US4677036A - Method of production of thin film magnetic head and magnetic head - Google Patents

Method of production of thin film magnetic head and magnetic head Download PDF

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Publication number
US4677036A
US4677036A US06/823,941 US82394186A US4677036A US 4677036 A US4677036 A US 4677036A US 82394186 A US82394186 A US 82394186A US 4677036 A US4677036 A US 4677036A
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US
United States
Prior art keywords
sio
layer
thin film
etching
magnetic head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US06/823,941
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English (en)
Inventor
Tsuneo Nakamura
Hidenori Yamasaki
Tohru Kira
Mitsuhiko Yoshikawa
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Sharp Corp
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Sharp Corp
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Publication date
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Assigned to SHARP KABUSHIKI KAISHA reassignment SHARP KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: KIRA, TOHRU, NAKAMURA, TSUNEO, YAMASAKI, HIDENORI, YOSHIKAWA, MITSUHIKO
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Publication of US4677036A publication Critical patent/US4677036A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/32—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/90—Magnetic feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49032—Fabricating head structure or component thereof
    • Y10T29/49036—Fabricating head structure or component thereof including measuring or testing
    • Y10T29/49043—Depositing magnetic layer or coating
    • Y10T29/49044—Plural magnetic deposition layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49032—Fabricating head structure or component thereof
    • Y10T29/4906—Providing winding
    • Y10T29/49062—Multilayered winding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49032—Fabricating head structure or component thereof
    • Y10T29/4906—Providing winding
    • Y10T29/49064—Providing winding by coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/11—Magnetic recording head
    • Y10T428/1171—Magnetic recording head with defined laminate structural detail
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Definitions

  • the present invention relates to a process for preparing a thin film magnetic head having an excellent high density record property, more particularly, to a planarization process of an irregular surface caused by the existence of an electroconductive coil after forming a dielectric layer.
  • FIG. 2 shows one embodiment of a coil type thin film magnetic heads prepared by a conventional method.
  • a soft magnetic thin film composed of Ni-Fe, Fe-Al-Si or Co-based amorphous alloys, is formed on a substrate 1 having good wear resistance, composed of alumina, ferrite, glass and the like, by means of sputtering, electron beam evaporation and the like and then etched to a desired shape by way of wet etching, ion beam etching and the like to form a lower magnetic core 2.
  • an insulation layer 3 is formed, wherein electroconductive coil 4 is embedded in the insulation layer 3.
  • the insulation layer 3 is made from SiO 2 , Si 3 N 4 , Al 2 O 3 and the like by way of plasma-CVD, sputtering or electron bem evaporation.
  • the electroconductive coil 4 is made from an electroconductive metal, such as Cu, Al and the like by way of electron beam vaporation, sputtering and the like.
  • the electroconductive coils 4 are shaped to desired forms by wet etching or a ion beam etching.
  • a general process for preparing the insulation layer 3 and the electroconductive coil 4 comprises forming the insulation layer 3, forming and etching the electroconductive coil 4, forming the remaining insulation layer 3, etching and forming a front magnetic gap layer and etching the insulation layer 3 to form a back core connection portion.
  • a soft magnetic layer 5 made from Ni-Fe, Fe-Al-Si, or Co-based amorphous alloy, is coated by sputtering, electron beam evaporation and the like and shaped by way of ion beam etching, wet etching and the like to form an upper magnetic core 5.
  • the irregular surface of the coil 4 has effects not only on the fabrication technique but also on magnetic properties of the upper magnetic core.
  • the differences in level of the electroconductive coil causes irregular surface of the soft magnetic thin film (i.e. upper magnetic core), for which the magnetic properties of the soft magnetic thin film declines to cause problems, such as producing inferior permeability. These problems become very significant in a high frequency range.
  • the planarization of the irregular surface is an important problem required from both fabrication technique and magnetic head properties.
  • a lift-off process and a planarization process by coating organic insulation materials such as a polyimide resist and the like.
  • the lift-off process comprises forming an electroconductive coil layer, shaping to a desirable coil form with a photo-resist and then lamination of the insulation layer on the photo-resist which is left after shaping.
  • this process has a problem in adhesion property, because the substrate can not be heated to a necessary temperature when the insulation layer is laminated.
  • the organic insulation materials such as polyimide and the like also have problems in heat-resistance, and stabilities such as stability with time.
  • the present invention is to provide a novel method for planarization of the upper surface of the insulation layer on the electroconductive coil.
  • a process for preparing a coil type thin film magnetic head holding a coil made from an electroconductive material between an upper and lower magnetic core made from a soft magnetic thin film comprising;
  • SiO 2 layer on a coil as an insulation layer by means of sputtering, plasma-CVD, or electron beam evaporation,
  • the process of the present invention may include the following step after dry-etching of additionally coating the coating-type SiO 2 on the insulation layer and the cured SiO 2 layer followed by curing by heat.
  • FIG. 1 is a process drawing of one embodiment of the present invention
  • FIG. 2 shows a sectional view of a conventional thin film magnetic head which is not planarized sufficiently
  • FIG. 3 shows a sectional view of one embodiment of the thin film magnetic head according to the process of the present invention.
  • the planarization process is carried out by using a coating type SiO 2 .
  • This process is simple and can be easily carried out, and the coating layer contains organic components in very little amount but it can be said that the coating layer is essentially inorganic.
  • it is not enough for thin film magnetic heads, having plural layered electroconductive coils or requiring strict magnetic properties of an upper magnetic core, to have the coating type SiO 2 applied only once. Two or more applications of the coatings can make it sufficiently flat, but it raises new problems such as a decline of wetting properties, cracks and the like. Accordingly, this process is not a complete solution.
  • a dry-etching process by a fluorohydrocarbon gas is adopted after curing the coating type SiO 2 layer, whereby a more sufficient flatness is obtained.
  • the present invention is illustrated according to the preferred embodiment.
  • FIGS. 1 (A), (B), (C) and (D) are explanatory drawings showing the process of the present invention comprising forming an electroconductive coil, laminating an insulation layer, applying the coating type SiO 2 , and heating said SiO 2 to cure.
  • a substrate 1 is a ferrite plate or plates where a soft magnetic film is coated on a ferrite plate, an alumina plate or a glass plate.
  • an insulation layer 31 made of SiO 2 and the like is laminated by the aid of a plasma-CVD, sputtering, electron beam evaporation and the like in a thickness of 1 to 2 ⁇ m.
  • An electroconductive material layer made from Cu and the like is laminated on the insulation layer 31 by means of electron beam evaporation and sputtering, followed by etching it by ion beam etching or sputtering etching, using a mask such as a photo resist, or a metal thin film for example Ti, Cr and the like, to obtain a desired shape of the electroconductive coil 4.
  • This state is shown in FIG. 1 (A).
  • the thickness of the electroconductive coil 4 may be within the range of 1 to 5 m. The following explanation which follows supposes that the thickness of the coil 4 is 2 ⁇ m. Accordingly, the letter H in FIG. 1 (A) is 2 ⁇ m.
  • FIG. 1 (B) shows that a SiO 2 layer 32 is laminated on the state FIG.
  • H 1 the difference between the electroconductive coils, i.e. H 1 , is 2.7 ⁇ m.
  • the difference, H 1 becomes larger than H 0 , because the deposition rate of SiO 2 is low in this part.
  • the coating type SiO 2 7 is formed and cured at an elevated temperature to make it flat, which is shown in FIG. 1 (C).
  • the planarization process is carried out by "Silica glass PMH" (commercially available from Tisso Co. Ltd.), the difference H 2 is about 0.5 ⁇ m, which shows that the difference is very improved.
  • planarization degree is enough inasmuch as the pattern formed on the electroconductive coil is large or as the single layer coil construction is required. Further planarization has to be done either for the multilayered coil which requires microfabrication or for thin film magnetic heads having excellent magnetic properties of the upper magnetic core.
  • the coating type SiO 2 is made once more on the state of FIG. 1 (C)
  • the difference can be more improved in the amount of H 2 of 0.1 to 0.2 ⁇ m.
  • the layer 7 of the coating type SiO 2 becomes thick enough to induce cracks. And also wetting properties become bad and in case of particular coatings, no wetting properties have been observed.
  • the adhesion strength between the coating type SiO 2 layers is inferior in comparison with the adhesion strength between the coating type SiO 2 layer 7 and the insulation layer 32 formed by the plasma-CVD.
  • FIG. 1 (D) emphasizes the coating layer of SiO 2 of FIG. 1 (C).
  • the thickness h of the SiO 2 coating is about 0.1 ⁇ m above the electroconductive coil 4.
  • the SiO 2 layer made by the plasma-CVD appears above the electroconductive coil 4 while the SiO 2 coating still remains between the coils. If the plasma-CVD made SiO 2 layer is etched faster than the coated SiO 2 layer, the planarization can be done in the difference of the etching rates.
  • the etching rate is about 500 ⁇ /min with the plasma-CVD deposited SiO 2 layer, and about 250 ⁇ /min with the coated SiO 2 layer, cured at 350° C. The difference in level in question will disappear at the rate of 250 ⁇ /min.
  • the etching continues to the broken line of FIG. 1 (D). In this etching process, the etching rates can vary respectively.
  • the plasma-CVD deposited SiO 2 layer can vary according to deposition conditions.
  • the coated SiO 2 layer may also vary according to curing conditions and may vary widely according to its compositions. If the PM series coating type SiO 2 available from Tisso Co. Ltd. is employed, the etching rate of 700 to 800 ⁇ /min can be accomplished according to the etching condition mentioned herein before, which makes it faster than that of the plasma-CVD deposited SiO 2 layer. In addition, the etching rate can also change according to etching conditions, such as gases to be used, gas pressures and the like.
  • the etching process of the present invention may prevent decline of wetting properties and development of cracks.
  • the decline of wetting properties and adhesion strength is caused by the coated SiO 2 layer existent throughout the surface and the development of cracks is caused by a thick layer of the coated SiO 2 .
  • the unnecessary coated layer can be etched off to prevent the problems mentioned above. As far as overetching is not made, the etching back of the present invention does not damage its flatness.
  • further embodiment of the present invention has a further step in which another SiO 2 is coated after the etching back. This process provides for a more flat surface.
  • FIG. 3 shows a thin film magnetic head having double layered electroconductive coils which is planarized by recoating the SiO 2 after etching back according to the present invention.
  • the etching back and the planarization by the recoating of SiO 2 is also effected to obtain good magnetic properties of the upper magnetic core.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Magnetic Heads (AREA)
US06/823,941 1985-01-29 1986-01-29 Method of production of thin film magnetic head and magnetic head Expired - Lifetime US4677036A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60-17623 1985-01-29
JP60017623A JPS61175919A (ja) 1985-01-29 1985-01-29 薄膜磁気ヘツドの製造方法

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US (1) US4677036A (enrdf_load_stackoverflow)
JP (1) JPS61175919A (enrdf_load_stackoverflow)
GB (1) GB2186110B (enrdf_load_stackoverflow)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4863557A (en) * 1987-05-29 1989-09-05 Yuuichi Kokaku Pattern forming process and thin-film magnetic head formed by said process
US4920013A (en) * 1986-09-24 1990-04-24 Hitachi, Ltd. Magnetic Multilayer structure
US4948667A (en) * 1986-03-19 1990-08-14 Hitachi Maxell, Ltd. Magnetic head
US4988403A (en) * 1988-12-21 1991-01-29 Rohm Co., Ltd. Method of forming patterned silicone rubber layer
US5016342A (en) * 1989-06-30 1991-05-21 Ampex Corporation Method of manufacturing ultra small track width thin film transducers
US5068760A (en) * 1988-06-23 1991-11-26 Sharp Kabushiki Kaisha Thin film magnetic head for a bidirectionally moveable recording medium
US5108837A (en) * 1987-12-04 1992-04-28 Digital Equipment Corporation Laminated poles for recording heads
US5236735A (en) * 1989-05-27 1993-08-17 Tdk Corporation Method of producing a thin film magnetic head
US5729887A (en) * 1994-05-09 1998-03-24 Daidotokushuko Kabushikikaisha Method of manufacturing a thin-film coil
US6178070B1 (en) 1999-02-11 2001-01-23 Read-Rite Corporation Magnetic write head and method for making same
US6204999B1 (en) * 1998-12-23 2001-03-20 Read-Rite Corporation Method and system for providing a write head having a conforming pole structure
US6417998B1 (en) 1999-03-23 2002-07-09 Read-Rite Corporation Ultra small advanced write transducer and method for making same
US20030135986A1 (en) * 2002-01-14 2003-07-24 International Business Machines Corporation Simultaneous planarization of pole piece and coil materials for write head applications
US20040140017A1 (en) * 2000-11-09 2004-07-22 Branagan Daniel J. Hard metallic materials
US20050164016A1 (en) * 2004-01-27 2005-07-28 Branagan Daniel J. Metallic coatings on silicon substrates, and methods of forming metallic coatings on silicon substrates
US20110252631A1 (en) * 2000-02-10 2011-10-20 Tdk Corporation Method of manufacturing a thin-film magnetic head
US10097054B2 (en) 2015-01-30 2018-10-09 Honeywell International Inc. Methods for manufacturing high temperature laminated stator cores
US11437188B2 (en) 2018-09-25 2022-09-06 Honeywell International Inc. Low porosity glass coatings formed on coiled wires, high temperature devices containing the same, and methods for the fabrication thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5828838A (ja) * 1981-08-14 1983-02-19 Comput Basic Mach Technol Res Assoc 薄膜磁気ヘッドの製造方法
JPS5877016A (ja) * 1981-10-28 1983-05-10 Sharp Corp 薄膜磁気ヘツドの製造方法
JPS5998316A (ja) * 1982-11-26 1984-06-06 Sharp Corp 薄膜磁気ヘツドの製造方法

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4948667A (en) * 1986-03-19 1990-08-14 Hitachi Maxell, Ltd. Magnetic head
US4920013A (en) * 1986-09-24 1990-04-24 Hitachi, Ltd. Magnetic Multilayer structure
US4863557A (en) * 1987-05-29 1989-09-05 Yuuichi Kokaku Pattern forming process and thin-film magnetic head formed by said process
US5108837A (en) * 1987-12-04 1992-04-28 Digital Equipment Corporation Laminated poles for recording heads
US5153980A (en) * 1988-06-23 1992-10-13 Sharp Kabushiki Kaisha Method of forming a magnetic head chip for a thin film magnetic head
US5068760A (en) * 1988-06-23 1991-11-26 Sharp Kabushiki Kaisha Thin film magnetic head for a bidirectionally moveable recording medium
US4988403A (en) * 1988-12-21 1991-01-29 Rohm Co., Ltd. Method of forming patterned silicone rubber layer
US5236735A (en) * 1989-05-27 1993-08-17 Tdk Corporation Method of producing a thin film magnetic head
US5016342A (en) * 1989-06-30 1991-05-21 Ampex Corporation Method of manufacturing ultra small track width thin film transducers
US5729887A (en) * 1994-05-09 1998-03-24 Daidotokushuko Kabushikikaisha Method of manufacturing a thin-film coil
US6204999B1 (en) * 1998-12-23 2001-03-20 Read-Rite Corporation Method and system for providing a write head having a conforming pole structure
US6178070B1 (en) 1999-02-11 2001-01-23 Read-Rite Corporation Magnetic write head and method for making same
US6417998B1 (en) 1999-03-23 2002-07-09 Read-Rite Corporation Ultra small advanced write transducer and method for making same
US8448330B2 (en) * 2000-02-10 2013-05-28 Tdk Corporation Method of manufacturing a thin-film magnetic head
US20110252631A1 (en) * 2000-02-10 2011-10-20 Tdk Corporation Method of manufacturing a thin-film magnetic head
US20040140017A1 (en) * 2000-11-09 2004-07-22 Branagan Daniel J. Hard metallic materials
US7785428B2 (en) 2000-11-09 2010-08-31 Battelle Energy Alliance, Llc Method of forming a hardened surface on a substrate
US8097095B2 (en) 2000-11-09 2012-01-17 Battelle Energy Alliance, Llc Hardfacing material
US7025659B2 (en) 2002-01-14 2006-04-11 Hitachi Global Storage Technologies Netherlands B.V. Simultaneous planarization of pole piece and coil materials for write head applications
US20060099890A1 (en) * 2002-01-14 2006-05-11 Florence Eschbach Simultaneous planarization of pole piece and coil materials for write head applications
US7201637B2 (en) 2002-01-14 2007-04-10 Hitachi Global Storage Technologies Netherlands B.V. Simultaneous planarization of pole piece and coil materials for write head applications
US20030135986A1 (en) * 2002-01-14 2003-07-24 International Business Machines Corporation Simultaneous planarization of pole piece and coil materials for write head applications
US7341765B2 (en) * 2004-01-27 2008-03-11 Battelle Energy Alliance, Llc Metallic coatings on silicon substrates, and methods of forming metallic coatings on silicon substrates
US20080160266A1 (en) * 2004-01-27 2008-07-03 Branagan Daniel J Metallic coatings on silicon substrates
US20050164016A1 (en) * 2004-01-27 2005-07-28 Branagan Daniel J. Metallic coatings on silicon substrates, and methods of forming metallic coatings on silicon substrates
US10097054B2 (en) 2015-01-30 2018-10-09 Honeywell International Inc. Methods for manufacturing high temperature laminated stator cores
US10958115B2 (en) 2015-01-30 2021-03-23 Honeywell International Inc. High temperature laminated stator cores and methods for the manufacture thereof
US11437188B2 (en) 2018-09-25 2022-09-06 Honeywell International Inc. Low porosity glass coatings formed on coiled wires, high temperature devices containing the same, and methods for the fabrication thereof

Also Published As

Publication number Publication date
JPS61175919A (ja) 1986-08-07
GB2186110B (en) 1988-09-07
JPH0349130B2 (enrdf_load_stackoverflow) 1991-07-26
GB2186110A (en) 1987-08-05
GB8602002D0 (en) 1986-03-05

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