USD687791S1 - Multi-keyed wafer carrier - Google Patents
Multi-keyed wafer carrier Download PDFInfo
- Publication number
- USD687791S1 USD687791S1 US29/416,236 US201229416236F USD687791S US D687791 S1 USD687791 S1 US D687791S1 US 201229416236 F US201229416236 F US 201229416236F US D687791 S USD687791 S US D687791S
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- US
- United States
- Prior art keywords
- wafer carrier
- keyed
- keyed wafer
- view
- enlarged view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The dash-dot broken lines shown in the drawings define the area corresponding to the enlarged portion shown in FIGS. 2 , 4, 6, 8, 10, and 12 views and form no part of the claimed design.
Claims (1)
- The ornamental design for a multi-keyed wafer carrier, as shown and described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/416,236 USD687791S1 (en) | 2012-03-20 | 2012-03-20 | Multi-keyed wafer carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/416,236 USD687791S1 (en) | 2012-03-20 | 2012-03-20 | Multi-keyed wafer carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD687791S1 true USD687791S1 (en) | 2013-08-13 |
Family
ID=48917009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/416,236 Active USD687791S1 (en) | 2012-03-20 | 2012-03-20 | Multi-keyed wafer carrier |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD687791S1 (en) |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130125820A1 (en) * | 2011-11-23 | 2013-05-23 | Gerald Zheyao Yin | Chemical vapor deposition or epitaxial-layer growth reactor and supporter thereof |
| USD720309S1 (en) * | 2011-11-18 | 2014-12-30 | Tokyo Electron Limited | Inner tube for process tube for manufacturing semiconductor wafers |
| USD723077S1 (en) * | 2013-12-03 | 2015-02-24 | Applied Materials, Inc. | Chuck carrier film |
| USD769200S1 (en) * | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| USD770990S1 (en) * | 2013-05-15 | 2016-11-08 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| USD778247S1 (en) | 2015-04-16 | 2017-02-07 | Veeco Instruments Inc. | Wafer carrier with a multi-pocket configuration |
| USD793971S1 (en) | 2015-03-27 | 2017-08-08 | Veeco Instruments Inc. | Wafer carrier with a 14-pocket configuration |
| USD793972S1 (en) | 2015-03-27 | 2017-08-08 | Veeco Instruments Inc. | Wafer carrier with a 31-pocket configuration |
| USD808349S1 (en) | 2013-05-15 | 2018-01-23 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| USD868124S1 (en) * | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD869409S1 (en) | 2016-09-30 | 2019-12-10 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD877101S1 (en) | 2018-03-09 | 2020-03-03 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD894137S1 (en) | 2017-10-05 | 2020-08-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD908645S1 (en) | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
| USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| USD940765S1 (en) | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD947802S1 (en) | 2020-05-20 | 2022-04-05 | Applied Materials, Inc. | Replaceable substrate carrier interfacing film |
| USD1007449S1 (en) | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD1053230S1 (en) | 2022-05-19 | 2024-12-03 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| USD1072774S1 (en) | 2021-02-06 | 2025-04-29 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD1110975S1 (en) | 2022-01-12 | 2026-02-03 | Applied Materials Inc. | Collimator for a physical vapor deposition (PVD) chamber |
Citations (37)
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| US3731435A (en) * | 1971-02-09 | 1973-05-08 | Speedfam Corp | Polishing machine load plate |
| US3845738A (en) * | 1973-09-12 | 1974-11-05 | Rca Corp | Vapor deposition apparatus with pyrolytic graphite heat shield |
| US4165584A (en) * | 1977-01-27 | 1979-08-28 | International Telephone And Telegraph Corporation | Apparatus for lapping or polishing materials |
| US4512113A (en) * | 1982-09-23 | 1985-04-23 | Budinger William D | Workpiece holder for polishing operation |
| US4739589A (en) * | 1985-07-12 | 1988-04-26 | Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoff Mbh | Process and apparatus for abrasive machining of a wafer-like workpiece |
| US5191738A (en) * | 1989-06-16 | 1993-03-09 | Shin-Etsu Handotai Co., Ltd. | Method of polishing semiconductor wafer |
| US5193316A (en) * | 1991-10-29 | 1993-03-16 | Texas Instruments Incorporated | Semiconductor wafer polishing using a hydrostatic medium |
| US5377451A (en) * | 1993-02-23 | 1995-01-03 | Memc Electronic Materials, Inc. | Wafer polishing apparatus and method |
| US5422316A (en) * | 1994-03-18 | 1995-06-06 | Memc Electronic Materials, Inc. | Semiconductor wafer polisher and method |
| US5573448A (en) * | 1993-08-18 | 1996-11-12 | Shin-Etsu Handotai Co., Ltd. | Method of polishing wafers, a backing pad used therein, and method of making the backing pad |
| US5647789A (en) * | 1993-11-01 | 1997-07-15 | Fujikoshi Kakai Kogyo Kabushiki Kaisha | Polishing machine and a method of polishing a work |
| US5674107A (en) * | 1995-04-25 | 1997-10-07 | Lucent Technologies Inc. | Diamond polishing method and apparatus employing oxygen-emitting medium |
| US5683518A (en) * | 1993-01-21 | 1997-11-04 | Moore Epitaxial, Inc. | Rapid thermal processing apparatus for processing semiconductor wafers |
| US5788777A (en) * | 1997-03-06 | 1998-08-04 | Burk, Jr.; Albert A. | Susceptor for an epitaxial growth factor |
| US5840124A (en) * | 1997-06-30 | 1998-11-24 | Emcore Corporation | Wafer carrier with flexible wafer flat holder |
| US5865666A (en) * | 1997-08-20 | 1999-02-02 | Lsi Logic Corporation | Apparatus and method for polish removing a precise amount of material from a wafer |
| US6080042A (en) * | 1997-10-31 | 2000-06-27 | Virginia Semiconductor, Inc. | Flatness and throughput of single side polishing of wafers |
| US6241825B1 (en) * | 1999-04-16 | 2001-06-05 | Cutek Research Inc. | Compliant wafer chuck |
| US20020011204A1 (en) * | 2000-02-28 | 2002-01-31 | Applied Materials, Inc. | Semiconductor wafer support lift-pin assembly |
| US6375749B1 (en) * | 1999-07-14 | 2002-04-23 | Seh America, Inc. | Susceptorless semiconductor wafer support and reactor system for epitaxial layer growth |
| US6454635B1 (en) * | 2000-08-08 | 2002-09-24 | Memc Electronic Materials, Inc. | Method and apparatus for a wafer carrier having an insert |
| US6500059B2 (en) * | 2000-12-01 | 2002-12-31 | Taiwan Semiconductor Manufacturing Company, Ltd | Apparatus and method for mounting a wafer in a polishing machine |
| US6514424B2 (en) * | 2000-05-11 | 2003-02-04 | WACKER SILTRONIC GESELLSCHAFT FüR HALBLEITERMATERIALIEN AG | Process for the double-side polishing of semiconductor wafers and carrier for carrying out the process |
| US20030057089A1 (en) * | 2000-12-01 | 2003-03-27 | Tin Nguyen | Disk carrier |
| US6666948B2 (en) * | 2001-04-23 | 2003-12-23 | Phuong Van Nguyen | Silicon wafer polisher |
| US6709981B2 (en) * | 2000-08-16 | 2004-03-23 | Memc Electronic Materials, Inc. | Method and apparatus for processing a semiconductor wafer using novel final polishing method |
| US6733367B1 (en) * | 2001-04-23 | 2004-05-11 | Phuong Van Nguyen | Method and apparatus for polishing silicon wafers |
| US7008308B2 (en) * | 2003-05-20 | 2006-03-07 | Memc Electronic Materials, Inc. | Wafer carrier |
| US7169234B2 (en) * | 2004-01-30 | 2007-01-30 | Asm America, Inc. | Apparatus and methods for preventing rotational slippage between a vertical shaft and a support structure for a semiconductor wafer holder |
| US7235139B2 (en) * | 2003-10-28 | 2007-06-26 | Veeco Instruments Inc. | Wafer carrier for growing GaN wafers |
| US7252737B2 (en) * | 2001-08-09 | 2007-08-07 | Applied Materials, Inc. | Pedestal with integral shield |
| US20090194026A1 (en) * | 2008-01-31 | 2009-08-06 | Burrows Brian H | Processing system for fabricating compound nitride semiconductor devices |
| USD633452S1 (en) * | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| US8177993B2 (en) * | 2006-11-05 | 2012-05-15 | Globalfoundries Singapore Pte Ltd | Apparatus and methods for cleaning and drying of wafers |
| US8182315B2 (en) * | 2008-03-24 | 2012-05-22 | Phuong Van Nguyen | Chemical mechanical polishing pad and dresser |
| US8328600B2 (en) * | 2010-03-12 | 2012-12-11 | Duescher Wayne O | Workpiece spindles supported floating abrasive platen |
| USD674759S1 (en) * | 2010-08-19 | 2013-01-22 | Epistar Corporation | Wafer carrier |
-
2012
- 2012-03-20 US US29/416,236 patent/USD687791S1/en active Active
Patent Citations (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3731435A (en) * | 1971-02-09 | 1973-05-08 | Speedfam Corp | Polishing machine load plate |
| US3845738A (en) * | 1973-09-12 | 1974-11-05 | Rca Corp | Vapor deposition apparatus with pyrolytic graphite heat shield |
| US4165584A (en) * | 1977-01-27 | 1979-08-28 | International Telephone And Telegraph Corporation | Apparatus for lapping or polishing materials |
| US4512113A (en) * | 1982-09-23 | 1985-04-23 | Budinger William D | Workpiece holder for polishing operation |
| US4739589A (en) * | 1985-07-12 | 1988-04-26 | Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoff Mbh | Process and apparatus for abrasive machining of a wafer-like workpiece |
| US5191738A (en) * | 1989-06-16 | 1993-03-09 | Shin-Etsu Handotai Co., Ltd. | Method of polishing semiconductor wafer |
| US5193316A (en) * | 1991-10-29 | 1993-03-16 | Texas Instruments Incorporated | Semiconductor wafer polishing using a hydrostatic medium |
| US5683518A (en) * | 1993-01-21 | 1997-11-04 | Moore Epitaxial, Inc. | Rapid thermal processing apparatus for processing semiconductor wafers |
| US5377451A (en) * | 1993-02-23 | 1995-01-03 | Memc Electronic Materials, Inc. | Wafer polishing apparatus and method |
| US5573448A (en) * | 1993-08-18 | 1996-11-12 | Shin-Etsu Handotai Co., Ltd. | Method of polishing wafers, a backing pad used therein, and method of making the backing pad |
| US5647789A (en) * | 1993-11-01 | 1997-07-15 | Fujikoshi Kakai Kogyo Kabushiki Kaisha | Polishing machine and a method of polishing a work |
| US5422316A (en) * | 1994-03-18 | 1995-06-06 | Memc Electronic Materials, Inc. | Semiconductor wafer polisher and method |
| US5674107A (en) * | 1995-04-25 | 1997-10-07 | Lucent Technologies Inc. | Diamond polishing method and apparatus employing oxygen-emitting medium |
| US5788777A (en) * | 1997-03-06 | 1998-08-04 | Burk, Jr.; Albert A. | Susceptor for an epitaxial growth factor |
| US5840124A (en) * | 1997-06-30 | 1998-11-24 | Emcore Corporation | Wafer carrier with flexible wafer flat holder |
| US5865666A (en) * | 1997-08-20 | 1999-02-02 | Lsi Logic Corporation | Apparatus and method for polish removing a precise amount of material from a wafer |
| US6080042A (en) * | 1997-10-31 | 2000-06-27 | Virginia Semiconductor, Inc. | Flatness and throughput of single side polishing of wafers |
| US6241825B1 (en) * | 1999-04-16 | 2001-06-05 | Cutek Research Inc. | Compliant wafer chuck |
| US6375749B1 (en) * | 1999-07-14 | 2002-04-23 | Seh America, Inc. | Susceptorless semiconductor wafer support and reactor system for epitaxial layer growth |
| US20020011204A1 (en) * | 2000-02-28 | 2002-01-31 | Applied Materials, Inc. | Semiconductor wafer support lift-pin assembly |
| US6514424B2 (en) * | 2000-05-11 | 2003-02-04 | WACKER SILTRONIC GESELLSCHAFT FüR HALBLEITERMATERIALIEN AG | Process for the double-side polishing of semiconductor wafers and carrier for carrying out the process |
| US6454635B1 (en) * | 2000-08-08 | 2002-09-24 | Memc Electronic Materials, Inc. | Method and apparatus for a wafer carrier having an insert |
| US6709981B2 (en) * | 2000-08-16 | 2004-03-23 | Memc Electronic Materials, Inc. | Method and apparatus for processing a semiconductor wafer using novel final polishing method |
| US6500059B2 (en) * | 2000-12-01 | 2002-12-31 | Taiwan Semiconductor Manufacturing Company, Ltd | Apparatus and method for mounting a wafer in a polishing machine |
| US20030057089A1 (en) * | 2000-12-01 | 2003-03-27 | Tin Nguyen | Disk carrier |
| US6666948B2 (en) * | 2001-04-23 | 2003-12-23 | Phuong Van Nguyen | Silicon wafer polisher |
| US6733367B1 (en) * | 2001-04-23 | 2004-05-11 | Phuong Van Nguyen | Method and apparatus for polishing silicon wafers |
| US7252737B2 (en) * | 2001-08-09 | 2007-08-07 | Applied Materials, Inc. | Pedestal with integral shield |
| US7008308B2 (en) * | 2003-05-20 | 2006-03-07 | Memc Electronic Materials, Inc. | Wafer carrier |
| US7235139B2 (en) * | 2003-10-28 | 2007-06-26 | Veeco Instruments Inc. | Wafer carrier for growing GaN wafers |
| US7169234B2 (en) * | 2004-01-30 | 2007-01-30 | Asm America, Inc. | Apparatus and methods for preventing rotational slippage between a vertical shaft and a support structure for a semiconductor wafer holder |
| US8177993B2 (en) * | 2006-11-05 | 2012-05-15 | Globalfoundries Singapore Pte Ltd | Apparatus and methods for cleaning and drying of wafers |
| US20090194026A1 (en) * | 2008-01-31 | 2009-08-06 | Burrows Brian H | Processing system for fabricating compound nitride semiconductor devices |
| US8182315B2 (en) * | 2008-03-24 | 2012-05-22 | Phuong Van Nguyen | Chemical mechanical polishing pad and dresser |
| USD633452S1 (en) * | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| US8328600B2 (en) * | 2010-03-12 | 2012-12-11 | Duescher Wayne O | Workpiece spindles supported floating abrasive platen |
| USD674759S1 (en) * | 2010-08-19 | 2013-01-22 | Epistar Corporation | Wafer carrier |
Cited By (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD720309S1 (en) * | 2011-11-18 | 2014-12-30 | Tokyo Electron Limited | Inner tube for process tube for manufacturing semiconductor wafers |
| US20130125820A1 (en) * | 2011-11-23 | 2013-05-23 | Gerald Zheyao Yin | Chemical vapor deposition or epitaxial-layer growth reactor and supporter thereof |
| USD813180S1 (en) | 2013-05-15 | 2018-03-20 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| USD769200S1 (en) * | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| USD770990S1 (en) * | 2013-05-15 | 2016-11-08 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| USD808349S1 (en) | 2013-05-15 | 2018-01-23 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| USD723077S1 (en) * | 2013-12-03 | 2015-02-24 | Applied Materials, Inc. | Chuck carrier film |
| USD793971S1 (en) | 2015-03-27 | 2017-08-08 | Veeco Instruments Inc. | Wafer carrier with a 14-pocket configuration |
| USD793972S1 (en) | 2015-03-27 | 2017-08-08 | Veeco Instruments Inc. | Wafer carrier with a 31-pocket configuration |
| USD852762S1 (en) | 2015-03-27 | 2019-07-02 | Veeco Instruments Inc. | Wafer carrier with a 14-pocket configuration |
| USD806046S1 (en) | 2015-04-16 | 2017-12-26 | Veeco Instruments Inc. | Wafer carrier with a multi-pocket configuration |
| USD778247S1 (en) | 2015-04-16 | 2017-02-07 | Veeco Instruments Inc. | Wafer carrier with a multi-pocket configuration |
| USD869409S1 (en) | 2016-09-30 | 2019-12-10 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD894137S1 (en) | 2017-10-05 | 2020-08-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD946638S1 (en) | 2017-12-11 | 2022-03-22 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD868124S1 (en) * | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD877101S1 (en) | 2018-03-09 | 2020-03-03 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD902165S1 (en) | 2018-03-09 | 2020-11-17 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD908645S1 (en) | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
| USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| USD970566S1 (en) | 2020-03-23 | 2022-11-22 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| USD947802S1 (en) | 2020-05-20 | 2022-04-05 | Applied Materials, Inc. | Replaceable substrate carrier interfacing film |
| USD940765S1 (en) | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD966357S1 (en) | 2020-12-02 | 2022-10-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD1072774S1 (en) | 2021-02-06 | 2025-04-29 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD1007449S1 (en) | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD1110975S1 (en) | 2022-01-12 | 2026-02-03 | Applied Materials Inc. | Collimator for a physical vapor deposition (PVD) chamber |
| USD1053230S1 (en) | 2022-05-19 | 2024-12-03 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
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