USD954986S1 - Electrode cover for a plasma processing device - Google Patents

Electrode cover for a plasma processing device Download PDF

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Publication number
USD954986S1
USD954986S1 US29/731,604 US202029731604F USD954986S US D954986 S1 USD954986 S1 US D954986S1 US 202029731604 F US202029731604 F US 202029731604F US D954986 S USD954986 S US D954986S
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US
United States
Prior art keywords
processing device
plasma processing
electrode cover
view
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/731,604
Inventor
Shintarou Nakatani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Assigned to HITACHI HIGH-TECH CORPORATION reassignment HITACHI HIGH-TECH CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NAKATANI, SHINTAROU
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Description

FIG. 1 is a front, bottom and right side perspective view of an electrode cover for a plasma processing device according to the design;
FIG. 2 is a rear, bottom and right side perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a rear view thereof;
FIG. 9 is a cross-sectional view taken along line 9-9 of FIG. 3;
FIG. 10 is an enlarged view of the portion shown in BOX 10 in FIG. 9;
FIG. 11 is an enlarged front, bottom and right side perspective view of a cross-sectional view taken along line 9-9 of FIG. 3; and,
FIG. 12 is an enlarged rear, bottom and right side perspective view of a cross-sectional view taken along line 9-9 of FIG. 3.
The broken lines show the boundary of enlarged portions and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an electrode cover for a plasma processing device, as shown and described.
US29/731,604 2019-10-18 2020-04-16 Electrode cover for a plasma processing device Active USD954986S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-023330 2019-02-13
JPD2019-23330F JP1659287S (en) 2019-10-18 2019-10-18

Publications (1)

Publication Number Publication Date
USD954986S1 true USD954986S1 (en) 2022-06-14

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Application Number Title Priority Date Filing Date
US29/731,604 Active USD954986S1 (en) 2019-10-18 2020-04-16 Electrode cover for a plasma processing device

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US (1) USD954986S1 (en)
JP (1) JP1659287S (en)
TW (1) TWD210379S (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11996315B2 (en) 2020-11-18 2024-05-28 Applied Materials, Inc. Thin substrate handling via edge clamping

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1704964S (en) 2021-04-19 2022-01-14 Suceptoring for plasma processing equipment

Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4579354A (en) * 1984-12-05 1986-04-01 Vassallo Research And Development Corporation Gasket
USD638550S1 (en) * 2009-11-13 2011-05-24 3M Innovative Properties Company Sample processing disk cover
USD667561S1 (en) * 2009-11-13 2012-09-18 3M Innovative Properties Company Sample processing disk cover
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD803917S1 (en) * 2015-06-16 2017-11-28 Hitachi Kokusai Electric, Inc. Heat reflector for substrate processing apparatus
USD804556S1 (en) * 2015-06-16 2017-12-05 Hitachi Kokusai Electric Inc. Heat reflector for substrate processing apparatus
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
JP1598998S (en) 2017-08-31 2018-03-05
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD830435S1 (en) * 2015-12-28 2018-10-09 Ntn Corporation Inner ring for tapered roller bearing
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD868993S1 (en) * 2017-08-31 2019-12-03 Hitachi High-Technologies Corporation Electrode plate for a plasma processing apparatus
USD868995S1 (en) * 2017-11-06 2019-12-03 Hitachi High-Technologies Corporation Gas diffusion plate for a plasma processing apparatus
USD871608S1 (en) * 2017-07-31 2019-12-31 Hitachi High-Technologies Corporation Gas ring for a plasma processing apparatus
USD871609S1 (en) * 2017-08-31 2019-12-31 Hitachi High-Technologies Corporation Electrode plate peripheral ring for a plasma processing apparatus
USD891636S1 (en) * 2018-10-25 2020-07-28 Hitachi High-Tech Corporation Ring for a plasma processing apparatus
USD917026S1 (en) * 2019-09-12 2021-04-20 S & B Technical Products, Inc. Pipe sealing gasket
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4579354A (en) * 1984-12-05 1986-04-01 Vassallo Research And Development Corporation Gasket
USD638550S1 (en) * 2009-11-13 2011-05-24 3M Innovative Properties Company Sample processing disk cover
USD667561S1 (en) * 2009-11-13 2012-09-18 3M Innovative Properties Company Sample processing disk cover
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD803917S1 (en) * 2015-06-16 2017-11-28 Hitachi Kokusai Electric, Inc. Heat reflector for substrate processing apparatus
USD804556S1 (en) * 2015-06-16 2017-12-05 Hitachi Kokusai Electric Inc. Heat reflector for substrate processing apparatus
USD830435S1 (en) * 2015-12-28 2018-10-09 Ntn Corporation Inner ring for tapered roller bearing
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD871608S1 (en) * 2017-07-31 2019-12-31 Hitachi High-Technologies Corporation Gas ring for a plasma processing apparatus
JP1598998S (en) 2017-08-31 2018-03-05
USD868993S1 (en) * 2017-08-31 2019-12-03 Hitachi High-Technologies Corporation Electrode plate for a plasma processing apparatus
USD870314S1 (en) * 2017-08-31 2019-12-17 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD871609S1 (en) * 2017-08-31 2019-12-31 Hitachi High-Technologies Corporation Electrode plate peripheral ring for a plasma processing apparatus
USD868995S1 (en) * 2017-11-06 2019-12-03 Hitachi High-Technologies Corporation Gas diffusion plate for a plasma processing apparatus
USD891636S1 (en) * 2018-10-25 2020-07-28 Hitachi High-Tech Corporation Ring for a plasma processing apparatus
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD917026S1 (en) * 2019-09-12 2021-04-20 S & B Technical Products, Inc. Pipe sealing gasket

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
4″ Storz Pressure Gasket. Online, published date unknown. Retrieved on Feb. 20, 2022 from URL: https://www.firehosedirect.com/4-storz-pressure-gasket. *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11996315B2 (en) 2020-11-18 2024-05-28 Applied Materials, Inc. Thin substrate handling via edge clamping

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TWD210379S (en) 2021-03-11
JP1659287S (en) 2020-05-11

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