USD729753S1 - Elastic membrane for semiconductor wafer polishing - Google Patents

Elastic membrane for semiconductor wafer polishing Download PDF

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Publication number
USD729753S1
USD729753S1 US29/496,207 US201429496207F USD729753S US D729753 S1 USD729753 S1 US D729753S1 US 201429496207 F US201429496207 F US 201429496207F US D729753 S USD729753 S US D729753S
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US
United States
Prior art keywords
semiconductor wafer
elastic membrane
wafer polishing
view
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/496,207
Inventor
Makoto Fukushima
Hozumi Yasuda
Osamu Nabeya
Katsuhide Watanabe
Keisuke Namiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to US29/496,207 priority Critical patent/USD729753S1/en
Application granted granted Critical
Publication of USD729753S1 publication Critical patent/USD729753S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front view of an elastic membrane for semiconductor wafer polishing showing our new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a plan view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a cross-section view taken along the line 7-7 of FIG. 2 thereof;
FIG. 8 is a enlarged view of part 8 of FIG. 7 thereof; and,
FIG. 9 is a enlarged perspective view, observed from above thereof.
The broken lines depict environmental subject matter only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an elastic membrane for semiconductor wafer polishing, as shown and described.
US29/496,207 2010-12-28 2014-07-10 Elastic membrane for semiconductor wafer polishing Active USD729753S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/496,207 USD729753S1 (en) 2010-12-28 2014-07-10 Elastic membrane for semiconductor wafer polishing

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2010-031214 2010-02-16
JP2010-031213 2010-12-28
JP2010031216 2010-12-28
JP2010-031215 2010-12-28
JP2010031214 2010-12-28
JP2010031215 2010-12-28
JP2010-031216 2010-12-28
JP2010031213 2010-12-28
US29/384,219 USD711330S1 (en) 2010-12-28 2011-01-28 Elastic membrane for semiconductor wafer polishing
US29/496,207 USD729753S1 (en) 2010-12-28 2014-07-10 Elastic membrane for semiconductor wafer polishing

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/384,219 Division USD711330S1 (en) 2010-12-28 2011-01-28 Elastic membrane for semiconductor wafer polishing

Publications (1)

Publication Number Publication Date
USD729753S1 true USD729753S1 (en) 2015-05-19

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US29/384,219 Active USD711330S1 (en) 2010-12-28 2011-01-28 Elastic membrane for semiconductor wafer polishing
US29/496,207 Active USD729753S1 (en) 2010-12-28 2014-07-10 Elastic membrane for semiconductor wafer polishing

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US29/384,219 Active USD711330S1 (en) 2010-12-28 2011-01-28 Elastic membrane for semiconductor wafer polishing

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US (2) USD711330S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD769200S1 (en) 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD814473S1 (en) * 2016-01-19 2018-04-03 Sony Corporation Memory card
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD769200S1 (en) 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD813180S1 (en) 2013-05-15 2018-03-20 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD814473S1 (en) * 2016-01-19 2018-04-03 Sony Corporation Memory card
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD913977S1 (en) 2016-12-12 2021-03-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing

Also Published As

Publication number Publication date
USD711330S1 (en) 2014-08-19

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