USD984972S1 - Electrostatic chuck for semiconductor manufacture - Google Patents
Electrostatic chuck for semiconductor manufacture Download PDFInfo
- Publication number
- USD984972S1 USD984972S1 US35/355,138 US35513844F USD984972S US D984972 S1 USD984972 S1 US D984972S1 US 35513844 F US35513844 F US 35513844F US D984972 S USD984972 S US D984972S
- Authority
- US
- United States
- Prior art keywords
- electrostatic chuck
- semiconductor manufacture
- view
- manufacture
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
1. Electrostatic chuck for semiconductor manufacture
FIG. 1.1 is a front perspective view of an electrostatic chuck for semiconductor manufacture showing my new design;
FIG. 1.2 is another front perspective view thereof;
FIG. 1.3 is a front elevation view thereof;
FIG. 1.4 is a top plan view thereof;
FIG. 1.5 is a bottom plan view thereof;
FIG. 1.6 is a left side elevation view thereof;
FIG. 1.7 is a right side elevation view thereof;
FIG. 1.8 is an enlarged portion view labeled, “Fig. 1.8 ” in Fig. 1.1 ; and
FIG. 1.9 is an enlarged portion view labeled, “Fig. 1.9 ” in Fig. 1.2 .
The dashed-dot lines in Figs. 1.1 , 1.2 , 1.8 and 1.9 denote the boundaries of the enlarged portion views shown in Figs. 1.8 and 1.9 and form no part of the claimed design.
Claims (1)
- The ornamental design for an electrostatic chuck semi conductor manufacture, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202130170686.X | 2021-03-29 | ||
| CN202130170686 | 2021-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD984972S1 true USD984972S1 (en) | 2023-05-02 |
Family
ID=83059681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US35/355,138 Active USD984972S1 (en) | 2021-03-29 | 2021-09-17 | Electrostatic chuck for semiconductor manufacture |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD984972S1 (en) |
| JP (1) | JP1723603S (en) |
| TW (1) | TWD223375S (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1007449S1 (en) * | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD1053230S1 (en) | 2022-05-19 | 2024-12-03 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| USD1054388S1 (en) * | 2021-10-15 | 2024-12-17 | Shin-Etsu Chemical Co., Ltd. | Carrier substrate for handling |
| USD1066620S1 (en) * | 2021-02-12 | 2025-03-11 | Applied Materials, Inc. | Patterned heater pedestal with groove extensions |
| USD1071103S1 (en) * | 2022-04-11 | 2025-04-15 | Applied Materials, Inc. | Gas distribution plate |
| USD1071886S1 (en) * | 2022-01-20 | 2025-04-22 | Applied Materials, Inc. | Substrate support for a substrate processing chamber |
| USD1072774S1 (en) * | 2021-02-06 | 2025-04-29 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD1085029S1 (en) * | 2022-07-19 | 2025-07-22 | Applied Materials, Inc. | Gas distribution plate |
| USD1090468S1 (en) | 2021-09-08 | 2025-08-26 | Lam Research Corporation | Debubbler component |
| USD1103948S1 (en) * | 2021-08-21 | 2025-12-02 | Applied Materials, Inc. | Gas distribution plate |
| USD1104086S1 (en) * | 2021-08-21 | 2025-12-02 | Applied Materials, Inc. | Gas distribution plate |
Citations (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4502094A (en) * | 1981-09-14 | 1985-02-26 | U.S. Philips Corporation | Electrostatic chuck |
| US4645218A (en) * | 1984-07-31 | 1987-02-24 | Kabushiki Kaisha Tokuda Seisakusho | Electrostatic chuck |
| US4665463A (en) * | 1983-09-30 | 1987-05-12 | U.S. Philips Corporation | Electrostatic chuck |
| US5151845A (en) * | 1988-09-19 | 1992-09-29 | Toto Ltd. | Electrostatic chuck |
| USD363464S (en) * | 1992-08-27 | 1995-10-24 | Tokyo Electron Yamanashi Limited | Electrode for a semiconductor processing apparatus |
| US6028762A (en) * | 1996-01-31 | 2000-02-22 | Kyocera Corporation | Electrostatic chuck |
| USD425919S (en) * | 1997-11-14 | 2000-05-30 | Applied Materials, Inc. | Electrostatic chuck with improved spacing mask and workpiece detection device |
| US20020027762A1 (en) * | 1998-09-29 | 2002-03-07 | Shinji Yamaguchi | Electrostatic chuck |
| US20020159217A1 (en) * | 2001-01-29 | 2002-10-31 | Ngk Insulators, Ltd. | Electrostatic chuck and substrate processing apparatus |
| US6721162B2 (en) * | 1996-04-26 | 2004-04-13 | Applied Materials Inc. | Electrostatic chuck having composite dielectric layer and method of manufacture |
| US6731496B2 (en) * | 2000-05-10 | 2004-05-04 | Ibiden Co., Ltd. | Electrostatic chuck |
| USD489739S1 (en) * | 2002-12-20 | 2004-05-11 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
| USD490096S1 (en) * | 2002-12-20 | 2004-05-18 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
| USD490093S1 (en) * | 2002-12-20 | 2004-05-18 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
| USD490094S1 (en) * | 2002-12-20 | 2004-05-18 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
| USD490827S1 (en) * | 2002-12-20 | 2004-06-01 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
| US20040179323A1 (en) * | 2003-03-11 | 2004-09-16 | Alon Litman | Electrostatic chuck for wafer metrology and inspection equipment |
| US20040218339A1 (en) * | 2003-01-29 | 2004-11-04 | Kyocera Corporation | Electrostatic chuck |
| US6815352B1 (en) * | 1999-11-09 | 2004-11-09 | Shin-Etsu Chemical Co., Ltd. | Silicon focus ring and method for producing the same |
| US6863281B2 (en) * | 2001-09-13 | 2005-03-08 | Sumitomo Osaka Cement Co., Ltd. | Chucking apparatus and production method for the same |
| US20060002053A1 (en) * | 2004-03-31 | 2006-01-05 | Applied Materials, Inc. | Detachable electrostatic chuck for supporting a substrate in a process chamber |
| US20060221539A1 (en) * | 2005-03-31 | 2006-10-05 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
| US20070146961A1 (en) * | 2005-12-22 | 2007-06-28 | Ngk Insulators, Ltd. | Electrostatic chuck |
| USD546784S1 (en) * | 2005-09-29 | 2007-07-17 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| USD548200S1 (en) * | 2005-09-29 | 2007-08-07 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| USD548705S1 (en) * | 2005-09-29 | 2007-08-14 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| USD552565S1 (en) * | 2005-09-08 | 2007-10-09 | Tokyo Ohka Kogyo Co., Ltd. | Supporting plate |
| USD553104S1 (en) * | 2004-04-21 | 2007-10-16 | Tokyo Electron Limited | Absorption board for an electric chuck used in semiconductor manufacture |
| US20080037194A1 (en) * | 2004-06-28 | 2008-02-14 | Kyocera Corporation | Electrostatic Chuck |
| US20080144251A1 (en) * | 2006-12-19 | 2008-06-19 | Axcelis Technologies, Inc. | Annulus clamping and backside gas cooled electrostatic chuck |
| USD587222S1 (en) * | 2006-08-01 | 2009-02-24 | Tokyo Electron Limited | Attracting plate of an electrostatic chuck for semiconductor manufacturing |
| US7619870B2 (en) * | 2006-08-10 | 2009-11-17 | Tokyo Electron Limited | Electrostatic chuck |
| USD609655S1 (en) * | 2008-10-03 | 2010-02-09 | Ngk Insulators, Ltd. | Electrostatic chuck |
| USD614593S1 (en) * | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
| US8690135B2 (en) * | 2006-12-18 | 2014-04-08 | Camtek Ltd. | Chuck and a method for supporting an object |
| USD716742S1 (en) * | 2013-09-13 | 2014-11-04 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
| USD723077S1 (en) * | 2013-12-03 | 2015-02-24 | Applied Materials, Inc. | Chuck carrier film |
| USD724553S1 (en) * | 2013-09-13 | 2015-03-17 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
| US9494875B2 (en) * | 2011-10-06 | 2016-11-15 | Asml Netherlands B.V. | Chuck, a chuck control system, a lithography apparatus and a method of using a chuck |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1651623S (en) | 2019-07-18 | 2020-01-27 |
-
2021
- 2021-09-14 TW TW110304948F patent/TWD223375S/en unknown
- 2021-09-17 US US35/355,138 patent/USD984972S1/en active Active
- 2021-09-17 JP JP2021502987F patent/JP1723603S/en active Active
Patent Citations (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4502094A (en) * | 1981-09-14 | 1985-02-26 | U.S. Philips Corporation | Electrostatic chuck |
| US4665463A (en) * | 1983-09-30 | 1987-05-12 | U.S. Philips Corporation | Electrostatic chuck |
| US4645218A (en) * | 1984-07-31 | 1987-02-24 | Kabushiki Kaisha Tokuda Seisakusho | Electrostatic chuck |
| US5151845A (en) * | 1988-09-19 | 1992-09-29 | Toto Ltd. | Electrostatic chuck |
| USD363464S (en) * | 1992-08-27 | 1995-10-24 | Tokyo Electron Yamanashi Limited | Electrode for a semiconductor processing apparatus |
| US6028762A (en) * | 1996-01-31 | 2000-02-22 | Kyocera Corporation | Electrostatic chuck |
| US6721162B2 (en) * | 1996-04-26 | 2004-04-13 | Applied Materials Inc. | Electrostatic chuck having composite dielectric layer and method of manufacture |
| USD425919S (en) * | 1997-11-14 | 2000-05-30 | Applied Materials, Inc. | Electrostatic chuck with improved spacing mask and workpiece detection device |
| US20020027762A1 (en) * | 1998-09-29 | 2002-03-07 | Shinji Yamaguchi | Electrostatic chuck |
| US6815352B1 (en) * | 1999-11-09 | 2004-11-09 | Shin-Etsu Chemical Co., Ltd. | Silicon focus ring and method for producing the same |
| US6731496B2 (en) * | 2000-05-10 | 2004-05-04 | Ibiden Co., Ltd. | Electrostatic chuck |
| US20020159217A1 (en) * | 2001-01-29 | 2002-10-31 | Ngk Insulators, Ltd. | Electrostatic chuck and substrate processing apparatus |
| US6863281B2 (en) * | 2001-09-13 | 2005-03-08 | Sumitomo Osaka Cement Co., Ltd. | Chucking apparatus and production method for the same |
| USD490093S1 (en) * | 2002-12-20 | 2004-05-18 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
| USD490094S1 (en) * | 2002-12-20 | 2004-05-18 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
| USD490827S1 (en) * | 2002-12-20 | 2004-06-01 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
| USD490096S1 (en) * | 2002-12-20 | 2004-05-18 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
| USD489739S1 (en) * | 2002-12-20 | 2004-05-11 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
| US20040218339A1 (en) * | 2003-01-29 | 2004-11-04 | Kyocera Corporation | Electrostatic chuck |
| US20040179323A1 (en) * | 2003-03-11 | 2004-09-16 | Alon Litman | Electrostatic chuck for wafer metrology and inspection equipment |
| US20060002053A1 (en) * | 2004-03-31 | 2006-01-05 | Applied Materials, Inc. | Detachable electrostatic chuck for supporting a substrate in a process chamber |
| USD553104S1 (en) * | 2004-04-21 | 2007-10-16 | Tokyo Electron Limited | Absorption board for an electric chuck used in semiconductor manufacture |
| US20080037194A1 (en) * | 2004-06-28 | 2008-02-14 | Kyocera Corporation | Electrostatic Chuck |
| US20060221539A1 (en) * | 2005-03-31 | 2006-10-05 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
| USD552565S1 (en) * | 2005-09-08 | 2007-10-09 | Tokyo Ohka Kogyo Co., Ltd. | Supporting plate |
| USD548200S1 (en) * | 2005-09-29 | 2007-08-07 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| USD546784S1 (en) * | 2005-09-29 | 2007-07-17 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| USD548705S1 (en) * | 2005-09-29 | 2007-08-14 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| US20070146961A1 (en) * | 2005-12-22 | 2007-06-28 | Ngk Insulators, Ltd. | Electrostatic chuck |
| USD587222S1 (en) * | 2006-08-01 | 2009-02-24 | Tokyo Electron Limited | Attracting plate of an electrostatic chuck for semiconductor manufacturing |
| US7619870B2 (en) * | 2006-08-10 | 2009-11-17 | Tokyo Electron Limited | Electrostatic chuck |
| US8690135B2 (en) * | 2006-12-18 | 2014-04-08 | Camtek Ltd. | Chuck and a method for supporting an object |
| US20080144251A1 (en) * | 2006-12-19 | 2008-06-19 | Axcelis Technologies, Inc. | Annulus clamping and backside gas cooled electrostatic chuck |
| USD614593S1 (en) * | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
| USD609655S1 (en) * | 2008-10-03 | 2010-02-09 | Ngk Insulators, Ltd. | Electrostatic chuck |
| US9494875B2 (en) * | 2011-10-06 | 2016-11-15 | Asml Netherlands B.V. | Chuck, a chuck control system, a lithography apparatus and a method of using a chuck |
| USD716742S1 (en) * | 2013-09-13 | 2014-11-04 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
| USD724553S1 (en) * | 2013-09-13 | 2015-03-17 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
| USD723077S1 (en) * | 2013-12-03 | 2015-02-24 | Applied Materials, Inc. | Chuck carrier film |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1072774S1 (en) * | 2021-02-06 | 2025-04-29 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD1066620S1 (en) * | 2021-02-12 | 2025-03-11 | Applied Materials, Inc. | Patterned heater pedestal with groove extensions |
| USD1007449S1 (en) * | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD1103948S1 (en) * | 2021-08-21 | 2025-12-02 | Applied Materials, Inc. | Gas distribution plate |
| USD1104086S1 (en) * | 2021-08-21 | 2025-12-02 | Applied Materials, Inc. | Gas distribution plate |
| USD1090468S1 (en) | 2021-09-08 | 2025-08-26 | Lam Research Corporation | Debubbler component |
| USD1096679S1 (en) * | 2021-09-08 | 2025-10-07 | Lam Research Corporation | Debubbler component |
| USD1112391S1 (en) * | 2021-09-08 | 2026-02-10 | Lam Research Corporation | Debubbler component |
| USD1118897S1 (en) | 2021-09-08 | 2026-03-17 | Lam Research Corporation | Debubbler component |
| USD1054388S1 (en) * | 2021-10-15 | 2024-12-17 | Shin-Etsu Chemical Co., Ltd. | Carrier substrate for handling |
| USD1071886S1 (en) * | 2022-01-20 | 2025-04-22 | Applied Materials, Inc. | Substrate support for a substrate processing chamber |
| USD1071103S1 (en) * | 2022-04-11 | 2025-04-15 | Applied Materials, Inc. | Gas distribution plate |
| USD1053230S1 (en) | 2022-05-19 | 2024-12-03 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| USD1085029S1 (en) * | 2022-07-19 | 2025-07-22 | Applied Materials, Inc. | Gas distribution plate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1723603S (en) | 2022-08-31 |
| TWD223375S (en) | 2023-02-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |