiebolaget Electrolux | Verfahren und Vorrichtung zum Verbinden von Werkstücken mittels Hart- oder Weichlöten |
EP0402832A1 (de) * | 1989-06-15 | 1990-12-19 | Siemens Nixdorf Informationssysteme Aktiengesellschaft | Verfahren zur Führung des Temperaturverlaufes an Lötstellen beim Laserlöten |
US10081079B2 (en) | 2016-12-08 | 2018-09-25 | General Electric Company | Method and system for confined laser cutting |
DE102020116394A1 (de) | 2020-06-22 | 2021-12-23 | Pac Tech - Packaging Technologies Gmbh | Verfahren zur Überwachung eines Laserlötprozesses und Laserlötsystem |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3828590A1 (de) * | 1988-08-23 | 1990-03-22 | Productech Gmbh | Aenderungen der prozess-parameter als funktion der thermischen lasten einer waermequelle besonders beim impulsloeten |
DE3829350A1 (de) * | 1988-08-30 | 1990-03-01 | Messerschmitt Boelkow Blohm | Verfahren und einrichtung zur positionierung von loetlasern |
DE3903860C2 (de) * | 1989-02-10 | 1993-12-02 | Deutsche Aerospace | Verfahren und Vorrichtung zum Lasermikrolöten |
DE4105874C1 (de) * | 1991-02-25 | 1992-07-30 | Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De | |
DE4105875C1 (de) * | 1991-02-25 | 1992-08-13 | Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De | |
DE4200492C2 (de) * | 1991-10-04 | 1995-06-29 | Ghassem Dipl Ing Azdasht | Vorrichtung zum elektrischen Verbinden von Kontaktelementen |
DE4135685C1 (en) * | 1991-10-30 | 1993-06-03 | Friedhelm 7441 Neckartailfingen De Kussmaul | Temp. regulated soldering or de:soldering tool - has tip contg. glass fibre for IR transmission to IR sensor |
DE9113986U1 (de) * | 1991-11-11 | 1992-04-16 | Zevac Ausloetsysteme Gmbh, 3548 Arolsen, De | |
DE4219132A1 (de) * | 1992-06-11 | 1993-12-16 | Suess Kg Karl | Verfahren zum Herstellen von Silizium/Glas- oder Silizium/Silizium-Verbindungen |
AT398177B (de) * | 1992-07-03 | 1994-10-25 | Als Applikationen Fuer Lasersy | Verfahren zum löten und vorrichtung zur durchführung dieses verfahrens |
DE19850595C2 (de) * | 1998-11-03 | 2002-07-04 | Hahn Schickard Ges | Verfahren zum Laserlöten von Halbleiterchips |
DE10015938C2 (de) * | 2000-03-30 | 2002-10-31 | Bosch Gmbh Robert | Laser-Lötvorrichtung und Verfahren zum Abschätzen des Emissionsgrades einer Lötstellenoberfläche |
GB0015108D0 (en) * | 2000-06-20 | 2000-08-09 | Central Research Lab Ltd | Apparatus and method for producing pulsed mid infra-red radiation |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0069189A2 (de) * | 1981-06-30 | 1983-01-12 | International Business Machines Corporation | Flussmittelloses Lötverfahren |
EP0168605A2 (de) * | 1984-06-11 | 1986-01-22 | Vanzetti Systems, Inc. | Berührungsfreie Ermittlung der Verflüssigung bei schmelzbaren Stoffen |
-
1986
- 1986-03-01 DE DE19863606764 patent/DE3606764A1/de not_active Ceased
-
1987
- 1987-02-28 WO PCT/EP1987/000122 patent/WO1987005243A1/de not_active Application Discontinuation
- 1987-02-28 EP EP87901471A patent/EP0257076B1/de not_active Expired - Lifetime
- 1987-02-28 DE DE8787901471T patent/DE3771416D1/de not_active Revoked
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0069189A2 (de) * | 1981-06-30 | 1983-01-12 | International Business Machines Corporation | Flussmittelloses Lötverfahren |
EP0168605A2 (de) * | 1984-06-11 | 1986-01-22 | Vanzetti Systems, Inc. | Berührungsfreie Ermittlung der Verflüssigung bei schmelzbaren Stoffen |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN, Band 7, Nr. 230, (M-249)(1375) 12. Oktober 1983 & JP, A, 5812175 (Nippon Denki K.K.) siehe das ganze dokument * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0364422A1 (de) * | 1988-10-14 | 1990-04-18 | Aktiebolaget Electrolux | Verfahren und Vorrichtung zum Verbinden von Werkstücken mittels Hart- oder Weichlöten |
EP0402832A1 (de) * | 1989-06-15 | 1990-12-19 | Siemens Nixdorf Informationssysteme Aktiengesellschaft | Verfahren zur Führung des Temperaturverlaufes an Lötstellen beim Laserlöten |
US10081079B2 (en) | 2016-12-08 | 2018-09-25 | General Electric Company | Method and system for confined laser cutting |
DE102020116394A1 (de) | 2020-06-22 | 2021-12-23 | Pac Tech - Packaging Technologies Gmbh | Verfahren zur Überwachung eines Laserlötprozesses und Laserlötsystem |
DE102020116394B4 (de) | 2020-06-22 | 2022-03-24 | Pac Tech - Packaging Technologies Gmbh | Verfahren zur Überwachung eines Laserlötprozesses und Laserlötsystem |
Also Published As
Publication number | Publication date |
---|---|
EP0257076A1 (de) | 1988-03-02 |
EP0257076B1 (de) | 1991-07-17 |
DE3606764A1 (de) | 1987-09-03 |
DE3771416D1 (de) | 1991-08-22 |
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