USD998577S1 - Temporary protective film for manufacturing semiconductor devices - Google Patents

Temporary protective film for manufacturing semiconductor devices Download PDF

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Publication number
USD998577S1
USD998577S1 US29/834,586 US202229834586F USD998577S US D998577 S1 USD998577 S1 US D998577S1 US 202229834586 F US202229834586 F US 202229834586F US D998577 S USD998577 S US D998577S
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US
United States
Prior art keywords
protective film
semiconductor devices
manufacturing semiconductor
temporary protective
temporary
Prior art date
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Application number
US29/834,586
Inventor
Naoki Tomori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JPD2019-25326F external-priority patent/JP1667641S/ja
Priority claimed from JPD2019-25330F external-priority patent/JP1667713S/ja
Priority claimed from JPD2019-25329F external-priority patent/JP1667712S/ja
Application filed by Resonac Corp filed Critical Resonac Corp
Priority to US29/834,586 priority Critical patent/USD998577S1/en
Assigned to HITACHI CHEMICAL COMPANY, LTD. reassignment HITACHI CHEMICAL COMPANY, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TOMORI, NAOKI
Assigned to RESONAC CORPORATION reassignment RESONAC CORPORATION CHANGE OF NAME Assignors: SHOWA DENKO MATERIALS CO., LTD.
Application granted granted Critical
Publication of USD998577S1 publication Critical patent/USD998577S1/en
Assigned to RESONAC CORPORATION reassignment RESONAC CORPORATION CHANGE OF ADDRESS Assignors: RESONAC CORPORATION
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of a temporary protective film for manufacturing semiconductor devices of the present invention;
FIG. 2 is a front view of the thereof.
FIG. 3 is a rear view of the thereof.
FIG. 4 is a top view of the thereof.
FIG. 5 is a bottom view of the thereof.
FIG. 6 is a left side view of the thereof.
FIG. 7 is a right side view of the thereof; and,
FIG. 8 is a sectional view taken along the line 8-8 of FIG. 6 .

Claims (1)

    CLAIM
  1. The ornamental design for a temporary protective film for manufacturing semiconductor devices, as shown and described.
US29/834,586 2019-11-14 2022-04-13 Temporary protective film for manufacturing semiconductor devices Active USD998577S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/834,586 USD998577S1 (en) 2019-11-14 2022-04-13 Temporary protective film for manufacturing semiconductor devices

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JPD2019-25326F JP1667641S (en) 2019-11-14 2019-11-14
JPD2019-25330F JP1667713S (en) 2019-11-14 2019-11-14
JP2019-025326D 2019-11-14
JPD2019-25329F JP1667712S (en) 2019-11-14 2019-11-14
JP2019-025329D 2019-11-14
JP2019-025330D 2019-11-14
US35/355,107 USD962882S1 (en) 2019-11-14 2020-05-07 Temporary protective film for manufacturing semiconductor devices
US29/834,586 USD998577S1 (en) 2019-11-14 2022-04-13 Temporary protective film for manufacturing semiconductor devices

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US35/355,107 Division USD962882S1 (en) 2019-11-14 2020-05-07 Temporary protective film for manufacturing semiconductor devices

Publications (1)

Publication Number Publication Date
USD998577S1 true USD998577S1 (en) 2023-09-12

Family

ID=83104231

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US35/355,107 Active USD962882S1 (en) 2019-11-14 2020-05-07 Temporary protective film for manufacturing semiconductor devices
US29/834,586 Active USD998577S1 (en) 2019-11-14 2022-04-13 Temporary protective film for manufacturing semiconductor devices

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US35/355,107 Active USD962882S1 (en) 2019-11-14 2020-05-07 Temporary protective film for manufacturing semiconductor devices

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD962882S1 (en) * 2019-11-14 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD962883S1 (en) * 2020-11-02 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices

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US2080052A (en) 1936-02-04 1937-05-11 Lemaster Hager Adhesive tape box
US2082546A (en) * 1936-04-07 1937-06-01 Machate Fred Tape dispensing package
US2229961A (en) * 1938-10-04 1941-01-28 Gerard C Deane Shielded cutting device
US2414333A (en) * 1944-01-17 1947-01-14 Internat Plastic Corp Combined container and dispenser for tape
US2626666A (en) * 1949-04-16 1953-01-27 Scholl Mfg Co Inc Tape cutter
US2694533A (en) 1954-03-16 1954-11-16 Zucker Sam Adhesive tape dispenser
US2699251A (en) 1952-06-25 1955-01-11 Frank E Rizza Dispenser for adhesive tape
US3001306A (en) * 1956-02-20 1961-09-26 Walter B Wilkinson Index tabs and production thereof
US3187968A (en) * 1963-10-11 1965-06-08 Edward A Favre Tape dispenser
US3216634A (en) * 1963-11-18 1965-11-09 Johns Manville Tape dispenser
US3237174A (en) * 1962-11-02 1966-02-22 Ex Cell O Corp Magnetic core memory matrix and process of manufacturing the same
US4983932A (en) 1988-09-26 1991-01-08 Kitagawa Industries Co., Ltd. Electric noise absorber
US5258888A (en) 1991-03-15 1993-11-02 Compaq Computer Corporation Thermal packaging for natural convection cooled electronics
USD433061S (en) * 1999-05-26 2000-10-31 Dick Shen Pivot collar of adhesive tape
US20070241436A1 (en) 2004-05-18 2007-10-18 Keisuke Ookubo Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device
USD571859S1 (en) * 2006-09-21 2008-06-24 Terry Harmston Heat sealed ribbon roll
US20090189300A1 (en) * 2007-01-26 2009-07-30 Hiroyuki Kawakami Sealing Film and a Semiconductor Device Using the Same
US7669631B2 (en) 2004-04-02 2010-03-02 Shurtech Brands, Llc Adhesive tape dispenser
US20100080989A1 (en) 2008-10-01 2010-04-01 Nitto Denko Corporation Pressure-sensitive adhesive sheet for laser processing and method for laser processing
USD621051S1 (en) * 2008-10-17 2010-08-03 Kinesio IP, LLC Adhesive tape
USD621803S1 (en) 2008-07-16 2010-08-17 The Furukawa Electric Co., Ltd. Semiconductor wafer processing tape
USD656910S1 (en) 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD656909S1 (en) 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD664511S1 (en) 2010-10-15 2012-07-31 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD664512S1 (en) 2010-10-15 2012-07-31 Hitachi Chemical Comapany, Ltd. Adhesive tape for semiconductor manufacturing
USD741406S1 (en) * 2014-09-25 2015-10-20 Jeremy Doucette Adhesive tape roll with non-adherent pull tab
USD804435S1 (en) 2010-10-15 2017-12-05 Hitachi Chemical Company, Ltd. Flap in an adhesive tape for semiconductor manufacturing
USD847258S1 (en) 2017-07-23 2019-04-30 Heejoong Kang Adhesive tape
USD946540S1 (en) * 2020-11-02 2022-03-22 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD962882S1 (en) * 2019-11-14 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD962883S1 (en) * 2020-11-02 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
US20230043876A1 (en) * 2020-11-10 2023-02-09 Showa Denko Materials Co., Ltd. Reel body, method for manufacturing reel body, and method for manufacturing article
US11667817B2 (en) * 2016-10-03 2023-06-06 Showa Denko Materials Co., Ltd. Electroconductive film, roll, connected structure, and process for producing connected structure

Patent Citations (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2080052A (en) 1936-02-04 1937-05-11 Lemaster Hager Adhesive tape box
US2082546A (en) * 1936-04-07 1937-06-01 Machate Fred Tape dispensing package
US2229961A (en) * 1938-10-04 1941-01-28 Gerard C Deane Shielded cutting device
US2414333A (en) * 1944-01-17 1947-01-14 Internat Plastic Corp Combined container and dispenser for tape
US2626666A (en) * 1949-04-16 1953-01-27 Scholl Mfg Co Inc Tape cutter
US2699251A (en) 1952-06-25 1955-01-11 Frank E Rizza Dispenser for adhesive tape
US2694533A (en) 1954-03-16 1954-11-16 Zucker Sam Adhesive tape dispenser
US3001306A (en) * 1956-02-20 1961-09-26 Walter B Wilkinson Index tabs and production thereof
US3237174A (en) * 1962-11-02 1966-02-22 Ex Cell O Corp Magnetic core memory matrix and process of manufacturing the same
US3187968A (en) * 1963-10-11 1965-06-08 Edward A Favre Tape dispenser
US3216634A (en) * 1963-11-18 1965-11-09 Johns Manville Tape dispenser
US4983932A (en) 1988-09-26 1991-01-08 Kitagawa Industries Co., Ltd. Electric noise absorber
US5258888A (en) 1991-03-15 1993-11-02 Compaq Computer Corporation Thermal packaging for natural convection cooled electronics
USD433061S (en) * 1999-05-26 2000-10-31 Dick Shen Pivot collar of adhesive tape
US7669631B2 (en) 2004-04-02 2010-03-02 Shurtech Brands, Llc Adhesive tape dispenser
US20070241436A1 (en) 2004-05-18 2007-10-18 Keisuke Ookubo Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device
USD571859S1 (en) * 2006-09-21 2008-06-24 Terry Harmston Heat sealed ribbon roll
US20090189300A1 (en) * 2007-01-26 2009-07-30 Hiroyuki Kawakami Sealing Film and a Semiconductor Device Using the Same
USD621803S1 (en) 2008-07-16 2010-08-17 The Furukawa Electric Co., Ltd. Semiconductor wafer processing tape
US20100080989A1 (en) 2008-10-01 2010-04-01 Nitto Denko Corporation Pressure-sensitive adhesive sheet for laser processing and method for laser processing
USD621051S1 (en) * 2008-10-17 2010-08-03 Kinesio IP, LLC Adhesive tape
USD804435S1 (en) 2010-10-15 2017-12-05 Hitachi Chemical Company, Ltd. Flap in an adhesive tape for semiconductor manufacturing
USD656910S1 (en) 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD656909S1 (en) 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD664511S1 (en) 2010-10-15 2012-07-31 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD664512S1 (en) 2010-10-15 2012-07-31 Hitachi Chemical Comapany, Ltd. Adhesive tape for semiconductor manufacturing
USD680505S1 (en) 2010-10-15 2013-04-23 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD689831S1 (en) 2010-10-15 2013-09-17 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD690278S1 (en) 2010-10-15 2013-09-24 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD741406S1 (en) * 2014-09-25 2015-10-20 Jeremy Doucette Adhesive tape roll with non-adherent pull tab
US11667817B2 (en) * 2016-10-03 2023-06-06 Showa Denko Materials Co., Ltd. Electroconductive film, roll, connected structure, and process for producing connected structure
USD847258S1 (en) 2017-07-23 2019-04-30 Heejoong Kang Adhesive tape
USD962882S1 (en) * 2019-11-14 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD946540S1 (en) * 2020-11-02 2022-03-22 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD962883S1 (en) * 2020-11-02 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
US20230043876A1 (en) * 2020-11-10 2023-02-09 Showa Denko Materials Co., Ltd. Reel body, method for manufacturing reel body, and method for manufacturing article

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
"Back-grinding . . . " reference dated Nov. 6, 2021 found by RMS on the internet at: https://www.nitto.com/us/en/products/semicon/.
"Disposal . . . " reference dated Nov. 6, 2021 found by RMS on the internet at: https://www.pvawatersolublefilm.com/sale-11363692-disposable-high-temperature water-soluble-plastic-film-for-mold-release.html.
"Establishing . . . " reference dated Sep. 13, 2018 found by RMS on the internet at: https://www.mc.showadenko.com/english/information/2018/n_180913uo3.html.
"RD Series . . . " reference dated Nov. 6, 2021 found by RMS on the internet at: https://www.mc.showadenko.com/english/products/pm/ 015.html.

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