US8772624B2 - Solar cell encapsulant layers with enhanced stability and adhesion - Google Patents
Solar cell encapsulant layers with enhanced stability and adhesion Download PDFInfo
- Publication number
- US8772624B2 US8772624B2 US11/495,249 US49524906A US8772624B2 US 8772624 B2 US8772624 B2 US 8772624B2 US 49524906 A US49524906 A US 49524906A US 8772624 B2 US8772624 B2 US 8772624B2
- Authority
- US
- United States
- Prior art keywords
- solar cell
- layer
- ionomer
- encapsulant layer
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active, expires
Links
- 239000008393 encapsulating agent Substances 0.000 title claims abstract description 241
- 239000010410 layer Substances 0.000 claims abstract description 466
- 229920000554 ionomer Polymers 0.000 claims abstract description 212
- 238000000034 method Methods 0.000 claims abstract description 66
- 230000008569 process Effects 0.000 claims abstract description 55
- 239000002344 surface layer Substances 0.000 claims abstract description 26
- 239000004711 α-olefin Substances 0.000 claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 claims abstract description 11
- 239000011521 glass Substances 0.000 claims description 132
- 239000000203 mixture Substances 0.000 claims description 105
- -1 ethylene, propylene, 1-butene Chemical class 0.000 claims description 65
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 45
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 36
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 29
- 238000003475 lamination Methods 0.000 claims description 28
- 229920001577 copolymer Polymers 0.000 claims description 26
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 25
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 24
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 claims description 22
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 claims description 21
- 239000002253 acid Substances 0.000 claims description 18
- 239000000654 additive Substances 0.000 claims description 15
- 229920002313 fluoropolymer Polymers 0.000 claims description 12
- 239000004811 fluoropolymer Substances 0.000 claims description 12
- 229920001971 elastomer Polymers 0.000 claims description 11
- 239000000806 elastomer Substances 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 9
- 229920000098 polyolefin Polymers 0.000 claims description 9
- 239000004800 polyvinyl chloride Substances 0.000 claims description 9
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 8
- 229920002635 polyurethane Polymers 0.000 claims description 8
- 239000002356 single layer Substances 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 239000004814 polyurethane Substances 0.000 claims description 7
- 229920002379 silicone rubber Polymers 0.000 claims description 7
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 claims description 6
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 claims description 6
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 claims description 6
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 claims description 6
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 claims description 6
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 6
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 6
- 229920002554 vinyl polymer Polymers 0.000 claims description 6
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 5
- 239000005977 Ethylene Substances 0.000 claims description 5
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 5
- 229920000092 linear low density polyethylene Polymers 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims description 4
- 239000002985 plastic film Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 claims description 3
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical compound CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 claims description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 3
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 claims description 3
- 239000001530 fumaric acid Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 3
- 239000011976 maleic acid Substances 0.000 claims description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 3
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims description 3
- 239000012780 transparent material Substances 0.000 claims 3
- 239000013047 polymeric layer Substances 0.000 claims 1
- 150000001735 carboxylic acids Chemical class 0.000 abstract description 6
- 210000004027 cell Anatomy 0.000 description 243
- 239000010408 film Substances 0.000 description 86
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 55
- 229920002620 polyvinyl fluoride Polymers 0.000 description 33
- 239000000463 material Substances 0.000 description 27
- 239000000853 adhesive Substances 0.000 description 19
- 230000001070 adhesive effect Effects 0.000 description 19
- 239000002987 primer (paints) Substances 0.000 description 19
- 239000006185 dispersion Substances 0.000 description 18
- 239000005340 laminated glass Substances 0.000 description 17
- 229910052782 aluminium Inorganic materials 0.000 description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 16
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 description 15
- 229910001415 sodium ion Inorganic materials 0.000 description 15
- 239000000047 product Substances 0.000 description 13
- 238000012360 testing method Methods 0.000 description 13
- 239000005329 float glass Substances 0.000 description 12
- 229920000728 polyester Polymers 0.000 description 12
- 239000013615 primer Substances 0.000 description 12
- 150000001455 metallic ions Chemical class 0.000 description 11
- 238000011282 treatment Methods 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 10
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 10
- 229910052725 zinc Inorganic materials 0.000 description 10
- 239000011701 zinc Substances 0.000 description 10
- 229920002799 BoPET Polymers 0.000 description 9
- 230000004888 barrier function Effects 0.000 description 9
- 238000000748 compression moulding Methods 0.000 description 9
- 239000008188 pellet Substances 0.000 description 9
- 238000001125 extrusion Methods 0.000 description 8
- 229920001223 polyethylene glycol Polymers 0.000 description 8
- 239000006096 absorbing agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 239000000839 emulsion Substances 0.000 description 7
- 239000011229 interlayer Substances 0.000 description 7
- 230000003746 surface roughness Effects 0.000 description 7
- 239000003017 thermal stabilizer Substances 0.000 description 7
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 6
- 230000001143 conditioned effect Effects 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 229910052708 sodium Inorganic materials 0.000 description 6
- 239000011734 sodium Substances 0.000 description 6
- 239000003381 stabilizer Substances 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 101100389815 Caenorhabditis elegans eva-1 gene Proteins 0.000 description 5
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 230000003750 conditioning effect Effects 0.000 description 5
- 238000010276 construction Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 5
- 229910052718 tin Inorganic materials 0.000 description 5
- MOWXJLUYGFNTAL-DEOSSOPVSA-N (s)-[2-chloro-4-fluoro-5-(7-morpholin-4-ylquinazolin-4-yl)phenyl]-(6-methoxypyridazin-3-yl)methanol Chemical compound N1=NC(OC)=CC=C1[C@@H](O)C1=CC(C=2C3=CC=C(C=C3N=CN=2)N2CCOCC2)=C(F)C=C1Cl MOWXJLUYGFNTAL-DEOSSOPVSA-N 0.000 description 4
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 4
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 4
- 229910001335 Galvanized steel Inorganic materials 0.000 description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 125000000129 anionic group Chemical group 0.000 description 4
- 239000008397 galvanized steel Substances 0.000 description 4
- 229910052749 magnesium Inorganic materials 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- 150000001451 organic peroxides Chemical class 0.000 description 4
- 150000002978 peroxides Chemical class 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 4
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 3
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 3
- 101150023060 ACR2 gene Proteins 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- 101100161882 Caenorhabditis elegans acr-3 gene Proteins 0.000 description 3
- AYCPARAPKDAOEN-LJQANCHMSA-N N-[(1S)-2-(dimethylamino)-1-phenylethyl]-6,6-dimethyl-3-[(2-methyl-4-thieno[3,2-d]pyrimidinyl)amino]-1,4-dihydropyrrolo[3,4-c]pyrazole-5-carboxamide Chemical compound C1([C@H](NC(=O)N2C(C=3NN=C(NC=4C=5SC=CC=5N=C(C)N=4)C=3C2)(C)C)CN(C)C)=CC=CC=C1 AYCPARAPKDAOEN-LJQANCHMSA-N 0.000 description 3
- 229920001054 Poly(ethylene‐co‐vinyl acetate) Polymers 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 3
- 229920006397 acrylic thermoplastic Polymers 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000006059 cover glass Substances 0.000 description 3
- 238000004049 embossing Methods 0.000 description 3
- 239000005357 flat glass Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 239000002648 laminated material Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- 229920000428 triblock copolymer Polymers 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- 150000005208 1,4-dihydroxybenzenes Chemical class 0.000 description 2
- CJYDNDLQIIGSTH-UHFFFAOYSA-N 1-(3,5,7-trinitro-1,3,5,7-tetrazocan-1-yl)ethanone Chemical compound CC(=O)N1CN([N+]([O-])=O)CN([N+]([O-])=O)CN([N+]([O-])=O)C1 CJYDNDLQIIGSTH-UHFFFAOYSA-N 0.000 description 2
- ZMWRRFHBXARRRT-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-bis(2-methylbutan-2-yl)phenol Chemical compound CCC(C)(C)C1=CC(C(C)(C)CC)=CC(N2N=C3C=CC=CC3=N2)=C1O ZMWRRFHBXARRRT-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229920003947 DuPont™ Surlyn® 1707 Polymers 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000012963 UV stabilizer Substances 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 2
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- OCWYEMOEOGEQAN-UHFFFAOYSA-N bumetrizole Chemical compound CC(C)(C)C1=CC(C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O OCWYEMOEOGEQAN-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- QHZOMAXECYYXGP-UHFFFAOYSA-N ethene;prop-2-enoic acid Chemical compound C=C.OC(=O)C=C QHZOMAXECYYXGP-UHFFFAOYSA-N 0.000 description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 2
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 238000010348 incorporation Methods 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 229920001427 mPEG Polymers 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 230000008520 organization Effects 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- HXHCOXPZCUFAJI-UHFFFAOYSA-N prop-2-enoic acid;styrene Chemical compound OC(=O)C=C.C=CC1=CC=CC=C1 HXHCOXPZCUFAJI-UHFFFAOYSA-N 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000005336 safety glass Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000012815 thermoplastic material Substances 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 2
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- 239000005050 vinyl trichlorosilane Substances 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical class OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- HSLFISVKRDQEBY-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclohexane Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCC1 HSLFISVKRDQEBY-UHFFFAOYSA-N 0.000 description 1
- BWDSMNCMUXDKJM-UHFFFAOYSA-N 1-docosoxydocosane 2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.CCCCCCCCCCCCCCCCCCCCCCOCCCCCCCCCCCCCCCCCCCCCC BWDSMNCMUXDKJM-UHFFFAOYSA-N 0.000 description 1
- HQOVXPHOJANJBR-UHFFFAOYSA-N 2,2-bis(tert-butylperoxy)butane Chemical compound CC(C)(C)OOC(C)(CC)OOC(C)(C)C HQOVXPHOJANJBR-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- JGBAASVQPMTVHO-UHFFFAOYSA-N 2,5-dihydroperoxy-2,5-dimethylhexane Chemical compound OOC(C)(C)CCC(C)(C)OO JGBAASVQPMTVHO-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- SSKNCQWPZQCABD-UHFFFAOYSA-N 2-[2-[2-(2-heptanoyloxyethoxy)ethoxy]ethoxy]ethyl heptanoate Chemical compound CCCCCCC(=O)OCCOCCOCCOCCOC(=O)CCCCCC SSKNCQWPZQCABD-UHFFFAOYSA-N 0.000 description 1
- KRDXTHSSNCTAGY-UHFFFAOYSA-N 2-cyclohexylpyrrolidine Chemical compound C1CCNC1C1CCCCC1 KRDXTHSSNCTAGY-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- CPPDFKVVKLWZHE-UHFFFAOYSA-N 2-methylprop-2-enoic acid;phenoxybenzene Chemical compound CC(=C)C(O)=O.C=1C=CC=CC=1OC1=CC=CC=C1 CPPDFKVVKLWZHE-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical class O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- ACZGCWSMSTYWDQ-UHFFFAOYSA-N 3h-1-benzofuran-2-one Chemical class C1=CC=C2OC(=O)CC2=C1 ACZGCWSMSTYWDQ-UHFFFAOYSA-N 0.000 description 1
- YKZUNWLMLRCVCW-UHFFFAOYSA-N 4-[2-(4-bicyclo[2.2.1]hept-2-enyl)ethyl]bicyclo[2.2.1]hept-2-ene Chemical compound C1CC(C2)C=CC21CCC1(C=C2)CC2CC1 YKZUNWLMLRCVCW-UHFFFAOYSA-N 0.000 description 1
- KVCQTKNUUQOELD-UHFFFAOYSA-N 4-amino-n-[1-(3-chloro-2-fluoroanilino)-6-methylisoquinolin-5-yl]thieno[3,2-d]pyrimidine-7-carboxamide Chemical compound N=1C=CC2=C(NC(=O)C=3C4=NC=NC(N)=C4SC=3)C(C)=CC=C2C=1NC1=CC=CC(Cl)=C1F KVCQTKNUUQOELD-UHFFFAOYSA-N 0.000 description 1
- VMRIVYANZGSGRV-UHFFFAOYSA-N 4-phenyl-2h-triazin-5-one Chemical class OC1=CN=NN=C1C1=CC=CC=C1 VMRIVYANZGSGRV-UHFFFAOYSA-N 0.000 description 1
- CYHYIIFODCKQNP-UHFFFAOYSA-N 5,7-ditert-butyl-3-(3,4-dimethylphenyl)-3h-1-benzofuran-2-one Chemical compound C1=C(C)C(C)=CC=C1C1C(C=C(C=C2C(C)(C)C)C(C)(C)C)=C2OC1=O CYHYIIFODCKQNP-UHFFFAOYSA-N 0.000 description 1
- ACYXOHNDKRVKLH-UHFFFAOYSA-N 5-phenylpenta-2,4-dienenitrile prop-2-enoic acid Chemical compound OC(=O)C=C.N#CC=CC=CC1=CC=CC=C1 ACYXOHNDKRVKLH-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- OGBVRMYSNSKIEF-UHFFFAOYSA-N Benzylphosphonic acid Chemical class OP(O)(=O)CC1=CC=CC=C1 OGBVRMYSNSKIEF-UHFFFAOYSA-N 0.000 description 1
- HAVDCTUCZNKAHY-UHFFFAOYSA-N CC(=C)C(O)=O.CCCCCCCCCc1ccc(Oc2ccc(CCCCCCCCC)cc2)cc1 Chemical compound CC(=C)C(O)=O.CCCCCCCCCc1ccc(Oc2ccc(CCCCCCCCC)cc2)cc1 HAVDCTUCZNKAHY-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- ZZZCUOFIHGPKAK-UHFFFAOYSA-N D-erythro-ascorbic acid Natural products OCC1OC(=O)C(O)=C1O ZZZCUOFIHGPKAK-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-UHFFFAOYSA-N Di-Et ester-Fumaric acid Natural products CCOC(=O)C=CC(=O)OCC IEPRKVQEAMIZSS-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-WAYWQWQTSA-N Diethyl maleate Chemical compound CCOC(=O)\C=C/C(=O)OCC IEPRKVQEAMIZSS-WAYWQWQTSA-N 0.000 description 1
- 229920003311 DuPont™ Surlyn® 1601 Polymers 0.000 description 1
- 229920003945 DuPont™ Surlyn® 1705-1 Polymers 0.000 description 1
- 229920003946 DuPont™ Surlyn® 1706 Polymers 0.000 description 1
- 239000001828 Gelatine Substances 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 239000004609 Impact Modifier Substances 0.000 description 1
- 241000755266 Kathetostoma giganteum Species 0.000 description 1
- PWKSKIMOESPYIA-BYPYZUCNSA-N L-N-acetyl-Cysteine Chemical compound CC(=O)N[C@@H](CS)C(O)=O PWKSKIMOESPYIA-BYPYZUCNSA-N 0.000 description 1
- 239000004712 Metallocene polyethylene (PE-MC) Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- RRAQGPNOVYEVCW-UHFFFAOYSA-N OC(=O)C=C.C1=CC(CCCCCCCCC)=CC=C1OC1=CC=C(CCCCCCCCC)C=C1 Chemical compound OC(=O)C=C.C1=CC(CCCCCCCCC)=CC=C1OC1=CC=C(CCCCCCCCC)C=C1 RRAQGPNOVYEVCW-UHFFFAOYSA-N 0.000 description 1
- CRHWZQHMAWOVCS-UHFFFAOYSA-N OC(=O)C=C.CCCCCCCCCCCCCCCCCCCCCCOCCCCCCCCCCCCCCCCCCCCCC Chemical compound OC(=O)C=C.CCCCCCCCCCCCCCCCCCCCCCOCCCCCCCCCCCCCCCCCCCCCC CRHWZQHMAWOVCS-UHFFFAOYSA-N 0.000 description 1
- YIKSCQDJHCMVMK-UHFFFAOYSA-N Oxamide Chemical class NC(=O)C(N)=O YIKSCQDJHCMVMK-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229920000562 Poly(ethylene adipate) Polymers 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 1
- 229920010524 Syndiotactic polystyrene Polymers 0.000 description 1
- 229920006355 Tefzel Polymers 0.000 description 1
- 241001422033 Thestylus Species 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229930003268 Vitamin C Natural products 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 238000002835 absorbance Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 229920003232 aliphatic polyester Polymers 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 235000010323 ascorbic acid Nutrition 0.000 description 1
- 239000011668 ascorbic acid Substances 0.000 description 1
- 229960005070 ascorbic acid Drugs 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 150000001559 benzoic acids Chemical class 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- HTJZKHLYRXPLLS-VAWYXSNFSA-N bis(5-methyl-2-propan-2-ylcyclohexyl) (e)-but-2-enedioate Chemical compound CC(C)C1CCC(C)CC1OC(=O)\C=C\C(=O)OC1C(C(C)C)CCC(C)C1 HTJZKHLYRXPLLS-VAWYXSNFSA-N 0.000 description 1
- BXIQXYOPGBXIEM-UHFFFAOYSA-N butyl 4,4-bis(tert-butylperoxy)pentanoate Chemical compound CCCCOC(=O)CCC(C)(OOC(C)(C)C)OOC(C)(C)C BXIQXYOPGBXIEM-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 210000003850 cellular structure Anatomy 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- KRGNPJFAKZHQPS-UHFFFAOYSA-N chloroethene;ethene Chemical group C=C.ClC=C KRGNPJFAKZHQPS-UHFFFAOYSA-N 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 125000005266 diarylamine group Chemical group 0.000 description 1
- JBSLOWBPDRZSMB-BQYQJAHWSA-N dibutyl (e)-but-2-enedioate Chemical compound CCCCOC(=O)\C=C\C(=O)OCCCC JBSLOWBPDRZSMB-BQYQJAHWSA-N 0.000 description 1
- JBSLOWBPDRZSMB-FPLPWBNLSA-N dibutyl (z)-but-2-enedioate Chemical compound CCCCOC(=O)\C=C/C(=O)OCCCC JBSLOWBPDRZSMB-FPLPWBNLSA-N 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- IEPRKVQEAMIZSS-AATRIKPKSA-N diethyl fumarate Chemical compound CCOC(=O)\C=C\C(=O)OCC IEPRKVQEAMIZSS-AATRIKPKSA-N 0.000 description 1
- LDCRTTXIJACKKU-ONEGZZNKSA-N dimethyl fumarate Chemical compound COC(=O)\C=C\C(=O)OC LDCRTTXIJACKKU-ONEGZZNKSA-N 0.000 description 1
- 229960004419 dimethyl fumarate Drugs 0.000 description 1
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- QHSJIZLJUFMIFP-UHFFFAOYSA-N ethene;1,1,2,2-tetrafluoroethene Chemical compound C=C.FC(F)=C(F)F QHSJIZLJUFMIFP-UHFFFAOYSA-N 0.000 description 1
- HDERJYVLTPVNRI-UHFFFAOYSA-N ethene;ethenyl acetate Chemical group C=C.CC(=O)OC=C HDERJYVLTPVNRI-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- DUDCYUDPBRJVLG-UHFFFAOYSA-N ethoxyethane methyl 2-methylprop-2-enoate Chemical compound CCOCC.COC(=O)C(C)=C DUDCYUDPBRJVLG-UHFFFAOYSA-N 0.000 description 1
- DOMLXBPXLNDFAB-UHFFFAOYSA-N ethoxyethane;methyl prop-2-enoate Chemical compound CCOCC.COC(=O)C=C DOMLXBPXLNDFAB-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- DPNIJLHSBNLPNW-UHFFFAOYSA-N ethyl carbamate;styrene Chemical compound CCOC(N)=O.C=CC1=CC=CC=C1 DPNIJLHSBNLPNW-UHFFFAOYSA-N 0.000 description 1
- 229920006228 ethylene acrylate copolymer Polymers 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002443 hydroxylamines Chemical class 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- JYGFTBXVXVMTGB-UHFFFAOYSA-N indolin-2-one Chemical class C1=CC=C2NC(=O)CC2=C1 JYGFTBXVXVMTGB-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229940119545 isobornyl methacrylate Drugs 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 150000002690 malonic acid derivatives Chemical class 0.000 description 1
- 239000006078 metal deactivator Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 description 1
- FSAJWMJJORKPKS-UHFFFAOYSA-N octadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C=C FSAJWMJJORKPKS-UHFFFAOYSA-N 0.000 description 1
- NZIDBRBFGPQCRY-UHFFFAOYSA-N octyl 2-methylprop-2-enoate Chemical compound CCCCCCCCOC(=O)C(C)=C NZIDBRBFGPQCRY-UHFFFAOYSA-N 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- 229940049964 oleate Drugs 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 229940031826 phenolate Drugs 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- LCDOENXNMQXGFS-UHFFFAOYSA-N phenoxybenzene;prop-2-enoic acid Chemical compound OC(=O)C=C.C=1C=CC=CC=1OC1=CC=CC=C1 LCDOENXNMQXGFS-UHFFFAOYSA-N 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- XRBCRPZXSCBRTK-UHFFFAOYSA-N phosphonous acid Chemical class OPO XRBCRPZXSCBRTK-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- KUKFKAPJCRZILJ-UHFFFAOYSA-N prop-2-enenitrile;prop-2-enoic acid Chemical compound C=CC#N.OC(=O)C=C KUKFKAPJCRZILJ-UHFFFAOYSA-N 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000011227 reinforcement additive Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000012776 robust process Methods 0.000 description 1
- 238000004439 roughness measurement Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 229940114926 stearate Drugs 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000003319 supportive effect Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 229920002397 thermoplastic olefin Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229930003799 tocopherol Natural products 0.000 description 1
- 239000011732 tocopherol Substances 0.000 description 1
- 235000019149 tocopherols Nutrition 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- KRLHYNPADOCLAJ-UHFFFAOYSA-N undecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCOC(=O)C(C)=C KRLHYNPADOCLAJ-UHFFFAOYSA-N 0.000 description 1
- RRLMGCBZYFFRED-UHFFFAOYSA-N undecyl prop-2-enoate Chemical compound CCCCCCCCCCCOC(=O)C=C RRLMGCBZYFFRED-UHFFFAOYSA-N 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 235000019154 vitamin C Nutrition 0.000 description 1
- 239000011718 vitamin C Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- QUEDXNHFTDJVIY-UHFFFAOYSA-N γ-tocopherol Chemical class OC1=C(C)C(C)=C2OC(CCCC(C)CCCC(C)CCCC(C)C)(C)CCC2=C1 QUEDXNHFTDJVIY-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10788—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing ethylene vinylacetate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10018—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10743—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing acrylate (co)polymers or salts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0488—Double glass encapsulation, e.g. photovoltaic cells arranged between front and rear glass sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2327/00—Polyvinylhalogenides
- B32B2327/12—Polyvinylhalogenides containing fluorine
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to solar cell modules comprising encapsulant layers with enhanced stability and adhesion.
- Photovoltaic (solar) cell modules are units that convert light energy into electrical energy. Typical or conventional construction of a solar cell module consists of at least 5 structural layers.
- the layers of a conventional solar cell module are constructed in the following order starting from the top, or incident layer (that is, the layer first contacted by light) and continuing to the backing (the layer furthest removed from the incident layer): (1) incident layer or front-sheet, (2) front-sheet (or first) encapsulant layer, (3) voltage-generating layer (or solar cell layer), (4) back-sheet (second) encapsulant layer, and (5) backing layer or back-sheet.
- incident layer is typically a glass plate or a thin polymeric film (such as a fluoropolymer or polyester film), but could conceivably be any material that is transparent to sunlight.
- the encapsulant layers of solar cell modules are designed to encapsulate and protect the fragile voltage-generating layer.
- a solar cell module will incorporate at least two encapsulant layers sandwiched around the voltage-generating layer.
- the optical properties of the front-sheet encapsulant layer must be such that light can be effectively transmitted to the voltage-generating layer.
- polymeric interlayers have been developed to be used as encapsulant layers.
- these polymeric interlayers must possess a combination of characteristics including very high optical clarity, low haze, high impact resistance, shock absorbance, excellent ultraviolet (UV) light resistance, good long term thermal stability, excellent adhesion to glass and other solar cell laminate layers, low UV light transmittance, low moisture absorption, high moisture resistance, excellent long term weatherability, among other requirements.
- UV ultraviolet
- EVA ethylene vinyl acetate
- PVB polyvinylbutyral
- TPU thermoplastic polyurethane
- PVC polyvinylchloride
- metallocene-catalyzed linear low density polyethylenes polyolefin block elastomers
- ethylene acrylate copolymers such as poly(ethylene-co-methyl acrylate) and poly(ethylene
- EVA compositions which have commonly been utilized as the encapsulant layer within solar cell modules, suffer the shortcomings of low adhesion to the other components incorporated within the solar cell module, low creep resistance during the lamination process and end-use and low weathering and light stability. These shortcomings have generally been overcome through the formulation of adhesion primers, peroxide curing agents, and thermal and UV stabilizer packages into the EVA compositions, which complicates the sheet production and ensuing lamination processes.
- embossed films such as PET film
- a tacky adhesive film layer encapsulant, such as EVA, PVB, ionomer and polyethylene resins, with an encapsulant thickness of between 20 and 300 ⁇ m (0.8-11 mils).
- U.S. Pat. Nos. 5,476,553; 5,478,402; and 5,733,382 have disclosed the use of encapsulant layers derived from ionomers formed by the partial neutralization of ethylene-methacrylic acid copolymers or ethylene-acrylic acid copolymers with inorganic bases and the use of Surlyn® 1601 and Surlyn® 1707 (E.I. du Pont de Nemours and Company).
- the laminates disclosed therein were produced with or without additional adhesion primers.
- U.S. Pat. Nos. 5,741,370; 5,762,720 and 5,986,203 have disclosed a solar cell module back-sheet which is a thermoplastic polyolefin including a mixture of at least two ionomers.
- U.S. Pat. Nos. 6,114,046 and 6,353,042 have disclosed a solar cell laminate encapsulant material which includes a layer of metallocene polyethylene disposed between two layers of ionomer.
- U.S. Pat. No. 6,319,596 has disclosed a solar cell encapsulant layer comprising a polyolefin with an ionomer surface.
- U.S. Pat. Nos. 6,320,116 and 6,586,271 have disclosed solar cell encapsulant layers with reduced creep through treatment with electron beam radiation.
- the present invention is directed to a solar cell module or laminate comprising: (i) a first encapsulant layer, (ii) a solar cell layer comprising one or a plurality of electronically interconnected solar cells and having two opposite surfaces, a light-receiving surface and a rear surface, and (iii) an optional second encapsulant layer, wherein a) the first encapsulant layer has a total thickness of from about 0.1 to about 20 mils, b) the first encapsulant layer comprises at least one surface layer derived from a ionomeric composition comprising a finite amount of polymerized residues of an ⁇ -olefin and from about 18 to about 25 wt % of polymerized residues of an ⁇ , ⁇ -ethylenically unsaturated carboxylic acid based on the total weight of the composition, and c) the first and optional second encapsulant layers are laminated to each of the two opposite surfaces of said solar cell layer.
- the first encapsulant layer consists essentially of the ionomeric composition.
- the first encapsulant layer is laminated to the light-receiving surface of the solar cell layer and the optional second encapsulant layer is laminated to the rear surface of the solar cell layer.
- the solar cell module of the present invention further comprises (iv) an incident layer laminated to the first encapsulant layer and away from the solar cell layer, and (v) a back-sheet laminated to the rear surface of the solar cell layer, or to the optional second encapsulant layer and away from the solar cell layer when the optional second encapsulant layer is present.
- the optional second encapsulant layer has the same composition as the first encapsulant layer.
- the present invention is directed to a solar cell module consisting essentially of, from top to bottom, (i) an incident layer that is laminated to, (ii) a first encapsulant layer that is laminated to, (iii) a solar cell layer comprising one or a plurality of electronically interconnected solar cells, which is laminated to, (iv) an optional second encapsulant layer that is laminated to, (v) a back-sheet, wherein said first encapsulant layer has a total thickness of from about 0.1 to about 20 mils and comprises at least one surface layer derived from a ionomeric composition comprising a finite amount of polymerized residues of an ⁇ -olefin and from about 18 to about 25 wt % of polymerized residues of an ⁇ , ⁇ -ethylenically unsaturated carboxylic acid based on the total weight of the composition.
- the present invention is directed to a process of manufacturing a solar cell module comprising: (i) providing an assembly comprising from top to bottom an incident layer, a first encapsulant layer, a solar cell layer comprising one or a plurality of electronically interconnected solar cells, an optional second encapsulant layer, and a back-sheet and (ii) laminating the assembly to form the solar cell module, wherein the first encapsulant layer has a total thickness of from about 0.1 to about 20 mils and comprises at least one surface layer derived from a ionomeric composition comprising a finite amount of polymerized residues of an ⁇ -olefin and from about 18 to about 25 wt % of polymerized residues of an ⁇ , ⁇ -ethylenically unsaturated carboxylic acid based on the total weight of the composition.
- the step of lamination in manufacturing the solar cell module is conducted by subjecting the assembly to heat, or heat and pressure, or heat and vacuum.
- FIG. 1 is a cross-sectional view of one particular embodiment of the solar cell module or laminate 20 of the present invention, which comprises from top to bottom an incident layer 16 , a first encapsulant layer 10 , a solar cell layer 12 , an optional second encapsulant layer 14 , and a back-sheet 18 .
- the present invention is a solar cell module or a solar cell laminate comprising a first encapsulant layer, a solar cell layer, and an optional second encapsulant layer, wherein (i) the first encapsulant layer has a total thickness of about 0.1 to about 20 mils and comprises at least one surface layer derived from an ionomeric composition comprising a finite amount of polymerized residues of an ⁇ -olefin and greater than or equal to about 18 wt % of polymerized residues of an ⁇ , ⁇ -ethylenically unsaturated carboxylic acid based on the total weight of the polymeric composition, (ii) the solar cell layer comprises one or a plurality of electronically interconnected solar cells and has two opposite surfaces, a light-receiving surface and a rear surface, and (iii) the first and optional second encapsulant layers are laminated to each of the two opposite surfaces of the solar cell layer.
- the first encapsulant layer is laminated to the light-receiving surface of the solar cell layer and the optional second encapsulant layer is laminated to the rear surface of the encapsulant layer.
- the solar cell module or laminate 20 of the present invention may further comprise (i) a transparent incident layer (front sheet) 16 , such as a layer of glass, wherein the incident layer 16 is laminated to the first encapsulant layer 10 and away from the solar cell layer 12 , and (ii) a back-sheet 18 , which is laminated to the rear surface of the solar cell layer 12 b or, when the optional second encapsulant layer 14 is present, laminated to the second encapsulant layer 14 and away from the solar cell layer 12 .
- a transparent incident layer (front sheet) 16 such as a layer of glass
- a back-sheet 18 which is laminated to the rear surface of the solar cell layer 12 b or, when the optional second encapsulant layer 14 is present, laminated to the second encapsulant layer 14 and away from the solar cell layer 12 .
- the solar cell modules or laminates may further comprise one or more additional encapsulant layers and/or other additional layers of films or sheets.
- the first encapsulant layer included in the solar cell module has a total thickness of from about 0.1 to about 20 mils (about 0.003 to about 0.51 mm) and comprises at least one surface layer derived from an ionomeric composition containing a finite amount of polymerized residues of an ⁇ -olefin and greater than or equal to about 18 wt % of polymerized residues of an ⁇ , ⁇ -ethylenically unsaturated carboxylic acid based on the total weight of the ionomeric composition. It can be heated and be caused to form an adhesive bond with other encapsulant layer materials, flexible plastic materials, rigid materials, and/or solar cells.
- the first encapsulant layer may be a single-layer or multilayer film or sheet comprising at least one surface layer derived from the ionomeric composition described above.
- multilayer it is meant that the encapsulant layer may be a bi-layer, tri-layer, or include even more layers.
- the other layers may be formed from any material known within the art.
- Suitable compositions that maybe used as the other layers include, but are not limited to, ionomers, ethylene vinyl acetate (EVA), acoustic poly(vinyl acetal), acoustic poly(vinyl butyral), polyvinylbutyral (PVB), thermoplastic polyurethane (TPU), polyvinylchloride (PVC), metallocene-catalyzed linear low density polyethylenes, polyolefin block elastomers, ethylene acrylate ester copolymers, such as poly(ethylene-co-methyl acrylate) and poly(ethylene-co-butyl acrylate), acid copolymers, silicone elastomers, epoxy resins and combinations thereof.
- EVA ethylene vinyl acetate
- PVA acoustic poly(vinyl acetal)
- PVB polyvinylbutyral
- TPU thermoplastic polyurethane
- PVC polyvinylchloride
- both surface layers are derived from the ionomeric compositions containing a finite amount of ⁇ -olefins and greater than or equal to about 18 wt % of ⁇ , ⁇ -ethylenically unsaturated carboxylic acids to provide increased levels of adhesion.
- the ionomeric composition used herein comprises a finite amount of polymerized residues of ⁇ -olefins and greater than or equal to about 18 wt % of polymerized residues of ⁇ , ⁇ -ethylenically unsaturated carboxylic acids based on the total weight of the composition.
- Such ionomeric compositions provide the encapsulant layer derived therefrom with enhanced adhesion, clarity, percent light transmission and other physical properties.
- the ionomeric compositions used herein comprise from about 18 to about 25 wt %, or more preferably, from about 18 to about 23 wt %, or most preferably, from 20 to about 23 wt % of polymerized residues of ⁇ , ⁇ -ethylenically unsaturated carboxylic acids.
- the ⁇ -olefins used herein incorporate from 2 to 10 carbon atoms.
- the ⁇ -olefins may be selected from the group consisting of ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 1-heptene, 3-methyl-1-butene, 4-methyl-1-pentene, and the like and mixtures thereof.
- the ⁇ -olefin is ethylene.
- the ⁇ , ⁇ -ethylenically unsaturated carboxylic acids used herein may be selected from the group consisting of acrylic acid, methacrylic acid, itaconic acid, maleic acid, maleic anhydride, fumaric acid, monomethyl maleic acid, and mixtures thereof.
- the ⁇ , ⁇ -ethylenically unsaturated carboxylic acids are selected from the group consisting of acrylic acid, methacrylic acid and mixtures thereof.
- the ionomeric compositions used herein may optionally independently contain polymerized residues of other unsaturated comonomers.
- preferable other unsaturated comonomers include, but are not limited to, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, propyl acrylate, propyl methacrylate, isopropyl acrylate, isopropyl methacrylate, butyl acrylate, butyl methacrylate, isobutyl acrylate, isobutyl methacrylate, tert-butyl acrylate, tert-butyl methacrylate, octyl acrylate, octyl methacrylate, undecyl acrylate, undecyl methacrylate, octadecyl acrylate, octadecyl methacrylate, dodecyl acrylate, dodecy
- the other unsaturated comonomers are independently selected from the group consisting of, methyl acrylate, methyl methacrylate, butyl acrylate, butyl methacrylate, glycidyl methacrylate and mixtures thereof.
- the ionomeric compositions of the present invention independently contain between 0 and about 50 wt % of polymerized residues of the other unsaturated comonomer, based on the total weight of the composition. More preferably, the ionomeric compositions of the present invention independently contain between 0 and about 30 wt %, or most preferably, between 0 and about 20 wt % of polymerized residues of the other unsaturated comonomers.
- the parent acid copolymers which the ionomers are derived from, may be polymerized as disclosed, for example, in U.S. Pat. No. 3,404,134, U.S. Pat. No. 5,028,674, U.S. Pat. No. 6,500,888 and U.S. Pat. No. 6,518,365.
- the encapsulant layer derived from the ionomeric compositions described above exhibits improved toughness relative to what would be expected of a shaped article comprising a higher acid content. It is believed that the improved toughness is obtained by preparing a parent acid copolymer base resin with a lower melt index (MI) before it is neutralized.
- the parent acid copolymer resin of the present invention preferably has a MI of less than 60 g/10 min, or more preferably, less than 55 g/10 min, or even more preferably, less than 50 g/10 min, or most preferably, less than 35 g/10 min, as determined at 190° C.
- the MI can be measured by any standard test, such as test methods ISO 1133 and ASTM D1238, which are generally conducted at a temperature of 190° C. with a load of 2160 g.
- the parent acid copolymers may be neutralized from about 10% to about 100% with metallic ions based on the total carboxylic acid content.
- parent acid copolymers are from about 10% to about 50%, or more preferably, from about 20% to about 40% neutralized with metallic ions.
- the metallic ions may be monovalent, divalent, trivalent, multivalent, or mixtures of ions having the same or different valencies. Exemplary monovalent metallic ions include, but are not limited to, sodium, potassium, lithium, silver, mercury, copper, and the like and mixtures thereof.
- Exemplary divalent metallic ions include, but are not limited to, beryllium, magnesium, calcium, strontium, barium, copper, cadmium, mercury, tin, lead, iron, cobalt, nickel, zinc, and the like and mixtures thereof.
- Exemplary trivalent metallic ions include, but are not limited to, aluminum, scandium, iron, yttrium, and the like and mixtures thereof.
- Exemplary multivalent metallic ions include, but are not limited to, titanium, zirconium, hafnium, vanadium, tantalum, tungsten, chromium, cerium, iron, and the like and mixtures thereof.
- the metallic ion when the metallic ion is multivalent, complexing agents, such as stearate, oleate, salicylate, and phenolate radicals are included, as disclosed within U.S. Pat. No. 3,404,134.
- the metallic ion may be selected from the group consisting of sodium, lithium, magnesium, zinc, aluminum, and mixtures thereof. More preferably, the metallic ion may be selected from the group consisting of sodium, zinc, and mixtures thereof. Most preferably, the metallic ion is zinc.
- the parent acid copolymers of the present invention may be neutralized as disclosed, for example, in U.S. Pat. No. 3,404,134.
- the ionomeric compositions used herein preferably have a MI less than about 10 g/10 min, as measured by ASTM method D1238 at 190° C., to reduce resin creep (flow) during the lamination process and within the end-use. More preferably, the ionomeric compositions have a MI less than about 5 g/10 min, or most preferably, less than about 3 g/10 min.
- the ionomeric compositions also preferably have a flexural modulus greater than about 40,000 psi, as measured by ASTM method D638. More preferably, the ionomeric compositions have a flexural modulus greater than about 50,000 psi, and most preferably, greater than about 60,000 psi.
- the ionomeric compositions used herein contained in the first encapsulant layer of the solar cell module may further contain additives which effectively reduce the melt flow of the resin, to the limit of producing thermoset films or sheets.
- additives will enhance the upper end-use temperature and reduce creep of the encapsulant layer and laminates of the present invention, both during the lamination process and the end-uses thereof.
- the end-use temperature will be enhanced up to 20° C. to 70° C.
- laminates produced from such materials will be fire resistant. By reducing the melt flow of the thermoplastic films or sheets of the present invention, the material will have a reduced tendency to melt and flow out of the laminate and therefore less likely to serve as additional fire fuel.
- melt flow reducing additives include, but are not limited to, organic peroxides, such as 2,5-dimethylhexane-2,5-dihydroperoxide, 2,5-dimethyl-2,5-di(tert-betylperoxy)hexane-3, di-tert-butyl peroxide, tert-butylcumyl peroxide, 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane, dicumyl peroxide, alpha, alpha′-bis(tert-butyl-peroxyisopropyl)benzene, n-butyl-4,4-bis(tert-butylperoxy)valerate, 2,2-bis(tert-butylperoxy)butane, 1,1-bis(tert-butylperoxy)cyclohexane, 1,1-bis(tert-butylperoxy)-3,3,5-trimethyl-cyclohexan
- the organic peroxide may decompose at a temperature of about 100° C. or higher to generate radicals.
- the organic peroxides have a decomposition temperature which affords a half life of 10 hours at about 70° C. or higher to provide improved stability for blending operations.
- the organic peroxides will be added at a level of between about 0.01 and about 10 wt % based on the total weight of composition.
- initiators such as dibutyltin dilaurate, may be used.
- initiators are added at a level of from about 0.01 to about 0.05 wt % based on the total weight of composition.
- inhibitors such as hydroquinone, hydroquinone monomethyl ether, p-benzoquinone, and methylhydroquinone
- the inhibitors may be added for the purpose of enhancing control to the reaction and stability.
- the inhibitors would be added at a level of less than about 5 wt % based on the total weight of the composition.
- the encapsulant layer used herein does not incorporate cross-linking additives, such as the abovementioned peroxides.
- the ionomeric compositions used herein may further contain any additive known within the art.
- additives include, but are not limited to, plasticizers, processing aides, flow enhancing additives, lubricants, pigments, dyes, flame retardants, impact modifiers, nucleating agents to increase crystallinity, antiblocking agents such as silica, thermal stabilizers, hindered amine light stabilizers (HALS), UV absorbers, UV stabilizers, dispersants, surfactants, chelating agents, coupling agents, adhesives, primers, reinforcement additives, such as glass fiber, fillers and the like.
- plasticizers processing aides
- flow enhancing additives such as silica, thermal stabilizers, hindered amine light stabilizers (HALS), UV absorbers, UV stabilizers, dispersants, surfactants, chelating agents, coupling agents, adhesives, primers, reinforcement additives, such as glass fiber, fillers and the like.
- HALS hindered amine light stabilizers
- Thermal stabilizers are well disclosed within the art. Any known thermal stabilizer will find utility within the present invention.
- General classes of thermal stabilizers include, but are not limited to, phenolic antioxidants, alkylated monophenols, alkylthiomethylphenols, hydroquinones, alkylated hydroquinones, tocopherols, hydroxylated thiodiphenyl ethers, alkylidenebisphenols, O-, N- and S-benzyl compounds, hydroxybenzylated malonates, aromatic hydroxybenzyl compounds, triazine compounds, aminic antioxidants, aryl amines, diaryl amines, polyaryl amines, acylaminophenols, oxamides, metal deactivators, phosphites, phosphonites, benzylphosphonates, ascorbic acid (vitamin C), compounds which destroy peroxide, hydroxylamines, nitrones, thiosynergists, benzofuranones, indolinone
- the ionomeric compositions disclosed herein may comprise 0 to about 10.0 wt % of the thermal stabilizers, based on the total weight of the composition.
- the polymeric compositions disclosed herein comprise 0 to about 5.0 wt %, or more preferably, 0 to about 1.0 wt % of the thermal stabilizers.
- UV absorbers are well disclosed within the art. Any known UV absorber will find utility within the present invention.
- Preferable general classes of UV absorbers include, but are not limited to, benzotriazoles, hydroxybenzophenones, hydroxyphenyl triazines, esters of substituted and unsubstituted benzoic acids, and the like and mixtures thereof.
- the ionomeric compositions disclosed herein may comprise 0 to about 10.0 wt % of the UV absorbers, based on the total weight of the composition.
- the polymeric compositions disclosed herein comprise 0 to about 5.0 wt %, or more preferably, 0 to about 1.0 wt % of the UV absorbers.
- HALS are disclosed to be secondary, tertiary, acetylated, N-hydrocarbyloxy substituted, hydroxy substituted N-hydrocarbyloxy substituted, or other substituted cyclic amines which further incorporate steric hindrance, generally derived from aliphatic substitution on the carbon atoms adjacent to the amine function.
- the polymeric compositions disclosed herein may comprise 0 to about 10.0 wt % of HALS, based on the total weight of the composition.
- the ionomeric compositions disclosed herein comprise 0 to about 5.0 wt %, or more preferably, 0 to about 1.0 wt % of HALS.
- Silane coupling agents may be added in the ionomeric compositions to enhance the adhesive strengths.
- Specific examples of the silane coupling agents include, but are not limited to, gamma-chloropropylmethoxysilane, vinyltriethoxysilane, vinyltris(beta-methoxyethoxy)silane, gamma-methacryloxypropylmethoxysilane, vinyltriacetoxysilane, gamma-glycidoxypropyltrimethoxysilane, gamma-glycidoxypropyltriethoxysilane, beta-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, vinyltrichlorosilane, gamma-mercaptopropylmethoxysilane, gamma-aminopropyltriethoxysilane, N-beta-(aminoethyl)-gamma-aminoprop
- the first encapsulant layer included in the solar cell module has a total thickness of from about 0.1 to about 20 mils (about 0.003 to 0.51 mm).
- the thinner solar cell encapsulant films for example, with a total thickness of from about 0.1 to about 5 mils (about 0.003 to about 0.13 mm), are generally utilized within flexible solar cell laminates.
- the thicker solar cell encapsulant sheets for example, with a total thickness of from about 10 to about 20 mils (about 0.25 to about 0.51 mm), are generally utilized within rigid solar cell laminates.
- the thickness of the individual sub-layer components which make up the total multilayer encapsulant layer of the present invention is not critical and may be independently varied depending on the particular application.
- the ionomeric surface layers are minimized in thickness.
- the ionomeric surface layers are independently equal to or less than about 5 mils (0.13 mm) thick. More preferably, the ionomeric surface layers are independently equal to or less than about 3 mils (0.08 mm), or even more preferably, equal to or less than about 2 mils (0.05 mm), or most preferably, equal to or less than about 1 mil (0.03 mm) thick.
- the encapsulant layer described above which has at least one ionomeric surface layer, may be produced through any known process.
- the encapsulant layer may be produced through the use of preformed ionomer and other layer films and sheets, laminates thereof, extrusion coated multilayer films or sheets, co-extrusion casting and blown film processes. Generally, the films or sheets are produced through extrusion casting or blown film processes.
- the conditioning of poly(vinyl butyral) and ionomeric interlayers is known and practiced to provide the highest adhesion possible to provide the attributes commonly associated with safety glass.
- Conditioning of ionomeric solar cell encapsulant layers has not been disclosed within the art and can explain the generally recognized need to use adhesives and primers to provide the desired level of adhesion between the encapsulant layer and the other solar cell laminate layers.
- the encapsulant layer described above provides many desirable benefits to the overall solar cell module and the process to produce the solar cell laminate.
- the at least one surface layer that is derived from the ionomeric composition having high acid level provides significant enhancement in adhesion to the other solar cell laminate layers, especially to the rigid support layers, such as the glass layer, without the need for the incorporation of adhesion promoters and additives or the need for the application of primers to the glass or other solar cell laminate layers.
- the at least one ionomeric surface layer also makes the multilayer encapsulant layer tack-free and prevents it from blocking when rolled or stacked in storage or when manipulated during the production of the solar cell laminates.
- the presence of the at least one surface layer derived from zinc-neutralized, high acid content ionomers further reduces the impact of adhesion of the encapsulant layer when it is conditioned at high relative humidity (RH) environments.
- RH relative humidity
- the encapsulant layer when it is in a multilayer form, it relegates the preferable soft, low modulus layers, which have a tendency to block and stick, to the inner layer.
- the ionomeric layers tend to be rigid and have a high modulus, the incorporation of the other layer(s) substantially enhances the overall flexibility of the encapsulant layer and lowers the modulus to provide adequate physical shock protection for the fragile solar cell components.
- none of the layers contained within the multilayer solar cell encapsulant layer of the present invention are cross-linked, allowing for the avoidance of the complication of formulating the resin compositions with, for example, peroxide cross-linking agents, and producing curable sheets therefrom.
- the expensive stabilizers such as the UV absorbers, may be concentrated in one or both of the ionomeric surface layers, where the lowest overall concentration can most efficiently protect the overall multilayer encapsulant film or sheet and, in turn, the solar cell laminate.
- the optional second encapsulant layer or any other additional encapsulant layers comprised in the solar cell module of the present invention may be derived from any type of suitable films or sheets.
- the optional second encapsulant layer is derived from ionomers, ethylene vinyl acetate (EVA), acoustic poly(vinyl acetal), acoustic poly(vinyl butyral), polyvinylbutyral (PVB), thermoplastic polyurethane (PU), polyvinylchloride (PVC), metallocene-catalyzed linear low density polyethylenes, polyolefin block elastomers, ethylene acrylate ester copolymers, such as poly(ethylene-co-methyl acrylate) and poly(ethylene-co-butyl acrylate), acid copolymers, silicone elastomers or epoxy resins.
- EVA ethylene vinyl acetate
- PV acetal acoustic poly(vinyl butyral)
- PVB polyvinylbut
- the optional second encapsulant layer 14 is derived from ionomers, ethylene vinyl acetate (EVA), polyvinylbutyral (PVB), metallocene-catalyzed linear low density polyethylenes, acid copolymers or ethylene acrylate ester copolymers. Most preferably, the optional second encapsulant layer has the same composition as the first encapsulant layer.
- EVA ethylene vinyl acetate
- PVB polyvinylbutyral
- metallocene-catalyzed linear low density polyethylenes acid copolymers or ethylene acrylate ester copolymers.
- the optional second encapsulant layer has the same composition as the first encapsulant layer.
- the thickness of the optional second encapsulant layer or any other additional encapsulant layers is not critical and may be independently varied depending on the particular application.
- the thickness of the optional second encapsulant layer may range from about 1 to about 120 mils (about 0.026 to about 3.00 mm).
- Preferably the thickness of the optional second encapsulant layer ranges from about 1 to about 40 mils (about 0.026 to about 1.02 mm), or more preferably, from about 1 to about 20 mils (about 0.026 to about 0.51 mm).
- the first and optional second encapsulant layers comprised in the solar cell module of the present invention may have smooth or roughened surfaces.
- the encapsulant layers have roughened surfaces to facilitate the de-airing of the laminates through the laminate process.
- the efficiency of the solar cell module is related to the appearance and transparency of the transparent front-sheet portion of the solar cell laminates and is an important feature in assessing the desirability of using the laminates.
- the front-sheet portion of the solar cell laminate includes the top incident layer, the solar cell layer (voltage-generating solar cell) and the encapsulant layer and any other layers laminated between the incident layer and the solar cell layer.
- One factor affecting the appearance of the front-sheet portion of the solar cell laminates is whether the laminate includes trapped air or air bubbles between the encapsulant layer and the rear surface of the incident layer, or between the encapsulant layer and the light-receiving surface of the solar cell layer. It is desirable to remove air in an efficient manner during the lamination process. Providing channels for the escape of air and removing air during lamination is a known method for obtaining laminates with acceptable appearance.
- This can be effected by mechanically embossing or by melt fracture during extrusion followed by quenching so that the roughness is retained during handling. Retention of the surface roughness is preferable in the practice of the present invention to facilitate effective de-airing of the entrapped air during laminate preparation.
- the width of the channels may range from about 30 to about 300 ⁇ m, or preferably, from about 40 to about 250 ⁇ m, or more preferably, from about 50 to about 200 ⁇ m.
- the surface channels may be spaced from about 0.1 to about 1 mm apart, or preferably, from about 0.1 to about 0.9 mm apart, or more preferably, from about 0.15 to about 0.85 mm apart.
- Rz Surface roughness, Rz, measurements from single-trace profilometer measurements can be adequate in characterizing the average peak height of a surface with roughness peaks and valleys that are nearly randomly distributed.
- a single trace profilometer may not be sufficient in characterizing the texture of a surface that has certain regularities, particularly straight lines. In characterizing such surfaces, if care is taken such that the stylus does not ride in a groove or on a plateau, the Rz thus obtained can still be a valid indication of the surface roughness.
- Other surface parameters, such as the mean spacing (R Sm) may not be accurate because they depend on the actual path traversed. Parameters like R Sm can change depending on the angle the traversed path makes with the grooves.
- ARp is the distance between the highest point in the roughness profile over an area to the plane if all the material constituting the roughness is melted down.
- ARt is the difference in elevation between the highest peak and the lowest valley in the roughness profile over the area measured.
- the surface pattern of the ionomer and/or other polymeric surface layers of the multilayer encapsulant layer 10 are characterized by AR t less than 32 ⁇ m, and the ratio of ARp to AR t , also defined in ASME B46.1-1, may be between 0.42 and 0.62, or preferably, between 0.52 and 0.62.
- the ionomer and/or other polymeric surface layers of the multilayer encapsulant layer 10 may also have area kurtosis of less than about 5.
- the present invention can be suitably practiced with any of the surface patterns described above.
- the surface pattern is preferably an embossed pattern.
- the channel depth may range from about 2 to about 80 ⁇ m, or preferably, from about 2 to about 25 ⁇ m, or more preferably, from about 12 to about 20 ⁇ m, or most preferably, from about 14 to about 20 ⁇ m.
- the depth may be selected so that the regular channels provide suitable paths for air to escape during the lamination process. It is desirable therefore that the depth be sufficiently deep that the air pathways are not cut off prematurely during the heating stage of the lamination process, leading to trapped air in the laminate when it cools.
- the encapsulant layers can be embossed on one or both sides.
- the embossing pattern and/or the depth thereof can be asymmetric with respect to the two sides of the multilayer encapsulant layer. That is, the embossed patterns can be the same or different, as can be the depth of the pattern on either side of the multilayer encapsulant layers.
- the surface layers comprising ionomers and/or other polymeric compositions has an embossed pattern wherein the depth of the pattern on each side is in the range of from about 12 to about 20 ⁇ m.
- embossed pattern on one side of the multilayer encapsulant layer 10 that is orthogonal to the edges of layer, while the identical embossed pattern on the opposite side of the multilayer encapsulant layer 10 is slanted at some angle that is greater than or less than 90° to the edges. Offsetting the patterns in this manner can eliminate an undesirable optical effect in the layers.
- a surface pattern can be applied using a tool that imparts a pattern wherein the pattern requires less energy to obtain a flattened surface than conventional patterns.
- the energy required to obtain a smooth or flattened surface can vary depending upon the surface topography, as well as the type of material being flattened.
- an encapsulant layer having a surface roughness that allows for high-efficiency de-airing but with less energy for compression (or at a controlled and desired level tailored for the pre-press/de-airing process) is obtained.
- a surface pattern used in the present invention comprises projections upward from the base surface as well as voids, or depressions, in the encapsulant layer surface. Such projections and depressions would be of similar or the same volume, and located in close proximity to other such projections and voids on the encapsulant layer surface.
- the projections and depressions may be located such that heating and compressing the encapsulant layer surface results in more localized flow of the thermoplastic material from an area of higher thermoplastic mass (that is, a projection) to a void area (that is, depression), wherein such voids would be filled with the mass from a local projection, resulting in the encapsulant layer surface being flattened.
- Localized flow of the thermoplastic resin material to obtain a flattened surface would require less of an energy investment than a more conventional pattern, which requires flattening of a surface by effecting mass flow of thermoplastic material across the entire surface of the encapsulant layer.
- the main feature is the ability for the pattern to be flattened with relative ease as compared with the conventional art.
- the surface pattern may be applied to the encapsulant layer through common art processes.
- the extruded encapsulant layer may be passed over a specially prepared surface of a die roll positioned in close proximity to the exit of the die which imparts the desired surface characteristics to one side of the molten polymer.
- the encapsulant layer formed of polymer cast thereon will have a rough surface on the side which contacts the roll which generally conforms respectively to the valleys and peaks of the roll surface.
- Such die rolls are disclosed in, for example, U.S. Pat. No. 4,035,549. As is known, this rough surface is only temporary and particularly functions to facilitate de-airing during laminating after which it is melted smooth from the elevated temperature and pressure associated with autoclaving and other lamination processes.
- Solar cells are commonly available on an ever increasing variety as the technology evolves and is optimized. Within the present invention, a solar cell is meant to include any article which can convert light into electrical energy.
- Typical art examples of the various forms of solar cells include, for example, single crystal silicon solar cells, polycrystal silicon solar cells, microcrystal silicon solar cells, amorphous silicon based solar cells, copper indium selenide solar cells, compound semiconductor solar cells, dye sensitized solar cells, and the like.
- the most common types of solar cells include multi-crystalline solar cells, thin film solar cells, compound semiconductor solar cells and amorphous silicon solar cells due to relatively low cost manufacturing ease for large scale solar cells.
- Thin film solar cells are typically produced by depositing several thin film layers onto a substrate, such as glass or a flexible film, with the layers being patterned so as to form a plurality of individual cells which are electrically interconnected to produce a suitable voltage output.
- the substrate may serve as the rear surface or as a front window for the solar cell module.
- thin film solar cells are disclosed in U.S. Pat. Nos. 5,512,107; 5,948,176; 5,994,163; 6,040,521; 6,137,048; and 6,258,620.
- Examples of thin film solar cell modules are those that comprise cadmium telluride or CIGS, (Cu(In—Ga)(SeS)2), thin film cells.
- the solar cell module of the present invention may further comprise one or more sheet layers or film layers to serve as the incident layer, the back-sheet layer, and other additional layers.
- the sheet layers, such as incident and back-sheet layers, used herein may be glass or plastic sheets, such as, polycarbonate, acrylics, polyacrylate, cyclic polyolefins, such as ethylene norbornene polymers, metallocene-catalyzed polystyrene, polyamides, polyesters, fluoropolymers and the like and combinations thereof, or metal sheets, such as aluminum, steel, galvanized steel, and ceramic plates. Glass may serve as the incident layer of the solar cell laminate and the supportive back-sheet of the solar cell module may be derived from glass, rigid plastic sheets or metal sheets.
- glass is meant to include not only window glass, plate glass, silicate glass, sheet glass, low iron glass, tempered glass, tempered CeO-free glass, and float glass, but also includes colored glass, specialty glass which includes ingredients to control, for example, solar heating, coated glass with, for example, sputtered metals, such as silver or indium tin oxide, for solar control purposes, E-glass, Toroglass, Solex® glass (a product of Solutia) and the like.
- specialty glasses are disclosed in, for example, U.S. Pat. Nos. 4,615,989; 5,173,212; 5,264,286; 6,150,028; 6,340,646; 6,461,736; and 6,468,934.
- the type of glass to be selected for a particular laminate depends on the intended use.
- the film layers, such as incident, back-sheet, and other layers, used herein may be metal, such as aluminum foil, or polymeric.
- Preferable polymeric film materials include poly(ethylene terephthalate), polycarbonate, polypropylene, polyethylene, polypropylene, cyclic polyloefins, norbornene polymers, polystyrene, syndiotactic polystyrene, styrene-acrylate copolymers, acrylonitrile-styrene copolymers, poly(ethylene naphthalate), polyethersulfone, polysulfone, nylons, poly(urethanes), acrylics, cellulose acetates, cellulose triacetates, cellophane, vinyl chloride polymers, polyvinylidene chloride, vinylidene chloride copolymers, fluoropolymers, polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene, ethylene-
- the polymeric film is bi-axially oriented poly(ethylene terephthalate) (PET) film, aluminum foil, or a fluoropolymer film, such as Tedlar® or Tefzel® films, which are commercial products of the E.I. du Pont de Nemours and Company.
- PET poly(ethylene terephthalate)
- the polymeric film used herein may also be a multi-layer laminate material, such as a fluoropolymer/polyester/fluoropolymer (e.g., Tedlar®/Polyester/Tedlar®) laminate material or a fluoropolymer/polyester/EVA laminate material.
- the thickness of the polymeric film is not critical and may be varied depending on the particular application. Generally, the thickness of the polymeric film will range from about 0.1 to about 10 mils (about 0.003 to about 0.26 mm). The polymeric film thickness may be preferably within the range of about 1 and about 4 mil (about 0.025 and about 0.1 mm).
- the polymeric film is preferably sufficiently stress-relieved and shrink-stable under the coating and lamination processes.
- the polymeric film is heat stabilized to provide low shrinkage characteristics when subjected to elevated temperatures (i.e. less than 2% shrinkage in both directions after 30 min at 150°).
- the films used herein may serve as the incident layer 16 (such as the fluoropolymer or poly(ethylene terephthalate) film) or the back-sheet 18 (such as the fluoropolymer, aluminum foil, or poly(ethylene terephthalate) film).
- the films may also be included in the present solar cell module 20 as dielectric layers or a barrier layers, such as oxygen or moisture barrier layers.
- a layer of non-woven glass fiber may be included in the present solar cell laminate 20 to facilitate de-airing during the lamination process or to serve as a reinforcement for the encapsulant layer(s).
- the use of such scrim layers within solar cell laminates is disclosed within, for example, U.S. Pat. Nos. 5,583,057; 6,075,202; 6,204,443; 6,320,115; 6,323,416; and European Patent No. 0 769 818.
- one or both surfaces of the solar cell laminate layers may be treated to enhance the adhesion to other laminate layers.
- This treatment may take any form known within the art, including adhesives, primers, such as silanes, flame treatments, such as disclosed within U.S. Pat. Nos. 2,632,921; 2,648,097; 2,683,894; and 2,704,382, plasma treatments, such as disclosed within U.S. Pat. No.
- a thin layer of carbon may be deposited on one or both surfaces of the polymeric film through vacuum sputtering as disclosed in U.S. Pat. No. 4,865,711.
- a hydroxy-acrylic hydrosol primer coating that may serve as an adhesion-promoting primer for poly(ethylene terephthalate) films.
- the adhesive layer may take the form of a coating.
- the thickness of the adhesive/primer coating may be less than 1 mil, or preferably, less than 0.5 mil, or more preferably, less than 0.1 mil.
- the adhesive may be any adhesive or primer known within the art.
- adhesives and primers which may be useful in the present invention include, but are not limited to, gamma-chloropropylmethoxysilane, vinyltrichlorosilane, vinyltriethoxysilane, vinyltris(beta-methoxyethoxy)silane, gamma-methacryloxypropyltrimethoxysilane, beta-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, gammaglycidoxypropyltrimethoxysilane, vinyl-triacetoxysilane, gamma-mercaptopropyltrimethoxysilane, gamma-aminopropyltriethoxysilane, N-beta-(aminoethyl)-gamma-aminopropyl-trimethoxysilane, glue, gelatine, caesin, starch, cellulose esters, aliphatic polyesters, poly(
- the adhesive or primer is a silane that incorporates an amine function.
- silanes include, but are not limited to, gamma-aminopropyltriethoxysilane, N-beta-(aminoethyl)-gamma-aminopropyl-trimethoxysilane, and the like and mixtures thereof.
- Commercial examples of such materials include, for example A-1100® silane, (from the Silquest Company, formerly from the Union Carbide Company, believed to be gamma-aminopropyltrimethoxysilane) and Z6020® silane, (from the Dow Corning Corp.).
- the adhesives may be applied through melt processes or through solution, emulsion, dispersion, and the like, coating processes.
- One of ordinary skill in the art will be able to identify appropriate process parameters based on the composition and process used for the coating formation.
- the above process conditions and parameters for making coatings by any method in the art are easily determined by a skilled artisan for any given composition and desired application.
- the adhesive or primer composition can be cast, sprayed, air knifed, brushed, rolled, poured or printed or the like onto the surface.
- the adhesive or primer is diluted into a liquid medium prior to application to provide uniform coverage over the surface.
- the liquid media may function as a solvent for the adhesive or primer to form solutions or may function as a non-solvent for the adhesive or primer to form dispersions or emulsions.
- Adhesive coatings may also be applied by spraying the molten, atomized adhesive or primer composition onto the surface. Such processes are disclosed within the art for wax coatings in, for example, U.S. Pat. Nos. 5,078,313; 5,281,446; and 5,456,754.
- specific solar cell laminate constructions include, but are not limited to, glass/encapsulant layer of the present invention/solar cell/encapsulant layer of the present invention/glass; glass/encapsulant layer of the present invention/solar cell/encapsulant layer of the present invention/Tedlar® film; Tedlar® film/encapsulant layer of the present invention/solar cell/encapsulant layer of the present invention/glass; Tedlar® film/encapsulant layer of the present invention/solar cell/encapsulant layer of the present invention/Tedlar® film; glass/encapsulant layer of the present invention/solar cell/encapsulant layer of the present invention/PET film; Tedlar® film/encapsulant layer of the present invention/solar cell/encapsulant layer of the present invention/PET film; glass/encapsulant layer of the present invention/solar cell/encapsulant layer of the present invention/barrier coated film/encapsulant layer of the present invention/glass; glass/i
- the present invention is a process of manufacturing a solar cell module or laminate described above.
- the solar cell laminates of the present invention may be produced through autoclave and non-autoclave processes, as described below.
- the solar cell constructs described above may be laid up in a vacuum lamination press and laminated together under vacuum with heat and standard atmospheric or elevated pressure
- the solar cell laminates may be formed by conventional autoclave processes known within the art.
- a glass sheet, a first encapsulant layer disclosed herein, a solar cell, an optional second encapsulant layer and Tedlar® film, and a cover glass sheet are laminated together under heat and pressure and a vacuum (for example, in the range of about 27-28 inches (689-711 mm) Hg) to remove air.
- a vacuum for example, in the range of about 27-28 inches (689-711 mm) Hg
- the glass sheet has been washed and dried.
- a typical glass type is 90 mil thick annealed low iron glass.
- the laminate assembly of the present invention is placed into a bag capable of sustaining a vacuum (“a vacuum bag”), drawing the air out of the bag using a vacuum line or other means of pulling a vacuum on the bag, sealing the bag while maintaining the vacuum, placing the sealed bag in an autoclave at a temperature of about 130° C. to about 180° C., at a pressure of about 200 psi (15 bars) for from about 10 to about 50 minutes.
- a vacuum bag a bag capable of sustaining a vacuum
- a vacuum bag drawing the air out of the bag using a vacuum line or other means of pulling a vacuum on the bag
- sealing the bag while maintaining the vacuum
- placing the sealed bag in an autoclave at a temperature of about 130° C. to about 180° C., at a pressure of about 200 psi (15 bars) for from about 10 to about 50 minutes.
- the bag is autoclaved at a temperature of about 120° C. to about 160° C. for 20 to about 45 minutes, or more preferably, at a temperature of
- any air trapped within the laminate assembly may be removed through a nip roll process.
- the laminate assembly may be heated in an oven at a temperature of about 80° C. to about 120° C., or preferably, at a temperature of between about 90° C. and about 100° C., for about 30 minutes. Thereafter, the heated laminate assembly is passed through a set of nip rolls so that the air in the void spaces between the solar cell outside layers, the solar cell and the encapsulant layers may be squeezed out, and the edge of the assembly sealed.
- This process may provide the final solar cell laminate or may provide what is referred to as a pre-press assembly, depending on the materials of construction and the exact conditions utilized.
- the pre-press assembly may then be placed in an air autoclave where the temperature is raised to about 120° C. to about 160° C., or preferably, between about 135° C. and about 160° C., and pressure to between about 100 psig and about 300 psig, or preferably, about 200 psig (14.3 bar). These conditions are maintained for about 15 minutes to about 1 hour, or preferably, about 20 to about 50 minutes, after which, the air is cooled while no more air is added to the autoclave. After about 20 minutes of cooling, the excess air pressure is vented and the solar cell laminates are removed from the autoclave. This should not be considered limiting. Essentially any lamination process known within the art may be used with the encapsulants of the present invention.
- the laminates of the present invention may also be produced through non-autoclave processes.
- non-autoclave processes are disclosed, for example, within U.S. Pat. Nos. 3,234,062; 3,852,136; 4,341,576; 4,385,951; 4,398,979; 5,536,347; 5,853,516; 6,342,116; and 5,415,909, US Patent Application No. 2004/0182493, European Patent No. EP 1 235 683 B1, and PCT Patent Application Nos. WO 91/01880 and WO 03/057478 A1.
- the non-autoclave processes include heating the laminate assembly or the pre-press assembly and the application of vacuum, pressure or both.
- the pre-press may be successively passed through heating ovens and nip rolls.
- edges of the solar cell laminate may be sealed to reduce moisture and air intrusion and their potentially degradation effect on the efficiency and lifetime of the solar cell by any means disclosed within the art.
- General art edge seal materials include, but are not limited to, butyl rubber, polysulfide, silicone, polyurethane, polypropylene elastomers, polystyrene elastomers, block elastomers, styrene-ethylene-butylene-styrene (SEBS), and the like.
- Compressive Shear Strength was determined through the method disclosed within U.S. Pat. No. 6,599,630, the entire disclosure of which is enclosed herein by reference. Essentially, the compressive shear strength of a laminate was determined using the method detailed herein. Six 1 inch by 1 inch (25 mm by 25 mm) chips are sawed from the laminate. The chips are conditioned in a room controlled at a temperature of 23° C. ⁇ 2° C. and a relative humidity of 50% ⁇ 1% for one hour prior to testing. The compressive shear strength of the chip was determined using jig shown in FIG. 1 of U.S. Pat. No. 6,599,630.
- the chip was placed on the cut-out on the lower half of the jig, and the upper half was then placed on top of the chip.
- a cross-head was lowered at the rate of 0.1 inch per min (2.5 mm per min) until it contacts the upper piece of the device. As the cross-head continues to travel downward, one piece of glass of the chip begins to slides relative to the other.
- the compressive shear strength of the chip was the shear stress required to cause adhesive failure. The precision of this test is such that one standard deviation is typically 6% of the average result of six chips.
- the pummel adhesion of the samples was measured by the following procedure. For each test, a portion of the laminate, typically having dimensions of 15 by 30 cm, was subjected to the pummel test. First, this portion of the laminate was cooled for 8 hours at a temperature of ⁇ 18° C. It was then held in a pummel testing machine at a 45 angle to a supporting table. A force was evenly applied over a 10 by 15 cm area of the sample with a 450 g flathead hammer at a predetermined rate until the glass became pulverized. Once the glass pulverized, the glass remaining glued to the polymeric interlayer was compared with a list of formal standards. These standards comprise a scale ranging from 0 to 10 and are given as follows:
- the pummel test was performed on both surfaces of the laminated glass and a pummel value recorded for each surface tested. In general, good impact performance is attained at a pummel adhesion of greater than 5 for each surface, i.e., 5+5.
- the polymeric sheets used in Examples 1-42 are extruded as follows.
- the polymeric resins were fed into a 1.5 inch diameter Killion extruder with a temperature profile as follows:
- Extruder Temperature Zone (° C.) Feed Ambient Zone 1 160 Zone 2 200 Zone 3 200 Block 210 Die 210
- Polymer throughput was controlled by adjusting the screw speed to 70 rpm.
- the extruder fed a 14-inch “coathanger” die with a nominal gap of 0.038 inch.
- the as cast sheet was fed into a three roll stack consisting of a 6-inch diameter rubber nip roll covered with a Teflon® release film and two 12-inch diameter polished chrome chill rolls held at a temperature of between 10° C. and 15° C.
- the nominally 0.030 inch thick sheet was then wound onto cardboard cores at a rate of 3.3 feet/min.
- the glass laminates in Examples 1-42, 55-63, 105-112, 126-133, and 155-170 were produced in the following manner.
- the polymeric sheets Prior to lamination, the polymeric sheets were either “not conditioned”, which means that the polymeric sheets were subject to lamination as received, or conditioned, which means that the polymeric sheets were allowed to sit in an environment with a particular relative humidity (RH) for five days at a temperature of 72° F.
- RH relative humidity
- a pre-press assembly of an annealed float glass sheet layer, a polymeric sheet layer, a thin Teflon® film layer, and an annealed float cover glass layer were laid up. The pre-press assembly was then placed into a vacuum bag and heated to 90° C.-100° C.
- the pre-press assembly was then subjected to autoclaving at 135° C. for 30 min in an air autoclave to a pressure of 200 psig (14.3 bar). The air is then cooled while no more air is added to the autoclave. After 20 min of cooling and the air temperature reaches less than about 50° C., the excess pressure was vented, the assembly removed from the autoclave, and the Teflon® film and cover glass sheet removed to provide the desired laminate.
- the embossed sheet structures used in Examples 43-54, 113-117, and 134-138 were prepared on a 24-inch wide Sano multilayer coextrusion line equipped with embossing rolls utilizing common art sheet formation processes. This essentially entailed the use of an extrusion line consisting of a twin-screw extruder with a sheet die feeding melt into a calendar roll stack.
- the calendar rolls have an embossed surface pattern engraved into the metal surface which imparts to varying degrees a reverse image of the surface texture onto the polymer melt as it passes between and around the textured rolls. Both surfaces of the sheet were embossed with a pattern with the following characteristics:
- Rz can be expressed in microns by a 10-point average roughness in accordance with ISO-R468 of the International Organization for Standardization. Roughness measurements were made using a stylus-type profilometer (Surfcom 1500A manufactured by Tokyo Seimitsu Kabushiki Kaisha of Tokyo, Japan) as described in ASME B46.1-1995 using a trace length of 26 mm. ARp and ARt, and the area kurtosis were measured by tracing the roughness over a 5.6 mm ⁇ 5.6 mm area in 201 steps using the Perthometer Concept system manufactured by Mahr GmbH, Gottingen, Germany. The sheets typically have an Rz in the range of from about 15 to about 25 micron.
- the laminate structures comprising embossed sheet structures disclosed in Examples 43-54, 64-104, 118-125, 139-154 and Comparative Example CE1 were prepared as follows. Each layers of the laminate structures were stacked (laid up) to form the pre-laminate structures. The pre-laminate structures were then placed within a vacuum bag, which was sealed and placed into an oven at room temperature (25° C. ⁇ 5° C.). A vacuum was then applied to remove the air from the vacuum bag. While maintaining the application of the vacuum, the vacuum bag was heated at 135° C. for 1 hour. The vacuum was then discontinued and the vacuum bag removed from the oven, allowed to cool to room temperature (25° C. ⁇ 5° C.). The laminate structures were therefore produced and removed from the vacuum bag.
- the polymeric plaques in Examples 55-60, 62, and 63 were prepared through compression molding on a Carver Melt Press. The compression molding was conducted at a temperature of 190° C. and a pressure of 20,000 psi. The plaques were then cooled to room temperature over approximately 30 min and packaged in moisture barrier packaging.
- Examples 59, 60, and 62 a variety of polymeric compositions were dry blended and compounded on a 1 inch Killion single screw extruder, which had a melt temperature of approximately 200° C. and a rate of 2.5 pounds per hour.
- the screw speed ranged from 47 to 70 RPM and the rear zone temperature ranged from 120 to 170° C., depending on the composition.
- the adapter pressure ranged from 400 to 800 psi and power consumption ranged from about 2.5 to 3 amps.
- the typical extruder barrel temperature profile was as follows:
- Rear (Feed Hopper) Zone 120 to 170° C.
- Mid Zone 199 to 203° C.
- Front Zone 200 to 202° C.
- Adapter 200 to 201° C.
- a single strand was passed through a water bath and pelletized to form small pellets.
- the pellets were purged with nitrogen overnight at room temperature and then sealed in a moisture barrier package.
- the ionomer sheets comprising one of the ionomers listed in Table 1 were produced by extrusion cast.
- Examples 1-21 were glass laminates of a layer of annealed float glass sheet (6 inch by 12 inch (152 mm by 305 mm) by 2.5 mm thick) and a layer of one of the ionomer sheets listed in Table 1 (6 inch by 12 inch by 30 mil (0.76 mm) thick), wherein the tin sides of the glass layers were in contact with the sheets.
- These glass laminates were then subjected to 180-degree peel strength adhesion testing using an INSTRUMENTORS, Inc., Model SP-102B-3M90 SLIP/PEEL Tester at a rate of 1 inch per minute. The results are noted below within Table 1, wherein “ND” denotes “not determined”.
- Ionomer 1 was prepared from the corresponding poly(ethylene-co-methacrylic acid) having a MI of 60 g/10 min (190° C., ISO 1133, ASTM D1238).
- Ionomer 2 was a poly(ethylene-co-methacrylic acid) containing 21.5 wt % of methacrylic acid that is 34.5% neutralized with sodium ion and having a MI of 0.5 g/10 min (190° C., ISO 1133, ASTM D1238).
- Ionomer 2 was prepared from the corresponding poly(ethylene-co-methacrylic acid) having a MI of 29 g/10 min (190° C., ISO 1133, ASTM D1238).
- Ionomer 3 was a poly(ethylene-co-methacrylic acid) containing 21.5 wt % of methacrylic acid that is 32.5% neutralized with sodium ion and having a MI of 0.6 g/10 min (190° C., ISO 1133, ASTM D1238). Ionomer 3 was prepared from the corresponding poly(ethylene-co-methacrylic acid) having a MI of 29 g/10 min (190° C., ISO 1133, ASTM D1238).
- Ionomer 4 was a poly(ethylene-co-methacrylic acid) containing 21.5 wt % of methacrylic acid that is 31.1% neutralized with sodium ion and having a MI of 0.8 g/10 min (190° C., ISO 1133, ASTM D1238). Ionomer 4 was prepared from the corresponding poly(ethylene-co-methacrylic acid) having a MI of 29 g/10 min (190° C., ISO 1133, ASTM D1238).
- Ionomer 5 was a poly(ethylene-co-methacrylic acid) containing 21.5 wt % of methacrylic acid that is 29% neutralized with sodium ion and having a MI of 0.9 g/10 min (190° C., ISO 1133, ASTM D1238). Ionomer 5 was prepared from the corresponding poly(ethylene-co-methacrylic acid) having a MI of 29 g/10 min (190° C., ISO 1133, ASTM D1238).
- Ionomer 6 was a poly(ethylene-co-methacrylic acid) containing 21.5 wt % of methacrylic acid that is 24% neutralized with sodium ion and having a MI of 1.5 g/10 min (190° C., ISO 1133, ASTM D1238). Ionomer 6 was prepared from the corresponding poly(ethylene-co-methacrylic acid) having a MI of 29 g/10 min (190° C., ISO 1133, ASTM D1238).
- Ionomer 7 was a poly(ethylene-co-methacrylic acid) containing 21.5 wt % of methacrylic acid that is 22.4% neutralized with sodium ion and having a MI of 1.8 g/10 min (190° C., ISO 1133, ASTM D1238). Ionomer 7 was prepared from the corresponding poly(ethylene-co-methacrylic acid) having a MI of 29 g/10 min (190° C., ISO 1133, ASTM D1238).
- Ionomer 8 was a poly(ethylene-co-methacrylic acid) containing 21.5 wt % of methacrylic acid that is 22.1% neutralized with sodium ion and having a MI of 2.2 g/10 min (190° C., ISO 1133, ASTM D1238). Ionomer 8 was prepared from the corresponding poly(ethylene-co-methacrylic acid) having a MI of 29 g/10 min (190° C., ISO 1133, ASTM D1238).
- Ionomer 9 was a poly(ethylene-co-methacrylic acid) containing 21.5 wt % of methacrylic acid that is 17.9% neutralized with sodium ion and having a MI of 2.7 g/10 min (190° C., ISO 1133, ASTM D1238). Ionomer 9 was prepared from the corresponding poly(ethylene-co-methacrylic acid) having a MI of 29 g/10 min (190° C., ISO 1133, ASTM D1238).
- Ionomer 10 was a poly(ethylene-co-methacrylic acid) containing 21.5 wt % of methacrylic acid that is 14.6% neutralized with sodium ion and having a MI of 4.16 g/10 min (190° C., ISO 1133, ASTM D1238). Ionomer 10 was prepared from the corresponding poly(ethylene-co-methacrylic acid) having a MI of 29 g/10 min (190° C., ISO 1133, ASTM D1238).
- Ionomer 11 was a poly(ethylene-co-methacrylic acid) containing 22.1 wt % of methacrylic acid that is 41.1% neutralized with sodium ion and having a MI of 0.73 g/10 min (190° C., ISO 1133, ASTM D1238). Ionomer 11 was prepared from the corresponding poly(ethylene-co-methacrylic acid) having a MI of 60 g/10 min (190° C., ISO 1133, ASTM D1238).
- Ionomer 12 was a poly(ethylene-co-methacrylic acid) containing 22.1 wt % of methacrylic acid that is 37.3% neutralized with sodium ion and having a MI of 1.1 g/10 min (190° C., ISO 1133, ASTM D1238). Ionomer 12 was prepared from the corresponding poly(ethylene-co-methacrylic acid) having a MI of 60 g/10 min (190° C., ISO 1133, ASTM D1238).
- Ionomer 13 was a poly(ethylene-co-methacrylic acid) containing 22.1 wt % of methacrylic acid that is 30.3% neutralized with sodium ion and having a MI of 2.26 g/10 min (190° C., ISO 1133, ASTM D1238). Ionomer 13 was prepared from the corresponding poly(ethylene-co-methacrylic acid) having a MI of 60 g/10 min (190° C., ISO 1133, ASTM D1238).
- Ionomer 14 was a poly(ethylene-co-methacrylic acid) containing 22.1 wt % of methacrylic acid that is 26.0% neutralized with sodium ion and having a MI of 3.34 g/10 min (190° C., ISO 1133, ASTM D1238). Ionomer 14 was prepared from the corresponding poly(ethylene-co-methacrylic acid) having a MI of 60 g/10 min (190° C., ISO 1133, ASTM D1238).
- Ionomer 15 was a poly(ethylene-co-methacrylic acid) containing 22.1 wt % of methacrylic acid that is 24.8% neutralized with sodium ion and having a MI of 3.95 g/10 min (190° C., ISO 1133, ASTM D1238). Ionomer 15 was prepared from the corresponding poly(ethylene-co-methacrylic acid) having a MI of 60 g/10 min (190° C., ISO 1133, ASTM D1238).
- Ionomer 16 was a poly(ethylene-co-methacrylic acid) containing 19.0 wt % of methacrylic acid that is 37.0% neutralized with zinc ion and having a MI of 1.8 g/10 min (190° C., ISO 1133, ASTM D1238). Ionomer 16 was prepared from the corresponding poly(ethylene-co-methacrylic acid) having a MI of 60 g/10 min (190° C., ISO 1133, ASTM D1238).
- Ionomer 17 was a poly(ethylene-co-methacrylic acid) containing 19.0 wt % of methacrylic acid that is 36.0% neutralized with zinc ion and having a MI of 1.3 g/10 min (190° C., ISO 1133, ASTM D1238). Ionomer 17 was prepared from the corresponding poly(ethylene-co-methacrylic acid) having a MI of 60 g/10 min (190° C., ISO 1133, ASTM D1238).
- Ionomer 18 was a poly(ethylene-co-methacrylic acid) containing 19.0 wt % of methacrylic acid that is 32.0% neutralized with zinc ion and having a MI of 3.1 g/10 min (190° C., ISO 1133, ASTM D1238). Ionomer 18 was prepared from the corresponding poly(ethylene-co-methacrylic acid) having a MI of 60 g/10 min (190° C., ISO 1133, ASTM D1238).
- Ionomer 19 was a poly(ethylene-co-methacrylic acid) containing 20.0 wt % of methacrylic acid that is 34.0% neutralized with zinc ion and having a MI of 1.0 g/10 min (190° C., ISO 1133, ASTM D1238). Ionomer 19 was prepared from the corresponding poly(ethylene-co-methacrylic acid) having a MI of 60 g/10 min (190° C., ISO 1133, ASTM D1238).
- Ionomer 20 was a poly(ethylene-co-methacrylic acid) containing 21.5 wt % of methacrylic acid that is 32.0% neutralized with zinc ion and having a MI of 1.3 g/10 min (190° C., ISO 1133, ASTM D1238). Ionomer 20 was prepared from the corresponding poly(ethylene-co-methacrylic acid) having a MI of 60 g/10 min (190° C., ISO 1133, ASTM D1238).
- Examples 22-42 were glass laminates similar to those of the Examples 1-21 except that the air sides of the glass sheets were in contact with the ionomer sheets.
- the laminates were also subject to 180-degree peel strength adhesion testing using an INSTRUMENTORS, Inc., Model SP-102B-3M90 SLIP/PEEL Tester at a rate of 1 inch per minute. The results are noted below within Table 2, wherein “ND” denotes “not determined”.
- Examples 43-54 and comparative example CE 1 were tri-layer sheet structures with embossed surface layers (Table 3).
- Ionomer 22 was a poly(ethylene-co-methacrylic acid) containing 19 wt % of methacrylic acid that is 39% neutralized with zinc ion and having a MI of 4 g/10 min (190° C., ISO 1133, ASTM D1238).
- EBA 1 was a poly(ethylene-co-n-butyl acrylate) containing 27 wt % of n-butyl acrylate and having a MI of 4 g/10 min (190° C., ISO 1133, ASTM D1238).
- a variety of laminate structures (4 inch by 4 inch (102 mm by 102 mm)) comprising the embossed sheet structures listed in Table 3 were produced to demonstrate various solar cell structures.
- the laminate structures included “glass/tri-layer sheet structure/glass”, “fluoropolymer film/tri-layer sheet structure/glass”, “aluminum sheet/tri-layer sheet structure/glass”, “aluminum film/tri-layer sheet structure” and “glass/tri-layer sheet structure”.
- the glass used was 1 ⁇ 8 inch (3.2 mm) thick Starphire® glass sheet (a commercial product of the PPG Corporation); the fluoropolymer film was 1.5 mil (0.38 mm) thick corona surface treated Tedlar® grade WH15BL3 (a product of the DuPont Company); and the aluminum sheet was 1 ⁇ 8 inch (3.2 mm) thick and was 5052 alloyed with 2.5 wt % magnesium and conformed to Federal specification QQ-A-250/8 and ASTM B209.
- a polymeric plaque (6 inch by 7 inch (152 mm by 178 mm) by 40 mil (1.02 mm) thick) were produced through compression molding from a copoly(ethylene-co-methacrylic acid) containing 21.4 wt % of methacrylic acid that was 31% neutralized with sodium.
- the glass laminate of Example 55 had the structure of glass/polymeric plaque/glass, wherein the two glass layer were made of 6 inch by 7 inch by 2.5 mm thick clear annealed float glass plates and the tin sides of the glass plates were in contact with the polymeric plaque. It was found to have a compressive shear strength of 5095 psi and a pummel adhesion at an average of 7.
- a polymeric plaque (6 inch by 7 inch (152 mm by 178 mm) by 40 mil (1.02 mm) thick) were produced through compression molding from a copoly(ethylene-co-methacrylic acid) containing 21.4 wt % of methacrylic acid that was 32% neutralized with zinc.
- the glass laminate of Example 56 had the structure of glass/polymeric plaque/glass, wherein the two glass layer were made of 6 inch by 7 inch by 2.5 mm thick clear annealed float glass plates and the tin sides of the glass plates were in contact with the polymeric plaque. It was found to have a compressive shear strength of 5338 psi and a pummel adhesion at an average of 8.
- a polymeric plaque (6 inch by 7 inch (152 mm by 178 mm) by 40 mil (1.02 mm) thick) were produced through compression molding from a copoly(ethylene-co-methacrylic acid) containing 21.4 wt % of methacrylic acid that was 31% neutralized with sodium.
- the glass laminate of Example 57 had the structure of glass/polymeric plaque/glass, wherein the two glass layer were made of 6 inch by 7 inch by 2.5 mm thick clear annealed float glass plates and the air sides of the glass plates were in contact with the polymeric plaque. It was found to have a compressive shear strength of 4742 psi and a pummel adhesion at an average of 5.
- a polymeric plaque (6 inch by 7 inch (152 mm by 178 mm) by 40 mil (1.02 mm) thick) were produced through compression molding from a copoly(ethylene-co-methacrylic acid) containing 21.4 wt % of methacrylic acid that was 32% neutralized with zinc.
- the glass laminate of Example 58 had the structure of glass/polymeric plaque/glass, wherein the two glass layer were made of 6 inch by 7 inch by 2.5 mm thick clear annealed float glass plates and the air sides of the glass plates were in contact with the polymeric plaque. It was found to have a compressive shear strength of 5027 psi and a pummel adhesion at an average of 8.
- polymeric pellets were prepared from a polymeric composition consisting of 1) 99.60 wt % of poly(ethylene-co-methacrylic acid) which contains 21.4 wt % of methacrylic acid that is 29% neutralized with sodium, 2) 0.30 wt % of Tinuvin® 326 stabilizer, a product of the Ciba Company, which was reported to be 2-(3-tert-butyl-2-hydroxy-5-methylphenyl)-5-chloro-2H-benzotriazole (CAS Number 3896-11-5), and 3) 0.10 wt % of Irganox® 1010 stabilizer, a product of the Ciba Company, which was reported to be pentaerythritol tetrakis(3,5-di-tert-butyl-4-hydroxyhydrocinnamate) (CAS Number 6683-19-8). 6 inch by 7 inch (152 mm by 178 mm) by 25 mil (0.64 mm) thick polymeric plaques were then produced
- Example 59 was a glass laminate of a 12 inch by 12 inch (305 mm by 305 mm) by 2.5 mm thick annealed float glass plate and the polymeric plaque prepared above. It was found to have a 90 degree peel strength of 1.5 lb/inch at a peel rate of 1 inch/min, and a 90 degree peel strength of 1.5 lb/inch at a peel rate of 2 inches/min.
- polymeric pellets were prepared from a polymeric composition consisting of 1) 99.60 wt % of poly(ethylene-co-methacrylic acid) containing 21.4 wt % of methacrylic acid that is 32% neutralized with zinc, 2) 0.30 wt % of Tinuvin® 328 stabilizer, a product of the Ciba Company, which was reported to be 2-(2H-benzotriazol-2-yl)-4,6-di-tert-pentylphenol (CAS Number 25973-55-1), and 3) 0.10 wt % of HP-136® stabilizer, a product of the Ciba Company, which was reported to be 5,7-di-tert-butyl-3-(3,4-di-methylphenyl)-3H-benzofuran-2-one (CAS Number 181314-48-7). 6 inch by 7 inch (152 mm by 178 mm) by 25 mil (0.64 mm) thick polymeric plaques were then produced from these polymeric pellets.
- the glass laminate of Example 60 comprised a 12 inch by 12 inch (305 mm by 305 mm) by 2.5 mm thick annealed float glass plate and the polymeric plaque prepared above. It was found to have a 90 degree peel strength of 1.5 lb/inch at a peel rate of 9.2 inch/min, and a 90 degree peel strength of 10.1 lb/inch at a peel rate of 2 inches/min.
- Example 61 was a glass laminate having the structure of glass/polymeric plaque interlayer/glass, wherein the polymeric plaque interlayer was made of three layers of 2 inch by 2 inch (51 mm ⁇ 51 mm) by 25 mil (0.64 mm) thick plaques prepared from the polymeric composition in Example 60, and the two glass layers were made of two 2 inch by 2 inch by 2.5 mm thick pieces of annealed gloat glass plate.
- polymeric pellets were prepared from a polymeric composition consisting of 1) 99.70 wt % of poly(ethylene-co-methacrylic acid) containing 21.4 wt % of methacrylic acid that is 32% neutralized with zinc and 2) 0.30 wt % of Chimassorb® 944 FD stabilizer, a product of the Ciba Company, which was reported to be poly[[6-[(1,1,3,3-tetramethylbutyl)amino]-s-triazine-2,4-diyl]-[(2,2,6,6-tetramethyl-4-piperidyl)imino]-hexamethylene-[(2,2,6,6-tetramethyl-4-piperidylimino]] (CAS Number 71878-19-8). 6 inch by 7 inch (152 mm by 178 mm) by 25 mil (0.64 mm) thick polymeric plaques were then produced from these polymeric pellets through compression molding.
- Example 62 was a glass laminate between a layer of the polymeric plaque and a layer of 12 inch by 12 inch (305 mm by 305 mm) by 2.5 mm thick annealed float glass plate.
- a 6 inch by 7 inch (152 mm by 178 mm) by 40 mil (1.02 mm) thick polymeric plaque was produced from a copoly(ethylene-co-methacrylic acid) containing 21.4 wt % of methacrylic acid that was 32% neutralized with zinc through compression molding.
- Example 63 was a glass laminate composed of a layer of the polymeric plaque and a layer of 6 inch by 6 inch (152 mm by 152 mm) by 2.5 mm thick annealed float glass plate, wherein the polymeric plaque was conditioned at 5% RH at a temperature of 72° F. overnight prior to lamination and the tin side of the glass plate was in contact with the polymeric plaque.
- Example 63 The glass laminate of Example 63 was then subjected to 90 degree peel strength adhesion testing using an INSTRUMENTORS, Inc., Model SP-102B-3M90 SLIP/PEEL Tester. The laminate was peeled at rates of 1 inch and 2 inches per min. They were found to have a peel adhesion of greater than 30 lbs/in.
- Examples 64-66 are ionomer films produced through a blown film process commonly known within the art.
- Examples 67-70 are 12 inch by 12 inch solar cell laminate structures comprising one of the ionomer films of Examples 64-66.
- a glass cover sheet (3 mm thick) is added to the laminate structure and then removed after the lamination process.
- Example 64 is an aluminum sheet (3.2 mm thick) that is 5052 alloyed with 2.5 wt % of magnesium and conforms to Federal specification QQ-A-250/8 and ASTM B209.
- FPF is a corona surface treated Tedlar ® film grade WH15BL3 (1.5 mil (0.038 mm) thick), a product of the DuPont Corporation.
- Solar Cell 1 is a 10 inch by 10 inch amorphous silicon photovoltaic device comprising a stainless steel substrate (125 ⁇ m thick) with an amorphous silicon semiconductor layer (U.S. Pat. No. 6,093,581, Example 1).
- Solar Cell 2 is a 10 inch by 10 inch copper indium diselenide (CIS) photovoltaic device (U.S. Pat. No. 6,353,042, column 6, line 19).
- Solar Cell 3 is a 10 inch by 10 inch cadmium telluride (CdTe) photovoltaic device (U.S. Pat. No. 6,353,042, column 6, line 49).
- Solar Cell 4 is a silicon solar cell made from a 10 inch by 10 inch polycrystalline EFG-grown wafer (U.S. Pat. No. 6,660,930, column 7, line 61).
- Examples 71-75 are bi-layer film structures produced through a blown film process, as is commonly known within the art.
- EBA 2 is a poly(ethylene-co-n-butyl acrylate) containing 30 wt % of n-butyl acrylate and having a MI of 1 g/10 min (190° C., ISO 1133, ASTM D1238).
- EMA 1 is a poly(ethylene-co-methyl acrylate) containing 30 wt % of methyl acrylate.
- EVA 1 is a formulated composition of poly(ethylene-co-vinyl acetate) containing 32 wt % of vinyl acetate content.
- Examples 76-81 are solar cell laminate structures comprising the bi-layer film structures in Table 7.
- Examples 82-87 tri-layer film structures produced through a blown film process as commonly known within the art.
- Ionomer 6 is a poly(ethylene-co-methacrylic acid) containing 21 wt % of methacrylic acid that is 30% neutralized with zinc ion and having a MI of 1 g/10 min (190° C., ISO 1133, ASTM D1238).
- EEA is a poly(ethylene-co-ethyl acrylate) containing 32 wt % of ethyl acrylate and having a MI of 0.4 g/10 min (190° C., ISO 1133, ASTM D1238).
- EMA 2 is a poly(ethylene-co-methyl acrylate) containing 35 wt % of methyl acrylate and having a MI of 0.7 g/10 min (190° C., ISO 1133, ASTM D1238).
- Examples 88-93 are 12 inch by 12 inch solar cell laminate structures comprising the tri-layer film structures of Examples 82-87.
- Examples 84-96 are monolayer sheet structures having embossed surface layers.
- Examples 97-104 are solar cell laminate structures produced in a manner similar to that is used in preparing the laminate structures in Examples 43-54.
- EBA 3 is a formulated composition based on poly(ethylene-co-butyl acrylate) containing 20 wt % of butyl acrylate based on the weight of the total copolymer in the form of 20 mil thick (0.51 mm) sheet.
- EVA 2 is SC50B, believed to be a formulated composition based on poly(ethylene-co-vinyl acetate) in the form of 20 mil thick (0.51 mm) sheet, (a product of the Hi-Sheet Corporation (formerly Mitsui Chemicals Fabro, Inc.).
- Glass 1 is Starphire ® glass (3.2 mm thick) from the PPG Corporation.
- Glass 2 is a clear annealed float glass plate layer (2.5 mm thick).
- Ionomer 23 is a 90 mil (2.25 mm) thick embossed sheet of a poly(ethylene-co-methacrylic acid) containing 18 wt % of methacrylic acid that is 30% neutralized with zinc ion and having a MI of 1 g/10 min (190° C., ISO 1133, ASTM D1238). Ionomer 23 is prepared from a poly(ethylene-co-methacrylic acid) having a MI of 60 g/10 min.
- PVB is B51V, believed to be a formulated composition based on poly(vinyl butyral) in the form of 20 mil (0.51 mm) thick sheet (a product of the DuPont Corporation.
- Examples 105-112 are solar cell laminate structures prepared in a manner similar to that was used in preparing the glass laminates in Examples 1-42.
- a glass cover sheet (3 mm thick) is added to the laminate structure and then removed after the lamination process.
- Layers 1 and 2 constitute the incident layer of the solar cell laminate and Layers 4 and 5 constitute the back layer of the solar cell laminate.
- Examples 113-117 are bi-layer sheet structures with embossed surface layers.
- Examples 118-125 are solar cell laminate structures produced in a manner similar to that is used in preparing the laminate structures in Examples 43-54.
- the ionomeric surface of the bi-layer sheet is in contact with a glass surface.
- Layers 1 and 2 constitute the incident layer of the solar cell laminate and Layers 4 and 5 constitute the back layer of the solar cell laminate.
- Example Layer 1 Layer 2 Layer 3 Layer 4 Layer 5 118, 126 Glass 1
- Example 113 Solar Cell 1 Example 113 Glass 1 119, 127 Glass 2
- Example 114 Solar Cell 2
- Example 114 Glass 2 120, 128 FPF
- Example 115 Solar Cell 3
- Example 117 Solar Cell 2 EBA 3 ALF 122, 130 Glass 1
- Example 114 Solar Cell 4 EVA 2 ALF 123, 131 FPF
- Example 115 Solar Cell 1 PVB A Glass 3 125, 133 Glass 1
- Example 117 Solar Cell 4 Ionomer 24 Glass 2 Ionomer 24 is a 20 mil (0.51 mm) thick embossed sheet of a poly(ethylene-co-methacrylic acid) containing 22 wt % of methacrylic acid that is 26% neutralized with zinc ion and having a MI of 0.75 g/10 min (190° C., ISO 11
- Ionomer 24 is prepared from a poly(ethylene-co-methacrylic acid) having a MI of 60 g/10 min.
- PVB A is an acoustic poly(vinyl butyral) sheet including 100 parts per hundred (pph) poly(vinyl butyral) with a hydroxyl number of 15 plasticized with 48.5 pph plasticizer tetraethylene glycol diheptanoate prepared similarly to disclosed within WO 2004/039581.
- Examples 126-133 are 12 inch by 12 inch solar cell laminate structures produced in a manner similar to that is used in preparing the solar cell laminates of Examples 105-112. For those laminate structures where it is possible, the ionomeric surface of the bi-layer sheet is in contact with a glass surface. Layers 1 and 2 constitute the incident layer of the solar cell laminate and Layers 4 and 5 constitute the back layer of the solar cell laminate.
- Examples 134-138 are tri-layer film structures with embossed surface layers.
- Examples 139-154 are 12 inch by 12 inch solar cell laminate structures produced in a manner similar to that was used in preparing the laminates in Examples 43-54.
- Layers 1 and 2 constitute the incident layer of the solar cell laminate and
- Layers 4 and 5 constitute the back layer of the solar cell laminate.
- Example 134 Solar Cell 1 Example 134 Glass 1 140, 156 Glass 2
- Example 135 Solar Cell 2
- Example 135 Glass 2 141, 157 Glass 1
- Example 136 Solar Cell 3
- Example 137 Solar Cell 4
- Example 138 Solar Cell 1
- Example 137 Solar Cell 1 PVB
- Example 138 ALF 149, 165 Glass 1 Ionomer 24
- Example 138 Glass 3 150, 166 Glass 1
- Example 137 Solar Cell 4 Ionomer 23 Glass 2 151, 167 Glass 1
- Examples 155-170 are 12 inch by 12 inch solar cell laminate structures produced in a manner similar to that is used in preparing the laminates of in Example 105-112. Layers 1 and 2 constitute the incident layer of the solar cell laminate and Layers 4 and 5 constitute the back layer of the solar cell laminate.
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
- Photovoltaic Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/495,249 US8772624B2 (en) | 2006-07-28 | 2006-07-28 | Solar cell encapsulant layers with enhanced stability and adhesion |
JP2009522792A JP2009545185A (ja) | 2006-07-28 | 2007-07-24 | 高い安定性及び接着性を有する太陽電池封入層 |
KR1020097004193A KR101326430B1 (ko) | 2006-07-28 | 2007-07-24 | 안정성 및 점착성이 향상된 태양 전지 봉지제 층 |
CNA2007800346991A CN101517749A (zh) | 2006-07-28 | 2007-07-24 | 具有增强稳定性和粘合性的太阳能电池封装层 |
EP07836225A EP2047520A2 (fr) | 2006-07-28 | 2007-07-24 | Couches d'encapsulation de cellules solaires présentant une stabilité et un pouvoir adhésif améliorés |
PCT/US2007/016698 WO2008013837A2 (fr) | 2006-07-28 | 2007-07-24 | Couches d'encapsulation de cellules solaires présentant une stabilité et un pouvoir adhésif améliorés |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/495,249 US8772624B2 (en) | 2006-07-28 | 2006-07-28 | Solar cell encapsulant layers with enhanced stability and adhesion |
Publications (2)
Publication Number | Publication Date |
---|---|
US20080023063A1 US20080023063A1 (en) | 2008-01-31 |
US8772624B2 true US8772624B2 (en) | 2014-07-08 |
Family
ID=38982040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/495,249 Active 2030-03-27 US8772624B2 (en) | 2006-07-28 | 2006-07-28 | Solar cell encapsulant layers with enhanced stability and adhesion |
Country Status (6)
Country | Link |
---|---|
US (1) | US8772624B2 (fr) |
EP (1) | EP2047520A2 (fr) |
JP (1) | JP2009545185A (fr) |
KR (1) | KR101326430B1 (fr) |
CN (1) | CN101517749A (fr) |
WO (1) | WO2008013837A2 (fr) |
Families Citing this family (69)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080099064A1 (en) * | 2006-10-27 | 2008-05-01 | Richard Allen Hayes | Solar cells which include the use of high modulus encapsulant sheets |
US20080128018A1 (en) | 2006-12-04 | 2008-06-05 | Richard Allen Hayes | Solar cells which include the use of certain poly(vinyl butyral)/film bilayer encapsulant layers with a low blocking tendency and a simplified process to produce thereof |
US20080196760A1 (en) * | 2007-02-15 | 2008-08-21 | Richard Allen Hayes | Articles such as safety laminates and solar cell modules containing high melt flow acid copolymer compositions |
US8691372B2 (en) * | 2007-02-15 | 2014-04-08 | E I Du Pont De Nemours And Company | Articles comprising high melt flow ionomeric compositions |
DE102007011403A1 (de) * | 2007-03-08 | 2008-09-11 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Frontseitig serienverschaltetes Solarmodul |
JP2010525601A (ja) * | 2007-04-26 | 2010-07-22 | システム ソチエタ ペル アツィオニ | セラミックのサポートスラブを備えた光電池モジュール又は光電池パネル |
US20080264471A1 (en) * | 2007-04-30 | 2008-10-30 | Richard Allen Hayes | Solar cell modules comprising compositionally distinct encapsulant layers |
US8637150B2 (en) | 2007-10-01 | 2014-01-28 | E I Du Pont De Nemours And Company | Multilayer acid terpolymer encapsulant layers and interlayers and laminates therefrom |
US20090151773A1 (en) | 2007-12-14 | 2009-06-18 | E. I. Du Pont De Nemours And Company | Acid Terpolymer Films or Sheets and Articles Comprising the Same |
WO2009095274A2 (fr) * | 2008-02-02 | 2009-08-06 | Renolit Belgium N.V. | Modules photovoltaïques et procédé de production |
EP2165754A1 (fr) * | 2008-05-13 | 2010-03-24 | Neuweiler AG | Autoclave destiné à la fabrication de verres solaires et agencement doté d'un tel autoclave |
US20090288701A1 (en) * | 2008-05-23 | 2009-11-26 | E.I.Du Pont De Nemours And Company | Solar cell laminates having colored multi-layer encapsulant sheets |
JP2011522442A (ja) * | 2008-06-02 | 2011-07-28 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 低ヘーズの封止層を有する太陽電池モジュール |
JP5280443B2 (ja) | 2008-06-26 | 2013-09-04 | 三井・デュポンポリケミカル株式会社 | 太陽電池用積層シート及びこれを用いた太陽電池モジュール |
WO2010039836A1 (fr) * | 2008-09-30 | 2010-04-08 | Adco Products, Inc. | Module solaire comportant un adhésif de montage encapsulant |
US20100101646A1 (en) * | 2008-10-24 | 2010-04-29 | E. I. Du Pont De Nemours And Company | Non-autoclave lamination process for manufacturing solar cell modules |
US20100101647A1 (en) * | 2008-10-24 | 2010-04-29 | E.I. Du Pont De Nemours And Company | Non-autoclave lamination process for manufacturing solar cell modules |
WO2010050570A1 (fr) * | 2008-10-30 | 2010-05-06 | 三井・デュポンポリケミカル株式会社 | Feuille multicouche, matériau de scellement d'élément de pile solaire et module de pile solaire |
AU2009308728B2 (en) * | 2008-10-31 | 2016-02-04 | Performance Materials Na, Inc. | High-clarity ionomer compositions and articles comprising the same |
EP2342209A1 (fr) | 2008-10-31 | 2011-07-13 | E. I. du Pont de Nemours and Company | Modules de cellules solaires comportant des agents d'encapsulation à faible voile |
EP2342241B1 (fr) * | 2008-10-31 | 2016-08-03 | E. I. du Pont de Nemours and Company | Articles stratifiés à transparence élevé comportant une couche ionomère intermédiaire |
US20100154867A1 (en) * | 2008-12-19 | 2010-06-24 | E. I. Du Pont De Nemours And Company | Mechanically reliable solar cell modules |
WO2010074276A1 (fr) * | 2008-12-26 | 2010-07-01 | 京セラ株式会社 | Module de conversion photoélectrique |
KR101643791B1 (ko) | 2008-12-30 | 2016-07-28 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 블렌딩된 고투명성 이오노머 조성물 및 그를 포함하는 용품 |
MX2011006996A (es) * | 2008-12-31 | 2011-08-08 | Du Pont | Laminados que comprenden capas ionomericas intermedias con baja opacidad y alta resistencia a la humedad. |
JP5984241B2 (ja) * | 2008-12-31 | 2016-09-06 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company | 低ヘイズ性および高耐湿性を有する封入材シートを含む太陽電池モジュール |
CN102325812A (zh) * | 2008-12-31 | 2012-01-18 | 纳幕尔杜邦公司 | 具有低雾度和高耐湿性的离聚物组合物以及包含该组合物的制品 |
KR101054470B1 (ko) | 2009-02-25 | 2011-08-04 | 삼성전자주식회사 | 염료감응 태양전지용 전해질 및 이를 이용한 염료감응 태양전지 |
WO2010101810A1 (fr) * | 2009-03-03 | 2010-09-10 | Arkema France | Feuille de fond photovoltaïque thermoformable |
US9352511B2 (en) * | 2009-06-04 | 2016-05-31 | Stella Chemifa Corporation | Method for producing multilayer film |
EP2259334A1 (fr) * | 2009-06-05 | 2010-12-08 | Kuraray Europe GmbH | Module photovoltaïque doté de feuilles contenant du plastifiant et ayant un fluage faible |
AT508268B1 (de) * | 2009-06-08 | 2011-02-15 | 3S Swiss Solar Systems Ag | Verfahren zur herstellung eines aus schichten aufgebauten solarpaneels |
ES2531104T3 (es) | 2009-07-23 | 2015-03-10 | Renolit Belgium Nv | Módulos fotovoltaicos con lámina de respaldo basada en polipropileno |
CN101694817B (zh) * | 2009-09-30 | 2012-10-03 | 中国科学院等离子体物理研究所 | 一种提高染料敏化太阳电池稳定性的方法 |
KR101554977B1 (ko) * | 2009-10-05 | 2015-09-22 | 리젝 오스트리아 게엠베하 | 진공 요소 및 그 제조방법 |
US20110162705A1 (en) * | 2010-01-06 | 2011-07-07 | Popa Paul J | Moisture resistant photovoltaic devices with elastomeric, polysiloxane protection layer |
CN102905896B (zh) | 2010-05-13 | 2017-02-08 | 三井-杜邦聚合化学株式会社 | 多层材料、太阳能电池用密封材料、安全(夹层)玻璃用中间膜、太阳能电池组件及安全(夹层)玻璃 |
US8211264B2 (en) | 2010-06-07 | 2012-07-03 | E I Du Pont De Nemours And Company | Method for preparing transparent multilayer film structures having a perfluorinated copolymer resin layer |
US8211265B2 (en) * | 2010-06-07 | 2012-07-03 | E. I. Du Pont De Nemours And Company | Method for preparing multilayer structures containing a perfluorinated copolymer resin layer |
KR101031582B1 (ko) * | 2010-06-24 | 2011-04-27 | 주식회사 비봉 이앤지 | 아이오노머를 이용한 태양전지 모듈 |
JPWO2012002422A1 (ja) * | 2010-06-30 | 2013-08-29 | シャープ株式会社 | 太陽電池モジュールの製造方法、及びその製造方法で製造された太陽電池モジュール |
JP2013537494A (ja) | 2010-07-30 | 2013-10-03 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | フッ素化コポリマー樹脂層および封止層を備える多層フィルム |
US8409379B2 (en) | 2010-07-30 | 2013-04-02 | E I Du Pont De Nemours And Company | Multilayer structures containing a fluorinated copolymer resin layer and an ethylene terpolymer layer |
US20120037213A1 (en) * | 2010-08-11 | 2012-02-16 | Du Pont Apollo Limited | Backsheet for a photovoltaic module |
US9017854B2 (en) * | 2010-08-30 | 2015-04-28 | Applied Nanostructured Solutions, Llc | Structural energy storage assemblies and methods for production thereof |
KR101460464B1 (ko) * | 2010-10-08 | 2014-11-12 | 미쓰이 가가쿠 가부시키가이샤 | 태양 전지 봉지재 및 태양 전지 모듈 |
WO2012082913A1 (fr) | 2010-12-15 | 2012-06-21 | E. I. Du Pont De Nemours And Company | Procédé de fabrication d'un module photovoltaïque au moyen d'un montage présentant des éléments de production de pression ou un joint ou insert d'étanchéité transmettant une force extérieure |
US8507097B2 (en) | 2010-12-21 | 2013-08-13 | E I Du Pont De Nemours And Company | Multilayer films containing a fluorinated copolymer resin layer and a cross-linkable ionomeric encapsulant layer |
CN102254975A (zh) * | 2011-05-09 | 2011-11-23 | 上海联孚新能源科技有限公司 | 一种柔性薄膜太阳能电池及其封装方法 |
DE102011052992A1 (de) * | 2011-05-31 | 2012-12-06 | Schott Solar Ag | Solarzellenmodul |
ES2667692T3 (es) * | 2011-06-30 | 2018-05-14 | Dow Global Technologies Llc | Películas basadas en poliolefina multicapeadas que tienen una capa que comprende un material compuesto de copolímero en bloque cristalino o una resina de material compuesto de copolímero en bloque |
EP2742537A4 (fr) | 2011-08-04 | 2015-05-20 | 3M Innovative Properties Co | Ensembles barrières à bord protégé |
EP2740147A4 (fr) * | 2011-08-04 | 2015-04-29 | 3M Innovative Properties Co | Procédé de fabrication d'ensembles résistant au délaminage |
JP2013041897A (ja) * | 2011-08-12 | 2013-02-28 | Mitsubishi Plastics Inc | 太陽電池裏面保護材用ポリエステルフィルム |
WO2013078013A1 (fr) * | 2011-11-22 | 2013-05-30 | 3M Innovative Properties Company | Films intégrés à utiliser dans des modules solaires |
KR101417219B1 (ko) * | 2011-11-29 | 2014-07-09 | 엘지이노텍 주식회사 | 태양광 발전장치 |
NL2008840C2 (en) * | 2012-05-16 | 2013-11-20 | Novopolymers N V | Multilayer encapsulant film for photovoltaic modules. |
NL2008837C2 (en) * | 2012-05-16 | 2013-11-20 | Novopolymers N V | Solar panel. |
US20150144191A1 (en) * | 2012-05-16 | 2015-05-28 | Novopolymers N.V | Polymer sheet |
EP2860766B1 (fr) * | 2012-06-07 | 2017-06-14 | Dai Nippon Printing Co., Ltd. | Module de batterie solaire et son procédé de fabrication |
JP6127562B2 (ja) * | 2013-02-13 | 2017-05-17 | 大日本印刷株式会社 | 太陽電池用封止材ロール |
MY171949A (en) * | 2013-04-22 | 2019-11-08 | Dow Global Technologies Llc | Electronic devices comprising two encapsulant films |
EP3024650A1 (fr) * | 2013-07-22 | 2016-06-01 | E. I. du Pont de Nemours and Company | Feuilles polymères multicouches et stratifiés de faible poids produits à partir de ces dernières |
WO2016095952A1 (fr) * | 2014-12-15 | 2016-06-23 | Ven Van De Marcus Leonardus Gerardus Maria | Film de recouvrement pour production d'énergie électrique photovoltaïque |
US20190067503A1 (en) * | 2015-11-04 | 2019-02-28 | Borealis Ag | A photovoltaic module |
MX2020005994A (es) | 2017-12-08 | 2020-10-14 | Apogee Entpr Inc | Promotores de adhesion, superficies de vidrio que incluyen los mismos y metodos para hacer los mismos. |
EP3863850B1 (fr) * | 2018-10-11 | 2023-06-28 | SABIC Global Technologies B.V. | Film multicouche à base de polyoléfines avec une couche barrière hybride |
FR3093116B1 (fr) * | 2019-02-26 | 2021-03-12 | Commissariat Energie Atomique | Dispositif fonctionnel integrable dans une chaussee circulable |
WO2021016384A1 (fr) * | 2019-07-22 | 2021-01-28 | Massachusetts Institute Of Technology | Structures semi-conductrices flexibles et techniques associées |
Citations (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3264272A (en) * | 1961-08-31 | 1966-08-02 | Du Pont | Ionic hydrocarbon polymers |
US3344014A (en) | 1963-02-28 | 1967-09-26 | Du Pont | Safety glass |
US3762988A (en) | 1971-08-09 | 1973-10-02 | Dow Chemical Co | Interlayer and laminated product |
JPS56116047A (en) | 1980-02-19 | 1981-09-11 | Olympus Optical Co Ltd | Copying apparatus |
US4663228A (en) | 1983-05-03 | 1987-05-05 | Advanced Glass Systems Corp. | Laminated safety glass |
JPH0294574A (ja) | 1988-09-30 | 1990-04-05 | Teijin Ltd | 可撓性太陽電池シート |
JPH06322334A (ja) | 1993-05-10 | 1994-11-22 | Du Pont Mitsui Polychem Co Ltd | 太陽電池用接着シート |
US5476553A (en) | 1994-02-18 | 1995-12-19 | Ase Americas, Inc. | Solar cell modules and method of making same |
US5478402A (en) * | 1994-02-17 | 1995-12-26 | Ase Americas, Inc. | Solar cell modules and method of making same |
JPH08316508A (ja) | 1995-05-12 | 1996-11-29 | Du Pont Mitsui Polychem Co Ltd | 太陽電池封止用難燃シートの製造方法 |
US5733382A (en) | 1995-12-18 | 1998-03-31 | Hanoka; Jack I. | Solar cell modules and method of making same |
US5741370A (en) | 1996-06-27 | 1998-04-21 | Evergreen Solar, Inc. | Solar cell modules with improved backskin and methods for forming same |
US5762720A (en) | 1996-06-27 | 1998-06-09 | Evergreen Solar, Inc. | Solar cell modules with integral mounting structure and methods for forming same |
US5763062A (en) | 1996-11-08 | 1998-06-09 | Artistic Glass Products Company | Ionomer resin films and laminates thereof |
JPH1126791A (ja) | 1997-07-08 | 1999-01-29 | Du Pont Mitsui Polychem Co Ltd | 太陽電池モジュール用保護シート |
WO1999004971A2 (fr) | 1997-07-24 | 1999-02-04 | Evergreen Solar, Inc. | Matiere d'encapsulation pour applications mettant en oeuvre des modules solaires ou du verre feuillete |
US5986203A (en) | 1996-06-27 | 1999-11-16 | Evergreen Solar, Inc. | Solar cell roof tile and method of forming same |
WO1999058334A2 (fr) | 1998-05-14 | 1999-11-18 | E.I. Du Pont De Nemours And Company | Lamines de verre pour systemes de fenetres de protection |
JP2000186114A (ja) | 1998-10-16 | 2000-07-04 | Du Pont Mitsui Polychem Co Ltd | 太陽電池封止材料及び太陽電池モジュ―ル |
US6114046A (en) * | 1997-07-24 | 2000-09-05 | Evergreen Solar, Inc. | Encapsulant material for solar cell module and laminated glass applications |
JP2001089616A (ja) | 1999-07-16 | 2001-04-03 | Du Pont Mitsui Polychem Co Ltd | 重合体組成物及びその用途 |
JP2001119057A (ja) | 1999-10-21 | 2001-04-27 | Du Pont Mitsui Polychem Co Ltd | 太陽電池封止材料及び太陽電池モジュール |
JP2001119056A (ja) | 1999-10-20 | 2001-04-27 | Du Pont Mitsui Polychem Co Ltd | 太陽電池封止材料及び太陽電池モジュール |
JP2001119047A (ja) | 1999-10-21 | 2001-04-27 | Du Pont Mitsui Polychem Co Ltd | 太陽電池封止材料及び太陽電池モジュール |
JP2001144313A (ja) | 1999-11-11 | 2001-05-25 | Du Pont Mitsui Polychem Co Ltd | 太陽電池封止材料及び太陽電池モジュール |
US6320116B1 (en) | 1997-09-26 | 2001-11-20 | Evergreen Solar, Inc. | Methods for improving polymeric materials for use in solar cell applications |
US6319596B1 (en) | 1999-06-03 | 2001-11-20 | Madico, Inc. | Barrier laminate |
US20020004555A1 (en) * | 2000-01-21 | 2002-01-10 | Silvia Di-Benedetto | Impact modified polyamide composition |
US6353042B1 (en) | 1997-07-24 | 2002-03-05 | Evergreen Solar, Inc. | UV-light stabilization additive package for solar cell module and laminated glass applications |
US20020155302A1 (en) | 2001-04-19 | 2002-10-24 | Smith Novis W. | Method for preparing laminated safety glass |
US20030000568A1 (en) * | 2001-06-15 | 2003-01-02 | Ase Americas, Inc. | Encapsulated photovoltaic modules and method of manufacturing same |
US20030124296A1 (en) | 2000-10-26 | 2003-07-03 | Smith Charles Anthony | Glass laminates for threat resistant window systems |
US20040011755A1 (en) | 2002-07-19 | 2004-01-22 | Wood Graham R. | System for holding items |
JP2004031445A (ja) | 2002-06-21 | 2004-01-29 | Du Pont Mitsui Polychem Co Ltd | 太陽電池モジュールの表層構造 |
US6690930B1 (en) | 1998-05-26 | 2004-02-10 | T-Mobile Deutschland Gmbh | Process to control a subscriber identity module (SIM) in mobile phone system |
US20040144415A1 (en) | 2002-12-03 | 2004-07-29 | Arhart Richard J. | Ionomer/nylon films for use as backing layer for photovoltaic cells |
JP2005034913A (ja) | 2003-07-15 | 2005-02-10 | Hitachi Koki Co Ltd | 打撃工具 |
JP2005064268A (ja) | 2003-08-13 | 2005-03-10 | Canon Inc | 露光装置及びその使用方法 |
JP2005064266A (ja) | 2003-08-13 | 2005-03-10 | Murata Mfg Co Ltd | 電磁波シールドシートおよび電子機器 |
US20050274410A1 (en) * | 2002-10-25 | 2005-12-15 | Nakajma Glass Co., Inc | Solar battery module manufacturing method |
US20050279401A1 (en) * | 2004-06-17 | 2005-12-22 | Arhart Richard J | Multilayer ionomer films for use as encapsulant layers for photovoltaic cell modules |
WO2006002389A1 (fr) | 2004-06-24 | 2006-01-05 | E.I. Dupont De Nemours And Company | Films transparents ionomères formés de mélanges de copolymères ionomères |
JP2006032308A (ja) | 2003-09-29 | 2006-02-02 | Du Pont Mitsui Polychem Co Ltd | 色素増感型太陽電池スペーサー |
JP2006036875A (ja) | 2004-07-26 | 2006-02-09 | Du Pont Mitsui Polychem Co Ltd | 太陽電池封止用エチレン共重合体組成物及びそれを用いた太陽電池モジュール |
JP2006035874A (ja) | 2004-07-22 | 2006-02-09 | Toyota Motor Corp | 車輌のマルチリンク式リヤサスペンション |
JP2006036876A (ja) | 2004-07-26 | 2006-02-09 | Du Pont Mitsui Polychem Co Ltd | 太陽電池封止材及びそれを用いた太陽電池モジュール |
US20060057392A1 (en) | 2003-10-07 | 2006-03-16 | Smillie Benjamin A | Multi-layer sheet having a weatherable surface layer |
US20060141212A1 (en) | 2000-10-26 | 2006-06-29 | Smith Charles A | Interlayers for laminated safety glass with superior de-airing and laminating properties and process for making the same |
JP2006186237A (ja) | 2004-12-28 | 2006-07-13 | Du Pont Mitsui Polychem Co Ltd | 太陽電池封止材の製造方法 |
JP2006190865A (ja) | 2005-01-07 | 2006-07-20 | Du Pont Mitsui Polychem Co Ltd | 太陽電池封止材 |
JP2006190867A (ja) | 2005-01-07 | 2006-07-20 | Du Pont Mitsui Polychem Co Ltd | 太陽電池封止材 |
US20060165929A1 (en) | 2004-12-07 | 2006-07-27 | Lenges Geraldine M | Multilayer composite films and articles prepared therefrom |
WO2006085603A1 (fr) | 2005-02-10 | 2006-08-17 | Du Pont-Mitsui Polychemicals Co., Ltd. | Procede de production d’un materiau d’etancheite pour pile solaire |
WO2006095762A1 (fr) | 2005-03-08 | 2006-09-14 | Du Pont/Mitsui Polychemicals Co. Ltd. | Materiau etancheifiant pour pile solaire |
US20070221268A1 (en) | 2006-03-21 | 2007-09-27 | Hasch Bruce M | Encapsulants for electronic components |
US20080017241A1 (en) | 2006-07-21 | 2008-01-24 | Anderson Jerrel C | Embossed high modulus encapsulant sheets for solar cells |
US20080023064A1 (en) | 2006-07-28 | 2008-01-31 | Richard Allen Hayes | Low modulus solar cell encapsulant sheets with enhanced stability and adhesion |
US20080264481A1 (en) * | 2007-04-30 | 2008-10-30 | Richard Allen Hayes | Solar cell modules comprising compositionally distinct encapsulant layers |
US20080264471A1 (en) * | 2007-04-30 | 2008-10-30 | Richard Allen Hayes | Solar cell modules comprising compositionally distinct encapsulant layers |
-
2006
- 2006-07-28 US US11/495,249 patent/US8772624B2/en active Active
-
2007
- 2007-07-24 JP JP2009522792A patent/JP2009545185A/ja not_active Withdrawn
- 2007-07-24 WO PCT/US2007/016698 patent/WO2008013837A2/fr active Application Filing
- 2007-07-24 EP EP07836225A patent/EP2047520A2/fr not_active Withdrawn
- 2007-07-24 KR KR1020097004193A patent/KR101326430B1/ko active IP Right Grant
- 2007-07-24 CN CNA2007800346991A patent/CN101517749A/zh active Pending
Patent Citations (65)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3264272A (en) * | 1961-08-31 | 1966-08-02 | Du Pont | Ionic hydrocarbon polymers |
US3344014A (en) | 1963-02-28 | 1967-09-26 | Du Pont | Safety glass |
US3762988A (en) | 1971-08-09 | 1973-10-02 | Dow Chemical Co | Interlayer and laminated product |
JPS56116047A (en) | 1980-02-19 | 1981-09-11 | Olympus Optical Co Ltd | Copying apparatus |
US4663228A (en) | 1983-05-03 | 1987-05-05 | Advanced Glass Systems Corp. | Laminated safety glass |
JPH0294574A (ja) | 1988-09-30 | 1990-04-05 | Teijin Ltd | 可撓性太陽電池シート |
JPH06322334A (ja) | 1993-05-10 | 1994-11-22 | Du Pont Mitsui Polychem Co Ltd | 太陽電池用接着シート |
JP3510646B2 (ja) | 1993-05-10 | 2004-03-29 | 三井・デュポンポリケミカル株式会社 | 太陽電池用接着シート |
US5478402A (en) * | 1994-02-17 | 1995-12-26 | Ase Americas, Inc. | Solar cell modules and method of making same |
US5476553A (en) | 1994-02-18 | 1995-12-19 | Ase Americas, Inc. | Solar cell modules and method of making same |
JPH08316508A (ja) | 1995-05-12 | 1996-11-29 | Du Pont Mitsui Polychem Co Ltd | 太陽電池封止用難燃シートの製造方法 |
US5733382A (en) | 1995-12-18 | 1998-03-31 | Hanoka; Jack I. | Solar cell modules and method of making same |
US5986203A (en) | 1996-06-27 | 1999-11-16 | Evergreen Solar, Inc. | Solar cell roof tile and method of forming same |
US5741370A (en) | 1996-06-27 | 1998-04-21 | Evergreen Solar, Inc. | Solar cell modules with improved backskin and methods for forming same |
US5762720A (en) | 1996-06-27 | 1998-06-09 | Evergreen Solar, Inc. | Solar cell modules with integral mounting structure and methods for forming same |
US5763062A (en) | 1996-11-08 | 1998-06-09 | Artistic Glass Products Company | Ionomer resin films and laminates thereof |
JPH1126791A (ja) | 1997-07-08 | 1999-01-29 | Du Pont Mitsui Polychem Co Ltd | 太陽電池モジュール用保護シート |
US6114046A (en) * | 1997-07-24 | 2000-09-05 | Evergreen Solar, Inc. | Encapsulant material for solar cell module and laminated glass applications |
US6353042B1 (en) | 1997-07-24 | 2002-03-05 | Evergreen Solar, Inc. | UV-light stabilization additive package for solar cell module and laminated glass applications |
US6187448B1 (en) * | 1997-07-24 | 2001-02-13 | Evergreen Solar, Inc. | Encapsulant material for solar cell module and laminated glass applications |
WO1999004971A2 (fr) | 1997-07-24 | 1999-02-04 | Evergreen Solar, Inc. | Matiere d'encapsulation pour applications mettant en oeuvre des modules solaires ou du verre feuillete |
US6586271B2 (en) | 1997-09-26 | 2003-07-01 | Evergreen Solar, Inc. | Methods for improving polymeric materials for use in solar cell applications |
US6320116B1 (en) | 1997-09-26 | 2001-11-20 | Evergreen Solar, Inc. | Methods for improving polymeric materials for use in solar cell applications |
WO1999058334A2 (fr) | 1998-05-14 | 1999-11-18 | E.I. Du Pont De Nemours And Company | Lamines de verre pour systemes de fenetres de protection |
US6690930B1 (en) | 1998-05-26 | 2004-02-10 | T-Mobile Deutschland Gmbh | Process to control a subscriber identity module (SIM) in mobile phone system |
JP2000186114A (ja) | 1998-10-16 | 2000-07-04 | Du Pont Mitsui Polychem Co Ltd | 太陽電池封止材料及び太陽電池モジュ―ル |
US6319596B1 (en) | 1999-06-03 | 2001-11-20 | Madico, Inc. | Barrier laminate |
JP2001089616A (ja) | 1999-07-16 | 2001-04-03 | Du Pont Mitsui Polychem Co Ltd | 重合体組成物及びその用途 |
JP2001119056A (ja) | 1999-10-20 | 2001-04-27 | Du Pont Mitsui Polychem Co Ltd | 太陽電池封止材料及び太陽電池モジュール |
JP2001119047A (ja) | 1999-10-21 | 2001-04-27 | Du Pont Mitsui Polychem Co Ltd | 太陽電池封止材料及び太陽電池モジュール |
JP2001119057A (ja) | 1999-10-21 | 2001-04-27 | Du Pont Mitsui Polychem Co Ltd | 太陽電池封止材料及び太陽電池モジュール |
JP2001144313A (ja) | 1999-11-11 | 2001-05-25 | Du Pont Mitsui Polychem Co Ltd | 太陽電池封止材料及び太陽電池モジュール |
US20020004555A1 (en) * | 2000-01-21 | 2002-01-10 | Silvia Di-Benedetto | Impact modified polyamide composition |
US20030124296A1 (en) | 2000-10-26 | 2003-07-03 | Smith Charles Anthony | Glass laminates for threat resistant window systems |
US20060141212A1 (en) | 2000-10-26 | 2006-06-29 | Smith Charles A | Interlayers for laminated safety glass with superior de-airing and laminating properties and process for making the same |
US20020155302A1 (en) | 2001-04-19 | 2002-10-24 | Smith Novis W. | Method for preparing laminated safety glass |
US20030000568A1 (en) * | 2001-06-15 | 2003-01-02 | Ase Americas, Inc. | Encapsulated photovoltaic modules and method of manufacturing same |
JP2004031445A (ja) | 2002-06-21 | 2004-01-29 | Du Pont Mitsui Polychem Co Ltd | 太陽電池モジュールの表層構造 |
US20040011755A1 (en) | 2002-07-19 | 2004-01-22 | Wood Graham R. | System for holding items |
US20050274410A1 (en) * | 2002-10-25 | 2005-12-15 | Nakajma Glass Co., Inc | Solar battery module manufacturing method |
US20040144415A1 (en) | 2002-12-03 | 2004-07-29 | Arhart Richard J. | Ionomer/nylon films for use as backing layer for photovoltaic cells |
JP2005034913A (ja) | 2003-07-15 | 2005-02-10 | Hitachi Koki Co Ltd | 打撃工具 |
JP2005064268A (ja) | 2003-08-13 | 2005-03-10 | Canon Inc | 露光装置及びその使用方法 |
JP2005064266A (ja) | 2003-08-13 | 2005-03-10 | Murata Mfg Co Ltd | 電磁波シールドシートおよび電子機器 |
JP2006032308A (ja) | 2003-09-29 | 2006-02-02 | Du Pont Mitsui Polychem Co Ltd | 色素増感型太陽電池スペーサー |
US20060057392A1 (en) | 2003-10-07 | 2006-03-16 | Smillie Benjamin A | Multi-layer sheet having a weatherable surface layer |
US20050279401A1 (en) * | 2004-06-17 | 2005-12-22 | Arhart Richard J | Multilayer ionomer films for use as encapsulant layers for photovoltaic cell modules |
US20060084763A1 (en) | 2004-06-24 | 2006-04-20 | Arhart Richard J | Transparent ionomeric films from blends of ionomeric copolymers |
WO2006002389A1 (fr) | 2004-06-24 | 2006-01-05 | E.I. Dupont De Nemours And Company | Films transparents ionomères formés de mélanges de copolymères ionomères |
JP2006035874A (ja) | 2004-07-22 | 2006-02-09 | Toyota Motor Corp | 車輌のマルチリンク式リヤサスペンション |
JP2006036876A (ja) | 2004-07-26 | 2006-02-09 | Du Pont Mitsui Polychem Co Ltd | 太陽電池封止材及びそれを用いた太陽電池モジュール |
JP2006036875A (ja) | 2004-07-26 | 2006-02-09 | Du Pont Mitsui Polychem Co Ltd | 太陽電池封止用エチレン共重合体組成物及びそれを用いた太陽電池モジュール |
US20060165929A1 (en) | 2004-12-07 | 2006-07-27 | Lenges Geraldine M | Multilayer composite films and articles prepared therefrom |
JP2006186237A (ja) | 2004-12-28 | 2006-07-13 | Du Pont Mitsui Polychem Co Ltd | 太陽電池封止材の製造方法 |
JP2006190865A (ja) | 2005-01-07 | 2006-07-20 | Du Pont Mitsui Polychem Co Ltd | 太陽電池封止材 |
JP2006190867A (ja) | 2005-01-07 | 2006-07-20 | Du Pont Mitsui Polychem Co Ltd | 太陽電池封止材 |
US20090023867A1 (en) | 2005-02-10 | 2009-01-22 | Koichi Nishijima | Process for Producing Encapsulating Material for Solar Cell |
WO2006085603A1 (fr) | 2005-02-10 | 2006-08-17 | Du Pont-Mitsui Polychemicals Co., Ltd. | Procede de production d’un materiau d’etancheite pour pile solaire |
WO2006095762A1 (fr) | 2005-03-08 | 2006-09-14 | Du Pont/Mitsui Polychemicals Co. Ltd. | Materiau etancheifiant pour pile solaire |
US20090120489A1 (en) | 2005-03-08 | 2009-05-14 | Du Pont-Mitsui Polychemicals Co., Ltd. | Encapsulating Material for Solar Cell |
US20070221268A1 (en) | 2006-03-21 | 2007-09-27 | Hasch Bruce M | Encapsulants for electronic components |
US20080017241A1 (en) | 2006-07-21 | 2008-01-24 | Anderson Jerrel C | Embossed high modulus encapsulant sheets for solar cells |
US20080023064A1 (en) | 2006-07-28 | 2008-01-31 | Richard Allen Hayes | Low modulus solar cell encapsulant sheets with enhanced stability and adhesion |
US20080264481A1 (en) * | 2007-04-30 | 2008-10-30 | Richard Allen Hayes | Solar cell modules comprising compositionally distinct encapsulant layers |
US20080264471A1 (en) * | 2007-04-30 | 2008-10-30 | Richard Allen Hayes | Solar cell modules comprising compositionally distinct encapsulant layers |
Non-Patent Citations (6)
Title |
---|
Baum, Bernard, et al., in "Solar Collectors. Final Report", DOE/CS/35359-T1 (DE84011480), DOE6081.1, Contract No. AC4-78CS35359, (Springborn Laboratories, Inc.)., Jun. 1983. |
DuPont(TM) Sentry Glas® Plus, Laminating Guide, Oct. 2006. |
DuPont™ Sentry Glas® Plus, Laminating Guide, Oct. 2006. |
PCT International Preliminary Report on Patentability for International application No. PCT/US2007/016698, dated Feb. 12, 2009. |
PCT International Search Report and Written Opinion for International Application No. PCT/US2007/016698, filed Jul. 24, 2007, dated May 26, 2008. |
U.S. Appl. No. 11/796.565, filed Apr. 30, 2007, Inventor Richard Allen Hayes. |
Also Published As
Publication number | Publication date |
---|---|
JP2009545185A (ja) | 2009-12-17 |
KR101326430B1 (ko) | 2013-11-07 |
WO2008013837A2 (fr) | 2008-01-31 |
KR20090042941A (ko) | 2009-05-04 |
WO2008013837A3 (fr) | 2008-07-31 |
CN101517749A (zh) | 2009-08-26 |
US20080023063A1 (en) | 2008-01-31 |
EP2047520A2 (fr) | 2009-04-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8772624B2 (en) | Solar cell encapsulant layers with enhanced stability and adhesion | |
US7847184B2 (en) | Low modulus solar cell encapsulant sheets with enhanced stability and adhesion | |
US8168885B2 (en) | Low modulus solar cell encapsulant sheets with enhanced stability and adhesion | |
US8657993B2 (en) | Articles such as safety laminates and solar cell modules containing high melt flow acid copolymer compositions | |
US8080727B2 (en) | Solar cell modules comprising an encapsulant sheet of a blend of ethylene copolymers | |
US7851694B2 (en) | Embossed high modulus encapsulant sheets for solar cells | |
US20080099064A1 (en) | Solar cells which include the use of high modulus encapsulant sheets | |
US8133752B2 (en) | Solar cells which include the use of certain poly(vinyl butyral)/film bilayer encapsulant layers with a low blocking tendency and a simplified process to produce thereof | |
US8080726B2 (en) | Solar cell modules comprising compositionally distinct encapsulant layers | |
US8445776B2 (en) | Solar cell module having a low haze encapsulant layer | |
US8691372B2 (en) | Articles comprising high melt flow ionomeric compositions | |
US8399095B2 (en) | Solar cells modules comprising low haze encapsulants | |
US20080053516A1 (en) | Solar cell modules comprising poly(allyl amine) and poly (vinyl amine)-primed polyester films | |
US20080264471A1 (en) | Solar cell modules comprising compositionally distinct encapsulant layers | |
US20100126558A1 (en) | Solar cell modules comprising an encapsulant sheet of an ethylene copolymer | |
US20090288701A1 (en) | Solar cell laminates having colored multi-layer encapsulant sheets |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: E. I. DU PONT DE NEMOURS AND COMPANY, DELAWARE Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HAYES, RICHARD ALLEN;LENGES, GERALDINE M.;PESEK, STEVEN C.;AND OTHERS;REEL/FRAME:018572/0358;SIGNING DATES FROM 20061009 TO 20061106 Owner name: E. I. DU PONT DE NEMOURS AND COMPANY, DELAWARE Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HAYES, RICHARD ALLEN;LENGES, GERALDINE M.;PESEK, STEVEN C.;AND OTHERS;SIGNING DATES FROM 20061009 TO 20061106;REEL/FRAME:018572/0358 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551) Year of fee payment: 4 |
|
AS | Assignment |
Owner name: PERFORMANCE MATERIALS NA, INC., MICHIGAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:E.I. DU PONT DE NEMOURS AND COMPANY;REEL/FRAME:050237/0001 Effective date: 20190328 |
|
AS | Assignment |
Owner name: DOW GLOBAL TECHNOLOGIES LLC, MICHIGAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:THE DOW CHEMICAL COMPANY;REEL/FRAME:057813/0928 Effective date: 20211008 Owner name: THE DOW CHEMICAL COMPANY, MICHIGAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:PERFORMANCE MATERIALS NA, INC.;REEL/FRAME:057813/0792 Effective date: 20211008 |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 8 |