US7845071B2 - Method of manufacturing electronic part - Google Patents

Method of manufacturing electronic part Download PDF

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Publication number
US7845071B2
US7845071B2 US11/072,989 US7298905A US7845071B2 US 7845071 B2 US7845071 B2 US 7845071B2 US 7298905 A US7298905 A US 7298905A US 7845071 B2 US7845071 B2 US 7845071B2
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US
United States
Prior art keywords
adhesive tape
adhesive
electronic part
manufacturing
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related, expires
Application number
US11/072,989
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English (en)
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US20050210666A1 (en
Inventor
Hisao Morooka
Hideaki Ninomiya
Junichi Shimamura
Kazuo Nishi
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Semiconductor Energy Laboratory Co Ltd
TDK Corp
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Semiconductor Energy Laboratory Co Ltd
TDK Corp
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Assigned to SEMICONDUCTOR ENERGY LABORATORY CO., LTD., TDK CORPORATION reassignment SEMICONDUCTOR ENERGY LABORATORY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MOROOKA, HISAO, NINOMIYA, HIDEAKI, NISHI, KAZUO, SHIMAMURA, JUNICHI
Publication of US20050210666A1 publication Critical patent/US20050210666A1/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5193—Electrical connector or terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Definitions

  • the present invention relates to a substrate holding method for holding a flexible substrate typified by a plastic film on a holding jig and to a method of manufacturing an electronic part by using the substrate holding method.
  • the material of a substrate used for forming an electronic device as a main part of an electronic part is being changed from a material having rigidity typified by a ceramics substrate, an FPC (Flexible Printed Circuit) board, a glass substrate, and the like to a material having flexibility typified by a plastic film.
  • An example of the electronic part accompanying the technical demand is a small solar battery provided in a clock or the like. The electronic part is not easily cracked, is bendable, and can be processed in an arbitrary shape since a flexible substrate is used, so that the electronic part has an advantage from the viewpoint of portability. By using the advantage, development of an active display is also being progressed.
  • a problem occurs in handling of the plastic film from the following two viewpoints.
  • the plastic film generally has low rigidity and a high coefficient of thermal expansion
  • heat (concretely, heat cycle) is generated during various processes (for example, in a film forming process) in a process of manufacturing an electronic part
  • the plastic film is thermally deformed by the influence of the heat. Specifically, the plastic film is contracted or warped.
  • the plastic film is thermally deformed, the dimensions of the plastic film change, so that it becomes difficult to control the dimensional precision of the electronic part.
  • the plastic film is generally thin and deflectable, when an external force is applied during a process of manufacturing an electronic part, the plastic film is physically deformed by the influence of the external force. Specifically, the plastic film is broken or a wrinkle occurs. Since the plastic film is physically easily deformed and cannot be conveyed in the manufacturing process, it is difficult to put the plastic film in an electronic parts automatic manufacturing line.
  • the present invention has been achieved in consideration of such problems and its first object is to provide a substrate holding method capable of contributing to improvement in the performance of an electronic part.
  • a second object of the invention is to provide a method of manufacturing an electronic part, capable of improving the performance of an electronic part by using the substrate holding method of the invention.
  • a flexible substrate is adhered to a holding jig by using an adhesive whose total quantity of gas detected when analysis using gas chromatograph mass spectrometry is conducted under test conditions of 180° C. and 10 minutes is 100.5 ⁇ g/g or less in n-tetradecane, thereby holding the substrate by the holding jig.
  • a flexible substrate is adhered to the holding jig by using an adhesive whose total quantity of gas detected when analysis using gas chromatograph mass spectrometry is conducted under test conditions of 180° C. and 10 minutes is 100.5 ⁇ g/g or less in n-tetradecane, and then an electronic device is formed on the substrate to manufacture an electronic part. Consequently, as described above, the release quantity of unnecessary gas released from the adhesive during the process of manufacturing an electronic part is suppressed.
  • an acrylic adhesive from which gas containing aliphatic hydrocarbon, aliphatic alcohol, and acrylic ester is detected may be used.
  • An adhesive may be prepared by using a pre-adhesive for preparing the adhesive and heating the pre-adhesive so that the total gas quantity becomes 100.5 ⁇ g/g or less in n-tetradecane.
  • the substrate it is preferable to use a substrate having a thermal contraction property.
  • the “aliphatic hydrocarbon” is not limited to a pure compound constructed by carbon and hydrogen (a compound which does not contain elements other than carbon and hydrogen) but includes a compound obtained by substituting part of the skeleton of hydrocarbon and a compound in which a derivative is constructed by introducing another skeleton to the hydrocarbon skeleton.
  • the definition of the “aliphatic hydrocarbon” (including a substituted compound and a derivative compound) is also similarly applied to the “aliphatic alcohol” and “acrylic ester”.
  • a solar battery may be manufactured as the electronic part by forming a solar cell as the electronic device.
  • the step of forming the solar battery device may include a step of forming a conductive film, a step of forming a semiconductor film by using chemical vapor deposition (CVD), a step of forming a pattern film by using a screen printing method, or a step of patterning a film to be patterned by using a laser.
  • CVD chemical vapor deposition
  • the substrate holding method the substrate is adhered to the holding jig by using the adhesive having a proper gas releasing characteristic such that the total quantity of gas detected when analysis using the gas chromatograph mass spectrometry is carried out under the test conditions of 180° C. and 10 minutes is 100.5 ⁇ g/g or less in n-tetradecane. Consequently, for example, in the case where the substrate held by the holding jig is subjected to the process of manufacturing an electronic part, the release quantity of gas exerting an adverse influence on the performance of an electronic part is suppressed. Therefore, the invention can contribute to improvement in performance of an electronic part.
  • the substrate holding method of the invention is used and the substrate is held by the holding jig by using the adhesive having a proper gas releasing characteristic, so that a release amount of unnecessary gas released from the adhesive during the process of manufacturing the electronic part is suppressed, and deterioration in the performance of the electronic part caused by the unnecessary gas is suppressed. Therefore, the performance of the electronic part can be improved.
  • FIG. 1 is a flowchart for explaining the flow of a substrate holding method according to an embodiment of the invention.
  • FIG. 2 is a perspective view for explaining a substrate holding procedure.
  • FIG. 3 is a perspective view for explaining the substrate holding procedure subsequent to FIG. 2 .
  • FIG. 4 is a perspective view for explaining the substrate holding procedure subsequent to FIG. 3 .
  • FIG. 5 is a flowchart for explaining the flow of a method of manufacturing a solar battery, using the substrate holding method according to the embodiment of the invention.
  • FIG. 6 is a perspective view for explaining a procedure of manufacturing a solar battery.
  • FIG. 7 is a perspective view for explaining a process of manufacturing a solar battery, subsequent to FIG. 6 .
  • FIG. 8 is a perspective view for explaining a process of manufacturing a solar battery, subsequent to FIG. 7 .
  • FIG. 1 is provided to explain the flow of the substrate holding method
  • FIGS. 2 to 4 are provided to explain the procedure for holding a substrate.
  • the substrate holding method according to the embodiment is a method of holding a flexible substrate typified by, for example, a plastic film on a holding jig and is applied to a method of manufacturing an electronic part typified by a solar battery.
  • a holding frame 10 as a holding jig is prepared (step S 101 in FIG. 1 ).
  • the plastic film 1 is made of, for example, polyethylene naphthalate (PEN) and is a sheet obtained by cutting a PEN film wound in a roll so as to be in arbitrary dimensions.
  • the plastic film 1 has a thermal contraction property so as not to have a wrinkle by being stretched by thermal contraction when the plastic film 1 is influenced by heat in a state where it is held by the holding frame 10 .
  • the material of the plastic film 1 is not always limited to PEN but can be freely selected.
  • PET polyethylene terephthalate
  • PES polyether sulfone
  • polyimide or the like can be used.
  • the holding frame 10 is a dedicated jig for holding and fixing the plastic film 1 and is made of, for example, a ceramics-metal composite material such as silicon carbide (SiC)-aluminum (Al) complex.
  • the holding frame 10 has, for example, a frame structure having an almost rectangular shape in which a rectangular opening 11 is formed.
  • the dimension of the opening 11 is designed so as to be smaller than the outside diameter of the plastic film 1 .
  • a taper 12 is provided at an arbitrary corner of the holding frame 10 so that the user of the holding frame 10 can recognize the orientation of the holding frame 10 on the basis of the position of the taper 12 .
  • an adhesive tape 20 of a double-face type is prepared as an adhesive for adhering the plastic film 1 to the holding frame 10 as shown in FIG. 3 (step S 102 in FIG. 1 ).
  • an adhesive tape 20 an adhesive tape having a proper gas release property and whose gas total quantity detected when analysis using gas chromatograph mass spectrometry is conducted under test conditions of 180° C. and 10 minutes is 100.5 ⁇ g/g or less in n-tetradecane is prepared.
  • the “gas” is a generic name for organic and inorganic gases which can be detected by the analysis using the gas chromatograph mass spectrometry.
  • the “gas chromatograph mass spectrometry” is, strictly, dynamic head space-gas chromatograph-mass spectrometry (HS-GC-MS).
  • the dynamic HS-GC-MS is also called purge & trap-gas chromatograph-mass spectrometry (P&T-GC-MS).
  • An example of the procedure of preparing the adhesive tape 20 is as follows.
  • a pre-adhesive tape 20 Z is prepared (step S 1021 in FIG. 1 ).
  • the pre-adhesive tape 20 Z is a pre-adhesive used for adhering the plastic film 1 to the holding frame 10 .
  • the pre-adhesive tape 20 Z does not have a proper gas releasing property necessary for the adhesive tape 20 , that is, does not satisfy the condition that gas total quantity detected when analysis using gas chromatograph mass spectrometry is conducted under the test conditions of 180° C. and 10 minutes is 100.5 ⁇ g/g or less in n-tetradecane.
  • an adhesive tape of an acrylic material (whose main component is an acrylic compound) from which gas including aliphatic hydrocarbon, aliphatic alcohol, and acrylic ester is detected in analysis using the gas chromatograph mass spectrometry is prepared.
  • the “aliphatic hydrocarbon” is not limited to a pure compound constructed by carbon and hydrogen (a compound which does not contain elements other than carbon and hydrogen) but includes a compound obtained by substituting part of the skeleton of hydrocarbon and a compound in which a derivative is constructed by introducing another skeleton to the hydrocarbon skeleton.
  • the definition of the “aliphatic hydrocarbon” (including a substituted compound and a derivative compound) is also similarly applied to the “aliphatic alcohol” and “acrylic ester”.
  • the pre-adhesive tape 20 Z is adhered to the holding frame 10 so as to surround the opening 11 from four sides (step S 1022 in FIG. 1 ).
  • the pre-adhesive tape 20 Z it is not always necessary to adhere the pre-adhesive tape 20 Z so as to surround the opening 11 from four sides.
  • a heating equipment such as a clean oven is used to heat the pre-adhesive tape 20 Z so that the total quantity of gas detected when analysis using the gas chromatograph mass spectrometry is conducted under the test conditions of 180° C. and 10 minutes becomes equal to or less than 100.5 ⁇ g/g in n-tetradecane (step S 1023 in FIG. 1 ).
  • the heating conditions at this time can be freely set as long as the total quantity of the gas satisfies the above-described conditions.
  • the relation between the heating conditions of the pre-adhesive tape 20 Z and the total quantity of the gas is obtained in advance by using the gas chromatograph mass spectrometry, in other words, the heating conditions under which the total quantity of gas detected when analysis using the gas chromatograph mass spectrometry is conducted under the test conditions of 180° C. and 10 minutes on the pre-adhesive tape 20 Z becomes 100.5 ⁇ g/g or less are grasped in advance.
  • the pre-adhesive tape 20 Z is heated. In such a manner, the adhesive tape 20 having a proper gas releasing characteristic is prepared.
  • the plastic film 1 is adhered to the holding frame 10 by using the adhesive tape 20 (step S 103 in FIG. 1 ).
  • the whole adhesive tape 20 adhered to the opening 11 so as to surround it from four sides in the preceding process is used and the opening 11 is closed with the plastic film 1 .
  • the plastic film 1 is adhered to the holding frame 10 by using adhesive strength of the adhesive tape 20 , that is, the plastic film 1 is held by the holding frame 10 via the adhesive tape 20 , and the substrate holding process is completed.
  • the plastic film 1 is subjected to a process of manufacturing an electronic part in a state where it is held by the holding frame 10 , when a process accompanying generation of heat (for example, film forming process typified by plasma CVD (Chemical Vapor Deposition)) is performed on the plastic film 1 during the manufacturing process, the plastic film 1 is thermal-contracted by being influenced by the heat generated at the time of the process. Consequently, by using tension accompanying the thermal contraction, the plastic film 1 is uniformly stretched so as not to include a wrinkle, that is, the surface of the plastic film 1 is made flat.
  • a process accompanying generation of heat for example, film forming process typified by plasma CVD (Chemical Vapor Deposition)
  • the plastic film 1 is thermal-contracted by being influenced by the heat generated at the time of the process. Consequently, by using tension accompanying the thermal contraction, the plastic film 1 is uniformly stretched so as not to include a wrinkle, that is, the surface of the plastic film 1 is made flat.
  • the adhesive tape 20 used for adhering the plastic film 1 to the holding frame 10 has a proper gas releasing characteristic, the release quantity of unnecessary gas released from the adhesive tape 20 influenced by the heat, that is, gas exerting an adverse influence on the performance of an electronic part is suppressed.
  • the plastic film 1 is adhered to the holding frame 10 by using the adhesive tape 20 having a proper gas releasing characteristic such that the total quantity of gas detected when analysis using the gas chromatograph mass spectrometry is carried out under the test conditions of 180° C. and 10 minutes is 100.5 ⁇ g/g or less in n-tetradecane. Therefore, for example, in the case where the plastic film 1 is subjected to the process of manufacturing an electronic part, even if a process accompanying generation of heat is performed on the plastic film 1 during the manufacturing process, the release quantity of unnecessary gas released from the adhesive tape 20 due to the influence of the heat is suppressed. Therefore, the invention can contribute to improvement in performance of an electronic part.
  • a proper gas releasing characteristic of the adhesive tape 20 that is, the permissible range of a gas release quantity by which the performance of an electronic part can be assured is specified on the basis of the result of the analysis using the gas chromatograph mass spectrometry (dynamic HS-GC-MS) known as a general gas spectrometry. Consequently, the gas release quantity of the adhesive tape 20 can be easily measured by using the gas chromatograph mass spectrometry and the permissible range of the gas release quantity can be also easily specified on the basis of the gas release quantity.
  • the gas chromatograph mass spectrometry dynamic HS-GC-MS
  • the permissible range of the gas release quantity is specified by conversion using a specific substance (for example, n-tetradecan) in consideration of the fact that various kinds of gases are released from the adhesive tape 20 , the permissible range of the gas release quantity can be specified with high reproducibility irrespective of the material of the adhesive tape 20 . Therefore, improvement in the performance of an electronic part can be realized easily and stably.
  • a specific substance for example, n-tetradecan
  • the pre-adhesive tape 20 Z having no proper gas release characteristic is used.
  • the adhesive tape 20 is prepared.
  • the pre-adhesive tape 20 Z does not have a proper gas release characteristic prepared for adhering the plastic film 1 to the holding frame 10 .
  • the pre-adhesive tape 20 Z which does not have a proper gas release characteristic can be also converted to the adhesive tape 20 having a proper gas release characteristic.
  • the adhesive tape 20 is not limited to an adhesive tape initially having a proper gas release characteristic but the pre-adhesive tape 20 Z such as a commercially available both-faced tape can be converted to the adhesive tape 20 and the resultant adhesive tape 20 can be used.
  • the pre-adhesive tape 20 Z such as a commercially available both-faced tape can be converted to the adhesive tape 20 and the resultant adhesive tape 20 can be used.
  • the plastic film 1 is adhered to the holding frame 10 by using the adhesive tape 20 so that, naturally, the plastic film 1 can be held by the holding frame 10 by using adhesive strength of the adhesive tape 20 .
  • the plastic film 1 having heat contractility for example, when the plastic film 1 is subjected to a process of manufacturing an electronic part as described above, the plastic film 1 is uniformly stretched so as not to have a wrinkle by heat contraction by being influenced by heat generated during the manufacturing process. Consequently, the surface of the plastic film 1 is made flat. Therefore, occurrence of a wrinkle in the plastic film 1 can be prevented and the plastic film 1 can be made flat easily.
  • the pre-adhesive tape 20 Z is adhered to the holding frame 10 and heated, thereby making the gas release characteristic proper.
  • the gas release characteristic may be also made proper by pre-heating the pre-adhesive tape 20 Z before the pre-adhesive tape 20 Z is adhered to the holding frame 10 .
  • the adhesive tape 20 is prepared by pre-heating the pre-adhesive tape 20 Z and the prepared adhesive tape 20 is adhered to the holding frame 10 .
  • the process of performing the heating process on the pre-adhesive tape 20 Z during the process of manufacturing an electronic part becomes unnecessary. Therefore, the method can contribute to simplification of the process of manufacturing an electronic part.
  • the pre-adhesive tape 20 Z an acrylic adhesive tape from which gas including aliphatic hydrocarbon, aliphatic alcohol, and acrylic ester is detected is used.
  • the invention is not limited to the acrylic adhesive tape.
  • the material of the pre-adhesive tape 20 Z can be freely changed and the kind of gas detected when analysis using the gas chromatograph mass spectrometry is conducted can be also freely changed according to the material of the pre-adhesive tape 20 Z.
  • a silicon adhesive tape (made of a material whose main component is a silicon compound) from which gas containing siloxane is detected may be used as the pre-adhesive tape 20 Z. In this case as well, effects similar to those of the foregoing embodiment can be obtained.
  • the adhesive tape 20 is used as an adhesive for adhering the plastic film 1 to the holding frame 10 in the embodiment, the invention is not limited to the adhesive tape 20 . As long as an adhesive can stably adhere the plastic film 1 to the holding frame 10 , the mode of the adhesive can be freely changed.
  • a gel adhesive paste may be used in place of the adhesive tape 20 in the form of a tape. In this case as well, effects similar to those of the foregoing embodiment can be obtained.
  • the pre-adhesive tape 20 Z which does not have a proper gas release characteristic is used. By heating the pre-adhesive tape 20 Z to make the gas release characteristic proper, the adhesive tape 20 is prepared.
  • the invention is not limited to the procedure.
  • the adhesive tape 20 having a proper gas release characteristic can be prepared from the beginning, the adhesive tape 20 can be used as it is. Naturally, the work of preparing the adhesive tape 20 by heating the pre-adhesive tape 20 Z is unnecessary.
  • FIG. 5 is a flowchart for explaining the flow of the solar battery manufacturing method.
  • FIGS. 6 to 8 are used for explaining the procedure of manufacturing a solar battery.
  • FIG. 9 is a schematic plan view of a solar battery manufactured by using the solar battery manufacturing method shown in FIGS. 5 to 8 .
  • FIGS. 6 to 8 are cross sections taken along line A-A of the solar battery shown in FIG. 9 .
  • the arrow attached to the line A-A indicates the direction of the sectional configuration shown in FIGS. 6 to 8 .
  • FIG. 5 shows a process of forming a part corresponding to the section taken along line A-A of the solar battery.
  • the plastic film 1 is adhered to the holding frame 10 via the adhesive tape 20 which is, for example, prepared by heating the pre-adhesive tape 20 Z under the heating conditions of 200° C. and 120 minutes, the plastic film 1 is held by the holding frame 10 and, after that, the plastic film 1 is subjected to the following series of processes in a state where the plastic film 1 is held by the holding frame 10 .
  • the adhesive tape 20 which is, for example, prepared by heating the pre-adhesive tape 20 Z under the heating conditions of 200° C. and 120 minutes
  • a plurality of solar cells as electronic devices are pattern-formed in a lump in parallel on the plastic film 1 held by the holding frame 10 and, after that, the plastic film 1 is diced into the solar cells, thereby manufacturing a plurality of solar batteries in a lump.
  • the holding frame 10 and the adhesive tape 20 are not shown but only the plastic film 1 is shown.
  • a solar cell 30 is provided on the plastic film 1 .
  • the solar cell 30 includes, mainly, four photoelectric converting units 31 to 34 each having an almost fan shape and five contact electrode layers 35 to 39 for electrically connecting the photoelectric converting units 31 to 34 .
  • the photoelectric converting units 31 to 34 are connected in series via the contact electrode layers 35 to 39 .
  • a groove 54 for guiding the contact electrode layer 35 to the back side of the plastic film 1 is provided.
  • the plastic film 1 is cleaned as necessary. After that, for example, as shown in FIG. 6 , by forming a film made of a conductive material such as aluminum (Al) by using sputtering, a bottom electrode layer 41 as a conductive film is formed so as to cover the plastic film 1 (step S 201 in FIG. 5 ). Subsequently, by forming a film of a semiconductor material such as a non-single crystal silicon by using plasma CVD, a photoelectric converting layer 42 as a semiconductor film is formed so as to cover the bottom electrode layer 41 (step S 202 in FIG. 5 ).
  • a photoelectric converting layer 42 as a semiconductor film is formed so as to cover the bottom electrode layer 41.
  • the photoelectric converting layer 42 converts photo energy into electric energy by using a photoelectric effect.
  • the photoelectric converting layer 42 is formed so as to have, for example, a p-i-n structure in which a p-type semiconductor layer, an i-type semiconductor layer, and an n-type semiconductor layer are stacked.
  • the plastic film 1 is influenced by heat generated at the time of plasma CVD and, by thermal contraction, uniformly stretched so as not to include a wrinkle, so that the surface of the plastic film 1 becomes flat. Since the plasmas are uniformly spread in the whole surface of the plastic film 1 at the time of plasma CVD, the thickness of the photoelectric converting layer 42 becomes uniform.
  • insulating layer patterns 43 and 44 as pattern films are formed so as to become ring patterns having different diameters on the photoelectric converting layer 42 (step S 203 in FIG. 5 ).
  • a film is formed of a transparent electrode material such as ITO (Indium Tin Oxide) by using sputtering, thereby forming a top electrode layer 45 as a conductive film so as to cover the insulating layer patterns 43 and 44 and the photoelectric converting layer 42 in the periphery of the insulating layer patterns 43 and 44 (step S 204 in FIG. 5 ).
  • a stacked structure body having a configuration in which the bottom electrode layer 41 , photoelectric converting layer 42 , insulating layer patterns 43 and 44 , and top electrode layer 45 are stacked is formed on the plastic film 1 .
  • the stacked structure body as a film to be patterned is selectively irradiated with a laser beam so as to selectively melt the stacked structure body in a pattern, thereby forming four grooves 51 to 54 (step S 205 in FIG. 5 ).
  • a laser beam for example, a YAG (Yttrium Aluminum Garnet) laser (having a spot diameter of 80 ⁇ m ⁇ ) is used.
  • laser scribing a groove forming process using the laser will be called “laser scribing”.
  • the contact electrode layer 35 is formed in a circular pattern and its one end is exposed from the back side of the plastic film 1 via the groove 54 .
  • the photoelectric converting unit 31 having a stacked structure in which the bottom electrode layer 41 , photoelectric converting layer 42 , insulating layer patterns 43 and 44 , top electrode layer 45 , and insulating layer patterns 46 and 47 are stacked is formed and the contact electrode layer 35 is formed. Thereby, the portion corresponding to the section taken along line A-A of the solar battery is completed.
  • the process of forming the portion (the photoelectric converting unit 31 and the contact electrode layer 35 ) corresponding to the section taken along line A-A of the solar battery has been described as the solar battery manufacturing method, by using the manufacturing process, specifically, the process of forming the bottom electrode layer 41 and the top electrode layer 45 as conductive films, the process of forming the photoelectric converting layer 42 as a semiconductor film by the CVD, the process of forming the insulating layer patterns 43 , 44 , 46 , and 47 by using the screen printing method, and the process of patterning a film to be patterned by using a laser (laser scribing), portions corresponding to sections other than the section taken along line A-A of the solar battery (the photoelectric converting units 32 to 34 and the contact electrode layers 36 to 39 ) can be similarly formed.
  • the manufacturing process specifically, the process of forming the bottom electrode layer 41 and the top electrode layer 45 as conductive films, the process of forming the photoelectric converting layer 42 as a semiconductor film by the CVD, the process of
  • a solar battery is manufactured by forming the solar cell 30 on the plastic film 1 held by using the substrate holding method of the invention. Consequently, as described above, the release quantity of unnecessary gas released from the adhesive tape 20 during the solar battery manufacturing process is suppressed.
  • the performance of the solar battery can be improved.
  • the plastic film 1 is uniformly stretched by being thermally contracted due to the influence of heat generated during the solar battery manufacturing process, and the surface of the plastic film 1 becomes flat, so that plasmas are uniformly spread in the whole surface of the plastic film 1 at the time of plasma CVD. Therefore, the thickness of the photoelectric converting layer 42 can be controlled to be uniform in the film plane.
  • a solar battery was manufactured by the solar battery manufacturing method of the invention.
  • a solar cell was formed on the plastic film held by the holding frame by the procedure which will be described below, thereby manufacturing a solar battery. Specifically, first, the plastic film was subjected to ultrasonic cleaning as necessary and, after that, a film made of aluminum was formed by sputtering, thereby forming a bottom electrode layer so as to cover the plastic film. Subsequently, by forming a film of non-single crystal silicon by using plasma CVD, a photoelectric converting layer having the p-i-n structure was formed so as to cover the bottom electrode layer. After that, an insulating layer pattern was formed on the photoelectric converting layer by pattern printing using the screen printing method.
  • a plurality of contact electrode layers were formed so as to bury the through grooves and the top electrode layer and the insulating layer pattern in the periphery of the through grooves.
  • a plurality of photoelectric converting units having the stacked structure in which the bottom electrode layer, photoelectric converting layer, insulating layer pattern, top electrode layer, and insulating layer pattern are stacked were formed, the plurality of contact electrode layers were formed, and the photoelectric converting units were connected in series via the contact electrode layers, thereby completing a solar battery.
  • Table 1 indicates the gas release characteristic based on the result of the gas chromatograph mass spectrometry.
  • Table 1 the component number, retention time (minutes), gas quantity ( ⁇ g/g), gas total quantity, and qualification result are shown with respect to each of the pre-adhesive tape and the adhesive tape.
  • an analyzer constructed by connecting the Curie point head space sampler JHS-100A manufactured by Japan Analytical Industry Co., Ltd. to the gas chromatograph mass spectrometer GC-MS QP-5050A manufactured by Shimadzu Corporation was used and an analyzing work was done in the following procedure.
  • a sample tube made of glass and mounted on the analyzer was filled with 10 mg of a sample (the pre-adhesive tape and the adhesive tape) and was heated under the heating conditions of 180° C. and 10 minutes while flowing helium (He) gas as a purge gas into the sample tube at a flow rate of 50 mL/min.
  • He helium
  • 1% of the helium gas was introduced when the injection temperature of a sample introduction part was 300° C. and the sample split ratio was 100.
  • the scan mode m/z was set to 33 to 350 and the interface temperature was set to 300° C.
  • the gas release characteristic of the adhesive tape used Example 2 was also similarly examined.
  • the total quantity of the gas related to the adhesive tape was 100.5 ⁇ g/g and is much lower than that of the pre-adhesive tape. Consequently, it was recognized that the quantity of gas released from the pre-adhesive tape subjected to the heating process decreases by performing the heating process on the pre-adhesive tape, so that the pre-adhesive tape can be converted to the adhesive tape by using the heating process.
  • Table 2 shows the power generating performances of the solar batteries.
  • Table 2 shows, as factors of determining the power generating performance of a solar battery, open circuit voltage Voc (V), short-circuit current Isc (mA), fill factor FF, and power generating efficiency (%).
  • the total quantity of gas ⁇ g/g is also shown.
  • data in the columns of “Examples 1 and 2” indicates the performance results of the solar batteries manufactured by using the solar battery manufacturing methods of Examples 1 and 2.
  • Data in the columns of “Comparative Example” indicates the performance result of the solar battery manufactured by using the solar battery manufacturing method of Comparative Example.
  • Example 2 Total quantity of gas ( ⁇ g/g) 718.0 55.0 100.5 Open circuit voltage Voc (V) 0.82 0.86 0.86 Short-circuit current Ics (mA) 13.5 16.2 16.0 Fill factor FF 0.622 0.730 0.725 Power generating efficiency (%) 6.89 10.20 9.98
  • the gas release characteristic of an adhesive tape total quantity of gas detected when analysis using the gas chromatograph mass spectrometry was conducted under the test conditions of 180° C. and 10 minutes
  • the power generating performance of the solar battery in the case where the gas total quantity is 100.5 ⁇ g/g or less in n-tetradecane, an excellent power generating performance was obtained.
  • the substrate holding method of the invention may be applied to the method of manufacturing another electronic part other than the solar battery.
  • An example of the “another electronic part” is a TFT (Thin Film Transistor) element formed on an FPC substrate. Also in the case where the substrate holding method of the invention is applied to the “another electronic part”, effects similar to those of the foregoing embodiments and examples can be obtained.
  • the substrate holding method according to the invention can be applied to the method of manufacturing an electronic part typified by a solar battery.

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  • Photovoltaic Devices (AREA)
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JP2004087279A JP4737942B2 (ja) 2004-03-24 2004-03-24 太陽電池の製造方法
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US20110192452A1 (en) * 2010-02-11 2011-08-11 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and fabrication method thereof

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JP5732800B2 (ja) * 2010-09-30 2015-06-10 Tdk株式会社 太陽電池モジュール
JP6008181B2 (ja) * 2012-09-04 2016-10-19 カシオ計算機株式会社 ソーラーパネルおよび時計
US9398705B2 (en) * 2014-12-02 2016-07-19 Flextronics Ap, Llc. Stretchable printed electronic sheets to electrically connect uneven two dimensional and three dimensional surfaces
CN111922642A (zh) * 2020-08-05 2020-11-13 江西安维尔智能设备有限公司 动力电池的壳体成型方法

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US20050210666A1 (en) 2005-09-29

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