USH1267H - Integrated circuit and lead frame assembly - Google Patents

Integrated circuit and lead frame assembly Download PDF

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Publication number
USH1267H
USH1267H US07/549,504 US54950490A USH1267H US H1267 H USH1267 H US H1267H US 54950490 A US54950490 A US 54950490A US H1267 H USH1267 H US H1267H
Authority
US
United States
Prior art keywords
lead frame
leads
integrated circuit
circuit assembly
substantially planar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US07/549,504
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English (en)
Inventor
Melissa D. Boyd
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Priority to US07/549,504 priority Critical patent/USH1267H/en
Assigned to HEWLETT-PACKARD COMPANY reassignment HEWLETT-PACKARD COMPANY ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: BOYD, MELLSSA D.
Priority to EP19910306084 priority patent/EP0465253A3/en
Priority to JP3190589A priority patent/JPH04233244A/ja
Application granted granted Critical
Publication of USH1267H publication Critical patent/USH1267H/en
Assigned to HEWLETT-PACKARD COMPANY reassignment HEWLETT-PACKARD COMPANY MERGER (SEE DOCUMENT FOR DETAILS). Assignors: HEWLETT-PACKARD COMPANY
Assigned to AGILENT TECHNOLOGIES, INC. reassignment AGILENT TECHNOLOGIES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HEWLETT-PACKARD COMPANY, A DELAWARE CORPORATION
Assigned to AVAGO TECHNOLOGIES GENERAL IP PTE. LTD. reassignment AVAGO TECHNOLOGIES GENERAL IP PTE. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AGILENT TECHNOLOGIES, INC.
Assigned to AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD. reassignment AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Assigned to AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. reassignment AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. MERGER (SEE DOCUMENT FOR DETAILS). Assignors: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
Assigned to DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT reassignment DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT PATENT SECURITY AGREEMENT Assignors: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Assigned to AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. reassignment AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Assignors: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Assigned to AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. reassignment AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 017207 FRAME 0020. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Assignors: AGILENT TECHNOLOGIES, INC.
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Definitions

  • the present invention relates to integrated circuit and lead frame assemblies and more particularly, to such assemblies which are implemented in a tape automated bonding (TAB) process.
  • TAB tape automated bonding
  • Tape automated bonding is a technique for connecting conductive leads to the electrical contacts on an integrated circuit chip, known as a die. When such leads are so connected, they can be used to interconnect the integrated circuit with additional circuitry.
  • a strip of film is divided into a plurality of adjacent rectangular segments, each of which has a plurality of conductive leads etched thereon. The leads in each segment are referred to as a lead frame.
  • a die mounted on a central portion of each lead frame is electrically connected to the inner ends of the leads in the frame in a known manner.
  • the film or tape upon which the die are mounted may be wound onto reels prior to additional processing, testing and the like. After final testing, the tape is cut into individual TAB segments, each of which contains a die and an associated lead frame.
  • the leads are arranged so that the inner extremities thereof define a predetermined rectangular pattern which corresponds to a substantially identical pattern of contacts or bumps on the integrated circuit die to which each of the leads is connected.
  • the outer extremity of each lead may thus be used to connect the integrated circuit to other components.
  • TAB bonding is limited in the number of leads which can be routed to an integrated circuit (IC) due to processes in fabricating the TAB tape which limit the spacing of the leads. This is a particular problem on some integrated circuits which can require as many as 250 or more leads. It would be desirable to increase the number of lead connections which can be made to an integrated circuit.
  • An integrated circuit assembly comprises an integrated circuit having first and second sets of contact pads mounted thereon.
  • a first lead frame comprises a substantially planar array of leads and has the inner extremities thereof connected to the first set of contact pads. In the central portion of the lead frame an opening is defined by the inner extremities of the leads.
  • a second lead frame has a plurality of leads which extend through the opening and which are connected to the second set of contact pads.
  • a method of creating such an assembly is also provided.
  • FIG. 1 is a plan view of an integrated circuit constructed in accordance with the present invention.
  • FIG. 2 is a plan view of a first lead frame connected to the integrated circuit of FIG. 1.
  • FIG. 3 is a plan view of a second lead frame connected to the structure illustrated in FIG. 2.
  • FIG. 4 is a cross-sectional view taken along 3--3 in FIG. 3.
  • the die includes a body 12 which incorporates a silicon wafer (not visible) having the integrated circuit fabricated therein in a known manner.
  • the body includes an upper surface 14 which is coated with a passivation layer to protect the integrated circuit.
  • a first set of contact pads 16 comprise a plurality of bumps, like bumps 18, 20, 22, 24, which are formed in a square adjacent the perimeter of die 10.
  • a second set of contact pads, indicated generally at 26, includes a plurality of bumps, like bumps 28, 30, 32, which are formed in a square concentric with the square formed by the contact pads in first set 16.
  • the bumps in each of sets 16, 26 comprise gold posts which extend above passivation surface 14 approximately 1 mil to provide a mechanical stand-off from surface 14 for connecting leads thereto.
  • Each of the bumps is electrically connected to internal regions of the integrated circuit in die 10.
  • Die 10, including the bumps formed thereon, is fabricated utilizing a well known process. It is to appreciated that the present invention may also be implemented with an unbumped die.
  • die 10 is shown interconnected with a first lead frame 34.
  • the lead frame is supported on a square, substantially planar base 36 having a central square opening 38 therethrough.
  • Base 36 is made from a polyimide film. Polyester or glass-reinforced epoxy films are equally suitable as a material for base 36.
  • Lead frame 34 includes a plurality of conductive leads, like leads 39, 40, 41, 42, 44, 45, which are connected to and supported by base 36.
  • the leads, like leads 39-45 extend over the outer edge of base 36 as shown.
  • Some of the leads extend inwardly to a bump, like lead 41 extends to bump 20, on die 10.
  • Others of the leads, like lead 42 extend inwardly part way to the edge of opening 38 in base 36.
  • the short leads, like leads 40, 42 are referred to herein as traces.
  • the long leads, like leads 41, 44, 45 include inner ends which are connected to the bumps and which form an opening in the lead frame formed by the long leads.
  • FIG. 3 indicated generally at 53 is an integrated circuit and lead frame assembly constructed in accordance with the present invention. Included therein is a second lead frame 54 which is shown laid over the structure illustrated in FIG. 2.
  • Assembly 53 includes a planar base 56 having a central opening 58 therethrough.
  • base 56 comprises a polyimide film which is substantially square and concentric with square opening 58.
  • Base 56 supports a plurality of conductive leads, like leads 60, 62, 64.
  • Each of the leads includes an inner and outer end, like inner end 66 and outer end 68 (in FIG. 4) on lead 60.
  • An outer extremity 70 of lead 60 is connected to trace 40 on lead frame 34 directly therebeneath.
  • the manner of making the connection is conventional and can comprise a solder connection or one made with conductive epoxy.
  • Each of the leads on second lead frame 54 includes an inner end which extends over opening 58 and which is connected to one of the bumps which form the contact pads in second set 26, like end 66 is connected to bump 28.
  • Each of the outer lead ends on second lead frame 54 extends over the outer edge thereof and is connected to one of the traces on first lead frame 34, like outer end 68 of lead 60 is connected to trace 40. Since bases 36, 56 are substantially planar and are parallel to one another, the outer and inner ends of the leads in second lead frame 54 include bends which extend downwardly from the lead frame to connect with the bumps.
  • Each of the bumps in both sets 16, 26 is thus electrically connected to a different lead over one of slots 48, 50, 52, 54.
  • the outer ends of the leads mounted on base 36 are bent as shown in FIG. 4 to facilitate attachment to a circuit board.
  • die 10 is first fabricated, in a known manner, to produce gold bumps in a first set 16 and a second set 26, best illustrated in FIG. 1.
  • Lead frames 34, 54 and the bases 36, 56, respectively, are also manufactured using known TAB processes.
  • Lead frame 34 is connected to die 10 by positioning the two components as illustrated in FIG. 4 with the inner ends of the leads over the first set 16 of bumps. Thereafter, the inner lead ends are gang bonded to the bumps using known gang bonding technology.
  • the present invention can be also implemented with unbumped die and single-point bonding.
  • lead frame 54 With lead frame 34 and die 10 so connected to one another, lead frame 54 is positioned relative to the die and first lead frame as shown in FIG. 4.
  • the inner ends of the leads on lead frame 54 are then connected to the bumps in set 26, via, e.g., gang bonding or single-point bonding.
  • the outer leads on frame 54 are connected to traces, like traces 40, 42 on lead frame 34, by soldering or with conductive epoxy. Other techniques, such as single-point bonding or laser welding may be equally well used.
  • An integrated circuit and lead frame assembly is thus provided which increases the number of leads which can be connected to an integrated circuit.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
US07/549,504 1990-07-05 1990-07-05 Integrated circuit and lead frame assembly Abandoned USH1267H (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US07/549,504 USH1267H (en) 1990-07-05 1990-07-05 Integrated circuit and lead frame assembly
EP19910306084 EP0465253A3 (en) 1990-07-05 1991-07-04 Integrated circuit and lead frame assembly
JP3190589A JPH04233244A (ja) 1990-07-05 1991-07-04 集積回路アセンブリ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/549,504 USH1267H (en) 1990-07-05 1990-07-05 Integrated circuit and lead frame assembly

Publications (1)

Publication Number Publication Date
USH1267H true USH1267H (en) 1993-12-07

Family

ID=24193280

Family Applications (1)

Application Number Title Priority Date Filing Date
US07/549,504 Abandoned USH1267H (en) 1990-07-05 1990-07-05 Integrated circuit and lead frame assembly

Country Status (3)

Country Link
US (1) USH1267H (ja)
EP (1) EP0465253A3 (ja)
JP (1) JPH04233244A (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5534729A (en) * 1993-06-29 1996-07-09 Texas Instruments Incorporated Integrated circuit lead frame for coupling to non-neighboring bond pads
US5598030A (en) * 1992-05-21 1997-01-28 Kabushiki Kaisha Toshiba Semiconductor device having multilevel tab leads
US5757082A (en) * 1995-07-31 1998-05-26 Rohm Co., Ltd. Semiconductor chips, devices incorporating same and method of making same
US6150728A (en) * 1995-05-12 2000-11-21 Mitsubishi Denki Kabushiki Kaisha Semiconductor memory device having a pad arrangement with reduced occupying area
US20040212053A1 (en) * 2003-04-28 2004-10-28 Koh Wei H. Semiconductor package for random access memory integrated circuits
US20050121421A1 (en) * 2001-10-02 2005-06-09 Neil Kirby Method of manufacturing circuits
US20060097367A1 (en) * 2004-04-01 2006-05-11 Agere Systems Inc. Integrated circuit device having flexible leadframe

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4239857A1 (de) * 1992-11-27 1994-06-01 Abb Research Ltd Leistungshalbleitermodul
US5340771A (en) * 1993-03-18 1994-08-23 Lsi Logic Corporation Techniques for providing high I/O count connections to semiconductor dies
JP3564970B2 (ja) * 1997-02-17 2004-09-15 セイコーエプソン株式会社 テープキャリアおよびこれを用いたテープキャリアデバイス
JP2001217380A (ja) * 2000-02-04 2001-08-10 Hitachi Ltd 半導体装置およびその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6377127A (ja) * 1986-09-19 1988-04-07 Mitsubishi Electric Corp 半導体装置
JPS63124434A (ja) * 1986-11-12 1988-05-27 Mitsubishi Electric Corp 半導体装置の製造方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5598030A (en) * 1992-05-21 1997-01-28 Kabushiki Kaisha Toshiba Semiconductor device having multilevel tab leads
US5534729A (en) * 1993-06-29 1996-07-09 Texas Instruments Incorporated Integrated circuit lead frame for coupling to non-neighboring bond pads
US6150728A (en) * 1995-05-12 2000-11-21 Mitsubishi Denki Kabushiki Kaisha Semiconductor memory device having a pad arrangement with reduced occupying area
US5757082A (en) * 1995-07-31 1998-05-26 Rohm Co., Ltd. Semiconductor chips, devices incorporating same and method of making same
US20050121421A1 (en) * 2001-10-02 2005-06-09 Neil Kirby Method of manufacturing circuits
US7642126B2 (en) * 2001-10-02 2010-01-05 Poly-Flex Circuits Limited Method of manufacturing circuits
US20040212053A1 (en) * 2003-04-28 2004-10-28 Koh Wei H. Semiconductor package for random access memory integrated circuits
US7781873B2 (en) * 2003-04-28 2010-08-24 Kingston Technology Corporation Encapsulated leadframe semiconductor package for random access memory integrated circuits
US20060097367A1 (en) * 2004-04-01 2006-05-11 Agere Systems Inc. Integrated circuit device having flexible leadframe
US7541220B2 (en) * 2004-04-01 2009-06-02 Agere Systems Inc. Integrated circuit device having flexible leadframe

Also Published As

Publication number Publication date
JPH04233244A (ja) 1992-08-21
EP0465253A2 (en) 1992-01-08
EP0465253A3 (en) 1992-07-15

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