US9598614B2 - Three-dimensional electrically conductive adhesive film - Google Patents

Three-dimensional electrically conductive adhesive film Download PDF

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Publication number
US9598614B2
US9598614B2 US14/397,955 US201314397955A US9598614B2 US 9598614 B2 US9598614 B2 US 9598614B2 US 201314397955 A US201314397955 A US 201314397955A US 9598614 B2 US9598614 B2 US 9598614B2
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adhesive
particles
adhesive sheet
conductive particles
fibriform
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Expired - Fee Related
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US20150129812A1 (en
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Lesmona SCHERF
Thorsten Krawinkel
Alexander Fischer
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Tesa SE
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Tesa SE
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive

Definitions

  • the invention describes an adhesive film which is electrically conductive in three dimensions and is intended for the permanent adhesive bonding of two articles.
  • One possibility is to use a conductive backing, meaning that the adhesive need only be conducting in the z-direction, although the adhesive tape as a whole is conducting in the x,y-direction as well.
  • the current is conducted through the adhesive to the backing, and is then distributed in the x,y-direction and conducted again in the z-direction through the adhesive to the surface.
  • the particles protrude from the surface to a certain degree, particularly if high conductivities are required, the particles serve as spacers between the adhesive and the substrate to be bonded, thereby lowering further the bonding performance.
  • Particularly flexible components such as flexible conductor tracks are subject to high flexural stresses and are particularly susceptible to adhesive failure.
  • An adhesive sheet which is conductive in three dimensions is very difficult to achieve using spherical particles, since a very large amount of particles are needed, given that they are required to contact one another, in order to achieve conductivity in the plane. With such a high degree of filling with electrically conductive particles, the bond strength suffers markedly.
  • dendritic particles are often used, possessing a much larger surface area for a given volume and therefore offering the possibility of achieving conductivity for a smaller amount of electrically conductive particles.
  • the surface of the adhesives in this case is very rough, since the individual “armlets” of the dendrites protrude from the adhesive; unlike spherical particles, the dendritic particles are unable all to possess exactly the same size. This significantly restricts the laminatability of the adhesives.
  • the invention relates accordingly to an adhesive sheet comprising a layer of an adhesive and also conductive particles admixed with the adhesive, with some of the conductive particles being fibriform and some of the particles being in the form of dendritic structures.
  • This sheet is preferably an adhesive transfer sheet, in other words a single-layer, unbacked adhesive sheet, which consists of the layer of the particle-containing adhesive.
  • FIG. 1 is a schematic of a measuring setup used to measure electrical resistance in x,y-direction (surface resistance) as described hereinbelow.
  • Adhesives used are preferably crosslinkable adhesives, more particularly those adhesives which crosslink preferably on exposure to heat.
  • Preferred in accordance with the invention is a heat-activatable, thermally crosslinking sheet of adhesive.
  • the adhesive sheet of the invention comprises an adhesive matrix incorporating the conductive particles used in accordance with the invention, preferably in homogeneous distribution.
  • Adhesive sheets that are very advantageous in accordance with the invention, however, possess a matrix composed of a heat-activatedly bondable adhesive.
  • Heat-activatedly bondable adhesives also referred to in the literature—and in the context of the present specification—as “heat-activatable adhesive” and “thermally activatable adhesive” generally lack self-adhesive properties, or are only weakly self-adhesive, at room temperature, but in some cases may already have a significant inherent tack.
  • the adhesive quality desired for the application is activated only after application, by supply of thermal energy. Cooling then brings about the adhesive bonding, resulting in the required bond strengths.
  • Heat-activatable (adhesive) sheets or heat-activatable (adhesive) tapes for the purposes of the present specification are double-sided adhesive sheets or adhesive tapes in which the layer of adhesive is realized by a heat-activatedly bondable adhesive. Even before being applied to the substrate to be bonded, heat-activatable sheets and tapes are of two-dimensional design, and can in principle be single-layer (known as adhesive transfer tapes) or multilayer systems, the latter with or without backing or carrier layer(s).
  • the conductive adhesive sheets of the invention are single-layer and unbacked.
  • the heat-activatable sheets or tapes are applied to the substrate to be bonded, or introduced between the substrates to be bonded, at room temperature or at elevated temperatures, for example. Application is followed by activation in order to bring about the ultimate adhesive bonding.
  • Heat-activatable adhesives of the kind also suitable as a matrix for the adhesive sheet of the invention can be differentiated fundamentally into two categories—that is, into thermoplastic heat-activatable adhesives and into reactive heat-activatable adhesives.
  • These adhesives lack self-adhesive properties, or are weakly self-adhesive, at room temperature.
  • the adhesive becomes activated only by heat, and becomes self-adhesive at the same time.
  • Responsibility for this is possessed by a correspondingly high glass transition temperature on the part of the adhesive, meaning that the activation temperature for achieving a sufficient tack—generally from a few tens to a hundred degrees Celsius—is above room temperature.
  • An adhesive effect comes about even before the composition has set, owing to the self-adhesive properties.
  • thermoplastic, heat-activatable adhesive sets, with solidification, physically (on use of suitable thermoplastic materials as adhesive composition, resulting generally in reversible bonding), possibly chemically as well (when using suitable thermoplastically reactive materials as adhesive composition, resulting generally in irreversible bonding), so that the bonding effect is retained in the cooled state where it has developed the actual bond strengths.
  • Thermoplastics are compounds of the kind defined in Römpp (Online Version; 2008 edition, document code RD-20-01271).
  • This rubric covers polymer systems of the kind having functional groups such that on supply of heat, a chemical reaction occurs, with the adhesive undergoing chemical setting and thus bringing forth the adhesive effect.
  • Reactive heat-activatable adhesives generally do not become self-adhesive on supply of heat, and so the adhesive effect ensues only after setting has taken place.
  • reactive heat-activatable adhesives are not thermoplastic, but are instead realized by means of an elastomer/reactive resin system (compare, however, the heat-activatable films by means of thermoplastic-reactive materials; see above).
  • Adhesives are constructed in principle from one or more polymers (of the base polymer component, referred to for simplicity as base polymer), with further components generally being admixed for the purpose of fine-tuning the properties (such as, for example, resins (tackifying resins and/or reactive resins), plasticizers, and the like) and with the optional possibility of further additives, favorably influencing the properties of the adhesive (such as fillers, for example, or the conductive particles that are relevant in the present invention), being admixed.
  • base polymer referred to for simplicity as base polymer
  • further components generally being admixed for the purpose of fine-tuning the properties (such as, for example, resins (tackifying resins and/or reactive resins), plasticizers, and the like) and with the optional possibility of further additives, favorably influencing the properties of the adhesive (such as fillers, for example, or the conductive particles that are relevant in the present invention), being admixed.
  • polyolefins such as, for example, poly-alpha-olefins, polyisobutylene, polyisoprene, polybutadiene, or amorphous polypropylene-, nitrile rubbers, polychloroprenes, polyethylene-vinyl
  • thermoplastic polyurethanes which are known as reaction products of polyesterols or polyetherols and organic diisocyanates. These materials may be used as thermoplastic and also as thermoplastic-reactive heat-activatable systems.
  • the stated polymers may each be used alone and in a mixture (with one or more further polymers).
  • the base polymer is admixed with one or more reactive resins.
  • the fraction of the resins as a proportion of the heat-activatable adhesive is preferably between 30 and 75 wt %, based on the mass of the mixture of base polymer and reactive resin (without conductive particle additions).
  • Epoxy resins which can be used advantageously include, for example, the reaction product of bisphenol A and epichlorohydrin, epichlorohydrin, glycidyl ester, the reaction product of epichlorohydrin and p-aminophenol.
  • Preferred commercial examples are, e.g., AralditeTM 6010, CY-281TM, ECNTM 1273, ECNTM 1280, MY 720, RD-2 from Ciba Geigy, DERTM 331, DERTM 732, DERTM 736, DENTM 432, DENTM 438, DENTM 485 from Dow Chemical, EponTM 812, 825, 826, 828, 830, 834, 836, 871, 872, 1001, 1004, 1031, etc., from Shell Chemical, and HPTTM 1071, HPTTM 1079, likewise from Shell Chemical.
  • Examples of commercial aliphatic epoxy resins are, e.g., vinylcyclohexane dioxides, such as ERL-4206, ERL-4221, ERL 4201, ERL-4289 or ERL-0400 from Union Carbide Corp.
  • the adhesive may optionally be admixed with bond strength-boosting resins (known as tackifier resins or tackifiers).
  • Suitable resins include hydrogenated and unhydrogenated derivatives of rosin, polyterpene resins, preferably based on alpha-pinene, terpene-phenolic resins, noncrosslinking phenolic resins, novolaks, hydrogenated and unhydrogenated polymers of dicyclopentadiene, hydrogenated and unhydrogenated polymers of preferably C-8 and C-9 aromatics, hydrogenated C-5/C9 polymers, aromatics-modified, selectively hydrogenated dicyclopentadiene derivatives, resins based on pure aromatics, such as alpha-methylstyrene, vinyltoluene, or styrene, for example, and resins comprising mixtures of different aromatic monomers, and coumarone-indene resins, which are obtained from coal tar.
  • Aforementioned tackifier resins may be used both alone and in a mixture of two or more tackifier resins.
  • tackifier resins are preferably selected such that the sheets of adhesive at room temperature have only very little pressure-sensitive tack, or none, and acquire their tack only under hot conditions.
  • Heat-activatable sheets of this kind are best obtained through the selection of high-melting resins, especially those having a softening point of well above 110° C. (figures given for the softening point of resins are given by analogy to DIN EN 1427:2007 with the respective resin instead of bitumen; in the case of softening temperatures above 150° C., procedure 8.1 b from that specification is employed by analogy).
  • Lower-melting resins may also be employed, but are used advantageously only in a small amount, preferably below 30 wt %, based on the overall adhesive without electrically conducting particles.
  • Crosslinkable adhesives are used advantageously for the adhesive sheet of the invention, more preferably those which crosslink on exposure to heat.
  • crosslinkers also referred to as curing agents
  • crosslinkers are not necessary for the reaction, but may be added particularly in order to scavenge an excess of reactive resin.
  • crosslinkers have emerged as being advantageous.
  • Crosslinkers or curing agents employed are primarily the following compounds, as described in more detail in U.S. Pat. No. 3,970,608 A, for example:
  • Accelerators may be, for example, the following:
  • formaldehyde donors may be added, such as hexamethylenetetramine.
  • An optional possibility for adjusting the desired properties of the adhesive, more particularly of the heat-activatable adhesive is to add fillers (e.g., (in particular nonconducting) fibers, carbon black, zinc oxide, titanium dioxide, chalk, solid or hollow glass spheres, microspheres made from other materials, silica, silicates), nucleators, expandants, bonding booster additives, and thermoplastics, compounding agents and/or aging inhibitors, in the form, for example, of primary and secondary antioxidants or in the form of light stabilizers.
  • fillers e.g., (in particular nonconducting) fibers, carbon black, zinc oxide, titanium dioxide, chalk, solid or hollow glass spheres, microspheres made from other materials, silica, silicates
  • nucleators e.g., (in particular nonconducting) fibers, carbon black, zinc oxide, titanium dioxide, chalk, solid or hollow glass spheres, microspheres made from other materials, silica, silicates
  • nucleators e.g.,
  • additives which may typically be utilized are as follows: primary antioxidants, such as sterically hindered phenols, secondary antioxidants, such as phosphites or thioethers, in-process stabilizers, such as C-radical scavengers, light stabilizers, such as UV absorbers or sterically hindered amines, antiozonants, metal deactivators, and processing assistants, for example, to name but a few.
  • primary antioxidants such as sterically hindered phenols
  • secondary antioxidants such as phosphites or thioethers
  • in-process stabilizers such as C-radical scavengers
  • light stabilizers such as UV absorbers or sterically hindered amines
  • antiozonants such as antiozonants, metal deactivators, and processing assistants, for example, to name but a few.
  • the surface of the adhesive tape is very rough, with a large proportion of the particles protruding from the adhesive and preventing effective flow.
  • Fibriform particles adopt an orientation when the adhesive tape is produced from solution, and are oriented preferably in the web direction.
  • the conductivity in that direction therefore, is very much higher than at right angles thereto.
  • the conductivity in the z-direction is much less than when using dendritic particles.
  • the performance which can be achieved is much better than when using only one of the particle varieties (fibriform or dendritic), even if the total amount of conductive particles is not increased.
  • the conductivity in the z-direction is still extremely good, and does not change, compared with the use of purely dendritic particles.
  • the conductivity in the x,y-direction is still as good as for the use of pure fibers, and the difference between the web direction and the direction at right angles thereto is still only very small.
  • the adhesive now has much better laminatability and much greater bond strength.
  • the overall content of particles can in fact be lowered somewhat, without any significant reduction in the x-direction conductivity.
  • the conductive particles admixed to the adhesive sheet of the invention are particles whose structure exhibits an anisotropic, multiply branched morphology in which smaller side branches (secondary arms) come out from a trunk (primary arm), and may in turn have side branches (tertiary arms).
  • the branches here may be straight or curved and may in each case be branched in turn, similarly to the structure of a fir tree.
  • Particles of these kinds are referred to in the literature—and for the purposes of the present specification as well—as “dendrites”, as “dendritic particles”, as “particles with dendritic form”, and as “particles with dendritic structure”.
  • the extent in one dimension is commonly greater than in at least one other dimension, more particularly than in both other dimensions.
  • Dendritic particles used in accordance with the invention are particles which have at least secondary arms, preferably those which possess at least tertiary arms as well.
  • dendritic particles may with preference be dendritic metal particles, made of zinc, iron, bismuth, copper, silver, or gold, for example, to name but a few.
  • the metal of the particles is selected such that the particles do not fail as a result of oxidation after a short time.
  • Preference is given to using copper or silver dendrites.
  • Gold may likewise be used outstandingly, but it is very expensive.
  • silverized copper dendrites it is preferred for silverized copper dendrites to be used, with the copper being preferably covered fully by the layer of silver.
  • different amounts of silver are used in order to cover the copper completely. In the case of particles between 30 and 40 ⁇ m, this figure is about 20% silver.
  • the average size of the dendrites is preferably selected such that their maximum extent corresponds approximately to the thickness of the adhesive sheet.
  • Fibriform particles have an extent in one preferential direction that is significantly greater than in any extent perpendicular to the preferential direction.
  • Employed very preferably as fibers are particles whose maximum extent is at least three times as large as the greatest extent perpendicularly to the direction of maximum extent. The size of the fibers ought to be selected to be small, and the length of the fibers (maximum extent of the fiber particles) ought not to be greater than ten times the thickness of the layer of adhesive.
  • the fibriform particles may either consist directly of metal, or else preferably metallized fibers, more particularly metallized glass fibers, are used. Metallized carbon fibers are also suitable.
  • the metal layer in this case preferably covers at least the predominant part of the surface of the inner material, very preferably the entire surface of the inner material.
  • fibriform particles which on their outside (in other words on at least the predominant part of their surface) contain the same metal as the dendrites do on at least the predominant part of their surface, so that no electrical local element is produced, with the possibility that a metal might be broken down.
  • the ratio of dendrites to fibers may fluctuate, but neither of the two species of particle should be present in more than a tenfold excess, based on the total weight of the conductive particles. Fibers and dendrites are used very advantageously in equal weight proportions.
  • the fraction of the conductive particles is between 40 and 90 wt %, based on the total mass of the adhesive including particles; the amount is preferably between 50 and 80 wt %, more preferably between 55 and 70 wt %.
  • the adhesive sheet of the invention may be used outstandingly for adhesive bonds in the electronics sector, as for example for the bonding of electronic conductor tracks.
  • the adhesive sheets of the invention very preferably have thicknesses in the range from 30 to 100 ⁇ m, preferably from 40 to 50 ⁇ m.
  • FCCL Flexible Copper Clad Laminate
  • FCCL of the assemblies of FCCL and steel produced by the method described above is peeled from the stiffener at a 90° angle at a rate of 50 mm/min, and the force required in N/cm is recorded.
  • the measurements are made in accordance with military standard MIL-DTL-83528C.
  • a sample of the adhesive sheet is freed from any release sheets or release papers that may be present, and a section measuring 5 ⁇ 5 cm 2 is cut out. This section is then placed between two cylindrical, gold-plated electrodes, cleaned beforehand with ethanol and each having a circular contact area of 1 inch 2 (in each case one end face of the respective cylindrical electrode), which are connected to a current/voltage source and to a sensitive ohmmeter.
  • the adhesive sheet is then aligned horizontally between each of the likewise horizontal contact areas.
  • the lower of the electrodes lies, by its end face remote from the adhesive sheet, on a solid surface.
  • a 5 kg weight is then placed onto the end face of the upper electrode, remote from the adhesive sheet, in order to optimize the contacting of the adhesive sheet. Measurement takes place at 23° C. and 50% rh. The resistance is measured in ohms.
  • a sample of the noncrosslinked adhesive sheet is freed from any release films or release papers that may be present, and a section measuring 5 ⁇ 5 cm 2 is cut out.
  • a measuring setup is used as depicted in FIG. 1 .
  • the reference symbols have the following meanings:
  • the electrode After being cleaned with ethanol, the electrode is placed onto the sample. The area between the two parts of the electrode is precisely 1 inch 2 , 6.45 mm 2 . Again, measurement takes place at 23° C. and 50% rh. The weight of the electrode system (electrodes and insulator) is 240 g.
  • the sample is measured once in the x-direction, this being the direction in which coating was carried out, and once in the y-direction, transverse to the direction of coating.
  • the heat-activatable composition was subsequently coated out onto a siliconized PET film and dried at 100° C., to give a layer of adhesive 40 ⁇ m thick.
  • a striking feature for comparative example 2 is its very poor laminatability onto the FCCL. This lamination is very much easier for example 1. Despite this, the conductivity is of similar quality, in contrast to example 3.
  • the heat-activatable composition was subsequently coated out onto a siliconized PET film and dried at 100° C., to give a layer of adhesive 40 ⁇ m thick.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
US14/397,955 2012-05-04 2013-04-05 Three-dimensional electrically conductive adhesive film Expired - Fee Related US9598614B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102012207462 2012-05-04
DE102012207462.7 2012-05-04
DE102012207462A DE102012207462A1 (de) 2012-05-04 2012-05-04 Dreidimensional elektrisch leitfähige Klebstofffolie
PCT/EP2013/057233 WO2013164154A1 (de) 2012-05-04 2013-04-05 Dreidimensional elektrisch leitfähige klebstofffolie

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US9598614B2 true US9598614B2 (en) 2017-03-21

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EP (1) EP2844690B1 (enrdf_load_stackoverflow)
JP (1) JP2015521214A (enrdf_load_stackoverflow)
KR (1) KR102085553B1 (enrdf_load_stackoverflow)
CN (1) CN104284928B (enrdf_load_stackoverflow)
DE (1) DE102012207462A1 (enrdf_load_stackoverflow)
IN (1) IN2014DN10108A (enrdf_load_stackoverflow)
MX (1) MX358202B (enrdf_load_stackoverflow)
PL (1) PL2844690T3 (enrdf_load_stackoverflow)
TW (1) TW201402772A (enrdf_load_stackoverflow)
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US20220025225A1 (en) * 2017-05-09 2022-01-27 3M Innovative Properties Company Electrically conductive adhesive

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JP5989928B1 (ja) * 2016-02-10 2016-09-07 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
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WO2013164154A1 (de) 2013-11-07
US20150129812A1 (en) 2015-05-14

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