CN100386013C - 基体保持方法及电子元件制造方法 - Google Patents

基体保持方法及电子元件制造方法 Download PDF

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Publication number
CN100386013C
CN100386013C CNB2005100637415A CN200510063741A CN100386013C CN 100386013 C CN100386013 C CN 100386013C CN B2005100637415 A CNB2005100637415 A CN B2005100637415A CN 200510063741 A CN200510063741 A CN 200510063741A CN 100386013 C CN100386013 C CN 100386013C
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CN
China
Prior art keywords
solar cell
plastic film
splicing tape
gas
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2005100637415A
Other languages
English (en)
Chinese (zh)
Other versions
CN1674777A (zh
Inventor
师冈久雄
二宫英昭
岛村淳一
西和夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
TDK Corp
Original Assignee
Semiconductor Energy Laboratory Co Ltd
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd, TDK Corp filed Critical Semiconductor Energy Laboratory Co Ltd
Publication of CN1674777A publication Critical patent/CN1674777A/zh
Application granted granted Critical
Publication of CN100386013C publication Critical patent/CN100386013C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5193—Electrical connector or terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Landscapes

  • Photovoltaic Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CNB2005100637415A 2004-03-24 2005-03-24 基体保持方法及电子元件制造方法 Expired - Fee Related CN100386013C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP87279/2004 2004-03-24
JP87279/04 2004-03-24
JP2004087279A JP4737942B2 (ja) 2004-03-24 2004-03-24 太陽電池の製造方法

Publications (2)

Publication Number Publication Date
CN1674777A CN1674777A (zh) 2005-09-28
CN100386013C true CN100386013C (zh) 2008-04-30

Family

ID=34988003

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005100637415A Expired - Fee Related CN100386013C (zh) 2004-03-24 2005-03-24 基体保持方法及电子元件制造方法

Country Status (3)

Country Link
US (1) US7845071B2 (enExample)
JP (1) JP4737942B2 (enExample)
CN (1) CN100386013C (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101463925B1 (ko) * 2008-06-13 2014-11-27 주성엔지니어링(주) 박막형 태양전지 및 그 제조방법
US8704083B2 (en) * 2010-02-11 2014-04-22 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and fabrication method thereof
JP5728864B2 (ja) * 2010-09-22 2015-06-03 Tdk株式会社 太陽電池モジュール
JP5732800B2 (ja) * 2010-09-30 2015-06-10 Tdk株式会社 太陽電池モジュール
JP6008181B2 (ja) * 2012-09-04 2016-10-19 カシオ計算機株式会社 ソーラーパネルおよび時計
US9398705B2 (en) * 2014-12-02 2016-07-19 Flextronics Ap, Llc. Stretchable printed electronic sheets to electrically connect uneven two dimensional and three dimensional surfaces
CN111922642A (zh) * 2020-08-05 2020-11-13 江西安维尔智能设备有限公司 动力电池的壳体成型方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5448105A (en) * 1989-09-28 1995-09-05 Dia Nippon Printing Co., Ltd. Semiconductor device having a leadframe and metal substrate
CN1114467A (zh) * 1994-04-30 1996-01-03 佳能株式会社 透光树脂密封的半导体
JP2510281B2 (ja) * 1989-03-17 1996-06-26 株式会社富士電機総合研究所 薄膜太陽電池の製造方法
US20020037605A1 (en) * 2000-09-25 2002-03-28 Hideaki Ninomiya Method of supporting a flexible substrate and method of manufacturing a semiconductor device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3180623B2 (ja) * 1995-05-23 2001-06-25 住友金属鉱山株式会社 電子デバイス用支持板
JP3934177B2 (ja) * 1996-06-27 2007-06-20 Ｎｅｃ東芝スペースシステム株式会社 フレキシブルソーラパドル
JP2005109412A (ja) * 2003-10-02 2005-04-21 Fuji Photo Film Co Ltd レーザモジュール

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2510281B2 (ja) * 1989-03-17 1996-06-26 株式会社富士電機総合研究所 薄膜太陽電池の製造方法
US5448105A (en) * 1989-09-28 1995-09-05 Dia Nippon Printing Co., Ltd. Semiconductor device having a leadframe and metal substrate
CN1114467A (zh) * 1994-04-30 1996-01-03 佳能株式会社 透光树脂密封的半导体
US20020037605A1 (en) * 2000-09-25 2002-03-28 Hideaki Ninomiya Method of supporting a flexible substrate and method of manufacturing a semiconductor device

Also Published As

Publication number Publication date
CN1674777A (zh) 2005-09-28
US7845071B2 (en) 2010-12-07
JP2005277045A (ja) 2005-10-06
JP4737942B2 (ja) 2011-08-03
US20050210666A1 (en) 2005-09-29

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Granted publication date: 20080430

Termination date: 20180324