USD687791S1 - Multi-keyed wafer carrier - Google Patents

Multi-keyed wafer carrier Download PDF

Info

Publication number
USD687791S1
USD687791S1 US29/416,236 US201229416236F USD687791S US D687791 S1 USD687791 S1 US D687791S1 US 201229416236 F US201229416236 F US 201229416236F US D687791 S USD687791 S US D687791S
Authority
US
United States
Prior art keywords
wafer carrier
keyed
keyed wafer
view
enlarged view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/416,236
Inventor
Sandeep Krishnan
Keng Moy
Alexander I. Gurary
Matthew King
Vadim Boguslavskiy
Steven Krommenhoek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Veeco Instruments Inc
Original Assignee
Veeco Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Veeco Instruments Inc filed Critical Veeco Instruments Inc
Priority to US29/416,236 priority Critical patent/USD687791S1/en
Assigned to VEECO INSTRUMENTS INC. reassignment VEECO INSTRUMENTS INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GURARY, ALEXANDER I., BOGUSLAVSKIY, VADIM, KING, MATTHEW, KRISHNAN, SANDEEP, KROMMENHOEK, STEVEN, MOY, KENG
Application granted granted Critical
Publication of USD687791S1 publication Critical patent/USD687791S1/en
Assigned to HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT reassignment HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT PATENT SECURITY AGREEMENT Assignors: VEECO INSTRUMENTS INC.
Assigned to HSBC BANK USA, NATIONAL ASSOCIATION reassignment HSBC BANK USA, NATIONAL ASSOCIATION SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: VEECO INSTRUMENTS INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a bottom perspective view of a multi-keyed wafer carrier showing a first embodiment of our new design;
FIG. 2 is an enlarged view of a portion of FIG. 1;
FIG. 3 is a bottom plan view of the first embodiment;
FIG. 4 is an enlarged view of a portion of FIG. 3;
FIG. 5 is a bottom perspective view of a multi-keyed wafer carrier showing a second embodiment of our new design;
FIG. 6 is an enlarged view of a portion of FIG. 5;
FIG. 7 is a bottom plan view of the second embodiment;
FIG. 8 is an enlarged view of a portion of FIG. 7;
FIG. 9 is a bottom perspective view of a multi-keyed wafer carrier showing a third embodiment of our new design;
FIG. 10 is an enlarged view of a portion of FIG. 9;
FIG. 11 is a bottom plan view of the third embodiment;
FIG. 12 is an enlarged view of a portion of FIG. 11;
FIG. 13 is a top perspective view that can correspond to any of the first, second, or third embodiments;
FIG. 14 is a top plan view that can correspond to any of the first, second, or third embodiments; and,
FIG. 15 is a right side view that can correspond to any of the first, second, or third embodiments, the left side, front, and rear views being the same as the right side view.
The dash-dot broken lines shown in the drawings define the area corresponding to the enlarged portion shown in FIGS. 2, 4, 6, 8, 10, and 12 views and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a multi-keyed wafer carrier, as shown and described.
US29/416,236 2012-03-20 2012-03-20 Multi-keyed wafer carrier Active USD687791S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/416,236 USD687791S1 (en) 2012-03-20 2012-03-20 Multi-keyed wafer carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/416,236 USD687791S1 (en) 2012-03-20 2012-03-20 Multi-keyed wafer carrier

Publications (1)

Publication Number Publication Date
USD687791S1 true USD687791S1 (en) 2013-08-13

Family

ID=48917009

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/416,236 Active USD687791S1 (en) 2012-03-20 2012-03-20 Multi-keyed wafer carrier

Country Status (1)

Country Link
US (1) USD687791S1 (en)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130125820A1 (en) * 2011-11-23 2013-05-23 Gerald Zheyao Yin Chemical vapor deposition or epitaxial-layer growth reactor and supporter thereof
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD723077S1 (en) * 2013-12-03 2015-02-24 Applied Materials, Inc. Chuck carrier film
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) * 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD778247S1 (en) 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD869409S1 (en) 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD947802S1 (en) 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1072774S1 (en) 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1110975S1 (en) 2022-01-12 2026-02-03 Applied Materials Inc. Collimator for a physical vapor deposition (PVD) chamber

Citations (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3731435A (en) * 1971-02-09 1973-05-08 Speedfam Corp Polishing machine load plate
US3845738A (en) * 1973-09-12 1974-11-05 Rca Corp Vapor deposition apparatus with pyrolytic graphite heat shield
US4165584A (en) * 1977-01-27 1979-08-28 International Telephone And Telegraph Corporation Apparatus for lapping or polishing materials
US4512113A (en) * 1982-09-23 1985-04-23 Budinger William D Workpiece holder for polishing operation
US4739589A (en) * 1985-07-12 1988-04-26 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoff Mbh Process and apparatus for abrasive machining of a wafer-like workpiece
US5191738A (en) * 1989-06-16 1993-03-09 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafer
US5193316A (en) * 1991-10-29 1993-03-16 Texas Instruments Incorporated Semiconductor wafer polishing using a hydrostatic medium
US5377451A (en) * 1993-02-23 1995-01-03 Memc Electronic Materials, Inc. Wafer polishing apparatus and method
US5422316A (en) * 1994-03-18 1995-06-06 Memc Electronic Materials, Inc. Semiconductor wafer polisher and method
US5573448A (en) * 1993-08-18 1996-11-12 Shin-Etsu Handotai Co., Ltd. Method of polishing wafers, a backing pad used therein, and method of making the backing pad
US5647789A (en) * 1993-11-01 1997-07-15 Fujikoshi Kakai Kogyo Kabushiki Kaisha Polishing machine and a method of polishing a work
US5674107A (en) * 1995-04-25 1997-10-07 Lucent Technologies Inc. Diamond polishing method and apparatus employing oxygen-emitting medium
US5683518A (en) * 1993-01-21 1997-11-04 Moore Epitaxial, Inc. Rapid thermal processing apparatus for processing semiconductor wafers
US5788777A (en) * 1997-03-06 1998-08-04 Burk, Jr.; Albert A. Susceptor for an epitaxial growth factor
US5840124A (en) * 1997-06-30 1998-11-24 Emcore Corporation Wafer carrier with flexible wafer flat holder
US5865666A (en) * 1997-08-20 1999-02-02 Lsi Logic Corporation Apparatus and method for polish removing a precise amount of material from a wafer
US6080042A (en) * 1997-10-31 2000-06-27 Virginia Semiconductor, Inc. Flatness and throughput of single side polishing of wafers
US6241825B1 (en) * 1999-04-16 2001-06-05 Cutek Research Inc. Compliant wafer chuck
US20020011204A1 (en) * 2000-02-28 2002-01-31 Applied Materials, Inc. Semiconductor wafer support lift-pin assembly
US6375749B1 (en) * 1999-07-14 2002-04-23 Seh America, Inc. Susceptorless semiconductor wafer support and reactor system for epitaxial layer growth
US6454635B1 (en) * 2000-08-08 2002-09-24 Memc Electronic Materials, Inc. Method and apparatus for a wafer carrier having an insert
US6500059B2 (en) * 2000-12-01 2002-12-31 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus and method for mounting a wafer in a polishing machine
US6514424B2 (en) * 2000-05-11 2003-02-04 WACKER SILTRONIC GESELLSCHAFT FüR HALBLEITERMATERIALIEN AG Process for the double-side polishing of semiconductor wafers and carrier for carrying out the process
US20030057089A1 (en) * 2000-12-01 2003-03-27 Tin Nguyen Disk carrier
US6666948B2 (en) * 2001-04-23 2003-12-23 Phuong Van Nguyen Silicon wafer polisher
US6709981B2 (en) * 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
US6733367B1 (en) * 2001-04-23 2004-05-11 Phuong Van Nguyen Method and apparatus for polishing silicon wafers
US7008308B2 (en) * 2003-05-20 2006-03-07 Memc Electronic Materials, Inc. Wafer carrier
US7169234B2 (en) * 2004-01-30 2007-01-30 Asm America, Inc. Apparatus and methods for preventing rotational slippage between a vertical shaft and a support structure for a semiconductor wafer holder
US7235139B2 (en) * 2003-10-28 2007-06-26 Veeco Instruments Inc. Wafer carrier for growing GaN wafers
US7252737B2 (en) * 2001-08-09 2007-08-07 Applied Materials, Inc. Pedestal with integral shield
US20090194026A1 (en) * 2008-01-31 2009-08-06 Burrows Brian H Processing system for fabricating compound nitride semiconductor devices
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US8177993B2 (en) * 2006-11-05 2012-05-15 Globalfoundries Singapore Pte Ltd Apparatus and methods for cleaning and drying of wafers
US8182315B2 (en) * 2008-03-24 2012-05-22 Phuong Van Nguyen Chemical mechanical polishing pad and dresser
US8328600B2 (en) * 2010-03-12 2012-12-11 Duescher Wayne O Workpiece spindles supported floating abrasive platen
USD674759S1 (en) * 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier

Patent Citations (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3731435A (en) * 1971-02-09 1973-05-08 Speedfam Corp Polishing machine load plate
US3845738A (en) * 1973-09-12 1974-11-05 Rca Corp Vapor deposition apparatus with pyrolytic graphite heat shield
US4165584A (en) * 1977-01-27 1979-08-28 International Telephone And Telegraph Corporation Apparatus for lapping or polishing materials
US4512113A (en) * 1982-09-23 1985-04-23 Budinger William D Workpiece holder for polishing operation
US4739589A (en) * 1985-07-12 1988-04-26 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoff Mbh Process and apparatus for abrasive machining of a wafer-like workpiece
US5191738A (en) * 1989-06-16 1993-03-09 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafer
US5193316A (en) * 1991-10-29 1993-03-16 Texas Instruments Incorporated Semiconductor wafer polishing using a hydrostatic medium
US5683518A (en) * 1993-01-21 1997-11-04 Moore Epitaxial, Inc. Rapid thermal processing apparatus for processing semiconductor wafers
US5377451A (en) * 1993-02-23 1995-01-03 Memc Electronic Materials, Inc. Wafer polishing apparatus and method
US5573448A (en) * 1993-08-18 1996-11-12 Shin-Etsu Handotai Co., Ltd. Method of polishing wafers, a backing pad used therein, and method of making the backing pad
US5647789A (en) * 1993-11-01 1997-07-15 Fujikoshi Kakai Kogyo Kabushiki Kaisha Polishing machine and a method of polishing a work
US5422316A (en) * 1994-03-18 1995-06-06 Memc Electronic Materials, Inc. Semiconductor wafer polisher and method
US5674107A (en) * 1995-04-25 1997-10-07 Lucent Technologies Inc. Diamond polishing method and apparatus employing oxygen-emitting medium
US5788777A (en) * 1997-03-06 1998-08-04 Burk, Jr.; Albert A. Susceptor for an epitaxial growth factor
US5840124A (en) * 1997-06-30 1998-11-24 Emcore Corporation Wafer carrier with flexible wafer flat holder
US5865666A (en) * 1997-08-20 1999-02-02 Lsi Logic Corporation Apparatus and method for polish removing a precise amount of material from a wafer
US6080042A (en) * 1997-10-31 2000-06-27 Virginia Semiconductor, Inc. Flatness and throughput of single side polishing of wafers
US6241825B1 (en) * 1999-04-16 2001-06-05 Cutek Research Inc. Compliant wafer chuck
US6375749B1 (en) * 1999-07-14 2002-04-23 Seh America, Inc. Susceptorless semiconductor wafer support and reactor system for epitaxial layer growth
US20020011204A1 (en) * 2000-02-28 2002-01-31 Applied Materials, Inc. Semiconductor wafer support lift-pin assembly
US6514424B2 (en) * 2000-05-11 2003-02-04 WACKER SILTRONIC GESELLSCHAFT FüR HALBLEITERMATERIALIEN AG Process for the double-side polishing of semiconductor wafers and carrier for carrying out the process
US6454635B1 (en) * 2000-08-08 2002-09-24 Memc Electronic Materials, Inc. Method and apparatus for a wafer carrier having an insert
US6709981B2 (en) * 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
US6500059B2 (en) * 2000-12-01 2002-12-31 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus and method for mounting a wafer in a polishing machine
US20030057089A1 (en) * 2000-12-01 2003-03-27 Tin Nguyen Disk carrier
US6666948B2 (en) * 2001-04-23 2003-12-23 Phuong Van Nguyen Silicon wafer polisher
US6733367B1 (en) * 2001-04-23 2004-05-11 Phuong Van Nguyen Method and apparatus for polishing silicon wafers
US7252737B2 (en) * 2001-08-09 2007-08-07 Applied Materials, Inc. Pedestal with integral shield
US7008308B2 (en) * 2003-05-20 2006-03-07 Memc Electronic Materials, Inc. Wafer carrier
US7235139B2 (en) * 2003-10-28 2007-06-26 Veeco Instruments Inc. Wafer carrier for growing GaN wafers
US7169234B2 (en) * 2004-01-30 2007-01-30 Asm America, Inc. Apparatus and methods for preventing rotational slippage between a vertical shaft and a support structure for a semiconductor wafer holder
US8177993B2 (en) * 2006-11-05 2012-05-15 Globalfoundries Singapore Pte Ltd Apparatus and methods for cleaning and drying of wafers
US20090194026A1 (en) * 2008-01-31 2009-08-06 Burrows Brian H Processing system for fabricating compound nitride semiconductor devices
US8182315B2 (en) * 2008-03-24 2012-05-22 Phuong Van Nguyen Chemical mechanical polishing pad and dresser
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US8328600B2 (en) * 2010-03-12 2012-12-11 Duescher Wayne O Workpiece spindles supported floating abrasive platen
USD674759S1 (en) * 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
US20130125820A1 (en) * 2011-11-23 2013-05-23 Gerald Zheyao Yin Chemical vapor deposition or epitaxial-layer growth reactor and supporter thereof
USD813180S1 (en) 2013-05-15 2018-03-20 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) * 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD723077S1 (en) * 2013-12-03 2015-02-24 Applied Materials, Inc. Chuck carrier film
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD852762S1 (en) 2015-03-27 2019-07-02 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD806046S1 (en) 2015-04-16 2017-12-26 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD778247S1 (en) 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD869409S1 (en) 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD902165S1 (en) 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD970566S1 (en) 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD947802S1 (en) 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD966357S1 (en) 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1072774S1 (en) 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1110975S1 (en) 2022-01-12 2026-02-03 Applied Materials Inc. Collimator for a physical vapor deposition (PVD) chamber
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber

Similar Documents

Publication Publication Date Title
USD687791S1 (en) Multi-keyed wafer carrier
USD687790S1 (en) Keyed wafer carrier
USD686582S1 (en) Wafer carrier having pockets
USD686175S1 (en) Wafer carrier having pockets
USD690671S1 (en) Wafer carrier having pockets
USD695241S1 (en) Wafer carrier having pockets
USD695242S1 (en) Wafer carrier having pockets
USD705927S1 (en) Absorbent article
USD686520S1 (en) Bracelet
USD690488S1 (en) Shoe
USD686174S1 (en) Semiconductor device
USD684141S1 (en) Portion of headphones
USD647678S1 (en) Dishrack
USD692942S1 (en) Eyewear
USD682712S1 (en) Watch
USD725497S1 (en) Watch
USD717254S1 (en) Semiconductor device
USD717256S1 (en) Semiconductor device
USD719113S1 (en) Semiconductor device
USD699693S1 (en) Semiconductor device
USD714660S1 (en) Package
USD685035S1 (en) Spinning top
USD689484S1 (en) Electronic device
USD732736S1 (en) Hair reader
USD688830S1 (en) Cosmetic case