US5846110A - Method of manufacturing plasma display panels with convex surface - Google Patents

Method of manufacturing plasma display panels with convex surface Download PDF

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US5846110A
US5846110A US08/619,243 US61924396A US5846110A US 5846110 A US5846110 A US 5846110A US 61924396 A US61924396 A US 61924396A US 5846110 A US5846110 A US 5846110A
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glass plate
substrate
plate
thermal expansion
expansion coefficient
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Shinji Kanagu
Masashi Amatsu
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Maxell Ltd
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Fujitsu Ltd
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Assigned to HITACHI CONSUMER ELECTRONICS CO., LTD. reassignment HITACHI CONSUMER ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI PLASMA PATENT LICENSING CO., LTD.
Assigned to HITACHI MAXELL, LTD. reassignment HITACHI MAXELL, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI CONSUMER ELECTRONICS CO, LTD., HITACHI CONSUMER ELECTRONICS CO., LTD.
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/241—Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
    • H01J11/12—AC-PDPs with at least one main electrode being out of contact with the plasma with main electrodes provided on both sides of the discharge space
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/34—Vessels, containers or parts thereof, e.g. substrates

Definitions

  • This invention relates to a Plasma Display Panel, hereinafter referred to as a PDP, which is a kind of thin display devices.
  • PDPs excel in the visual sensation because PDPs are of a self-luminescent type, and is comparatively easy to accomplish a large and high-speed display which suits television displays. Especially, surface discharge type PDPs are suitable for a color display by the use of fluorescent materials.
  • PDPs have discharge spaces therein arranged on a substantially flat plane.
  • the panel envelope to form the external outline is provided by a pair of substrates opposed from each other via the discharge space. At least the substrate on the front side must be transparent. Soda lime glass plates are usually used for the substrates on the front side and the back side.
  • the height of the separator walls is equal to the gap clearance of the discharge spaces.
  • the separator walls lie straight on a plane and are provided at equal intervals in the direction of the line of the display, i.e. in the direction along which the display electrodes extend. Spread of the discharge is limited by the separator walls, whereby discrete discharge cells are defined. Accordingly, an accurate matrix display is accomplished.
  • the separator walls play the role of distance pieces, i.e., spacers, to provide equal gap clearance of the discharge spaces all over the display area, in which an unequal clearance may affect the discharge condition.
  • PDP The manufacturing process of a PDP is divided roughly into three processes. That is, PDP is completed after sequentially undergoing a process by which predetermined composition elements are formed on each substrate so as to make the front panel and the back panel, a process in which the front panel, and the back panel thus made respectively in this manner, are combined (sealed) with each other, and a process to fill a discharge gas therein after cleaning the inside. Usually, the front panel and the back panel are manufactured in parallel.
  • Main composition elements in surface discharge type PDPs are, for example, display electrodes, a dielectric layer for the AC drive, a dielectric layer protection film, electrodes for addressing the discharge cell to be lit, separator walls, and fluorescent material layers.
  • composition elements accompanies heat processes.
  • the substrate is heated at a sputtering or vacuum evaporation of a film forming process of the conductive layer.
  • a thick film material represented by a low melting point glass, is heated so as to melt.
  • the material and the heat process condition of each composition element were selected so as to allow no influences, such as the deformation or change in quality, on the previously formed composition elements.
  • the heating temperature of the second time is chosen lower than the heating temperature of the first time; and accordingly, the materials to be heated are chosen to correspond to the required heating temperatures.
  • the substrate is expanded and contracted. Therefore, in mass-production, most substrates are in a warped state when each panel is finished, even if a smooth substrate is employed for the front panel or the back panel. The warp of the substrate becomes remarkable as the PDP screen size, i.e. the outline dimension of the substrate, becomes larger.
  • the direction of the warp of the substrate was irregular. That is, sometimes the inner surface on which the composition elements have been formed becomes convex, which is referred to hereinafter as a "warp in a positive direction”; or sometimes, on the contrary, the warp is such that the inner surface becomes concave, which is referred to hereinafter as a "warp in a negative direction”. Therefore, there were problems as follows.
  • FIGS. 1A to 1C schematically illustrate a cross-sectional view of panel shapes in the prior art sealing steps.
  • FIGS. 1A to 1C there are partially omitted the composition elements in order to make the figure simple, and the warp of the substrate is exaggerated.
  • a glass substrate 110 having a display electrode 120 thereon and a glass substrate 210 having plural separator walls 290 thereon are sealed with each other.
  • low melting-point glass layers 310 as the sealant are placed on the edges of glass substrate 210, the thickness of the low melting point glass layers 310 being chosen to be higher than the height of separator walls 290.
  • Glass substrate 110 and glass substrate 210 are stacked with each other as shown in FIG. 1(a).
  • the pair of glass substrates 110 & 210 is heated while pressed to each other so that low melting-point glass layer 310 is melted. Subsequently, the substrate temperature is lowered so that glass substrate 110 and glass substrate 210 are sealed with each other as shown in FIG. 1B.
  • a gap g is undesirably created between separator walls 290 and the inner surface of the glass substrate 110 unless a warp in a positive direction to counter the warp of the glass substrate 110 is on the opposite glass substrate 210 having separator walls 290.
  • the gap g is created because glass substrate 210 is flat.
  • the gap g does not completely disappear even though the deformation of glass substrate 110 allows the gap to become smaller than that at the beginning of the sealing operation. Therefore, there was a problem in that the display fell into disorder by the generation of so-called cross-talk caused from an excessive spread of the electrical discharge through the gap g between the substrate and the top of separator walls.
  • the front substrate and the back substrate are respectively in a warped state such that a central portion of each substrate projects in a frontwards direction relatively to a peripheral portion of the substrate, so that the front surface is convex.
  • a height difference of the central portion measured from a central part of a short side of a substrate divided by a longitudinal width of the substrate is preferably less than 0.1% for the front substrate and the back substrate, respectively.
  • a height difference ratio of the central portion from a central part of a short side of the back substrate is preferably less than 0.16%.
  • a height difference ratio of the central portion from a central part of a short side of the front substrate is preferably less than 0.06%.
  • a difference of the height difference ratios of the back substrate and the front substrate is preferably in the range from 0 to 0.1 percentage point.
  • FIGS. 1A through 1C schematically illustrate a segmented, cross-sectional view of a prior art PDP, where the warping of the panel is exaggerated;
  • FIG. 2 schematically illustrates a perspective view of necessary internal parts of a PDP of the present invention
  • FIG. 3 schematically illustrates electrode structure of the PDP
  • FIGS. 4 schematically illustrates general electrode configuration of the PDP
  • FIG. 5 is a flow chart of manufacturing processes of the PDP
  • FIG. 6 schematically illustrates a warped state of the panels at a manufacturing step
  • FIGS. 7A through 7C schematically illustrate the sealing process of the PDP
  • FIGS. 8A through 8D schematically illustrate a method to warp the panel
  • FIG. 9 is a temperature profile in accordance with the method shown in FIGS. 8;
  • FIGS. 10A through 10D schematically illustrate a second preferred embodiment of warping the panel
  • FIG. 11 schematically illustrates a warp of a substrate, and paths along which the warp is measured.
  • FIG. 12 shows experimental data to find preferable conditions.
  • FIG. 2 is a partially notched perspective view of the external appearance showing the warped state of a PDP 1 of the present invention, where the warped state is exaggerated.
  • the panel envelope is formed of a pair of glass substrates 11 and 21 which are opposed to each other via discharge spaces 30.
  • These glass substrates 11 and 21 are transparent and rectangular soda lime glass plates of 2.1 ⁇ 0.07 mm in thickness, and are connected with each other by a framed, or peripheral, sealing layer 31 which consists of low melting-point glass arranged on the peripheral edge portions of the mutually opposing areas of the substrates 11 and 12.
  • PDP 1 is used while connected with a driving circuit formed on a flexible printed circuit board, which is not shown in the figure.
  • the respective outside dimensions as well as mutual positions of the mutually opposing glass substrates 11 & 21 are chosen so that two mutually opposing sides of glass substrates 11 & 21 extend several mm beyond the edges of two mutually opposing sides of the other glass substrates 21 & 11, respectively, as seen in FIGS. 2 and 4. Concrete values of the external dimension will be shown later.
  • the feature of external appearance of PDP 1 is such that the glass substrates 11 and 21 are not flat but are warped in a convex shape at the front surface such that the central portion of the PDP projects toward the front viewing side, i.e., in a direction from the back to the front, and thus frontwardly convex.
  • the degree of the warp is very minute and the display surface is substantially flat as described later.
  • FIG. 3 is a perspective view to show an internal structure of a necessary part of PDP 1.
  • PDP 1 is a surface discharge type PDP of a three--electrode structure of the matrix display type, and is classified as a reflection type according to the arrangement form of the fluorescent materials.
  • the line pitch is 660 ⁇ m.
  • Display electrodes X & Y are each respectively formed of a wide and straight transparent electrode 41, which consists of an ITO (indium/tin oxide) thin film, and a narrow and straight bus electrode 42, which consists of a metal thin film, for example Cr/Cu/Cr, of a multi-layer structure.
  • ITO indium/tin oxide
  • bus electrode 42 which consists of a metal thin film, for example Cr/Cu/Cr, of a multi-layer structure.
  • Table 1 shows an example of the concrete dimensions of transparent electrode 41 and bus electrode 42.
  • Bus electrode 42 is a supplementary electrode to secure proper electrical conductivity, and is arranged on a surface of transparent electrode 41 opposite from the discharge gap, and on a side edge of that surface. Such an electrode structures allow an enhancement of the luminous efficiency by the expansion of the surface discharge area while limiting the shading of the display light to a minimum.
  • a dielectric layer 17 for the AC drive typically formed of a low melting-point glass layer PbO family is provided to insulate display electrodes X & Y from discharge spaces 30.
  • a protection film 18 formed of MgO (magnesium oxide) is vapor-deposited on the surface of dielectric layer 17. Thickness of dielectric layer 17 is about 30 ⁇ m. Thickness of protection film 18 is about 5000 ⁇ . Dielectric layer 17 is composed of two layers of a lower dielectric layer 17A and an upper layer 17B, which are of substantially equal thickness as shown in FIG. 6, in order to suppress generation of bubbles as well as to provide a smooth surface.
  • the inner surface of back glass substrate 21 is uniformly covered with an undercoat layer 22 of about 10 ⁇ m in thickness which consists of a low melting--point glass of ZnO family.
  • Address electrodes A are arranged on undercoat layer 22, each spaced by a constant pitch (220 ⁇ m) so as to be orthogonal to display electrodes X and Y.
  • Address electrode A is formed by baking a silver paste, where the thickness is about 10 ⁇ m.
  • Undercoat layer 22 is to prevent an electromigration of the silver of address electrode A.
  • dielectric layer 17 The accumulation of the wall charge on dielectric layer 17 is controlled by the electrical discharge between address electrode A and display electrode Y opposing with each other.
  • Address electrode A is covered with a dielectric layer 24 which consists of the low melting point glass of the same composition as undercoat layer 22. Dielectric layer 24 upon address electrode A is about 10 ⁇ m thick.
  • Discharge space 30 is divided by separator walls 29 into each unit luminescent area along the direction of the line (direction of the picture element array parallel to display electrodes X and Y), whereby the gap clearance of discharge space 30 is defined as well.
  • fluorescent layers 28R, 28B and 28G where R, G and B represent three primary colors for a full displaying, i.e. red, green, and blue, respectively, and will be simply denoted hereinafter with 28 when colors need not be specifically distinguished, so as to cover the surfaces of dielectric layer 24 over address electrodes A together with the sides of separator walls 29.
  • These fluorescent layers 28 emit lights by being excited by ultraviolet rays generated by the surface discharge.
  • a single picture element (pixel) of the display is composed of three adjacent unit luminescent areas (sub-pixels) in each line L.
  • the luminescent color in each column is the same for each line.
  • FIG. 4 schematically illustrates a general electrode configuration of PDP 1, and an arrangement of each glass substrate 11 and 21, as seen from discharge spaces 30.
  • a single line of the display matrix is formed with a pair of display electrodes X & Y, and a single column corresponds to a single address electrode A; further, sub-pixels on three columns form a single pixel.
  • Specification of the screen of PDP 1 is shown in Table 2.
  • a peripheral, or frame, area a31 Upon a peripheral, or frame, area a31, designated with slashes in FIG. 4, is the sealing layer 31 (shown in FIG. 2) where glass substrates 11 and 21 are to be sealed with each other. Width of the slashed frame a31 is 3-4 mm. Assuming that these substrates are flat, the typical sizes are given below, though glass substrates 11 and 21 are somewhat warped as described above.
  • Front glass substrate 11 is of such dimensions that the horizontal outside dimension w1 (i.e. along the direction of the lines) is 460 mm, and the vertical outside dimension v1 (i.e. along the columnwise direction) is 336 mm, where both of the horizontal ends project outwardly from the sealing area a31 by 7 mm, respectively.
  • All the display electrodes X are lead out to an edge on a horizontal end of the glass substrate 11, and all the display electrodes Y are lead out to another edge on another end. Display electrodes X are connected all together to a common terminal Xt in order to simplify the driving circuit and, accordingly, are electrically common.
  • each of the display electrodes Y is independent to provide the line scan of the sequential order of the lines; accordingly, they are individually connected to respective, discrete terminals Yt.
  • Discrete terminals Yt are divided into, for example, three groups, each of 160 lines, and are connected with driving circuits not shown in the figure via three flexible printed-wiring cables, in each of which the lines in a group are lumped together.
  • back glass substrate 21 The dimensions of back glass substrate 21 are such that the horizontal outside dimension w2 is 446 mm and the vertical outside dimension v2 along the columnwise direction, i.e. along the address electrode direction, is 350 mm, where both the ends in the vertical direction project outwardly from sealing area a31 by 7 mm, respectively.
  • Discrete terminals At thus divided into two groups, each of 960, are further divided into five sub-groups, each of 192.
  • the application of the mechanical pressure thus distributed into the subgroups allows shorter width of the flexible printed-wiring cables, whereby breaking of the glass substrate caused from the mechanical pressure application on a wide area is prevented.
  • the sealing area a31 the area in which the discharge cells are determined by display electrodes X & Y and address electrode A is an effective display area a1, that is the screen. Between effective display area a1 and sealing area a31 is provided a non-display area a2 of a framed shape in order to avoid an influence of the outgrassing from the sealant. As for each side of the non-display areas a2, the width of the side having exhaust hole 210 is about 15 mm, and the widths of three other sides are about 4 mm.
  • separator walls 29 are to define the discharge spaces in effective display area a1. Accordingly, both the ends of each separator wall 29 are away from sealing area a31 by about 4 mm only. Therefore, the discharge spaces 30 between each separator wall 29 are mutually joined, and can be exhausted as well as filled with the discharge gas through the single exhaust hole 210.
  • FIG. 5 is a flow-chart showing the production process of PDP 1.
  • FIG. 6 schematically illustrates the warped states during the production.
  • FIGS. 7 schematically illustrate the sealing processes.
  • a front panel 10, shown in FIG. 6, supported by a glass substrate 11 as a support body is first made in a front panel process P10 (FIG. 5), and a back panel 20 supported by a glass substrate 21 as a support body is manufactured concurrently in a back panel process P20 (FIG. 5).
  • a sealing process P30 (FIG. 5) the pair of front panel 10 and back panel 10 is arranged to oppose each other (P31), so that the panel envelope is formed in a sealing process P32 as described below, at which the peripheral (frame) areas of both the panels are sealed with each other.
  • PDP 1 is completed after sequentially passing an exhaust process (P41) at which an internal impurity gas is exhausted with a vacuum pump, and a process P42 at which a discharge gas, a mixture of neon and a small amount of xenon, is filled therein. Pressure of the discharge gas is about 500 Torr.
  • discharge spaces 30 are completely sealed up by tipping off exhaust tube 60; as well as PDP 1 is separated from the external piping system.
  • aging process P51 is performed such that the full screen is lit for tens of hours.
  • PDP 1 which passes an inspection P52 afterwards is shipped as a commodity.
  • Front panel 10 is composed of glass substrate 11 and five structural elements of the first group E10, i.e. transparent electrode 41, bus electrode 42, lower dielectric layer 17A, upper dielectric layer 17B and protection film 18, as shown in FIG. 6.
  • Front panel process P10 is composed of a total of five process steps P11 to 15, respectively corresponding to each of the five structural elements.
  • Transparent electrodes 41 and bus electrodes 42 are patterned by a photolithography method in the lump together with all display electrodes X and Y.
  • Lower dielectric layer 17A and upper dielectric layer 17B are formed by baking low melting-point glass.
  • Back panel 20 is composed of glass substrate 21 and five structural elements of the second group E20, i.e. substrate layer 22, address electrodes A, dielectric layer 24, separator walls 29 and fluorescent layers 28.
  • Back panel process P20 is composed of five process steps P21 to 25, respectively corresponding to each of the five structure elements, and a process P26 to provide the sealant material 31a formed of a low melting point glass layer particular for the sealing, on the sealing area a31.
  • the methods of forming separator walls 29 include a method of printing the low melting-point glass paste in stripes and baking thereof, or a method of printing the low melting point glass paste on the whole surface of the effective display area a1 and afterwards physically or chemically patterning thereof.
  • the patterning process may be performed after the paste is baked; however, if a sand-blast is employable, it is preferable in the view point of better controlling of the etching that the procedure is such that the paste layer is patterned first in a dry state and afterwards the paste layer is baked. Moreover, it is also possible to bake separator walls 29 at the same time as the baking process of dielectric layer 24.
  • Fluorescent layers 28 can be easily formed by printing the paste of fluorescent material on a predetermined column, i.e. between the separating walls, for each luminescent color, and baking the paste of the respective three colors all together.
  • fluorescent layer 28 can be widely coated to include the sides of separator walls 29; accordingly, the brightness of the display can be enhanced.
  • the material of each composition element and the annealing condition in each process are selected so that the influences, such as the deformation and change in the quality, should not appear to the composition elements formed in the previous process.
  • compositions of lower dielectric layer 17A, upper dielectric layer 17B, the back panel dielectric materials, i.e. undercoat layer 22 and dielectric layer 24, are collectively shown in Table 6.
  • both front panel 10 and back panel 20 are prepared to be warped intentionally in the positive direction as shown exaggeratedly in FIG. 6 in front panel process P10 and back panel process P20, respectively, where the warp in the positive direction is defined such that the surface, which is to be an inner surface when PDP1 is completed, i.e. on which the structural elements on glass substrates 11 & 21 are formed, is convex.
  • the warp in a negative direction is defined such that the inner surface of glass substrate 11 or 21 is concave.
  • the second point is that the degree of the warp of back panel 20 is larger than that of front panel 10.
  • the preferable amount of the front panel is 0.06% or less.
  • warp is in the range 0.06 to 0.16% while the difference between the respective warps of the front and back panels is from 0 to 0.1 percentage points. If the warp of the front panel or the back panel is respectively more than 0.16% or 0.06%, the panel cracks in the sealing process.
  • the front panel may become concave to cause the discharge spread. If the difference is larger than 0.1 point, the panel may cause a crack. For instance, when the degree of the warp of front panel 10 is selected to be 0.05% the degree of the warp of back panel 20 is selected to be a value within the range of 0.05 to 0.15%.
  • the outline dimensions w1' & 'W2' are substantially equal to the corresponding outline dimensions w1 & w2 in the flat state, as presented with formula w1' ⁇ w1 and w2 ⁇ 'w2, because the outline dimensions w1' & 'W2' are the straight distance between both the ends of each glass substrates 11 & 21, and the degree of the warp is only a little.
  • a PDP 1 having 0.1% or less of the warp such that the center part projects slightly in a direction from the back to the front side, as shown in FIG. 1, is accomplished by the employment of front panel 10 and back panel 20 warping in the positive direction, respectively. Even when the mechanical pressure is applied onto to the glass substrate for the anisotropic conductive film batch wiring, glass substrate 11 or 21 of thus made PDP 1 does not crack or break owing to the little degree of the warp at the area of the single batch wiring.
  • PDPs are structural devices where the front panel and the back panel are sealed with each other at the peripheral area, but the central areas merely touch, without being mechanically connected with each other. Due to such a structure, the intentional warping of both the panels at the step prior to the sealing process contributes to the improvement of reliability.
  • front panel 10 and back panel 20 are stacked so that the two convex surfaces are facing each other as shown with chain lines in FIG. 7(a). Then, all the four sides of the panels are pinched by clips 70 so that both the panels are mutually held together. Both the panels are elastically deformed by the pinching force of clips 70, so that front panel 10 changes from the state of the positive warp to the state of the negative warp as shown with the solid lines in FIG. 7(a).
  • separator walls 29 touch front panel while in the peripheral portion, separator walls 29 are away (i.e., displaced) from front panel 10, because the thickness of sealant layer 311a is higher than the height of separator walls 29.
  • both the panels are heated up to about 410° C. while pinched with clips 70 so as to melt the sealant layer 31a.
  • the gap at the peripheral portion are narrowed as sealant layer 31a softens.
  • all separator walls 29 finally touch front panel 10 as shown in FIG. 7(b).
  • the internal spaces are properly defined by separator walls 29,
  • the temperature of the panels is lowered to an ordinary temperature, i.e. a room temperature, by forced cooling or natural cooling.
  • sealant layers 31a are hardened so as to becomes a sealing layer 31 to seal the panels.
  • front panel 10 before the sealing process the front panel 10 may be flat as long as back panel 20 warps in a positive direction. However, if front panel 10 is warped in the negative direction at the step before the sealing process, a gap may be generated between front panel 12 and separator walls 29 after the sealing process.
  • both back panel 20 and front panel 10 must be actually warped in the positive direction in the step before the sealing process.
  • a method according to the present invention to prepare the warped front panel 10 and back panel 20 is hereinafter explained.
  • FIGS. 8 schematically illustrates a typical method to warp the panels.
  • FIG. 9 is a graph to qualitatively show a profile of baking temperature corresponding to FIG. 8.
  • glass substrate 11 for a front panel is typically referred to in FIG. 8, glass substrate 21 can be similarly warped for the back panel, as well.
  • a support body 90 in baking the thick film material such as the low melting-point glass, a support body 90, as a. setter, formed of a material having a thermal expansion coefficient smaller than that of glass substrate 11 is employed.
  • a quartz board typically of a trade name NEOCERAM NO, which has a thermal expansion coefficient of about -5 ⁇ 10 -7 /° C., accordingly, shrinks as the temperature rises, is the most suitable.
  • the thermal expansion coefficient of glass substrate 11 is about 90 ⁇ 10 -7 /° C.
  • a surface S90 of support body 90 is a little etched as to be sufficiently so rough that glass substrate 11 cannot slip on support body 90.
  • Glass substrate 11 is chamfered, where the chamfered surface S1a is rough like a ground glass plate.
  • Support body 90 carrying glass substrate 11 thereon is put into a baking furnace, for instance, of an inline type. As the temperature rises, glass substrate 11 expands and support body 90 relatively shrinks as shown with the arrows in FIG. 8B. When above-mentioned quartz board is used for the support body 90, support body 90 actually shrinks.
  • the heating process is carried out generally in two steps as shown in FIG. 9. That is, at first the temperature is raised from room temperature TTM to a predetermined temperature T1; next, temperature T1 is maintained for a predetermined fixed time so as to evaporate the binder of the paste. Next, the temperature is raised from temperature T1 to a temperature T4 which exceeds a softening point T2 of the low melting-point glass so as to adequately melt the low melting point glass; and subsequently cooled.
  • the highest temperature T4 for the baking is set in the vicinity of deformation point T3 of glass substrate 11. Accordingly, the stress generated in glass substrate 11 by warping due to the thermal expansion is decreased, that is annealed. If the cooling operation is performed after the stress is annealed, glass substrate 11 does not return to its state previous to the heating operation, but becomes a state such that it remains warped in the positive direction as shown in FIG. 8D. That is, the method of FIG. 8 is such a method that glass substrate 11 is warped by the use of non-reversibility of the heat expansion/contraction in the glass material.
  • Deformation point T2 of glass substrates 11 and 21 having the composition shown in Table 5 is about 570°-590° C. Therefore, in manufacturing PDP 1 the method of FIG. 8 can be applied to the process P13 for forming the lower dielectric layers 17A and to the process P23 for forming dielectric layer 24 on the back panel.
  • glass substrate 11 or 21 If glass substrate 11 or 21 is excessively heated, the glass substrates deforms by its own weight as shown with chains in FIG. 8C. That is, the desired warp is not achieved. Therefore, it is important to design the temperature profile in consideration of this respect.
  • FIGS. 10A to 10D schematically illustrate a second preferred embodiment of the warping method.
  • front glass substrate 11 is referred to in FIGS. 10
  • back glass substrate 21 can be warped in the similar way, as well.
  • a material having a smaller thermal expansion coefficient than that of each of the glass substrate 11 and 21 is employed for the widely spreading uniform thick film material such as dielectric layer 17 or 24.
  • Thermal expansion coefficient of the material of the composition of Table 6 is within the range of 70 ⁇ 10 -7 /° C. to 80 ⁇ 10 -7 /° C.
  • a paste 170 which is a mixture of low melting point glass powder 171 and binder 172 is printed on glass substrate 11; next, the glass substrate 11 is carried into the baking furnace so as to heat paste 170 as shown in FIG. 10A. As the temperature rises, the glass substrate 11 expands.
  • glass substrate 11 expands substantially freely because individual particles of low melting-point glass powder 171 are distributing in binder 172. As binder 172 evaporates, low melting-point glass powder 171 melts so as to form the lower dielectric layer 17A as shown in FIG. 10B. In the subsequent cooling step, glass substrate 11 and the lower dielectric layer 17A contract as shown in FIG. 10C. At this time, glass substrate 11 warps in the positive direction as shown in FIG. 10D. because the degree of the contraction of glass substrate 11 is larger than that of lower dielectric layer 17A caused from the difference of the thermal expansion coefficient of lower dielectric layer 17A.
  • a temperature distribution is provided along the direction of the thickness of glass substrate 11 or 21 during the cooling operation. That is, after the lower surface of glass substrate 11 or 21 is quickly cooled so as to contract, the substrate is slowly cooled together with the melted layer. Thus, glass substrate 11 or 21 having a warp resulted from the quick cool is accomplished.
  • the conditions for front panel process P10 and back panel process P20 are chosen so as to obtain the panels having the above-mentioned proper warps by suitable combination of the three above-mentioned methods.
  • Each of the three methods can be selectively combined for use in the formation of a single composition element, such as lower dielectric layer 17A or dielectric layer 24.
  • FIG. 11 schematically illustrates an exaggerated shape of a warped substrate and the paths P h & P v along which the surface heights were measured.
  • Each path starts from a center, where the heights are h 1 or h 4 , of a side of the substrate to travel along respective paths to the respective opposite side, where the heights are h 3 or h 6 .
  • the heights h2 & h5 respectively of the horizontal path and the vertical path become equal if the warp is symmetric.
  • the heights are measured with a dial gauge, which is not shown in the figure, while traveling along the above-described paths.
  • the percentage of the height is for the horizontal width w1'.
  • both the substrates may warp backwardly (i.e., be backwardly convex, thus frontwardly concave) the view point of controlling the gap.
  • the convex viewing surface is more preferable than the concave viewing surface.
  • the structure of PDP 1, including the size, the material, shape, and the formation method etc. of the composition elements may be variously modified.
  • address electrode A formed of the baked silver paste can be replaced with a thin film electrode so as to omit under coat layer 22.
  • the accurate contact between the separator walls to the surface of the opposing panel allows the perfect division of spaces 30 by separator walls 29; accordingly, a high quality display having no cross-talk of colors can be achieved in the simply structured PDP 1 having straight separator walls 29 on a back panel 20, only.
  • the damage of the substrate in connecting an outside driving circuit thereto can be decreased so that the productivity of the plasma display panel can be improved.
  • a cross-talk, i.e. an undesirable impurity, of the lit colors caused from excessive spread of the discharges through the gap between the separator walls and the facing substrate into the adjacent discharge space can be decreased so that the high quality in colors can be achieved.
  • a plasma display panel larger than 21 inches first has come to be realized.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
US08/619,243 1995-06-30 1996-03-21 Method of manufacturing plasma display panels with convex surface Expired - Lifetime US5846110A (en)

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JP16577595A JP3212837B2 (ja) 1995-06-30 1995-06-30 プラズマディスプレイパネル及びその製造方法

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US20050035715A1 (en) * 1998-06-15 2005-02-17 Hiroyuki Kado Plasma display panel with superior light-emitting characteristics, and method and apparatus for producing the plasma display panel
US6997769B2 (en) * 2000-01-07 2006-02-14 Pioneer Corporation Plasma display panel manufacturing apparatus and manufacturing method
US20060044744A1 (en) * 2004-08-24 2006-03-02 Sok-San Kim Plasma display device
US20060244381A1 (en) * 2003-05-20 2006-11-02 Kim Seak K Pdp having additional thin layers in the electrode pad
US7244901B1 (en) * 2006-04-11 2007-07-17 Danotech Co., Ltd. Capacitive touch panel
US20090284904A1 (en) * 2008-05-16 2009-11-19 Jer-Yao Wu Curved Display Panel and Method for Manufacturing the same
US20120026666A1 (en) * 2008-12-31 2012-02-02 Crooijmans Wilhelmus Display assembly for a computing device
US20120081874A1 (en) * 2010-09-30 2012-04-05 E Ink Holdings Inc. Curved display module and display device
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JP4111749B2 (ja) * 2002-05-17 2008-07-02 日立プラズマディスプレイ株式会社 プラズマディスプレイパネル
KR100515845B1 (ko) 2003-10-09 2005-09-21 삼성에스디아이 주식회사 플라즈마 디스플레이 패널 및 플라즈마 디스플레이 패널의후면 패널 제조방법
US7285914B2 (en) * 2003-11-13 2007-10-23 Samsung Sdi Co., Ltd. Plasma display panel (PDP) having phosphor layers in non-display areas
KR20050077751A (ko) * 2004-01-29 2005-08-03 아사히 가라스 가부시키가이샤 평판 디스플레이용 외부용기 및 그것을 사용한 평판디스플레이
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JP4835318B2 (ja) * 2006-08-10 2011-12-14 パナソニック株式会社 プラズマディスプレイパネルおよびその製造方法
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US8773856B2 (en) * 2010-11-08 2014-07-08 Graftech International Holdings Inc. Method of making an electronic device
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WO2016147230A1 (ja) * 2015-03-19 2016-09-22 パナソニックＩｐマネジメント株式会社 湾曲ディスプレイ装置

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US6758714B2 (en) * 1996-12-16 2004-07-06 Matsushita Electric Industrial Co., Ltd. Gas discharge panel and method for manufacturing the same
US20020009536A1 (en) * 1996-12-17 2002-01-24 Yuichiro Iguchi Method and apparatus for producing a plasma display
US7455879B2 (en) * 1996-12-17 2008-11-25 Toray Industries, Inc. Method and apparatus for producing a plasma display
US6159066A (en) * 1996-12-18 2000-12-12 Fujitsu Limited Glass material used in, and fabrication method of, a plasma display panel
US20030036330A1 (en) * 1997-10-08 2003-02-20 Hans Galenkamp Method of manufacturing a display device
US6422744B1 (en) * 1997-10-08 2002-07-23 Koninklijke Philips Electronics N.V. Method of testing a display device during the manufacture thereof
US7315120B2 (en) 1998-06-15 2008-01-01 Matsushita Electic Industrial Co., Ltd. Plasma display panel with superior light-emitting characteristics, and method and apparatus for producing the plasma display panel
US20050054258A1 (en) * 1998-06-15 2005-03-10 Hiroyuki Kado Plasma display panel with superior light-emitting characteristics, and method and apparatus for producing the plasma display panel
US7422502B2 (en) 1998-06-15 2008-09-09 Matsushita Electric Industrial Co., Ltd. Plasma display panel with superior light-emitting characteristics, and method and apparatus for producing the plasma display panel
US7131879B2 (en) 1998-06-15 2006-11-07 Matsushita Electric Industrial Co., Ltd. Plasma display panel with superior light-emitting characteristics, and method and apparatus for producing the plasma display panel
US6984159B1 (en) 1998-06-15 2006-01-10 Matsushita Electric Industrial Co., Ltd. Plasma display panel with superior light-emitting characteristics, and method and apparatus for producing the plasma display panel
US7172482B2 (en) 1998-06-15 2007-02-06 Matsushita Electric Industrial Co., Ltd. Plasma display panel with superior light-emitting characteristics, and method and apparatus for producing the plasma display panel
US7040944B2 (en) 1998-06-15 2006-05-09 Matsushita Electric Industrial Co., Ltd. Plasma display panel with superior light-emitting characteristics, and method and apparatus for producing the plasma display panel
US20050042966A1 (en) * 1998-06-15 2005-02-24 Hiroyuki Kado Plasma display panel with superior light-emitting characteristics, and method and apparatus for producing the plasma display panel
US20050042968A1 (en) * 1998-06-15 2005-02-24 Hiroyuki Kado Plasma display panel with superior light-emitting characteristics, and method and apparatus for producing the plasma display panel
US20050035715A1 (en) * 1998-06-15 2005-02-17 Hiroyuki Kado Plasma display panel with superior light-emitting characteristics, and method and apparatus for producing the plasma display panel
US20050037684A1 (en) * 1998-06-15 2005-02-17 Hiroyuki Kado Plasma display panel with superior light-emitting characteristics, and method and apparatus for producing the plasma display panel
US6414434B1 (en) * 1998-07-15 2002-07-02 Pioneer Corporation Plasma display panel having first and second partition walls
US6688933B1 (en) * 1998-09-30 2004-02-10 Osram Opto Semiconductors Gmbh & Co. Ohg Method for producing a component and corresponding component
US6817917B1 (en) * 1999-05-28 2004-11-16 Matsushita Electric Industrial Co., Ltd. Manufacturing method for a plasma display panel with superior luminescence
US6997769B2 (en) * 2000-01-07 2006-02-14 Pioneer Corporation Plasma display panel manufacturing apparatus and manufacturing method
US20060084349A1 (en) * 2000-01-07 2006-04-20 Pioneer Corporation Plasma display panel manufacturing apparatus and manufacturing method
US6848961B2 (en) * 2000-03-16 2005-02-01 Canon Kabushiki Kaisha Method and apparatus for manufacturing image displaying apparatus
US20050009433A1 (en) * 2000-03-16 2005-01-13 Canon Kabushiki Kaisha Method and apparatus for manufacturing image displaying apparatus
US7326097B2 (en) 2000-03-16 2008-02-05 Canon Kabushiki Kaisha Method and apparatus for manufacturing image displaying apparatus
US6786789B2 (en) * 2000-03-22 2004-09-07 Idemitsu Kosan Co., Ltd. Apparatus and method for manufacturing organic EL display device
US6820985B2 (en) 2000-04-19 2004-11-23 Matsushita Electric Industrial Co., Ltd. Display panel and production method therefor
US20040169927A1 (en) * 2000-04-19 2004-09-02 Masafumi Ookawa Display panel and manufacturing method for the display panel
WO2002102733A1 (fr) * 2001-06-15 2002-12-27 Asahi Glass Company, Limited Procede de production d'un substrat en verre a electrode metallique
US6876150B2 (en) * 2001-07-19 2005-04-05 Pioneer Corporation Flat plasma display panel and method of producing the same
US20030015963A1 (en) * 2001-07-19 2003-01-23 Pioneer Corporation Plasma display panel and method of producing the same
US20060244381A1 (en) * 2003-05-20 2006-11-02 Kim Seak K Pdp having additional thin layers in the electrode pad
US20060044744A1 (en) * 2004-08-24 2006-03-02 Sok-San Kim Plasma display device
US7423864B2 (en) * 2004-08-24 2008-09-09 Samsung Sdi Co., Ltd. Plasma display device
US7244901B1 (en) * 2006-04-11 2007-07-17 Danotech Co., Ltd. Capacitive touch panel
US20090284904A1 (en) * 2008-05-16 2009-11-19 Jer-Yao Wu Curved Display Panel and Method for Manufacturing the same
US8305743B2 (en) * 2008-05-16 2012-11-06 Au Optronics Corp. Curved display panel and method for manufacturing the same
US20120026666A1 (en) * 2008-12-31 2012-02-02 Crooijmans Wilhelmus Display assembly for a computing device
US8576552B2 (en) * 2008-12-31 2013-11-05 Palm, Inc. Display assembly for a computing device
US20120081874A1 (en) * 2010-09-30 2012-04-05 E Ink Holdings Inc. Curved display module and display device
US8953338B2 (en) * 2010-09-30 2015-02-10 E Ink Holdings Inc. Curved display module and display device
US10394066B1 (en) * 2018-06-12 2019-08-27 Sharp Kabushiki Kaisha Method of producing display panel

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JP3212837B2 (ja) 2001-09-25
TW322566B (enrdf_load_stackoverflow) 1997-12-11
JPH0917343A (ja) 1997-01-17
KR970003361A (ko) 1997-01-28
US6538380B1 (en) 2003-03-25
KR100257278B1 (ko) 2000-05-15

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