USD729753S1 - Elastic membrane for semiconductor wafer polishing - Google Patents

Elastic membrane for semiconductor wafer polishing Download PDF

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Publication number
USD729753S1
USD729753S1 US29/496,207 US201429496207F USD729753S US D729753 S1 USD729753 S1 US D729753S1 US 201429496207 F US201429496207 F US 201429496207F US D729753 S USD729753 S US D729753S
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United States
Prior art keywords
semiconductor wafer
elastic membrane
wafer polishing
view
polishing
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US29/496,207
Inventor
Makoto Fukushima
Hozumi Yasuda
Osamu Nabeya
Katsuhide Watanabe
Keisuke Namiki
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Ebara Corp
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Ebara Corp
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FIG. 1 is a front view of an elastic membrane for semiconductor wafer polishing showing our new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a plan view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a cross-section view taken along the line 7-7 of FIG. 2 thereof;
FIG. 8 is a enlarged view of part 8 of FIG. 7 thereof; and,
FIG. 9 is a enlarged perspective view, observed from above thereof.
The broken lines depict environmental subject matter only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an elastic membrane for semiconductor wafer polishing, as shown and described.
US29/496,207 2010-12-28 2014-07-10 Elastic membrane for semiconductor wafer polishing Active USD729753S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/496,207 USD729753S1 (en) 2010-12-28 2014-07-10 Elastic membrane for semiconductor wafer polishing

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2010-031214 2010-02-16
JP2010031214 2010-12-28
JP2010-031215 2010-12-28
JP2010031216 2010-12-28
JP2010-031216 2010-12-28
JP2010031213 2010-12-28
JP2010-031213 2010-12-28
JP2010031215 2010-12-28
US29/384,219 USD711330S1 (en) 2010-12-28 2011-01-28 Elastic membrane for semiconductor wafer polishing
US29/496,207 USD729753S1 (en) 2010-12-28 2014-07-10 Elastic membrane for semiconductor wafer polishing

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US29/384,219 Division USD711330S1 (en) 2010-12-28 2011-01-28 Elastic membrane for semiconductor wafer polishing

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USD729753S1 true USD729753S1 (en) 2015-05-19

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US29/496,207 Active USD729753S1 (en) 2010-12-28 2014-07-10 Elastic membrane for semiconductor wafer polishing

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD769200S1 (en) 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD814473S1 (en) * 2016-01-19 2018-04-03 Sony Corporation Memory card
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD711330S1 (en) * 2010-12-28 2014-08-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing

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USD634719S1 (en) 2009-08-27 2011-03-22 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
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US8021215B2 (en) * 2006-11-22 2011-09-20 Applied Materials, Inc. Carrier head with retaining ring and carrier ring
USD649126S1 (en) 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
USD650053S1 (en) 2011-02-15 2011-12-06 Prinsco, Inc. Pipe rib gasket
USD655797S1 (en) 2010-03-24 2012-03-13 Nippon Valqua Industries, Ltd. Hybrid seal member
US8202140B2 (en) 2007-09-04 2012-06-19 Samsung Electronics Co., Ltd. Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same
USD681176S1 (en) 2012-07-13 2013-04-30 Kmt Waterjet Systems Inc. Seal ring
US8454413B2 (en) * 2005-12-29 2013-06-04 Applied Materials, Inc. Multi-chamber carrier head with a textured membrane
US8469776B2 (en) * 2006-11-22 2013-06-25 Applied Materials, Inc. Flexible membrane for carrier head
US20130316628A1 (en) * 2012-05-23 2013-11-28 Samsung Electronics Co., Ltd. Flexible membranes for a polishing head
USD696751S1 (en) 2011-10-27 2013-12-31 Mueller International, Llc Slip-on gasket
USD711330S1 (en) * 2010-12-28 2014-08-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
US8859070B2 (en) * 2011-11-30 2014-10-14 Ebara Corporation Elastic membrane
US8932106B2 (en) * 2010-09-08 2015-01-13 Ebara Corporation Polishing apparatus having thermal energy measuring means
US8939817B2 (en) * 2011-05-31 2015-01-27 K.C. Tech Co., Ltd. Membrane assembly and carrier head having the membrane assembly

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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US2576673A (en) 1946-09-09 1951-11-27 Prentiss I Cole Fluid seal
US3064984A (en) 1959-08-20 1962-11-20 Gen Motors Corp Sealing grommet
US3347556A (en) 1965-02-24 1967-10-17 Lambert W Fleckenstein Sealing ring for piston and cylinder assemblies
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USD244533S (en) 1975-06-11 1977-05-31 Ite Imperial Corporation Water resistant gasket for conduits and the like
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USD286361S (en) 1983-09-29 1986-10-28 Dart Industries Inc Coaster or the like
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US7235139B2 (en) 2003-10-28 2007-06-26 Veeco Instruments Inc. Wafer carrier for growing GaN wafers
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US20080070479A1 (en) 2004-11-01 2008-03-20 Ebara Corporation Polishing Apparatus
US7635292B2 (en) 2004-12-10 2009-12-22 Ebara Corporation Substrate holding device and polishing apparatus
JP2006159392A (en) 2004-12-10 2006-06-22 Ebara Corp Substrate holding device and polishing device
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USD546784S1 (en) 2005-09-29 2007-07-17 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD548705S1 (en) 2005-09-29 2007-08-14 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
US8808062B2 (en) * 2005-12-29 2014-08-19 Applied Materials, Inc. Multi-chamber carrier head with a textured membrane
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US20080119119A1 (en) 2006-11-22 2008-05-22 Applied Materials, Inc. Carrier Ring for Carrier Head
US8469776B2 (en) * 2006-11-22 2013-06-25 Applied Materials, Inc. Flexible membrane for carrier head
US8021215B2 (en) * 2006-11-22 2011-09-20 Applied Materials, Inc. Carrier head with retaining ring and carrier ring
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USD609655S1 (en) 2008-10-03 2010-02-09 Ngk Insulators, Ltd. Electrostatic chuck
USD649126S1 (en) 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
USD616390S1 (en) 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
USD633452S1 (en) 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD634719S1 (en) 2009-08-27 2011-03-22 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD655797S1 (en) 2010-03-24 2012-03-13 Nippon Valqua Industries, Ltd. Hybrid seal member
USD638523S1 (en) 2010-07-20 2011-05-24 Wärtsilä Japan Ltd. Seal ring for stern tube
US8932106B2 (en) * 2010-09-08 2015-01-13 Ebara Corporation Polishing apparatus having thermal energy measuring means
USD711330S1 (en) * 2010-12-28 2014-08-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
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US8939817B2 (en) * 2011-05-31 2015-01-27 K.C. Tech Co., Ltd. Membrane assembly and carrier head having the membrane assembly
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US8859070B2 (en) * 2011-11-30 2014-10-14 Ebara Corporation Elastic membrane
US20130316628A1 (en) * 2012-05-23 2013-11-28 Samsung Electronics Co., Ltd. Flexible membranes for a polishing head
USD681176S1 (en) 2012-07-13 2013-04-30 Kmt Waterjet Systems Inc. Seal ring

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD769200S1 (en) 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD813180S1 (en) 2013-05-15 2018-03-20 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD814473S1 (en) * 2016-01-19 2018-04-03 Sony Corporation Memory card
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD913977S1 (en) 2016-12-12 2021-03-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing

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