USD396212S - Integrated circuit device - Google Patents
Integrated circuit device Download PDFInfo
- Publication number
- USD396212S USD396212S US29/068,463 US6846397F USD396212S US D396212 S USD396212 S US D396212S US 6846397 F US6846397 F US 6846397F US D396212 S USD396212 S US D396212S
- Authority
- US
- United States
- Prior art keywords
- integrated circuit
- circuit device
- view
- ornamental design
- elevational view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a perspective view of the top, front and left side of an integrated circuit device showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a front elevational view thereof; and,
FIG. 7 is a rear elevational view thereof.
Claims (1)
- The ornamental design for an integrated circuit device, as shown.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2683496 | 1996-09-09 | ||
JP8-26834 | 1996-09-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD396212S true USD396212S (en) | 1998-07-21 |
Family
ID=71597858
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/068,463 Expired - Lifetime USD396212S (en) | 1996-09-09 | 1997-03-03 | Integrated circuit device |
Country Status (1)
Country | Link |
---|---|
US (1) | USD396212S (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD416872S (en) * | 1997-11-06 | 1999-11-23 | Zf Microsystems, Inc. | Single component computer |
USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
USD920266S1 (en) * | 2019-09-29 | 2021-05-25 | China Chippacking Technology Co., Ltd. | Integrated circuit package |
USD920265S1 (en) * | 2019-09-29 | 2021-05-25 | China Chippacking Technology Co., Ltd. | Integrated circuit package |
USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
USD969762S1 (en) * | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package |
USD978809S1 (en) * | 2018-04-13 | 2023-02-21 | Rohm Co., Ltd. | Semiconductor module |
USD1009818S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
USD1009819S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
USD1037187S1 (en) * | 2022-05-12 | 2024-07-30 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
USD1042375S1 (en) * | 2022-05-12 | 2024-09-17 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
-
1997
- 1997-03-03 US US29/068,463 patent/USD396212S/en not_active Expired - Lifetime
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD416872S (en) * | 1997-11-06 | 1999-11-23 | Zf Microsystems, Inc. | Single component computer |
USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
USD864135S1 (en) | 2017-10-26 | 2019-10-22 | Mitsubishi Electric Corporation | Semiconductor device |
USD978809S1 (en) * | 2018-04-13 | 2023-02-21 | Rohm Co., Ltd. | Semiconductor module |
USD920265S1 (en) * | 2019-09-29 | 2021-05-25 | China Chippacking Technology Co., Ltd. | Integrated circuit package |
USD920266S1 (en) * | 2019-09-29 | 2021-05-25 | China Chippacking Technology Co., Ltd. | Integrated circuit package |
USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
USD969762S1 (en) * | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package |
USD1009818S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
USD1009819S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
USD1037187S1 (en) * | 2022-05-12 | 2024-07-30 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
USD1042375S1 (en) * | 2022-05-12 | 2024-09-17 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
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