USD716239S1 - Upper chamber liner - Google Patents
Upper chamber liner Download PDFInfo
- Publication number
- USD716239S1 USD716239S1 US29/471,945 US201329471945F USD716239S US D716239 S1 USD716239 S1 US D716239S1 US 201329471945 F US201329471945 F US 201329471945F US D716239 S USD716239 S US D716239S
- Authority
- US
- United States
- Prior art keywords
- upper chamber
- chamber liner
- view
- liner
- taken along
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
The broken lines in the figures form no part of the claimed design.
The upper chamber liner is shown broken away in FIGS. 11 and 12 to indicate that no particular length is claimed.
All surfaces not shown, form no part of the claimed design.
Claims (1)
- The ornamental design for an upper chamber liner, as shown and described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/471,945 USD716239S1 (en) | 2013-11-06 | 2013-11-06 | Upper chamber liner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/471,945 USD716239S1 (en) | 2013-11-06 | 2013-11-06 | Upper chamber liner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD716239S1 true USD716239S1 (en) | 2014-10-28 |
Family
ID=51753688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/471,945 Active USD716239S1 (en) | 2013-11-06 | 2013-11-06 | Upper chamber liner |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD716239S1 (en) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD786201S1 (en) * | 2015-10-19 | 2017-05-09 | Tymphany Hk Limited | Heat sink for woofer |
| USD802790S1 (en) * | 2015-06-12 | 2017-11-14 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
| USD837754S1 (en) * | 2017-04-28 | 2019-01-08 | Applied Materials, Inc. | Plasma chamber liner |
| USD838681S1 (en) * | 2017-04-28 | 2019-01-22 | Applied Materials, Inc. | Plasma chamber liner |
| USD842259S1 (en) * | 2017-04-28 | 2019-03-05 | Applied Materials, Inc. | Plasma chamber liner |
| USD875053S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
| USD875054S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
| USD875055S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
| USD913979S1 (en) * | 2019-08-28 | 2021-03-23 | Applied Materials, Inc. | Inner shield for a substrate processing chamber |
| USD925481S1 (en) * | 2018-12-06 | 2021-07-20 | Kokusai Electric Corporation | Inlet liner for substrate processing apparatus |
| USD931241S1 (en) * | 2019-08-28 | 2021-09-21 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
| USD1034493S1 (en) * | 2022-11-25 | 2024-07-09 | Ap Systems Inc. | Chamber wall liner for a semiconductor manufacturing apparatus |
| US12100577B2 (en) | 2019-08-28 | 2024-09-24 | Applied Materials, Inc. | High conductance inner shield for process chamber |
| USD1051867S1 (en) * | 2020-03-19 | 2024-11-19 | Applied Materials, Inc. | Confinement liner for a substrate processing chamber |
| USD1052546S1 (en) * | 2020-12-10 | 2024-11-26 | Nuflare Technology, Inc. | Cover ring of top plate for semiconductor manufacturing apparatus |
| USD1064005S1 (en) | 2022-08-04 | 2025-02-25 | Applied Materials, Inc. | Grounding ring of a process kit for semiconductor substrate processing |
| USD1069863S1 (en) * | 2022-08-04 | 2025-04-08 | Applied Materials, Inc. | Deposition ring of a process kit for semiconductor substrate processing |
| US12553133B2 (en) | 2022-08-04 | 2026-02-17 | Applied Materials Inc. | Substrate handling system, method, and apparatus |
Citations (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4340462A (en) * | 1981-02-13 | 1982-07-20 | Lam Research Corporation | Adjustable electrode plasma processing chamber |
| USD404370S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Cap for use in a semiconductor wafer heat processing apparatus |
| USD404372S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Ring for use in a semiconductor wafer heat processing apparatus |
| US6170429B1 (en) * | 1998-09-30 | 2001-01-09 | Lam Research Corporation | Chamber liner for semiconductor process chambers |
| US20020069970A1 (en) * | 2000-03-07 | 2002-06-13 | Applied Materials, Inc. | Temperature controlled semiconductor processing chamber liner |
| US6884297B2 (en) * | 2003-03-31 | 2005-04-26 | Ips Ltd. | Thin film deposition reactor |
| US20050229849A1 (en) * | 2004-02-13 | 2005-10-20 | Applied Materials, Inc. | High productivity plasma processing chamber |
| US7011039B1 (en) * | 2000-07-07 | 2006-03-14 | Applied Materials, Inc. | Multi-purpose processing chamber with removable chamber liner |
| US7234412B2 (en) * | 2002-04-11 | 2007-06-26 | Micron Technology, Inc. | Semiconductor substrate deposition processor chamber liner apparatus |
| USD556704S1 (en) * | 2005-08-25 | 2007-12-04 | Hitachi High-Technologies Corporation | Grounded electrode for a plasma processing apparatus |
| USD557226S1 (en) * | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| US20080041820A1 (en) * | 2002-09-20 | 2008-02-21 | Lam Research Corporation | Apparatus for reducing polymer deposition on a substrate and substrate support |
| US20080121620A1 (en) * | 2006-11-24 | 2008-05-29 | Guo G X | Processing chamber |
| USD593969S1 (en) * | 2006-10-10 | 2009-06-09 | Tokyo Electron Limited | Processing chamber for manufacturing semiconductors |
| USD600221S1 (en) * | 2008-03-28 | 2009-09-15 | Tokyo Electron Limited | Wafer boat |
| USD600222S1 (en) * | 2008-03-28 | 2009-09-15 | Tokyo Electron Limited | Wafer boat |
| US7942969B2 (en) * | 2007-05-30 | 2011-05-17 | Applied Materials, Inc. | Substrate cleaning chamber and components |
| US7987814B2 (en) * | 2008-04-07 | 2011-08-02 | Applied Materials, Inc. | Lower liner with integrated flow equalizer and improved conductance |
| USD658692S1 (en) * | 2011-03-30 | 2012-05-01 | Tokyo Electron Limited | Liner for plasma processing apparatus |
| USD658693S1 (en) * | 2011-03-30 | 2012-05-01 | Tokyo Electron Limited | Liner for plasma processing apparatus |
| USD658691S1 (en) * | 2011-03-30 | 2012-05-01 | Tokyo Electron Limited | Liner for plasma processing apparatus |
| US8313578B2 (en) * | 2008-01-28 | 2012-11-20 | Applied Materials, Inc. | Etching chamber having flow equalizer and lower liner |
| USD678228S1 (en) * | 2011-03-30 | 2013-03-19 | Tokyo Electron Limited | Chamber block |
| USD699692S1 (en) * | 2012-01-19 | 2014-02-18 | Applied Materials, Inc. | Upper liner |
-
2013
- 2013-11-06 US US29/471,945 patent/USD716239S1/en active Active
Patent Citations (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4340462A (en) * | 1981-02-13 | 1982-07-20 | Lam Research Corporation | Adjustable electrode plasma processing chamber |
| USD404370S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Cap for use in a semiconductor wafer heat processing apparatus |
| USD404372S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Ring for use in a semiconductor wafer heat processing apparatus |
| US6170429B1 (en) * | 1998-09-30 | 2001-01-09 | Lam Research Corporation | Chamber liner for semiconductor process chambers |
| US6277237B1 (en) * | 1998-09-30 | 2001-08-21 | Lam Research Corporation | Chamber liner for semiconductor process chambers |
| US20020069970A1 (en) * | 2000-03-07 | 2002-06-13 | Applied Materials, Inc. | Temperature controlled semiconductor processing chamber liner |
| US7011039B1 (en) * | 2000-07-07 | 2006-03-14 | Applied Materials, Inc. | Multi-purpose processing chamber with removable chamber liner |
| US7234412B2 (en) * | 2002-04-11 | 2007-06-26 | Micron Technology, Inc. | Semiconductor substrate deposition processor chamber liner apparatus |
| US20080041820A1 (en) * | 2002-09-20 | 2008-02-21 | Lam Research Corporation | Apparatus for reducing polymer deposition on a substrate and substrate support |
| US6884297B2 (en) * | 2003-03-31 | 2005-04-26 | Ips Ltd. | Thin film deposition reactor |
| US20050229849A1 (en) * | 2004-02-13 | 2005-10-20 | Applied Materials, Inc. | High productivity plasma processing chamber |
| USD557226S1 (en) * | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD556704S1 (en) * | 2005-08-25 | 2007-12-04 | Hitachi High-Technologies Corporation | Grounded electrode for a plasma processing apparatus |
| USD593969S1 (en) * | 2006-10-10 | 2009-06-09 | Tokyo Electron Limited | Processing chamber for manufacturing semiconductors |
| US20080121620A1 (en) * | 2006-11-24 | 2008-05-29 | Guo G X | Processing chamber |
| US7942969B2 (en) * | 2007-05-30 | 2011-05-17 | Applied Materials, Inc. | Substrate cleaning chamber and components |
| US8313578B2 (en) * | 2008-01-28 | 2012-11-20 | Applied Materials, Inc. | Etching chamber having flow equalizer and lower liner |
| USD600221S1 (en) * | 2008-03-28 | 2009-09-15 | Tokyo Electron Limited | Wafer boat |
| USD600222S1 (en) * | 2008-03-28 | 2009-09-15 | Tokyo Electron Limited | Wafer boat |
| US7987814B2 (en) * | 2008-04-07 | 2011-08-02 | Applied Materials, Inc. | Lower liner with integrated flow equalizer and improved conductance |
| US8282736B2 (en) * | 2008-04-07 | 2012-10-09 | Applied Materials, Inc. | Lower liner with integrated flow equalizer and improved conductance |
| US8118938B2 (en) * | 2008-04-07 | 2012-02-21 | Applied Materials, Inc. | Lower liner with integrated flow equalizer and improved conductance |
| USD658692S1 (en) * | 2011-03-30 | 2012-05-01 | Tokyo Electron Limited | Liner for plasma processing apparatus |
| USD658693S1 (en) * | 2011-03-30 | 2012-05-01 | Tokyo Electron Limited | Liner for plasma processing apparatus |
| USD658691S1 (en) * | 2011-03-30 | 2012-05-01 | Tokyo Electron Limited | Liner for plasma processing apparatus |
| USD678228S1 (en) * | 2011-03-30 | 2013-03-19 | Tokyo Electron Limited | Chamber block |
| USD699692S1 (en) * | 2012-01-19 | 2014-02-18 | Applied Materials, Inc. | Upper liner |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD802790S1 (en) * | 2015-06-12 | 2017-11-14 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
| USD786201S1 (en) * | 2015-10-19 | 2017-05-09 | Tymphany Hk Limited | Heat sink for woofer |
| USD837754S1 (en) * | 2017-04-28 | 2019-01-08 | Applied Materials, Inc. | Plasma chamber liner |
| USD838681S1 (en) * | 2017-04-28 | 2019-01-22 | Applied Materials, Inc. | Plasma chamber liner |
| USD842259S1 (en) * | 2017-04-28 | 2019-03-05 | Applied Materials, Inc. | Plasma chamber liner |
| USD875053S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
| USD875054S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
| USD875055S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
| USD925481S1 (en) * | 2018-12-06 | 2021-07-20 | Kokusai Electric Corporation | Inlet liner for substrate processing apparatus |
| USD913979S1 (en) * | 2019-08-28 | 2021-03-23 | Applied Materials, Inc. | Inner shield for a substrate processing chamber |
| USD931241S1 (en) * | 2019-08-28 | 2021-09-21 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
| US12100577B2 (en) | 2019-08-28 | 2024-09-24 | Applied Materials, Inc. | High conductance inner shield for process chamber |
| USD1051867S1 (en) * | 2020-03-19 | 2024-11-19 | Applied Materials, Inc. | Confinement liner for a substrate processing chamber |
| USD1052546S1 (en) * | 2020-12-10 | 2024-11-26 | Nuflare Technology, Inc. | Cover ring of top plate for semiconductor manufacturing apparatus |
| USD1064005S1 (en) | 2022-08-04 | 2025-02-25 | Applied Materials, Inc. | Grounding ring of a process kit for semiconductor substrate processing |
| USD1069863S1 (en) * | 2022-08-04 | 2025-04-08 | Applied Materials, Inc. | Deposition ring of a process kit for semiconductor substrate processing |
| US12553133B2 (en) | 2022-08-04 | 2026-02-17 | Applied Materials Inc. | Substrate handling system, method, and apparatus |
| USD1034493S1 (en) * | 2022-11-25 | 2024-07-09 | Ap Systems Inc. | Chamber wall liner for a semiconductor manufacturing apparatus |
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