USD916038S1 - Grounded electrode for a plasma processing apparatus - Google Patents

Grounded electrode for a plasma processing apparatus Download PDF

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Publication number
USD916038S1
USD916038S1 US29/706,143 US201929706143F USD916038S US D916038 S1 USD916038 S1 US D916038S1 US 201929706143 F US201929706143 F US 201929706143F US D916038 S USD916038 S US D916038S
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Prior art keywords
processing apparatus
plasma processing
grounded electrode
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grounded
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US29/706,143
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English (en)
Inventor
Taku Watanabe
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Hitachi High Tech Corp
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Hitachi High Tech Corp
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Assigned to HITACHI HIGH-TECHNOLOGIES CORPORATION reassignment HITACHI HIGH-TECHNOLOGIES CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WATANABE, TAKU
Assigned to HITACHI HIGH-TECH CORPORATION reassignment HITACHI HIGH-TECH CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI HIGH-TECHNOLOGIES CORPORATION
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US29/706,143 2019-03-19 2019-09-18 Grounded electrode for a plasma processing apparatus Active USD916038S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-005889 2019-03-19
JP2019005889F JP1646366S (enrdf_load_stackoverflow) 2019-03-19 2019-03-19

Publications (1)

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USD916038S1 true USD916038S1 (en) 2021-04-13

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US (1) USD916038S1 (enrdf_load_stackoverflow)
JP (1) JP1646366S (enrdf_load_stackoverflow)
TW (1) TWD204223S (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD928732S1 (en) * 2020-03-20 2021-08-24 Yubico Ab Bezel for attaching sensor to a printed circuit board in a security key
USD1008967S1 (en) * 2022-05-16 2023-12-26 Japan Aviation Electronics Industry, Limited Collar for connector
USD1042373S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en) 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD941372S1 (en) 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD934315S1 (en) 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD941371S1 (en) 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6265094B1 (en) * 1998-11-12 2001-07-24 Aer Energy Resources, Inc. Anode can for a metal-air cell
USD494551S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
USD556704S1 (en) * 2005-08-25 2007-12-04 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD812578S1 (en) * 2016-02-26 2018-03-13 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
USD830435S1 (en) * 2015-12-28 2018-10-09 Ntn Corporation Inner ring for tapered roller bearing
USD870314S1 (en) * 2017-08-31 2019-12-17 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD871609S1 (en) * 2017-08-31 2019-12-31 Hitachi High-Technologies Corporation Electrode plate peripheral ring for a plasma processing apparatus
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6265094B1 (en) * 1998-11-12 2001-07-24 Aer Energy Resources, Inc. Anode can for a metal-air cell
USD494551S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
USD556704S1 (en) * 2005-08-25 2007-12-04 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD830435S1 (en) * 2015-12-28 2018-10-09 Ntn Corporation Inner ring for tapered roller bearing
USD812578S1 (en) * 2016-02-26 2018-03-13 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
USD870314S1 (en) * 2017-08-31 2019-12-17 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD871609S1 (en) * 2017-08-31 2019-12-31 Hitachi High-Technologies Corporation Electrode plate peripheral ring for a plasma processing apparatus
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD928732S1 (en) * 2020-03-20 2021-08-24 Yubico Ab Bezel for attaching sensor to a printed circuit board in a security key
USD1042373S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en) 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1008967S1 (en) * 2022-05-16 2023-12-26 Japan Aviation Electronics Industry, Limited Collar for connector

Also Published As

Publication number Publication date
JP1646366S (enrdf_load_stackoverflow) 2019-11-25
TWD204223S (zh) 2020-04-21

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