US4719317A - Film-type electrical element and connection wire combination and method of connection - Google Patents

Film-type electrical element and connection wire combination and method of connection Download PDF

Info

Publication number
US4719317A
US4719317A US06/840,923 US84092386A US4719317A US 4719317 A US4719317 A US 4719317A US 84092386 A US84092386 A US 84092386A US 4719317 A US4719317 A US 4719317A
Authority
US
United States
Prior art keywords
component according
conductive track
glass particles
connection
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US06/840,923
Other languages
English (en)
Inventor
Quentin Reynolds
Karl Deckelmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WC HERAEUS A OF GERMANY GmbH LLC
WC Heraus GmbH and Co KG
Original Assignee
WC Heraus GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WC Heraus GmbH and Co KG filed Critical WC Heraus GmbH and Co KG
Assigned to W.C. HERAEUS GMBH, A LIMITED LIABILITY COMPANY OF GERMANY reassignment W.C. HERAEUS GMBH, A LIMITED LIABILITY COMPANY OF GERMANY ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: DECKELMANN, KARL, REYNOLDS, QUENTIN
Application granted granted Critical
Publication of US4719317A publication Critical patent/US4719317A/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/858—Bonding techniques
    • H01L2224/85801—Soldering or alloying
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
US06/840,923 1985-04-03 1986-03-18 Film-type electrical element and connection wire combination and method of connection Expired - Fee Related US4719317A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3512158 1985-04-03
DE19853512158 DE3512158A1 (de) 1985-04-03 1985-04-03 Elektrisches bauelement sowie verfahren zum herstellen eines solchen bauelementes

Publications (1)

Publication Number Publication Date
US4719317A true US4719317A (en) 1988-01-12

Family

ID=6267193

Family Applications (1)

Application Number Title Priority Date Filing Date
US06/840,923 Expired - Fee Related US4719317A (en) 1985-04-03 1986-03-18 Film-type electrical element and connection wire combination and method of connection

Country Status (4)

Country Link
US (1) US4719317A (de)
JP (1) JPS625604A (de)
DE (1) DE3512158A1 (de)
GB (1) GB2175457B (de)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4978814A (en) * 1988-02-16 1990-12-18 Thorn Emi Plc Electrical device including an electrical connector
US5023403A (en) * 1988-12-21 1991-06-11 Flachglas Aktiengesellschaft Device for connecting an electrical cable to a window pane having electrical conductors
US5136122A (en) * 1991-05-13 1992-08-04 Motorola, Inc. Braided fiber omega connector
US5912613A (en) * 1995-12-28 1999-06-15 Hokuriku Electric Industry Co., Ltd. High-voltage resistor unit and high-voltage variable resistor unit
US5928455A (en) * 1996-02-09 1999-07-27 Seb S.A. Method of making an electrical connection by gluing a rigid terminal to a conductive track, rigid terminal for use in the method and application to a heating receptacle heating plate
US6267630B1 (en) 1999-08-04 2001-07-31 Antaya Technologies Corporation Circular connector with blade terminal
US6530776B1 (en) 2001-10-09 2003-03-11 Husky Injection Molding Systems, Ltd. Method and apparatus of connection to an electrical film device
US20070018338A1 (en) * 2005-07-20 2007-01-25 Khalil Hosseini Connection element for a semiconductor component and method for producing the same
US20070029299A1 (en) * 2005-08-04 2007-02-08 Guardian Industries Corp. Heatable vehicle window utilizing silver inclusive epoxy electrical connection and method of making same
US20070193996A1 (en) * 2004-03-12 2007-08-23 Keizo Nakajima Heating element and production method thereof
US20080118634A1 (en) * 2006-11-22 2008-05-22 Tsinghua University Method for manufacturing transparent conductive film
US20080220242A1 (en) * 2006-11-22 2008-09-11 Tsinghua University Anodic structure and method for manufacturing same
KR100974503B1 (ko) 2008-03-28 2010-08-10 우진 일렉트로나이트(주) 로내부의 웨이퍼형 온도감지장치
KR100974502B1 (ko) 2008-03-28 2010-08-10 우진 일렉트로나이트(주) 로내부의 온도감지장치
CN103700954A (zh) * 2013-12-13 2014-04-02 陕西宝成航空仪表有限责任公司 电气设备接线柱与导线的导电胶接方法
US20170264024A1 (en) * 2014-05-23 2017-09-14 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Electrical connection element for fastening, in particular soldering, to a glass pane, and ribbon litz wire mixed braid
KR20170126469A (ko) * 2015-03-16 2017-11-17 파크 테크-파카징 테크놀로지이스 게엠베하 칩 배열 및 접촉 연결을 형성하는 방법
US10553964B2 (en) 2018-05-17 2020-02-04 Agc Automotive Americas R&D, Inc. Window assembly with solderless electrical connector
TWI762888B (zh) * 2019-04-09 2022-05-01 日商海上股份有限公司 絕緣被覆線之接合方法、連接構造、絕緣被覆線之剝離方法及結合裝置

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2489409A (en) * 1947-10-29 1949-11-29 Bell Telephone Labor Inc Resistor having distortion protected connecting means
CA655493A (en) * 1963-01-08 Arthur Linz, Jr. N-type semiconductors and method of manufacture
US3818118A (en) * 1972-06-19 1974-06-18 Gti Corp Solid state electronic element encapsulation with end contacting blister formation
US3827891A (en) * 1970-12-17 1974-08-06 J Larry High adhesion metallizing compositions
US3897624A (en) * 1969-04-08 1975-08-05 Agency Ind Science Techn Method for bonding ceramics with metal
JPS5027214B1 (de) * 1970-10-31 1975-09-05
US4028657A (en) * 1974-10-24 1977-06-07 W. C. Heraeus Gmbh Deposited layer type thermometric resistance structure
GB1532908A (en) * 1976-04-09 1978-11-22 Heraeus Gmbh W C Resistance thermometers
US4129848A (en) * 1975-09-03 1978-12-12 Raytheon Company Platinum film resistor device
US4459166A (en) * 1982-03-08 1984-07-10 Johnson Matthey Inc. Method of bonding an electronic device to a ceramic substrate
US4532075A (en) * 1984-08-10 1985-07-30 E. I. Du Pont De Nemours And Company Thick film conductor composition

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4935855A (de) * 1972-06-19 1974-04-03

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA655493A (en) * 1963-01-08 Arthur Linz, Jr. N-type semiconductors and method of manufacture
US2489409A (en) * 1947-10-29 1949-11-29 Bell Telephone Labor Inc Resistor having distortion protected connecting means
US3897624A (en) * 1969-04-08 1975-08-05 Agency Ind Science Techn Method for bonding ceramics with metal
JPS5027214B1 (de) * 1970-10-31 1975-09-05
US3827891A (en) * 1970-12-17 1974-08-06 J Larry High adhesion metallizing compositions
US3818118A (en) * 1972-06-19 1974-06-18 Gti Corp Solid state electronic element encapsulation with end contacting blister formation
US4028657A (en) * 1974-10-24 1977-06-07 W. C. Heraeus Gmbh Deposited layer type thermometric resistance structure
US4129848A (en) * 1975-09-03 1978-12-12 Raytheon Company Platinum film resistor device
GB1532908A (en) * 1976-04-09 1978-11-22 Heraeus Gmbh W C Resistance thermometers
US4459166A (en) * 1982-03-08 1984-07-10 Johnson Matthey Inc. Method of bonding an electronic device to a ceramic substrate
US4532075A (en) * 1984-08-10 1985-07-30 E. I. Du Pont De Nemours And Company Thick film conductor composition

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4978814A (en) * 1988-02-16 1990-12-18 Thorn Emi Plc Electrical device including an electrical connector
US5023403A (en) * 1988-12-21 1991-06-11 Flachglas Aktiengesellschaft Device for connecting an electrical cable to a window pane having electrical conductors
US5136122A (en) * 1991-05-13 1992-08-04 Motorola, Inc. Braided fiber omega connector
US5912613A (en) * 1995-12-28 1999-06-15 Hokuriku Electric Industry Co., Ltd. High-voltage resistor unit and high-voltage variable resistor unit
US5928455A (en) * 1996-02-09 1999-07-27 Seb S.A. Method of making an electrical connection by gluing a rigid terminal to a conductive track, rigid terminal for use in the method and application to a heating receptacle heating plate
US6267630B1 (en) 1999-08-04 2001-07-31 Antaya Technologies Corporation Circular connector with blade terminal
US6530776B1 (en) 2001-10-09 2003-03-11 Husky Injection Molding Systems, Ltd. Method and apparatus of connection to an electrical film device
US7675004B2 (en) * 2004-03-12 2010-03-09 Panasonic Corporation Heating element and production method thereof
US20070193996A1 (en) * 2004-03-12 2007-08-23 Keizo Nakajima Heating element and production method thereof
DE102005034485B4 (de) * 2005-07-20 2013-08-29 Infineon Technologies Ag Verbindungselement für ein Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterleistungsbauelements
US8581371B2 (en) * 2005-07-20 2013-11-12 Infineon Technologies Ag Connection element for a semiconductor component and method for producing the same
US20070018338A1 (en) * 2005-07-20 2007-01-25 Khalil Hosseini Connection element for a semiconductor component and method for producing the same
US20070029299A1 (en) * 2005-08-04 2007-02-08 Guardian Industries Corp. Heatable vehicle window utilizing silver inclusive epoxy electrical connection and method of making same
US8299400B2 (en) * 2005-08-04 2012-10-30 Guardian Industries Corp. Heatable vehicle window utilizing silver inclusive epoxy electrical connection and method of making same
US20080220242A1 (en) * 2006-11-22 2008-09-11 Tsinghua University Anodic structure and method for manufacturing same
US20080118634A1 (en) * 2006-11-22 2008-05-22 Tsinghua University Method for manufacturing transparent conductive film
KR100974503B1 (ko) 2008-03-28 2010-08-10 우진 일렉트로나이트(주) 로내부의 웨이퍼형 온도감지장치
KR100974502B1 (ko) 2008-03-28 2010-08-10 우진 일렉트로나이트(주) 로내부의 온도감지장치
CN103700954B (zh) * 2013-12-13 2016-05-11 陕西宝成航空仪表有限责任公司 电气设备接线柱与导线的导电胶接方法
CN103700954A (zh) * 2013-12-13 2014-04-02 陕西宝成航空仪表有限责任公司 电气设备接线柱与导线的导电胶接方法
US20170264024A1 (en) * 2014-05-23 2017-09-14 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Electrical connection element for fastening, in particular soldering, to a glass pane, and ribbon litz wire mixed braid
US10020597B2 (en) * 2014-05-23 2018-07-10 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Electrical connection element for fastening, in particular soldering, to a glass pane, and ribbon litz wire mixed braid
KR20170126469A (ko) * 2015-03-16 2017-11-17 파크 테크-파카징 테크놀로지이스 게엠베하 칩 배열 및 접촉 연결을 형성하는 방법
US20180047697A1 (en) * 2015-03-16 2018-02-15 Pac Tech - Packaging Technologies Gmbh Chip arrangement and method for forming a contact connection
US10553964B2 (en) 2018-05-17 2020-02-04 Agc Automotive Americas R&D, Inc. Window assembly with solderless electrical connector
TWI762888B (zh) * 2019-04-09 2022-05-01 日商海上股份有限公司 絕緣被覆線之接合方法、連接構造、絕緣被覆線之剝離方法及結合裝置

Also Published As

Publication number Publication date
JPH0324041B2 (de) 1991-04-02
DE3512158C2 (de) 1987-09-24
DE3512158A1 (de) 1986-10-23
GB2175457A (en) 1986-11-26
GB2175457B (en) 1989-01-11
GB8601988D0 (en) 1986-03-05
JPS625604A (ja) 1987-01-12

Similar Documents

Publication Publication Date Title
US4719317A (en) Film-type electrical element and connection wire combination and method of connection
KR970008549B1 (ko) 높은 열 사이클 접착력 및 노화 접착력을 위한 은 풍부 전도체 조성물
US4107759A (en) Fused monolithic ceramic capacitor package
US4361597A (en) Process for making sensor for detecting fluid flow velocity or flow amount
US4835038A (en) Substrate coated with multiple thick films
US4053864A (en) Thermistor with leads and method of making
JPS6151361B2 (de)
JP2023503210A (ja) センサセンブリ及びセンサセンブリを製造する方法
US5560098A (en) Method of making an electrical connection to thick film tracks
JP3652647B2 (ja) 高温検出器及びその製造方法
US20040075527A1 (en) Ttemperature probe and a method for producing the same
KR100268699B1 (ko) 칩저항기터미날전극용전도성페이스트조성물
TW388036B (en) Circuit arrangement comprising an smd-component, in particular a temperature sensor, and a method of manufacturing a temperature sensor
US4524038A (en) Method of making a vibration-resistant electrical component and connection lead combination, particularly exhaust gas composition sensor
US20010015287A1 (en) Printed circuit boards having at least one metal layer
US3119172A (en) Method of making an electrical connection
RU2086027C1 (ru) Способ изготовления толстопленочных резисторов
CN85101180A (zh) 厚膜电路用配方
KR100358302B1 (ko) 부온도 계수 써미스터
JPH0986955A (ja) 絶縁体用ガラス組成物、絶縁体ペースト、および厚膜印刷回路
JP2641530B2 (ja) チップ状電子部品の製造方法
US5186809A (en) Structure for joining a wire to a solid electrolytic element
JPH0349108A (ja) 銅導体組成物
JPS5834770B2 (ja) 熱電対の製造方法
JPH02298851A (ja) 検出素子端子構造

Legal Events

Date Code Title Description
AS Assignment

Owner name: W.C. HERAEUS GMBH, HERAEUSSTRASSE 12-14, D-6450 HA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:REYNOLDS, QUENTIN;DECKELMANN, KARL;REEL/FRAME:004529/0119

Effective date: 19860303

FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

FPAY Fee payment

Year of fee payment: 4

FPAY Fee payment

Year of fee payment: 8

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
FP Lapsed due to failure to pay maintenance fee

Effective date: 20000112

STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362