USD357462S - Hybrid integrated circuit for electric power control - Google Patents

Hybrid integrated circuit for electric power control Download PDF

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Publication number
USD357462S
USD357462S US29/019,278 US1927894F USD357462S US D357462 S USD357462 S US D357462S US 1927894 F US1927894 F US 1927894F US D357462 S USD357462 S US D357462S
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US
United States
Prior art keywords
integrated circuit
electric power
power control
hybrid integrated
hybrid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/019,278
Inventor
Noriho Terasawa
Shin Soyano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Assigned to FUJI ELECTRIC CO., LTD. reassignment FUJI ELECTRIC CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SOYANO, SHIN, TERASAWA, NORIHO
Application granted granted Critical
Publication of USD357462S publication Critical patent/USD357462S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of the top, front and right side of a hybrid integrated circuit for electric power control showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a rear elevational view thereof; and,
FIG. 7 is a bottom plan view thereof.

Claims (1)

  1. The ornamental design for a hybrid integrated circuit for electric power control, as shown.
US29/019,278 1993-09-16 1994-02-28 Hybrid integrated circuit for electric power control Expired - Lifetime USD357462S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5-27995 1993-09-16
JP2799593 1993-09-16

Publications (1)

Publication Number Publication Date
USD357462S true USD357462S (en) 1995-04-18

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US29/019,278 Expired - Lifetime USD357462S (en) 1993-09-16 1994-02-28 Hybrid integrated circuit for electric power control

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Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD470825S1 (en) 2001-12-28 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD539761S1 (en) * 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
USD548202S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD705184S1 (en) * 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD738834S1 (en) * 2014-07-29 2015-09-15 Jianhui Xie Driver circuit integrated LED module
USD745476S1 (en) * 2012-10-19 2015-12-15 Solumatics CVBA Print board
USD769834S1 (en) * 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD783549S1 (en) * 2015-02-04 2017-04-11 Mitsubishi Electric Corporation Semiconductor device
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module
USD836073S1 (en) * 2017-01-25 2018-12-18 Shindengen Electric Manufacturing Co., Ltd. Solid state relay
USD847104S1 (en) * 2017-09-29 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD847103S1 (en) * 2017-09-07 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD851612S1 (en) * 2017-06-30 2019-06-18 Microduino Inc. Electrical module
USD858467S1 (en) 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD864132S1 (en) 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD877102S1 (en) * 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD879729S1 (en) * 2017-06-30 2020-03-31 Microduino Inc. Electrical module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3825876A (en) 1971-08-12 1974-07-23 Augat Inc Electrical component mounting
US4780795A (en) 1986-04-28 1988-10-25 Burr-Brown Corporation Packages for hybrid integrated circuit high voltage isolation amplifiers and method of manufacture
US4943686A (en) 1988-04-18 1990-07-24 Andrzej Kucharek Seal frame and method of use
US5053634A (en) 1988-07-25 1991-10-01 Sawafuji Electric Co., Ltd. Waterproofing device for control circuit used in outboard engines
US5130881A (en) 1988-01-11 1992-07-14 The United States Of Americas As Represented By The Secretary Of The Air Force IC socket having overvoltage protection

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3825876A (en) 1971-08-12 1974-07-23 Augat Inc Electrical component mounting
US4780795A (en) 1986-04-28 1988-10-25 Burr-Brown Corporation Packages for hybrid integrated circuit high voltage isolation amplifiers and method of manufacture
US5130881A (en) 1988-01-11 1992-07-14 The United States Of Americas As Represented By The Secretary Of The Air Force IC socket having overvoltage protection
US4943686A (en) 1988-04-18 1990-07-24 Andrzej Kucharek Seal frame and method of use
US5053634A (en) 1988-07-25 1991-10-01 Sawafuji Electric Co., Ltd. Waterproofing device for control circuit used in outboard engines

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Hybrid interface on p. 106 of Electrical Design, Feb. 4, 1993.
Semiconductor on p. 126 of Electrical Design, Jan. 21, 1993.

Cited By (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD470825S1 (en) 2001-12-28 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD548202S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD539761S1 (en) * 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD745476S1 (en) * 2012-10-19 2015-12-15 Solumatics CVBA Print board
USD769834S1 (en) * 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD705184S1 (en) * 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD738834S1 (en) * 2014-07-29 2015-09-15 Jianhui Xie Driver circuit integrated LED module
USD783549S1 (en) * 2015-02-04 2017-04-11 Mitsubishi Electric Corporation Semiconductor device
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module
USD858467S1 (en) 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD875058S1 (en) 2017-01-05 2020-02-11 Rohm Co., Ltd. Power semiconductor module
USD864132S1 (en) 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD836073S1 (en) * 2017-01-25 2018-12-18 Shindengen Electric Manufacturing Co., Ltd. Solid state relay
USD836565S1 (en) * 2017-01-25 2018-12-25 Shindengen Electric Manufacturing Co., Ltd. Solid state relay
USD879729S1 (en) * 2017-06-30 2020-03-31 Microduino Inc. Electrical module
USD851612S1 (en) * 2017-06-30 2019-06-18 Microduino Inc. Electrical module
USD847103S1 (en) * 2017-09-07 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD847104S1 (en) * 2017-09-29 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD877102S1 (en) * 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD978809S1 (en) 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD903613S1 (en) 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module

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