USD1095474S1 - Power module package - Google Patents

Power module package

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Publication number
USD1095474S1
USD1095474S1 US29/997,705 US202529997705F USD1095474S US D1095474 S1 USD1095474 S1 US D1095474S1 US 202529997705 F US202529997705 F US 202529997705F US D1095474 S USD1095474 S US D1095474S
Authority
US
United States
Prior art keywords
power module
module package
view
package
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/997,705
Inventor
Seungwon Im
Jeonghyuk Park
KeunHyuk Lee
Jerome Teysseyre
Paolo Bilardo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Components Industries LLC
Original Assignee
Semiconductor Components Industries LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Components Industries LLC filed Critical Semiconductor Components Industries LLC
Priority to US29/997,705 priority Critical patent/USD1095474S1/en
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC reassignment SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TEYSSEYRE, JEROME, LEE, KEUNHYUK, IM, SEUNGWON, PARK, JEONGHYUK, Bilardo, Paolo
Application granted granted Critical
Publication of USD1095474S1 publication Critical patent/USD1095474S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of a power module package showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a front view thereof;
FIG. 5 is a rear view thereof;
FIG. 6 is a first side view thereof; and,
FIG. 7 is a second side view thereof.
The broken lines depict unclaimed portions of the environmental structure and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a power module package, as shown and described.
US29/997,705 2022-12-02 2025-04-09 Power module package Active USD1095474S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/997,705 USD1095474S1 (en) 2022-12-02 2025-04-09 Power module package

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/861,844 USD1098055S1 (en) 2022-12-02 2022-12-02 Power module package
US29/997,705 USD1095474S1 (en) 2022-12-02 2025-04-09 Power module package

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/861,844 Division USD1098055S1 (en) 2022-12-02 2022-12-02 Power module package

Publications (1)

Publication Number Publication Date
USD1095474S1 true USD1095474S1 (en) 2025-09-30

Family

ID=97172277

Family Applications (3)

Application Number Title Priority Date Filing Date
US29/861,844 Active USD1098055S1 (en) 2022-12-02 2022-12-02 Power module package
US29/997,703 Active USD1113776S1 (en) 2022-12-02 2025-04-09 Power module package
US29/997,705 Active USD1095474S1 (en) 2022-12-02 2025-04-09 Power module package

Family Applications Before (2)

Application Number Title Priority Date Filing Date
US29/861,844 Active USD1098055S1 (en) 2022-12-02 2022-12-02 Power module package
US29/997,703 Active USD1113776S1 (en) 2022-12-02 2025-04-09 Power module package

Country Status (1)

Country Link
US (3) USD1098055S1 (en)

Citations (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3602846A (en) * 1969-07-14 1971-08-31 Pulse Eng Inc Delay line
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US3825876A (en) * 1971-08-12 1974-07-23 Augat Inc Electrical component mounting
US4916519A (en) * 1989-05-30 1990-04-10 International Business Machines Corporation Semiconductor package
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US5105257A (en) * 1990-08-08 1992-04-14 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor device and semiconductor device packaging element
USD345731S (en) * 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
US5337216A (en) * 1992-05-18 1994-08-09 Square D Company Multichip semiconductor small outline integrated circuit package structure
US5434357A (en) * 1991-12-23 1995-07-18 Belcher; Donald K. Reduced semiconductor size package
US5646443A (en) * 1993-10-15 1997-07-08 Nec Corporation Semiconductor package
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD397092S (en) * 1997-01-03 1998-08-18 Fujitsu Limited Integrated circuit package
US5798570A (en) * 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
US5844307A (en) * 1995-07-31 1998-12-01 Nec Corporation Plastic molded IC package with leads having small flatness fluctuation
US5959842A (en) * 1998-05-14 1999-09-28 Lucent Technologies Inc. Surface mount power supply package and method of manufacture thereof
US6093957A (en) * 1997-04-18 2000-07-25 Lg Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
US6238953B1 (en) * 1999-01-12 2001-05-29 Sony Corporation Lead frame, resin-encapsulated semiconductor device and fabrication process for the device
USD448739S1 (en) * 2000-09-12 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
US20030042584A1 (en) * 2001-09-05 2003-03-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of manufacturing the same
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
US6555899B1 (en) * 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US6992386B2 (en) * 2003-07-31 2006-01-31 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same
USD548202S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7205647B2 (en) 2002-09-17 2007-04-17 Chippac, Inc. Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages
US7064426B2 (en) 2002-09-17 2006-06-20 Chippac, Inc. Semiconductor multi-package module having wire bond interconnect between stacked packages
US9082607B1 (en) 2006-12-14 2015-07-14 Utac Thai Limited Molded leadframe substrate semiconductor package

Patent Citations (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3602846A (en) * 1969-07-14 1971-08-31 Pulse Eng Inc Delay line
US3825876A (en) * 1971-08-12 1974-07-23 Augat Inc Electrical component mounting
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US4916519A (en) * 1989-05-30 1990-04-10 International Business Machines Corporation Semiconductor package
US5105257A (en) * 1990-08-08 1992-04-14 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor device and semiconductor device packaging element
US5434357A (en) * 1991-12-23 1995-07-18 Belcher; Donald K. Reduced semiconductor size package
US5337216A (en) * 1992-05-18 1994-08-09 Square D Company Multichip semiconductor small outline integrated circuit package structure
USD345731S (en) * 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
US5646443A (en) * 1993-10-15 1997-07-08 Nec Corporation Semiconductor package
US5844307A (en) * 1995-07-31 1998-12-01 Nec Corporation Plastic molded IC package with leads having small flatness fluctuation
US5798570A (en) * 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD397092S (en) * 1997-01-03 1998-08-18 Fujitsu Limited Integrated circuit package
US6093957A (en) * 1997-04-18 2000-07-25 Lg Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
US5959842A (en) * 1998-05-14 1999-09-28 Lucent Technologies Inc. Surface mount power supply package and method of manufacture thereof
US6238953B1 (en) * 1999-01-12 2001-05-29 Sony Corporation Lead frame, resin-encapsulated semiconductor device and fabrication process for the device
US6555899B1 (en) * 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
USD448739S1 (en) * 2000-09-12 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
US20030042584A1 (en) * 2001-09-05 2003-03-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of manufacturing the same
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
US6992386B2 (en) * 2003-07-31 2006-01-31 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD548202S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
IGBTS and IPM Module, 10v to 100v,https://www.indiamart.com/proddetail/igbts-and-ipm-module-7488547988.html?mTd=1, 2024. (Year: 2024). *
Intelligent Power Modules provide excellent protection for industrial equipment,https://www.arrow.com/en/research-and-events/articles/on_semi_ipm, 2024. (Year: 2024). *

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