USD906273S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
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- USD906273S1 USD906273S1 US29/689,360 US201929689360F USD906273S US D906273 S1 USD906273 S1 US D906273S1 US 201929689360 F US201929689360 F US 201929689360F US D906273 S USD906273 S US D906273S
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-024475 | 2018-11-07 | ||
JPD2018-24475F JP1633578S (zh) | 2018-11-07 | 2018-11-07 |
Publications (1)
Publication Number | Publication Date |
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USD906273S1 true USD906273S1 (en) | 2020-12-29 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US29/689,360 Active USD906273S1 (en) | 2018-11-07 | 2019-04-29 | Semiconductor device |
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US (1) | USD906273S1 (zh) |
JP (1) | JP1633578S (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD922970S1 (en) | 2019-10-28 | 2021-06-22 | Rohm Co., Ltd. | Semiconductor device |
USD928105S1 (en) * | 2019-10-28 | 2021-08-17 | Rohm Co., Ltd. | Semiconductor device |
USD939458S1 (en) * | 2019-05-29 | 2021-12-28 | Diodes Incorporated | Leadframe |
USD940090S1 (en) * | 2019-05-29 | 2022-01-04 | Diodes Incorporated | Leadframe |
USD940669S1 (en) * | 2018-11-19 | 2022-01-11 | Kokusai Electric Corporation | Boat for substrate processing apparatus |
Citations (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD523403S1 (en) * | 2004-09-09 | 2006-06-20 | Kabushiki Kaisha Toshiba | Substrate for a semiconductor device |
USD648290S1 (en) * | 2010-06-08 | 2011-11-08 | Miyoshi Electronics Corporation | Semiconductor device |
USD674760S1 (en) * | 2011-04-01 | 2013-01-22 | Fuji Electric Co., Ltd. | Semiconductor device |
USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD729250S1 (en) * | 2013-07-30 | 2015-05-12 | Samsung Electronics Co., Ltd. | Semiconductor memory device |
JP1563812S (zh) | 2016-04-11 | 2016-11-21 | ||
USD777124S1 (en) * | 2014-04-02 | 2017-01-24 | Mitsubishi Electric Corporation | Power semiconductor device |
USD796978S1 (en) * | 2016-03-24 | 2017-09-12 | Advantest Corporation | Socket for electronic device testing apparatus |
USD839220S1 (en) * | 2013-02-19 | 2019-01-29 | Sony Corporation | Semiconductor device |
USD845921S1 (en) * | 2017-05-02 | 2019-04-16 | Rohm Co., Ltd. | Semiconductor device |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
USD864884S1 (en) * | 2017-10-23 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
US10510626B2 (en) * | 2015-07-06 | 2019-12-17 | Infineon Technologies Ag | Method for use in manufacturing a semiconductor device die |
US10546825B2 (en) * | 2017-05-24 | 2020-01-28 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device |
US10553559B2 (en) * | 2015-10-28 | 2020-02-04 | Mitsubishi Electric Corporation | Power semiconductor device |
US10557191B2 (en) * | 2017-01-31 | 2020-02-11 | Sakai Display Products Corporation | Method for producing deposition mask, deposition mask, and method for producing organic semiconductor device |
US10600789B2 (en) * | 2016-12-19 | 2020-03-24 | Samsung Electronics Co., Ltd. | Micro-pattern forming method, capacitor and method of manufacturing the same, semiconductor device and method of manufacturing the same, and electronic system including semiconductor device |
US10600744B2 (en) * | 2016-11-15 | 2020-03-24 | Rohm Co., Ltd. | Semiconductor device |
US10605828B2 (en) * | 2017-03-30 | 2020-03-31 | Advanced Semiconductor Engineering, Inc. | Device for attaching a semiconductor device to a circuit board |
US10636703B2 (en) * | 2010-05-10 | 2020-04-28 | Magnachip Semiconductor, Ltd. | Semiconductor device for preventing crack in pad region and fabricating method thereof |
US10644115B2 (en) * | 2018-02-28 | 2020-05-05 | Flosfia Inc. | Layered structure and semiconductor device including layered structure |
US10651050B2 (en) * | 2017-12-01 | 2020-05-12 | Micron Technology, Inc. | Semiconductor device packages and structures |
US10672878B2 (en) * | 2018-02-08 | 2020-06-02 | Panasonic Intellectual Property Management Co., Ltd. | Silicon carbide semiconductor device |
-
2018
- 2018-11-07 JP JPD2018-24475F patent/JP1633578S/ja active Active
-
2019
- 2019-04-29 US US29/689,360 patent/USD906273S1/en active Active
Patent Citations (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD523403S1 (en) * | 2004-09-09 | 2006-06-20 | Kabushiki Kaisha Toshiba | Substrate for a semiconductor device |
US10636703B2 (en) * | 2010-05-10 | 2020-04-28 | Magnachip Semiconductor, Ltd. | Semiconductor device for preventing crack in pad region and fabricating method thereof |
USD648290S1 (en) * | 2010-06-08 | 2011-11-08 | Miyoshi Electronics Corporation | Semiconductor device |
USD674760S1 (en) * | 2011-04-01 | 2013-01-22 | Fuji Electric Co., Ltd. | Semiconductor device |
USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD839220S1 (en) * | 2013-02-19 | 2019-01-29 | Sony Corporation | Semiconductor device |
USD729250S1 (en) * | 2013-07-30 | 2015-05-12 | Samsung Electronics Co., Ltd. | Semiconductor memory device |
USD777124S1 (en) * | 2014-04-02 | 2017-01-24 | Mitsubishi Electric Corporation | Power semiconductor device |
USD783550S1 (en) * | 2014-04-02 | 2017-04-11 | Mitsubishi Electric Corporation | Power semiconductor device |
US10510626B2 (en) * | 2015-07-06 | 2019-12-17 | Infineon Technologies Ag | Method for use in manufacturing a semiconductor device die |
US10553559B2 (en) * | 2015-10-28 | 2020-02-04 | Mitsubishi Electric Corporation | Power semiconductor device |
USD796978S1 (en) * | 2016-03-24 | 2017-09-12 | Advantest Corporation | Socket for electronic device testing apparatus |
JP1563812S (zh) | 2016-04-11 | 2016-11-21 | ||
US10600744B2 (en) * | 2016-11-15 | 2020-03-24 | Rohm Co., Ltd. | Semiconductor device |
US10600789B2 (en) * | 2016-12-19 | 2020-03-24 | Samsung Electronics Co., Ltd. | Micro-pattern forming method, capacitor and method of manufacturing the same, semiconductor device and method of manufacturing the same, and electronic system including semiconductor device |
US10557191B2 (en) * | 2017-01-31 | 2020-02-11 | Sakai Display Products Corporation | Method for producing deposition mask, deposition mask, and method for producing organic semiconductor device |
US10605828B2 (en) * | 2017-03-30 | 2020-03-31 | Advanced Semiconductor Engineering, Inc. | Device for attaching a semiconductor device to a circuit board |
USD845921S1 (en) * | 2017-05-02 | 2019-04-16 | Rohm Co., Ltd. | Semiconductor device |
US10546825B2 (en) * | 2017-05-24 | 2020-01-28 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device |
USD873227S1 (en) * | 2017-10-23 | 2020-01-21 | Mitsubishi Electric Corporation | Semiconductor device |
USD864884S1 (en) * | 2017-10-23 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
US10651050B2 (en) * | 2017-12-01 | 2020-05-12 | Micron Technology, Inc. | Semiconductor device packages and structures |
US10672878B2 (en) * | 2018-02-08 | 2020-06-02 | Panasonic Intellectual Property Management Co., Ltd. | Silicon carbide semiconductor device |
US10644115B2 (en) * | 2018-02-28 | 2020-05-05 | Flosfia Inc. | Layered structure and semiconductor device including layered structure |
Non-Patent Citations (2)
Title |
---|
"Integrated circuit device," Toshiba Semiconductor Company, Japan, JPO Publicly Known Design No. HC2000747100 date of making available to the public: Jun. 11, 2008, 5 pages including English translation of bibliographic data. |
Office Action issued for Japanese Patent Application No. 2018-024474, dated Mar. 1, 2019, 3 pages including abridged English translation. |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD940669S1 (en) * | 2018-11-19 | 2022-01-11 | Kokusai Electric Corporation | Boat for substrate processing apparatus |
USD939458S1 (en) * | 2019-05-29 | 2021-12-28 | Diodes Incorporated | Leadframe |
USD940090S1 (en) * | 2019-05-29 | 2022-01-04 | Diodes Incorporated | Leadframe |
USD969093S1 (en) * | 2019-05-29 | 2022-11-08 | Diodes Incorported | Leadframe |
USD969763S1 (en) * | 2019-05-29 | 2022-11-15 | Diodes Incorporated | Leadframe |
USD969764S1 (en) * | 2019-05-29 | 2022-11-15 | Diodes Incorported | Leadframe |
USD980811S1 (en) * | 2019-05-29 | 2023-03-14 | Diodes Incorporated | Leadframe |
USD985518S1 (en) * | 2019-05-29 | 2023-05-09 | Diodes Incorporated | Leadframe |
USD922970S1 (en) | 2019-10-28 | 2021-06-22 | Rohm Co., Ltd. | Semiconductor device |
USD928105S1 (en) * | 2019-10-28 | 2021-08-17 | Rohm Co., Ltd. | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JP1633578S (zh) | 2019-06-10 |
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