USD658691S1 - Liner for plasma processing apparatus - Google Patents

Liner for plasma processing apparatus Download PDF

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Publication number
USD658691S1
USD658691S1 US29/400,581 US201129400581F USD658691S US D658691 S1 USD658691 S1 US D658691S1 US 201129400581 F US201129400581 F US 201129400581F US D658691 S USD658691 S US D658691S
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US
United States
Prior art keywords
liner
processing apparatus
plasma processing
view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/400,581
Inventor
Kouki Suzuki
Jun Yamashita
Masakazu Ban
Atsushi Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BAN, MASAKAZU, SUZUKI, KOUKI, UEDA, ATSUSHI, YAMASHITA, JUN
Application granted granted Critical
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Anticipated expiration legal-status Critical
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FIG. 1 is a front view of a liner for plasma processing apparatus showing our new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a sectional view taken along line 7-7 of FIG. 1 thereof;
FIG. 8 is a sectional view taken along line 8-8 of FIG. 1 thereof; and,
FIG. 9 is a perspective view thereof.

Claims (1)

  1. The ornamental design for a liner for plasma processing apparatus, as shown and described.
US29/400,581 2011-03-30 2011-08-30 Liner for plasma processing apparatus Active USD658691S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-007264 2011-03-30
JP2011007264 2011-03-30

Publications (1)

Publication Number Publication Date
USD658691S1 true USD658691S1 (en) 2012-05-01

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Family Applications (1)

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US29/400,581 Active USD658691S1 (en) 2011-03-30 2011-08-30 Liner for plasma processing apparatus

Country Status (2)

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US (1) USD658691S1 (en)
TW (1) TWD149224S (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD676073S1 (en) * 2011-08-19 2013-02-12 Cole & Ashcroft, L.P. Wall shield
USD694791S1 (en) * 2011-09-20 2013-12-03 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
USD694790S1 (en) * 2011-09-20 2013-12-03 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
USD711331S1 (en) * 2013-11-07 2014-08-19 Applied Materials, Inc. Upper chamber liner
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
USD716240S1 (en) * 2013-11-07 2014-10-28 Applied Materials, Inc. Lower chamber liner
USD717746S1 (en) * 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
USD802790S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD802545S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Lower chamber for a plasma processing apparatus
USD826300S1 (en) * 2016-09-30 2018-08-21 Oerlikon Metco Ag, Wohlen Rotably mounted thermal plasma burner for thermalspraying
USD837754S1 (en) * 2017-04-28 2019-01-08 Applied Materials, Inc. Plasma chamber liner
USD838681S1 (en) * 2017-04-28 2019-01-22 Applied Materials, Inc. Plasma chamber liner
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner
USD909439S1 (en) * 2018-11-30 2021-02-02 Ferrotec (Usa) Corporation Two-piece crucible cover
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus

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USD259346S (en) * 1978-10-04 1981-05-26 Harrelson Rubber Company Sealing disc for tire retreading
USD338621S (en) * 1991-03-14 1993-08-24 Balson John E Rim seal for a can
US5410992A (en) * 1994-04-04 1995-05-02 Ford Motor Company Cooling system for automotive engine
USD401252S (en) * 1998-01-27 1998-11-17 Semiconductor Equipment Technology Shield and cover for target of sputter coating apparatus
USD403002S (en) * 1998-01-27 1998-12-22 Semiconductor Equipment Technology, Inc. Shield and cover for target of sputter coating apparatus
USD403334S (en) * 1998-01-27 1998-12-29 Semiconductor Equipment Technology, Inc Shield and cover for target of sputter coating apparatus
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
US6046425A (en) * 1991-05-31 2000-04-04 Hitachi, Ltd. Plasma processing apparatus having insulator disposed on inner surface of plasma generating chamber
US6135831A (en) * 1999-10-22 2000-10-24 Bird-Johnson Company Impeller for marine waterjet propulsion apparatus
USD442864S1 (en) * 2000-07-12 2001-05-29 Houston Harvest Gift Products, Llc Two-piece lid
US20010007302A1 (en) * 1997-05-16 2001-07-12 Liubo Hong Hybrid coil design for ionized deposition
USD449621S1 (en) * 2000-02-15 2001-10-23 Edward W. Hamlin Securing ring for a flexible bellows of a marine outboard drive
US6550484B1 (en) * 2001-12-07 2003-04-22 Novellus Systems, Inc. Apparatus for maintaining wafer back side and edge exclusion during supercritical fluid processing
USD489611S1 (en) * 2003-09-02 2004-05-11 John Monsanty Can lip protector
USD490450S1 (en) * 2002-05-20 2004-05-25 Tokyo Electron Limited Exhaust ring for semiconductor equipment
USD491963S1 (en) * 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
USD498826S1 (en) * 2003-02-13 2004-11-23 Nichias Co., Ltd Metal ring gasket
US20050150452A1 (en) * 2004-01-14 2005-07-14 Soovo Sen Process kit design for deposition chamber
USD510585S1 (en) * 2003-10-28 2005-10-11 Enterprises International, Inc. Guide bushing for a wire tying machine
US20050224179A1 (en) * 2002-05-22 2005-10-13 Tokyo Electron Korea Ltd. Baffle plate and plasma etching device having same
USD525127S1 (en) * 2004-03-01 2006-07-18 Kraft Foods Holdings, Inc. Susceptor ring
USD532095S1 (en) * 2004-10-07 2006-11-14 Flex-A-Lite Consolidated, Inc. Combined fan assembly and shroud
US20060272800A1 (en) * 2005-06-02 2006-12-07 Paccar Inc Radiator fan shroud with flow directing ports
USD556704S1 (en) * 2005-08-25 2007-12-04 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
US20070283887A1 (en) * 2004-10-07 2007-12-13 Tokyo Electron Limited Microwave Plasma Processing Apparatus
USD559994S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
US20080142159A1 (en) * 2004-12-17 2008-06-19 Tokyo Electron Limited Plasma Processing Apparatus
USD593585S1 (en) * 2005-07-29 2009-06-02 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
US20090250443A1 (en) * 2008-04-03 2009-10-08 Tes Co., Ltd. Plasma processing apparatus
USD605206S1 (en) * 2008-05-07 2009-12-01 Komatsu Ltd. Fan shroud for construction machinery
USD610176S1 (en) * 2008-08-26 2010-02-16 Tokyo Electron Limited Coater cup
USD616390S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
USD638951S1 (en) * 2009-11-13 2011-05-31 3M Innovative Properties Company Sample processing disk cover
USD645486S1 (en) * 2010-03-31 2011-09-20 Tokyo Electron Limited Dielectric window for plasma processing device

Patent Citations (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD259346S (en) * 1978-10-04 1981-05-26 Harrelson Rubber Company Sealing disc for tire retreading
USD338621S (en) * 1991-03-14 1993-08-24 Balson John E Rim seal for a can
US6046425A (en) * 1991-05-31 2000-04-04 Hitachi, Ltd. Plasma processing apparatus having insulator disposed on inner surface of plasma generating chamber
US5410992A (en) * 1994-04-04 1995-05-02 Ford Motor Company Cooling system for automotive engine
US20010007302A1 (en) * 1997-05-16 2001-07-12 Liubo Hong Hybrid coil design for ionized deposition
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
USD401252S (en) * 1998-01-27 1998-11-17 Semiconductor Equipment Technology Shield and cover for target of sputter coating apparatus
USD403002S (en) * 1998-01-27 1998-12-22 Semiconductor Equipment Technology, Inc. Shield and cover for target of sputter coating apparatus
USD403334S (en) * 1998-01-27 1998-12-29 Semiconductor Equipment Technology, Inc Shield and cover for target of sputter coating apparatus
US6135831A (en) * 1999-10-22 2000-10-24 Bird-Johnson Company Impeller for marine waterjet propulsion apparatus
USD449621S1 (en) * 2000-02-15 2001-10-23 Edward W. Hamlin Securing ring for a flexible bellows of a marine outboard drive
USD442864S1 (en) * 2000-07-12 2001-05-29 Houston Harvest Gift Products, Llc Two-piece lid
US6550484B1 (en) * 2001-12-07 2003-04-22 Novellus Systems, Inc. Apparatus for maintaining wafer back side and edge exclusion during supercritical fluid processing
USD490450S1 (en) * 2002-05-20 2004-05-25 Tokyo Electron Limited Exhaust ring for semiconductor equipment
US20050224179A1 (en) * 2002-05-22 2005-10-13 Tokyo Electron Korea Ltd. Baffle plate and plasma etching device having same
USD491963S1 (en) * 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
USD498826S1 (en) * 2003-02-13 2004-11-23 Nichias Co., Ltd Metal ring gasket
USD489611S1 (en) * 2003-09-02 2004-05-11 John Monsanty Can lip protector
USD510585S1 (en) * 2003-10-28 2005-10-11 Enterprises International, Inc. Guide bushing for a wire tying machine
US20050150452A1 (en) * 2004-01-14 2005-07-14 Soovo Sen Process kit design for deposition chamber
USD525127S1 (en) * 2004-03-01 2006-07-18 Kraft Foods Holdings, Inc. Susceptor ring
USD532095S1 (en) * 2004-10-07 2006-11-14 Flex-A-Lite Consolidated, Inc. Combined fan assembly and shroud
US20070283887A1 (en) * 2004-10-07 2007-12-13 Tokyo Electron Limited Microwave Plasma Processing Apparatus
US20080142159A1 (en) * 2004-12-17 2008-06-19 Tokyo Electron Limited Plasma Processing Apparatus
USD559994S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
US20060272800A1 (en) * 2005-06-02 2006-12-07 Paccar Inc Radiator fan shroud with flow directing ports
USD593585S1 (en) * 2005-07-29 2009-06-02 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD556704S1 (en) * 2005-08-25 2007-12-04 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
US20090250443A1 (en) * 2008-04-03 2009-10-08 Tes Co., Ltd. Plasma processing apparatus
USD605206S1 (en) * 2008-05-07 2009-12-01 Komatsu Ltd. Fan shroud for construction machinery
USD610176S1 (en) * 2008-08-26 2010-02-16 Tokyo Electron Limited Coater cup
USD616390S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
USD638951S1 (en) * 2009-11-13 2011-05-31 3M Innovative Properties Company Sample processing disk cover
USD645486S1 (en) * 2010-03-31 2011-09-20 Tokyo Electron Limited Dielectric window for plasma processing device

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD676073S1 (en) * 2011-08-19 2013-02-12 Cole & Ashcroft, L.P. Wall shield
USD694791S1 (en) * 2011-09-20 2013-12-03 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
USD694790S1 (en) * 2011-09-20 2013-12-03 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
USD717746S1 (en) * 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
USD711331S1 (en) * 2013-11-07 2014-08-19 Applied Materials, Inc. Upper chamber liner
USD716240S1 (en) * 2013-11-07 2014-10-28 Applied Materials, Inc. Lower chamber liner
USD802790S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD802545S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Lower chamber for a plasma processing apparatus
USD826300S1 (en) * 2016-09-30 2018-08-21 Oerlikon Metco Ag, Wohlen Rotably mounted thermal plasma burner for thermalspraying
USD837754S1 (en) * 2017-04-28 2019-01-08 Applied Materials, Inc. Plasma chamber liner
USD838681S1 (en) * 2017-04-28 2019-01-22 Applied Materials, Inc. Plasma chamber liner
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner
USD909439S1 (en) * 2018-11-30 2021-02-02 Ferrotec (Usa) Corporation Two-piece crucible cover
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus

Also Published As

Publication number Publication date
TWD149224S (en) 2012-09-11

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