USD810036S1 - Semiconductor module - Google Patents

Semiconductor module Download PDF

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Publication number
USD810036S1
USD810036S1 US29/598,481 US201729598481F USD810036S US D810036 S1 USD810036 S1 US D810036S1 US 201729598481 F US201729598481 F US 201729598481F US D810036 S USD810036 S US D810036S
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US
United States
Prior art keywords
semiconductor module
view
semiconductor
module
ornamental design
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Active
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US29/598,481
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English (en)
Inventor
Satoshi SAWAYANAGI
Masahiro Taoka
Tomofumi OOSE
Hideaki Takahashi
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Fuji Electric Co Ltd
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Fuji Electric Co Ltd
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Assigned to FUJI ELECTRIC CO., LTD. reassignment FUJI ELECTRIC CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OOSE, TOMOFUMI, TAKAHASHI, HIDEAKI, TAOKA, MASAHIRO, SAWAYANAGI, SATOSHI
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US29/598,481 2016-11-08 2017-03-27 Semiconductor module Active USD810036S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2016-24300F JP1578687S (de) 2016-11-08 2016-11-08
JP2016-024300 2016-11-08

Publications (1)

Publication Number Publication Date
USD810036S1 true USD810036S1 (en) 2018-02-13

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US29/598,481 Active USD810036S1 (en) 2016-11-08 2017-03-27 Semiconductor module

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JP (1) JP1578687S (de)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD822628S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD822627S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD823270S1 (en) * 2016-09-30 2018-07-17 Rohm Co., Ltd. Semiconductor device
USD827591S1 (en) * 2016-10-31 2018-09-04 Fuji Electric Co., Ltd. Semiconductor module
USD827593S1 (en) * 2014-11-28 2018-09-04 Fuji Electric Co., Ltd Semiconductor module
USD837752S1 (en) * 2017-01-31 2019-01-08 Dylan James Sievers Heatsink
USD873227S1 (en) * 2017-10-23 2020-01-21 Mitsubishi Electric Corporation Semiconductor device
USD877102S1 (en) * 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD1037163S1 (en) * 2021-11-17 2024-07-30 Fuji Electric Co., Ltd. Semiconductor module

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD874411S1 (en) 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD874412S1 (en) 2018-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD873226S1 (en) 2018-04-13 2020-01-21 Rohm Co., Ltd. Semiconductor module

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USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
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USD360619S (en) * 1993-09-16 1995-07-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
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USD396450S (en) * 1996-12-24 1998-07-28 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
US6078501A (en) * 1997-12-22 2000-06-20 Omnirel Llc Power semiconductor module
USD441726S1 (en) * 1999-07-14 2001-05-08 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor element
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
US20030042584A1 (en) * 2001-09-05 2003-03-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of manufacturing the same
US6774465B2 (en) * 2001-10-05 2004-08-10 Fairchild Korea Semiconductor, Ltd. Semiconductor power package module
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
US20100149774A1 (en) * 2008-12-17 2010-06-17 Mitsubishi Electric Corporation Semiconductor device
US20110044012A1 (en) * 2006-12-15 2011-02-24 Mitsubishi Electric Corporation Semiconductor device
US8107255B2 (en) * 2007-09-27 2012-01-31 Sanyo Semiconductor Co., Ltd. Circuit device and method of manufacturing the same
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
USD705184S1 (en) * 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
USD710319S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD712853S1 (en) * 2012-12-21 2014-09-09 Fuji Electric Co., Ltd. Semiconductor module
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD721048S1 (en) * 2013-06-17 2015-01-13 Fuji Electric Co., Ltd. Semiconductor module
USD721340S1 (en) * 2012-12-21 2015-01-20 Fuji Electric Co., Ltd. Semiconductor module
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD798832S1 (en) * 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module

Patent Citations (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4218724A (en) * 1978-11-21 1980-08-19 Kaufman Lance R Compact circuit package having improved circuit connectors
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US5410450A (en) * 1991-12-10 1995-04-25 Fuji Electric Co., Ltd. Internal wiring structure of a semiconductor device
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
US5408128A (en) * 1993-09-15 1995-04-18 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
USD360619S (en) * 1993-09-16 1995-07-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD357672S (en) * 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD357671S (en) * 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD357462S (en) * 1993-09-16 1995-04-18 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD389808S (en) * 1996-01-09 1998-01-27 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD396450S (en) * 1996-12-24 1998-07-28 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6078501A (en) * 1997-12-22 2000-06-20 Omnirel Llc Power semiconductor module
USD441726S1 (en) * 1999-07-14 2001-05-08 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor element
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
US20030042584A1 (en) * 2001-09-05 2003-03-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of manufacturing the same
US6774465B2 (en) * 2001-10-05 2004-08-10 Fairchild Korea Semiconductor, Ltd. Semiconductor power package module
US20110044012A1 (en) * 2006-12-15 2011-02-24 Mitsubishi Electric Corporation Semiconductor device
US8107255B2 (en) * 2007-09-27 2012-01-31 Sanyo Semiconductor Co., Ltd. Circuit device and method of manufacturing the same
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
US20100149774A1 (en) * 2008-12-17 2010-06-17 Mitsubishi Electric Corporation Semiconductor device
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD721340S1 (en) * 2012-12-21 2015-01-20 Fuji Electric Co., Ltd. Semiconductor module
USD712853S1 (en) * 2012-12-21 2014-09-09 Fuji Electric Co., Ltd. Semiconductor module
USD710319S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD721048S1 (en) * 2013-06-17 2015-01-13 Fuji Electric Co., Ltd. Semiconductor module
USD705184S1 (en) * 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD785577S1 (en) * 2013-08-21 2017-05-02 Mitsubishi Electric Corporation Semiconductor device
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD773413S1 (en) * 2015-02-04 2016-12-06 Mitsubishi Electric Corporation Semiconductor device
USD773412S1 (en) * 2015-02-04 2016-12-06 Mitsubishi Electric Corporation Semiconductor device
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
USD798832S1 (en) * 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD827593S1 (en) * 2014-11-28 2018-09-04 Fuji Electric Co., Ltd Semiconductor module
USD823270S1 (en) * 2016-09-30 2018-07-17 Rohm Co., Ltd. Semiconductor device
USD827591S1 (en) * 2016-10-31 2018-09-04 Fuji Electric Co., Ltd. Semiconductor module
USD822628S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD822627S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD837752S1 (en) * 2017-01-31 2019-01-08 Dylan James Sievers Heatsink
USD873227S1 (en) * 2017-10-23 2020-01-21 Mitsubishi Electric Corporation Semiconductor device
USD877102S1 (en) * 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD978809S1 (en) 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD903613S1 (en) 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD1037163S1 (en) * 2021-11-17 2024-07-30 Fuji Electric Co., Ltd. Semiconductor module

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