USD984972S1 - Electrostatic chuck for semiconductor manufacture - Google Patents

Electrostatic chuck for semiconductor manufacture Download PDF

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Publication number
USD984972S1
USD984972S1 US35/355,138 US35513844F USD984972S US D984972 S1 USD984972 S1 US D984972S1 US 35513844 F US35513844 F US 35513844F US D984972 S USD984972 S US D984972S
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Prior art keywords
electrostatic chuck
semiconductor manufacture
view
manufacture
semiconductor
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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US35/355,138
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Inventor
Quanyu SHI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Naura Microelectronics Equipment Co Ltd
Original Assignee
Beijing Naura Microelectronics Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Beijing Naura Microelectronics Equipment Co Ltd filed Critical Beijing Naura Microelectronics Equipment Co Ltd
Assigned to BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. reassignment BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHI, Quanyu
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Description

1. Electrostatic chuck for semiconductor manufacture
FIG. 1.1 is a front perspective view of an electrostatic chuck for semiconductor manufacture showing my new design;
FIG. 1.2 is another front perspective view thereof;
FIG. 1.3 is a front elevation view thereof;
FIG. 1.4 is a top plan view thereof;
FIG. 1.5 is a bottom plan view thereof;
FIG. 1.6 is a left side elevation view thereof;
FIG. 1.7 is a right side elevation view thereof;
FIG. 1.8 is an enlarged portion view labeled, “Fig. 1.8 ” in Fig. 1.1 ; and
FIG. 1.9 is an enlarged portion view labeled, “Fig. 1.9 ” in Fig. 1.2 .
The dashed-dot lines in Figs. 1.1 , 1.2 , 1.8 and 1.9 denote the boundaries of the enlarged portion views shown in Figs. 1.8 and 1.9 and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an electrostatic chuck semi conductor manufacture, as shown and described.
US35/355,138 2021-03-29 2021-09-17 Electrostatic chuck for semiconductor manufacture Active USD984972S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202130170686.X 2021-03-29
CN202130170686 2021-03-29

Publications (1)

Publication Number Publication Date
USD984972S1 true USD984972S1 (en) 2023-05-02

Family

ID=83059681

Family Applications (1)

Application Number Title Priority Date Filing Date
US35/355,138 Active USD984972S1 (en) 2021-03-29 2021-09-17 Electrostatic chuck for semiconductor manufacture

Country Status (3)

Country Link
US (1) USD984972S1 (en)
JP (1) JP1723603S (en)
TW (1) TWD223375S (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1007449S1 (en) * 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1054388S1 (en) * 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling
USD1066620S1 (en) * 2021-02-12 2025-03-11 Applied Materials, Inc. Patterned heater pedestal with groove extensions
USD1071103S1 (en) * 2022-04-11 2025-04-15 Applied Materials, Inc. Gas distribution plate
USD1071886S1 (en) * 2022-01-20 2025-04-22 Applied Materials, Inc. Substrate support for a substrate processing chamber
USD1072774S1 (en) * 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1085029S1 (en) * 2022-07-19 2025-07-22 Applied Materials, Inc. Gas distribution plate
USD1090468S1 (en) 2021-09-08 2025-08-26 Lam Research Corporation Debubbler component
USD1103948S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD1104086S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate

Citations (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4502094A (en) * 1981-09-14 1985-02-26 U.S. Philips Corporation Electrostatic chuck
US4645218A (en) * 1984-07-31 1987-02-24 Kabushiki Kaisha Tokuda Seisakusho Electrostatic chuck
US4665463A (en) * 1983-09-30 1987-05-12 U.S. Philips Corporation Electrostatic chuck
US5151845A (en) * 1988-09-19 1992-09-29 Toto Ltd. Electrostatic chuck
USD363464S (en) * 1992-08-27 1995-10-24 Tokyo Electron Yamanashi Limited Electrode for a semiconductor processing apparatus
US6028762A (en) * 1996-01-31 2000-02-22 Kyocera Corporation Electrostatic chuck
USD425919S (en) * 1997-11-14 2000-05-30 Applied Materials, Inc. Electrostatic chuck with improved spacing mask and workpiece detection device
US20020027762A1 (en) * 1998-09-29 2002-03-07 Shinji Yamaguchi Electrostatic chuck
US20020159217A1 (en) * 2001-01-29 2002-10-31 Ngk Insulators, Ltd. Electrostatic chuck and substrate processing apparatus
US6721162B2 (en) * 1996-04-26 2004-04-13 Applied Materials Inc. Electrostatic chuck having composite dielectric layer and method of manufacture
US6731496B2 (en) * 2000-05-10 2004-05-04 Ibiden Co., Ltd. Electrostatic chuck
USD489739S1 (en) * 2002-12-20 2004-05-11 Ngk Spark Plug Co., Ltd. Electrostatic chuck
USD490096S1 (en) * 2002-12-20 2004-05-18 Ngk Spark Plug Co., Ltd. Electrostatic chuck
USD490093S1 (en) * 2002-12-20 2004-05-18 Ngk Spark Plug Co., Ltd. Electrostatic chuck
USD490094S1 (en) * 2002-12-20 2004-05-18 Ngk Spark Plug Co., Ltd. Electrostatic chuck
USD490827S1 (en) * 2002-12-20 2004-06-01 Ngk Spark Plug Co., Ltd. Electrostatic chuck
US20040179323A1 (en) * 2003-03-11 2004-09-16 Alon Litman Electrostatic chuck for wafer metrology and inspection equipment
US20040218339A1 (en) * 2003-01-29 2004-11-04 Kyocera Corporation Electrostatic chuck
US6815352B1 (en) * 1999-11-09 2004-11-09 Shin-Etsu Chemical Co., Ltd. Silicon focus ring and method for producing the same
US6863281B2 (en) * 2001-09-13 2005-03-08 Sumitomo Osaka Cement Co., Ltd. Chucking apparatus and production method for the same
US20060002053A1 (en) * 2004-03-31 2006-01-05 Applied Materials, Inc. Detachable electrostatic chuck for supporting a substrate in a process chamber
US20060221539A1 (en) * 2005-03-31 2006-10-05 Ngk Spark Plug Co., Ltd. Electrostatic chuck
US20070146961A1 (en) * 2005-12-22 2007-06-28 Ngk Insulators, Ltd. Electrostatic chuck
USD546784S1 (en) * 2005-09-29 2007-07-17 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD548200S1 (en) * 2005-09-29 2007-08-07 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD548705S1 (en) * 2005-09-29 2007-08-14 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD552565S1 (en) * 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD553104S1 (en) * 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
US20080037194A1 (en) * 2004-06-28 2008-02-14 Kyocera Corporation Electrostatic Chuck
US20080144251A1 (en) * 2006-12-19 2008-06-19 Axcelis Technologies, Inc. Annulus clamping and backside gas cooled electrostatic chuck
USD587222S1 (en) * 2006-08-01 2009-02-24 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
US7619870B2 (en) * 2006-08-10 2009-11-17 Tokyo Electron Limited Electrostatic chuck
USD609655S1 (en) * 2008-10-03 2010-02-09 Ngk Insulators, Ltd. Electrostatic chuck
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
US8690135B2 (en) * 2006-12-18 2014-04-08 Camtek Ltd. Chuck and a method for supporting an object
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD723077S1 (en) * 2013-12-03 2015-02-24 Applied Materials, Inc. Chuck carrier film
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
US9494875B2 (en) * 2011-10-06 2016-11-15 Asml Netherlands B.V. Chuck, a chuck control system, a lithography apparatus and a method of using a chuck

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1651623S (en) 2019-07-18 2020-01-27

Patent Citations (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4502094A (en) * 1981-09-14 1985-02-26 U.S. Philips Corporation Electrostatic chuck
US4665463A (en) * 1983-09-30 1987-05-12 U.S. Philips Corporation Electrostatic chuck
US4645218A (en) * 1984-07-31 1987-02-24 Kabushiki Kaisha Tokuda Seisakusho Electrostatic chuck
US5151845A (en) * 1988-09-19 1992-09-29 Toto Ltd. Electrostatic chuck
USD363464S (en) * 1992-08-27 1995-10-24 Tokyo Electron Yamanashi Limited Electrode for a semiconductor processing apparatus
US6028762A (en) * 1996-01-31 2000-02-22 Kyocera Corporation Electrostatic chuck
US6721162B2 (en) * 1996-04-26 2004-04-13 Applied Materials Inc. Electrostatic chuck having composite dielectric layer and method of manufacture
USD425919S (en) * 1997-11-14 2000-05-30 Applied Materials, Inc. Electrostatic chuck with improved spacing mask and workpiece detection device
US20020027762A1 (en) * 1998-09-29 2002-03-07 Shinji Yamaguchi Electrostatic chuck
US6815352B1 (en) * 1999-11-09 2004-11-09 Shin-Etsu Chemical Co., Ltd. Silicon focus ring and method for producing the same
US6731496B2 (en) * 2000-05-10 2004-05-04 Ibiden Co., Ltd. Electrostatic chuck
US20020159217A1 (en) * 2001-01-29 2002-10-31 Ngk Insulators, Ltd. Electrostatic chuck and substrate processing apparatus
US6863281B2 (en) * 2001-09-13 2005-03-08 Sumitomo Osaka Cement Co., Ltd. Chucking apparatus and production method for the same
USD490093S1 (en) * 2002-12-20 2004-05-18 Ngk Spark Plug Co., Ltd. Electrostatic chuck
USD490094S1 (en) * 2002-12-20 2004-05-18 Ngk Spark Plug Co., Ltd. Electrostatic chuck
USD490827S1 (en) * 2002-12-20 2004-06-01 Ngk Spark Plug Co., Ltd. Electrostatic chuck
USD490096S1 (en) * 2002-12-20 2004-05-18 Ngk Spark Plug Co., Ltd. Electrostatic chuck
USD489739S1 (en) * 2002-12-20 2004-05-11 Ngk Spark Plug Co., Ltd. Electrostatic chuck
US20040218339A1 (en) * 2003-01-29 2004-11-04 Kyocera Corporation Electrostatic chuck
US20040179323A1 (en) * 2003-03-11 2004-09-16 Alon Litman Electrostatic chuck for wafer metrology and inspection equipment
US20060002053A1 (en) * 2004-03-31 2006-01-05 Applied Materials, Inc. Detachable electrostatic chuck for supporting a substrate in a process chamber
USD553104S1 (en) * 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
US20080037194A1 (en) * 2004-06-28 2008-02-14 Kyocera Corporation Electrostatic Chuck
US20060221539A1 (en) * 2005-03-31 2006-10-05 Ngk Spark Plug Co., Ltd. Electrostatic chuck
USD552565S1 (en) * 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD548200S1 (en) * 2005-09-29 2007-08-07 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD546784S1 (en) * 2005-09-29 2007-07-17 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD548705S1 (en) * 2005-09-29 2007-08-14 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
US20070146961A1 (en) * 2005-12-22 2007-06-28 Ngk Insulators, Ltd. Electrostatic chuck
USD587222S1 (en) * 2006-08-01 2009-02-24 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
US7619870B2 (en) * 2006-08-10 2009-11-17 Tokyo Electron Limited Electrostatic chuck
US8690135B2 (en) * 2006-12-18 2014-04-08 Camtek Ltd. Chuck and a method for supporting an object
US20080144251A1 (en) * 2006-12-19 2008-06-19 Axcelis Technologies, Inc. Annulus clamping and backside gas cooled electrostatic chuck
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
USD609655S1 (en) * 2008-10-03 2010-02-09 Ngk Insulators, Ltd. Electrostatic chuck
US9494875B2 (en) * 2011-10-06 2016-11-15 Asml Netherlands B.V. Chuck, a chuck control system, a lithography apparatus and a method of using a chuck
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD723077S1 (en) * 2013-12-03 2015-02-24 Applied Materials, Inc. Chuck carrier film

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1072774S1 (en) * 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1066620S1 (en) * 2021-02-12 2025-03-11 Applied Materials, Inc. Patterned heater pedestal with groove extensions
USD1007449S1 (en) * 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1103948S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD1104086S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD1090468S1 (en) 2021-09-08 2025-08-26 Lam Research Corporation Debubbler component
USD1096679S1 (en) * 2021-09-08 2025-10-07 Lam Research Corporation Debubbler component
USD1112391S1 (en) * 2021-09-08 2026-02-10 Lam Research Corporation Debubbler component
USD1118897S1 (en) 2021-09-08 2026-03-17 Lam Research Corporation Debubbler component
USD1054388S1 (en) * 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling
USD1071886S1 (en) * 2022-01-20 2025-04-22 Applied Materials, Inc. Substrate support for a substrate processing chamber
USD1071103S1 (en) * 2022-04-11 2025-04-15 Applied Materials, Inc. Gas distribution plate
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1085029S1 (en) * 2022-07-19 2025-07-22 Applied Materials, Inc. Gas distribution plate

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JP1723603S (en) 2022-08-31
TWD223375S (en) 2023-02-01

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