US5260547A - Autonomous container for the vacuum treatment of an object and its transfer lock - Google Patents

Autonomous container for the vacuum treatment of an object and its transfer lock Download PDF

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Publication number
US5260547A
US5260547A US07/848,254 US84825492A US5260547A US 5260547 A US5260547 A US 5260547A US 84825492 A US84825492 A US 84825492A US 5260547 A US5260547 A US 5260547A
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US
United States
Prior art keywords
container
enclosure
lock
handling
working station
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US07/848,254
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English (en)
Inventor
Francoise Houzay
Jean-Marie Moison
Yves Nissim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Orange SA
Original Assignee
France Telecom SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by France Telecom SA filed Critical France Telecom SA
Assigned to FRANCE TELECOM ETABLISSEMENT AUTONOME DE DROIT PUBLIC reassignment FRANCE TELECOM ETABLISSEMENT AUTONOME DE DROIT PUBLIC ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: HOUZAY, FRANCOISE, MOISON, JEAN-MARIE, NISSIM, YVES
Application granted granted Critical
Publication of US5260547A publication Critical patent/US5260547A/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67363—Closed carriers specially adapted for containing substrates other than wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Definitions

  • the invention relates to the treatment in vacuo of objects and in particular the production of electronic or microelectronic components, such as integrated circuits for use in optoelectronics.
  • a first solution consists of reducing these transfers by maintaining the component to be treated under a vacuum at all times. This is carried out by connecting together the different stations, so as to form a working unit known as a "single machine", which is heavy and very difficult to manipulate, bearing in mind the diversity of the evolution and the security conditions of each station. Such machines can occupy a surface area of several dozen square meters.
  • a second solution consists of using the "suitcase" system for transporting the sample to be treated between the individual stations.
  • containers are known which are able to transport samples in vacuo and which have for this purpose an autonomous vacuum unit.
  • the transported sample is transferred from the container to a working station by means of a transfer lock.
  • the object of the invention is to supply an improved container permitting both the vacuum transfer of a sample between two stations and its transfer in the enclosure of said station, but also permitting the performance of certain operations from the actual container or in the transfer lock.
  • a first objective of the invention is an autonomous container for the vacuum transportation between the individual stations of an object to be treated during a series of operations and comprising a small enclosure having an opening to permit the introduction and removal of the object kept under vacuum by means of a pump supplied by an autonomous supply source and object handling means.
  • the container comprises means for treating the object in the enclosure, tight bushings through the enclosure for the electrical conductors necessary for the treatment means, said treatments including the electrical characteristics, transparent viewing shielding windows for the observation and monitoring of the performance of the operations performed on the object in the enclosure and means for fixing the container to a transfer lock to a working station.
  • the shielding windows make it possible to carry out treatments by visible radiation.
  • the container is used both for the transportation and treatment of the object.
  • the container enclosure preferably has a gas intake so as to permit a gas treatment of the object.
  • the container is advantageously completed by a lever for handling the object along a translation axis and to one end of which is fixed an object fixing platform, so as to be able to remove, reintroduce and turn the object along the translation axis for positioning the same inside and outside the enclosure.
  • the platform preferably has a base having sealing means obstructing the opening of the enclosure when the platform is placed therein in order to enclose the object therein.
  • a fundamental construction of the container provides for the treatment means to be constituted by heating electrical elements.
  • At least one shielding window is angularly positioned with the Brewster angle with respect to the platform about the translation axis.
  • a second main objective of the invention for the advantageous completion of the container relates to a transfer lock for an object placed in a container, like that described hereinbefore, for transferring the object to a working station and comprising a fixing flange on a working station and container reception means.
  • said lock also has viewing shielding windows for observing the object and for monitoring the performance of the operations carried out thereon in the lock.
  • the said lock is advantageously equipped with a transfer rod for passing the object from the container platform, when it is removed, into the working station, when the lock is fixed near the latter.
  • FIG. 1 in section, the assembly of the container and the lock according to the invention.
  • FIG. 2 in section, the container according to the invention in the closed position.
  • FIG. 3 a plan view of the container only.
  • FIG. 4 a plan view corresponding to FIG. 3, but showing the container and the lock.
  • FIG. 1 shows the container 1 placed on a lock or lock chamber 2, said assembly being fixed to the intake of a working station 3.
  • the container 1 is mainly formed by a tight enclosure 4, in which the vacuum can be formed by means of a pump 5 fixed via a flange 6.
  • the portable nature of the container 1 makes it necessary for the enclosure 4 to be of small size and for the pump 5 to have a limited weight. However, it must still make it possible to obtain a high vacuum within the enclosure 4 and to have a supply autonomy, i.e. a low consumption is required.
  • an ionic pump with a pumping speed close to 10 liters per second.
  • the pump 5 must have batteries and a high voltage converter and a consumption not exceeding 10 milliwatts.
  • This type to pump is included in the catalogue of numerous manufacturers, including Meca 2000. The above indicated consumption makes it necessary for the pump to only operate under steady state conditions during the transportation of the container. The starting up of the pump 5 is then ensured by a conventional supply from the much more powerful mains.
  • an opening 7 to permit the introduction into and removal from the container 1 of an object, such as a specimen or sample of a microelectronics circuit 10.
  • an object such as a specimen or sample of a microelectronics circuit 10.
  • treatment means for the object 10 are provided within the enclosure 4.
  • One of the treatments involves the heating of the sample 10.
  • One treatment consisting of the heating of the sample 10 requires the supply of electric power within the enclosure 4.
  • the lateral part of the enclosure 4 has several viewing windows 12, which make it possible to observe the object 10, when it is enclosed within the enclosure 4, whilst also making it possible to carry out optical operations on said sample 10. An example of this operation is described in greater detail hereinafter.
  • the shielding windows 12 can be transparent to wavelengths other than visible wavelengths.
  • the container according to the invention is preferably made from stainless steel.
  • the positioning of the container 1 on the lock 2 obviously involves the presence of means for the fixing to the said lock 2.
  • the enclosure 4 has an upper flange 13 making it possible to bear on a bearing surface 14 of the lock 2.
  • the handling means for the object 10 are also fixed to the upper flange 13.
  • the placing under vacuum and the arrival of the special gases take place by means of two ducts 15,16 respectively.
  • the handling lever 18 is installed in sliding manner in the ring 17 in accordance with a vertical translation axis 50. It is manipulated with the aid of a handle 19. Its translation is vertical when the container 1 is placed on the lock 2. Such a vertical translation makes it possible to remove an object 10 placed at the lower end of the lever 18 and to position it in the centre of the volume which has remained free in the lock 2.
  • a metal bellows 23 surrounds the lever 18 and is tightly fixed by its two ends both to the ring 17 and to a bearing surface 24 of the lever placed just above the vertical part 21.
  • the bearing surface 24 bears on the lower surface 25 of the enclosure 4 and thus determines the removal position of the object 10.
  • the base 20 bears on the lower wall 25 and thus tightly closes the access hole 7 of the enclosure 4 by means of a sealing joint or gasket 26, which contacts both the base 20 and the part 25 of the enclosure 4.
  • the object 10 is preferably fixed to a platform 20 or to a vertical part 21 supporting the platform 20.
  • the object is fixed to the vertical part 21.
  • it is a microelectronics circuit sample mounted on a sample holder having six holes angularly spaced from one another by 60°.
  • the vertical part 21 in corresponding manner has three horizontal pins angularly spaced from one another by 120°.
  • the sample 10 is fixed by the introduction of the three pins 22 into three of the six holes of the sample holder.
  • the container is shown alone in FIG. 2 in the closed position, i.e. its lower opening 7 is obstructed by the base 20 of the platform.
  • the lever 18 is raised by means of the handle 19.
  • the object 10 is then confined within the tight enclosure 4.
  • the vacuum can then be formed by the pump 5 via the left-hand duct 15.
  • Special gases for treating the object can also be introduced by the righthand duct 16.
  • FIG. 3 is a section along line A--A of FIG. 2 through the lower part of the container. It is possible to see the location of the shielding windows 12 in a possible construction of the container according to the invention. Thus, for carrying out certain optical operations, such as spectrometry, it is of interest to position at least one of the windows 12 at a given angle, which is the Brewster reflection angle.
  • said Brewster angle B is close to 70° relative to the observation or normal reflection axis 31.
  • a second window can also be angularly positioned at the Brewster angle B on the other side of the normal reflection axis 31.
  • a first outlet 32 consists of an outlet flange 51 for fixing to a valve 27 giving access to a working station 3.
  • the sample 10 can then be brought to the said working station 3 in order to undergo therein one or more production operations.
  • the horizontal translation of the sample 10 preferably takes place by means of a manipulating rod 30 positioned horizontally facing said first outlet 32 in a handling or manipulating duct 33.
  • a manipulating rod 30 is commercially available under the name ball guide mechanical rod and is in particular marketed by Meca 2000. It permits a horizontal displacement of 500 mm.
  • two lateral windows 33 can be placed on the lock so as to also permit the monitoring and performance of optical operations within the lock 2 and outside the container 1.
  • One optical operation which can be carried out within the container 1 is infrared spectrometry. It is also possible to carry out electrical analyses, such as the measurement of electrical characteristics on the basis of a "current specimen".
  • optical operations can be carried out with the container 1 and without the lock 2.
  • the operations to be performed in vacuo i.e. from the container 1 and the lock 2, are e.g. electronic microscopy, electronic masking and ionic implantation, where the container serves as an annealing furnace under a controlled atmosphere.
  • the container 1 can also serve as a plasma chamber.
  • This relates to the production of a structure for a microoptoelectronic component having a III-V heterostructure, passivation layers and MIS, MES or ohmic contacts.
  • Such a process comprises the following stages:
  • characterization e.g. by Auger spectrometry in an analysis frame and in situ characterization in the container, e.g. by infrared spectrometry or photoluminescence.
  • the invention leads to the following advantages. There is an improvement to the quality of the sample and the interfaces between the different layers. Thus, the sample 10 is kept in vacuo, so that no natural oxide formation occurs.
  • the surface of a III-V-type heterostructure contaminated in this way has to be chemically cleaned prior to the deposition of the following layer. This operation takes a long time, is complicated and is never perfect, the surface still having time to become contaminated prior to the introduction into the treatment frame.
  • Each frame must have a personalized lock chamber.
  • the container according to the invention also facilitates the storage of several samples in a frame within the production process, so as to form batches.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Pipeline Systems (AREA)
US07/848,254 1991-03-14 1992-03-09 Autonomous container for the vacuum treatment of an object and its transfer lock Expired - Fee Related US5260547A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9103115A FR2673918B1 (fr) 1991-03-14 1991-03-14 Conteneur autonome pour le traitement sous vide d'un objet, et son sas de transfert.
FR9103115 1991-03-14

Publications (1)

Publication Number Publication Date
US5260547A true US5260547A (en) 1993-11-09

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Family Applications (1)

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US07/848,254 Expired - Fee Related US5260547A (en) 1991-03-14 1992-03-09 Autonomous container for the vacuum treatment of an object and its transfer lock

Country Status (5)

Country Link
US (1) US5260547A (fr)
EP (1) EP0504053B1 (fr)
JP (1) JPH0599140A (fr)
DE (1) DE69201146T2 (fr)
FR (1) FR2673918B1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5571330A (en) * 1992-11-13 1996-11-05 Asm Japan K.K. Load lock chamber for vertical type heat treatment apparatus
US6048434A (en) * 1993-09-16 2000-04-11 Hitachi, Ltd. Substrate holding system including an electrostatic chuck
US6105435A (en) * 1997-10-24 2000-08-22 Cypress Semiconductor Corp. Circuit and apparatus for verifying a chamber seal, and method of depositing a material onto a substrate using the same
WO2001014219A1 (fr) 1999-08-20 2001-03-01 Supreme Corq. Inc. Second systeme de fermeture synthetique pour bouteilles ou contenants bouches

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10164529C1 (de) 2001-12-18 2003-10-09 Jenoptik Laser Optik Sys Gmbh Einrichtung zur Aufbewahrung und zum Transport von mindestens einem optischen Bauelement

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2212330A (en) * 1938-05-03 1940-08-20 Albert G Thomas Sterilizing device
US4030622A (en) * 1975-05-23 1977-06-21 Pass-Port Systems, Inc. Wafer transport system
US4137865A (en) * 1976-12-30 1979-02-06 Bell Telephone Laboratories, Incorporated Molecular beam apparatus for processing a plurality of substrates
US4523885A (en) * 1982-04-29 1985-06-18 Heraeus Quarzschmelze Gmbh Apparatus for loading magazines into furnaces
US4607152A (en) * 1983-07-26 1986-08-19 Michel Allovon Vacuum evaporation device
US4676884A (en) * 1986-07-23 1987-06-30 The Boc Group, Inc. Wafer processing machine with evacuated wafer transporting and storage system
US4687542A (en) * 1985-10-24 1987-08-18 Texas Instruments Incorporated Vacuum processing system
JPS62290126A (ja) * 1986-02-27 1987-12-17 Deisuko Haitetsuku:Kk 縦型半導体熱処理装置への半導体基板の搬入出方法および外気混入防止装置
US4721836A (en) * 1986-05-14 1988-01-26 The United States Of America As Represented By The Secretary Of The Navy Apparatus for transient annealing of semiconductor samples in a controlled ambient
US4768911A (en) * 1987-09-01 1988-09-06 Huntington Mechanical Laboratories, Inc. Device for moving objects within and between sealed chambers
WO1988009563A1 (fr) * 1987-05-21 1988-12-01 Ion Implant Services Appareil d'implantation d'ions
US4852516A (en) * 1986-05-19 1989-08-01 Machine Technology, Inc. Modular processing apparatus for processing semiconductor wafers
US4861563A (en) * 1987-05-14 1989-08-29 Spectrum Cvd, Inc. Vacuum load lock
US4952299A (en) * 1988-10-31 1990-08-28 Eaton Corporation Wafer handling apparatus
US4976612A (en) * 1989-06-20 1990-12-11 Automated Wafer Systems Purge tube with floating end cap for loading silicon wafers into a furnace
US4977307A (en) * 1988-01-20 1990-12-11 Horiba, Ltd. Apparatus for heating sample within vacuum chamber
US5076205A (en) * 1989-01-06 1991-12-31 General Signal Corporation Modular vapor processor system

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2212330A (en) * 1938-05-03 1940-08-20 Albert G Thomas Sterilizing device
US4030622A (en) * 1975-05-23 1977-06-21 Pass-Port Systems, Inc. Wafer transport system
US4137865A (en) * 1976-12-30 1979-02-06 Bell Telephone Laboratories, Incorporated Molecular beam apparatus for processing a plurality of substrates
US4523885A (en) * 1982-04-29 1985-06-18 Heraeus Quarzschmelze Gmbh Apparatus for loading magazines into furnaces
US4607152A (en) * 1983-07-26 1986-08-19 Michel Allovon Vacuum evaporation device
US4687542A (en) * 1985-10-24 1987-08-18 Texas Instruments Incorporated Vacuum processing system
JPS62290126A (ja) * 1986-02-27 1987-12-17 Deisuko Haitetsuku:Kk 縦型半導体熱処理装置への半導体基板の搬入出方法および外気混入防止装置
US4721836A (en) * 1986-05-14 1988-01-26 The United States Of America As Represented By The Secretary Of The Navy Apparatus for transient annealing of semiconductor samples in a controlled ambient
US4852516A (en) * 1986-05-19 1989-08-01 Machine Technology, Inc. Modular processing apparatus for processing semiconductor wafers
US4676884A (en) * 1986-07-23 1987-06-30 The Boc Group, Inc. Wafer processing machine with evacuated wafer transporting and storage system
US4861563A (en) * 1987-05-14 1989-08-29 Spectrum Cvd, Inc. Vacuum load lock
WO1988009563A1 (fr) * 1987-05-21 1988-12-01 Ion Implant Services Appareil d'implantation d'ions
US4768911A (en) * 1987-09-01 1988-09-06 Huntington Mechanical Laboratories, Inc. Device for moving objects within and between sealed chambers
US4977307A (en) * 1988-01-20 1990-12-11 Horiba, Ltd. Apparatus for heating sample within vacuum chamber
US4952299A (en) * 1988-10-31 1990-08-28 Eaton Corporation Wafer handling apparatus
US5076205A (en) * 1989-01-06 1991-12-31 General Signal Corporation Modular vapor processor system
US4976612A (en) * 1989-06-20 1990-12-11 Automated Wafer Systems Purge tube with floating end cap for loading silicon wafers into a furnace

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5571330A (en) * 1992-11-13 1996-11-05 Asm Japan K.K. Load lock chamber for vertical type heat treatment apparatus
US6048434A (en) * 1993-09-16 2000-04-11 Hitachi, Ltd. Substrate holding system including an electrostatic chuck
US6217705B1 (en) 1993-09-16 2001-04-17 Hitachi, Ltd. Method of holding substrate and substrate holding system
US6105435A (en) * 1997-10-24 2000-08-22 Cypress Semiconductor Corp. Circuit and apparatus for verifying a chamber seal, and method of depositing a material onto a substrate using the same
US6494100B1 (en) 1997-10-24 2002-12-17 Cypress Semiconductor Corp. Circuit and apparatus for verifying a chamber seal, and method of depositing a material onto a substrate using the same
WO2001014219A1 (fr) 1999-08-20 2001-03-01 Supreme Corq. Inc. Second systeme de fermeture synthetique pour bouteilles ou contenants bouches

Also Published As

Publication number Publication date
EP0504053A1 (fr) 1992-09-16
DE69201146T2 (de) 1995-08-03
DE69201146D1 (de) 1995-02-23
EP0504053B1 (fr) 1995-01-11
FR2673918A1 (fr) 1992-09-18
FR2673918B1 (fr) 1993-05-28
JPH0599140A (ja) 1993-04-20

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