USD1069863S1 - Deposition ring of a process kit for semiconductor substrate processing - Google Patents

Deposition ring of a process kit for semiconductor substrate processing Download PDF

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Publication number
USD1069863S1
USD1069863S1 US29/848,746 US202229848746F USD1069863S US D1069863 S1 USD1069863 S1 US D1069863S1 US 202229848746 F US202229848746 F US 202229848746F US D1069863 S USD1069863 S US D1069863S
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United States
Prior art keywords
semiconductor substrate
substrate processing
process kit
deposition ring
deposition
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US29/848,746
Inventor
Abhishek Chowdhury
Nataraj BHASKAR RAO
Edwin C. Suarez
Harisha SATHYANARAYANA
Diego Ramiro PUENTE SOTOMAYOR
Qanit Takmeel
Mohammad Kamruzzaman CHOWDHURY
Arun Chakravarthy Chakravarthy
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Applied Materials Inc
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Applied Materials Inc
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Priority to US29/848,746 priority Critical patent/USD1069863S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BHASKAR RAO, NATARAJ, SATHYANARAYANA, HARISHA, SUAREZ, EDWIN C., Chowdhury, Abhishek, CHAKRAVARTHY, ARUN CHAKRAVARTHY, CHOWDHURY, Mohammad Kamruzzaman, PUENTE SOTOMAYOR, DIEGO RAMIRO, TAKMEEL, QANIT
Priority to TW112300435F priority patent/TWD228655S/en
Priority to JP2023002016F priority patent/JP1747763S/en
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Publication of USD1069863S1 publication Critical patent/USD1069863S1/en
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FIG. 1 is a top isometric view of a deposition ring of a process kit for semiconductor substrate processing, according to the novel design.
FIG. 2 is a bottom isometric view thereof.
FIG. 3 is a top plan view thereof.
FIG. 4 is a bottom plan view thereof.
FIG. 5 is a left elevation view thereof, enlarged to more clearly show details.
FIG. 6 is a right elevation view thereof, enlarged to more clearly show details.
FIG. 7 is a back elevation view thereof, enlarged to more clearly show details; and,
FIG. 8 is a front elevation view thereof, enlarged to more clearly show details.

Claims (1)

    CLAIM
  1. The ornamental design for a deposition ring of a process kit for semiconductor substrate processing, as shown and described.
US29/848,746 2022-08-04 2022-08-04 Deposition ring of a process kit for semiconductor substrate processing Active USD1069863S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/848,746 USD1069863S1 (en) 2022-08-04 2022-08-04 Deposition ring of a process kit for semiconductor substrate processing
TW112300435F TWD228655S (en) 2022-08-04 2023-02-03 Deposition ring of a process kit for semiconductor substrate processing
JP2023002016F JP1747763S (en) 2022-08-04 2023-02-06 Deposition ring in process kit for semiconductor substrate processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/848,746 USD1069863S1 (en) 2022-08-04 2022-08-04 Deposition ring of a process kit for semiconductor substrate processing

Publications (1)

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USD1069863S1 true USD1069863S1 (en) 2025-04-08

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US (1) USD1069863S1 (en)
JP (1) JP1747763S (en)
TW (1) TWD228655S (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1109710S1 (en) * 2022-03-22 2026-01-20 Achilles Corporation Main body of a semiconductor wafer carrying container
USD1112644S1 (en) * 2021-11-12 2026-02-10 Shenzhen Jiahe Yunfan Technology Co., Ltd Waterproof ring

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1064005S1 (en) 2022-08-04 2025-02-25 Applied Materials, Inc. Grounding ring of a process kit for semiconductor substrate processing
USD1069863S1 (en) * 2022-08-04 2025-04-08 Applied Materials, Inc. Deposition ring of a process kit for semiconductor substrate processing

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US20050150452A1 (en) 2004-01-14 2005-07-14 Soovo Sen Process kit design for deposition chamber
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USD717746S1 (en) * 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
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US20160322250A1 (en) 2014-05-15 2016-11-03 Infineon Technologies Ag Wafer Releasing
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US20190259635A1 (en) 2018-02-17 2019-08-22 Applied Materials, Inc. Process kit for processing reduced sized substrates
US20200027705A1 (en) 2018-07-23 2020-01-23 Samsung Electronics Co., Ltd. Substrate support apparatus and plasma processing apparatus having the same
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US20200194243A1 (en) 2018-12-17 2020-06-18 Applied Materials, Inc. Process kit having tall deposition ring for pvd chamber
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
US20200234928A1 (en) 2019-01-17 2020-07-23 Applied Materials, Inc. Semiconductor plasma processing equipment with wafer edge plasma sheath tuning ability
TWD211225S (en) 2019-08-22 2021-05-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 Exhaust duct
USD925481S1 (en) 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD933726S1 (en) 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD934315S1 (en) 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD939459S1 (en) * 2019-08-07 2021-12-28 Kokusai Electric Corporation Boat for wafer processing apparatus
TWD217060S (en) 2020-06-02 2022-02-11 美商應用材料股份有限公司 Enclosure system shelf of a substrate processing system
US20220157572A1 (en) 2020-11-18 2022-05-19 Applied Materials, Inc. Deposition ring for thin substrate handling via edge clamping
US20220165551A1 (en) 2020-11-23 2022-05-26 Advanced Micro-Fabrication Equipment Inc. China Bottom electrode assembly, plasma processing apparatus, and method of replacing focus ring
US20220344134A1 (en) 2018-01-19 2022-10-27 Applied Materials, Inc. Process kit for a substrate support
US20220406573A1 (en) 2021-06-18 2022-12-22 Applied Materials, Inc. Process kit having tall deposition ring and smaller diameter electrostatic chuck (esc) for pvd chamber
JP1747664S (en) * 2022-08-04 2023-06-29 Deposition ring in process kit for semiconductor substrate processing
JP1747764S (en) 2022-08-04 2023-06-30 Grounding ring of process kit for semiconductor substrate processing
JP1747763S (en) * 2022-08-04 2023-06-30 Deposition ring in process kit for semiconductor substrate processing
US11798823B2 (en) * 2019-11-18 2023-10-24 SCREEN Holdings Co., Ltd. Light irradiation type thermal process apparatus using a gas ring
USD1005245S1 (en) * 2021-04-19 2023-11-21 Hitachi High-Tech Corporation Electrode cover for a plasma processing apparatus
US20240044002A1 (en) * 2022-08-04 2024-02-08 Applied Materials, Inc. Substrate Handling System, Method, and Apparatus
USD1034493S1 (en) * 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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US5310339A (en) 1990-09-26 1994-05-10 Tokyo Electron Limited Heat treatment apparatus having a wafer boat
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US6123804A (en) 1999-02-22 2000-09-26 Applied Materials, Inc. Sectional clamp ring
US20050150452A1 (en) 2004-01-14 2005-07-14 Soovo Sen Process kit design for deposition chamber
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KR20090064113A (en) 2007-12-15 2009-06-18 주식회사 동부하이텍 Wafer lifting device and wafer dechucking method using the same
US9818585B2 (en) 2009-02-27 2017-11-14 Applied Materials, Inc. In situ plasma clean for removal of residue from pedestal surface without breaking vacuum
USD655255S1 (en) 2010-06-18 2012-03-06 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
US8485128B2 (en) 2010-06-30 2013-07-16 Lam Research Corporation Movable ground ring for a plasma processing chamber
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USD717746S1 (en) * 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
USD711331S1 (en) * 2013-11-07 2014-08-19 Applied Materials, Inc. Upper chamber liner
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USD812014S1 (en) 2015-07-30 2018-03-06 Japan Aviation Electronics Industry, Limited Ring for holding the connections of the connectors
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US20190259635A1 (en) 2018-02-17 2019-08-22 Applied Materials, Inc. Process kit for processing reduced sized substrates
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USD925481S1 (en) 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
US20200194243A1 (en) 2018-12-17 2020-06-18 Applied Materials, Inc. Process kit having tall deposition ring for pvd chamber
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD1040304S1 (en) * 2018-12-17 2024-08-27 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
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USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD939459S1 (en) * 2019-08-07 2021-12-28 Kokusai Electric Corporation Boat for wafer processing apparatus
TWD211225S (en) 2019-08-22 2021-05-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 Exhaust duct
US11798823B2 (en) * 2019-11-18 2023-10-24 SCREEN Holdings Co., Ltd. Light irradiation type thermal process apparatus using a gas ring
USD934315S1 (en) 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
TWD217060S (en) 2020-06-02 2022-02-11 美商應用材料股份有限公司 Enclosure system shelf of a substrate processing system
USD933726S1 (en) 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
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USD1005245S1 (en) * 2021-04-19 2023-11-21 Hitachi High-Tech Corporation Electrode cover for a plasma processing apparatus
US20220406573A1 (en) 2021-06-18 2022-12-22 Applied Materials, Inc. Process kit having tall deposition ring and smaller diameter electrostatic chuck (esc) for pvd chamber
JP1747664S (en) * 2022-08-04 2023-06-29 Deposition ring in process kit for semiconductor substrate processing
JP1747764S (en) 2022-08-04 2023-06-30 Grounding ring of process kit for semiconductor substrate processing
JP1747763S (en) * 2022-08-04 2023-06-30 Deposition ring in process kit for semiconductor substrate processing
US20240044002A1 (en) * 2022-08-04 2024-02-08 Applied Materials, Inc. Substrate Handling System, Method, and Apparatus
USD1034493S1 (en) * 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1112644S1 (en) * 2021-11-12 2026-02-10 Shenzhen Jiahe Yunfan Technology Co., Ltd Waterproof ring
USD1109710S1 (en) * 2022-03-22 2026-01-20 Achilles Corporation Main body of a semiconductor wafer carrying container
USD1112390S1 (en) * 2024-07-22 2026-02-10 Asm Ip Holding B.V. Flow control ring

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Publication number Publication date
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TWD228655S (en) 2023-11-21

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