US4611554A - Method and device for the treatment of printed circuit boards - Google Patents

Method and device for the treatment of printed circuit boards Download PDF

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Publication number
US4611554A
US4611554A US06/694,639 US69463985A US4611554A US 4611554 A US4611554 A US 4611554A US 69463985 A US69463985 A US 69463985A US 4611554 A US4611554 A US 4611554A
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US
United States
Prior art keywords
nozzles
boards
treatment
board
treated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US06/694,639
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English (en)
Inventor
Hartmut Mahlkow
Horst Blasing
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Assigned to SCHERING AKTIENGESELLSCHAFT reassignment SCHERING AKTIENGESELLSCHAFT ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: BLASING, HORST, MAHLKOW, HARTMUT
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Publication of US4611554A publication Critical patent/US4611554A/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor

Definitions

  • the present invention relates to a method and a device for the treatment of printed circuit boards with process solutions.
  • the treatment of the printed circuit boards with various process solutions is carried out to provide a so-called basis material, which can be then copper-coated, by applying to the boards or plates suitable process solutions, such as cleaning agents, rinsing solutions, etching solutions, neutralizing solutions in chemical baths to form electrically-conductive paths on the plates and in case of the drilled plates to make them through-contacting.
  • suitable process solutions such as cleaning agents, rinsing solutions, etching solutions, neutralizing solutions in chemical baths to form electrically-conductive paths on the plates and in case of the drilled plates to make them through-contacting.
  • a device for the treatment of printed circuit boards with process solutions comprising a container for collecting a treatment solution; a continuous conveyer for continually moving the boards vertically above said container; nozzles for applying a treatment solution to the boards being treated; tubular conduits connected to said nozzles and to said container for conveying a treatment solution to the nozzles; and two similar receivers positioned above said container and below said nozzles and arranged in mirror-inverted relationship relative to each other, said receivers being positioned at two sides of the board being treated and parallel to the direction of moving the boards, each receiver having at a lower end an outlet opening, an inner side wall facing the board being treated and an outer wall facing away from the board, said inner wall being shorter than said outer wall.
  • the receivers may be rectangular in shape.
  • the nozzles may be positioned at upper ends of the outer walls of the receivers.
  • Each nozzle may be formed as a nozzle bar or a strip.
  • Each of the nozzles may include a nozzle head which has a transversal bore extended normally to a plane of the board being treated.
  • the collecting container may be connected to said nozzles by the tubular conduits.
  • the device of this invention may be utilized for through-contacting of printed circuit tracks.
  • the device of the invention may further include separate feeding devices for various process solutions, said feeding devices being arranged one after another for applying various solutions to an outer surface of each board provided with holes to produce through-contacting on said boards.
  • the objects of the present invention may be further attained by a method of continually treating outer surfaces of printed circuit boards provided with holes to produce through-contacting on said boards by applying thereto of process and/or electrolyte solutions, comprising the steps of vertically moving said boards in a suspended position by a continuous conveyor; applying a treatment solution to said boards; draining said solution and collecting the latter; and feeding said solution after the draining and collecting step in a closed cycle back to said applying step.
  • Each process solution may be conveyed at two sides of the board being treated, by means of two receivers, into a collecting container from which the solution is fed back to said applying step.
  • Each process solution may be applied to each board in a separate treatment stage.
  • One of the process solutions may be a watery alkaline solution of a palladium complex which is adjusted to suitable pre-and-after treatment solutions. This process solution has proven to be particularly suitable for activating.
  • Said palladium complex is palladium salt from aminopyridone.
  • the method may be utilized for producing contact switches.
  • the device according to the present invention provides the treatment of printed circuit boards with through-contacting surfaces thereon which does not require a great deal of space.
  • the process solutions are applied directly onto the plates or boards so that the solutions are poured on the outer surface of each board and flow downwardly under gravity, whereby strong turbulent streams are produced in the holes formed in each board. Vortexes, which result from these streams prevent the formation of air blasts and serve the purpose of providing intensive contact of the process solutions with the surfaces of the holes formed in the printed circuit boards.
  • a further specific advantage of the device of the present invention resides in that it is light because it does not require conventional baths and heavy transportation means.
  • the device requires a little space to occupy further makes it possible that the device can be covered from the environment.
  • FIG. 1 is a schematic representation of the device according to the invention.
  • FIG. 2 is a cross-sectional view through a detail of FIG. 1;
  • FIG. 3 is a schematic view showing the device of the invention during the treatment of the printed circuit board.
  • FIG. 4 is a schematic view showing the device of FIG. 3 in a non-operative position.
  • reference numerals 1 designate two collecting tanks having outlet openings 4.
  • a printed circuit board 3 to be treated is suspended on a continual conveyor (non-shown but of any suitable conventional type) between two collecting tanks 1.
  • An accumulator or reservoir 5 is positioned below the board 3 to be treated.
  • Nozzles 2 are arranged above the respective collecting tanks 1.
  • Tubular conduits 7 with regulating valves of conventional design are connected to the nozzles 2.
  • Tubular conduits 6, also provided with suitable valves, are interconnected between reservoir 5 and tubular conduits 7.
  • Each nozzle has a nozzle head provided with a transverse bore directed towards the board being treated.
  • reference numerals 9 designate the streams of a treating agent.
  • Usual standard plates made of double-side copper-coated and glass-fiber-reinforced epoxy resin, are provided with bores in the usual fashion and then suspended on a continuous conveyor which feeds the plates through a number of the devices of the invention, assembled together and provided with separate feeding arrangements for various process solutions.
  • Respective printed circuit boards are treated by a conventional immersion method in an analogous manner.
  • the periods of time of the treatment during the immersion method are as follows:
  • the entire period of time of the conventional immersion-type treatment technique amounts to 25.5 min and is about 5 times longer than the entire time period of the treatment by the method according to this invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
US06/694,639 1984-02-21 1985-01-24 Method and device for the treatment of printed circuit boards Expired - Fee Related US4611554A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19843406583 DE3406583A1 (de) 1984-02-21 1984-02-21 Vorrichtung und verfahren zur behandlung von leiterplatten
DE3406583 1984-02-21

Publications (1)

Publication Number Publication Date
US4611554A true US4611554A (en) 1986-09-16

Family

ID=6228627

Family Applications (1)

Application Number Title Priority Date Filing Date
US06/694,639 Expired - Fee Related US4611554A (en) 1984-02-21 1985-01-24 Method and device for the treatment of printed circuit boards

Country Status (6)

Country Link
US (1) US4611554A (de)
EP (1) EP0152600B1 (de)
JP (1) JPS60198889A (de)
AT (1) AT396311B (de)
CA (1) CA1231595A (de)
DE (2) DE3406583A1 (de)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4828878A (en) * 1985-08-14 1989-05-09 Schering Aktiengesellschaft Device for and method of treating objects, particularly printed circuit boards
US4862827A (en) * 1988-06-28 1989-09-05 Wacker-Chemie Gmbh Apparatus for coating semiconductor components on a dielectric film
US5211756A (en) * 1991-08-09 1993-05-18 Micro-Plate/Systems Apparatus to manufacture printed circuit boards
US5588996A (en) * 1994-04-01 1996-12-31 Argus International Apparatus for spray coating flat surfaces
US5733376A (en) * 1994-04-01 1998-03-31 Argus International Apparatus for spray coating opposing major surfaces of a workpiece
US20050053718A1 (en) * 2001-10-27 2005-03-10 Samsung Electronics Co., Ltd. Positive active material for rechargeable lithium-sulfur batteries and method of preparing same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3122449A (en) * 1962-09-19 1964-02-25 Motorola Inc Method for metallizing non-conductors
US3298588A (en) * 1964-01-23 1967-01-17 Sanders Associates Inc Printed circuit board and machine for soldering same
US3798050A (en) * 1971-05-28 1974-03-19 Ppg Industries Inc Catalytic sensitization of substrates for metallization
US3931790A (en) * 1971-07-06 1976-01-13 Ppg Industries, Inc. Angled crossfire rinses
SU913612A1 (ru) * 1980-07-07 1982-03-15 Igor N Kolokolov Устройство для жидкостной обработки печатных плат, преимущественно для химического меднения 1
US4539069A (en) * 1983-01-06 1985-09-03 Systems Engineering & Manufacturing Corp. Printed circuit board component conveyor apparatus and process

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55156388A (en) * 1979-05-24 1980-12-05 Matsushita Electric Works Ltd Method of forming electric path onto insulating substrate
US4371422A (en) * 1980-10-15 1983-02-01 Micro-Plate, Inc. Continuous processing of printed circuit boards
US4454003A (en) * 1983-01-06 1984-06-12 Systems Engineering & Manufacturing Corp. Printed circuit board component conveyor apparatus and process

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3122449A (en) * 1962-09-19 1964-02-25 Motorola Inc Method for metallizing non-conductors
US3298588A (en) * 1964-01-23 1967-01-17 Sanders Associates Inc Printed circuit board and machine for soldering same
US3798050A (en) * 1971-05-28 1974-03-19 Ppg Industries Inc Catalytic sensitization of substrates for metallization
US3931790A (en) * 1971-07-06 1976-01-13 Ppg Industries, Inc. Angled crossfire rinses
SU913612A1 (ru) * 1980-07-07 1982-03-15 Igor N Kolokolov Устройство для жидкостной обработки печатных плат, преимущественно для химического меднения 1
US4539069A (en) * 1983-01-06 1985-09-03 Systems Engineering & Manufacturing Corp. Printed circuit board component conveyor apparatus and process

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4828878A (en) * 1985-08-14 1989-05-09 Schering Aktiengesellschaft Device for and method of treating objects, particularly printed circuit boards
US4862827A (en) * 1988-06-28 1989-09-05 Wacker-Chemie Gmbh Apparatus for coating semiconductor components on a dielectric film
US5211756A (en) * 1991-08-09 1993-05-18 Micro-Plate/Systems Apparatus to manufacture printed circuit boards
US5588996A (en) * 1994-04-01 1996-12-31 Argus International Apparatus for spray coating flat surfaces
US5733376A (en) * 1994-04-01 1998-03-31 Argus International Apparatus for spray coating opposing major surfaces of a workpiece
US20050053718A1 (en) * 2001-10-27 2005-03-10 Samsung Electronics Co., Ltd. Positive active material for rechargeable lithium-sulfur batteries and method of preparing same

Also Published As

Publication number Publication date
EP0152600A3 (en) 1987-04-22
DE3406583A1 (de) 1985-08-22
DE3484138D1 (de) 1991-03-28
EP0152600A2 (de) 1985-08-28
AT396311B (de) 1993-08-25
ATA49585A (de) 1992-11-15
JPS60198889A (ja) 1985-10-08
EP0152600B1 (de) 1991-02-20
CA1231595A (en) 1988-01-19

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AS Assignment

Owner name: SCHERING AKTIENGESELLSCHAFT BERLIN AND BERGKAMEN,

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:MAHLKOW, HARTMUT;BLASING, HORST;REEL/FRAME:004361/0589

Effective date: 19850115

FPAY Fee payment

Year of fee payment: 4

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
FP Lapsed due to failure to pay maintenance fee

Effective date: 19940921

STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362