US4591401A - Process for the direct bonding of metal to ceramics - Google Patents

Process for the direct bonding of metal to ceramics Download PDF

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Publication number
US4591401A
US4591401A US06/625,722 US62572284A US4591401A US 4591401 A US4591401 A US 4591401A US 62572284 A US62572284 A US 62572284A US 4591401 A US4591401 A US 4591401A
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US
United States
Prior art keywords
metal
ceramic substrate
metal component
bonding
oxide layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US06/625,722
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English (en)
Inventor
Arno Neidig
Klaus Bunk
Karl-Heinz Thiele
Georg Wahl
Jens Gobrecht
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BBC Brown Boveri AG Germany
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Brown Boveri und Cie AG Germany
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Assigned to BROWN, BOVERI & CIE AKTIENGESELLSCHAFT, MANNHEIM/GERMANY, A CORP OF GERMANY reassignment BROWN, BOVERI & CIE AKTIENGESELLSCHAFT, MANNHEIM/GERMANY, A CORP OF GERMANY ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: THIELE, KARL-HEINZ, BUNK, KLAUS, NEIDIG, ARNO, GOBRECHT, JENS, WAHL, GEORG
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/653—Processes involving a melting step
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658—Atmosphere during thermal treatment
    • C04B2235/6581—Total pressure below 1 atmosphere, e.g. vacuum
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658—Atmosphere during thermal treatment
    • C04B2235/6583—Oxygen containing atmosphere, e.g. with changing oxygen pressures
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/54—Oxidising the surface before joining
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/903—Metal to nonmetal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1064—Partial cutting [e.g., grooving or incising]

Definitions

  • the invention relates to a process for directly bonding a metal component, the surface of which is covered by an oxide layer, to a ceramic substrate, by heating the ceramic substrate with the metal component placed thereon, up to a temperature above the eutectic point of the metal and metal oxide but below the melting point of the metal.
  • the process can be used, for example, for bonding copper foils, in particular large-area foils.
  • German published specification No. 2,633,869 a process has been described in which an oxidized copper foil and an oxide-ceramic substrate are heated in an inert atmosphere at a temperature between the eutectic point of copper and copper oxide and the melting point of copper, until a sub-eutectic melt between the copper and the substrate has formed.
  • the heating in an inert atmosphere does not give the desired strong adhesive bond between the copper and the ceramic, since, at the given process temperatures, Cu 2 O is reduced to Cu, which does not bond to ceramics, unless a defined minimum oxygen partial pressure is maintained.
  • German published specification No. 2,319,854 differs from that just described in that a bright metal foil, in particular of copper, which has not been preoxidized, is to be bonded to the oxide-ceramic substrate in a reactive atmosphere, in particular an atmosphere containing oxygen.
  • the oxygen in the atmosphere must first oxidize the copper superficially, before the actual bonding process can proceed. It has been found, however, that, in particular in the case of large-area bonds between ceramics and copper, the oxygen cannot penetrate in an adequate quantity into the gap between the ceramics and copper, so that blister-like points without adhesion result.
  • the copper foil, at the indicated quantities of oxygen being coated with a thick black copper oxide layer on the side facing away from the ceramic substrate, and this coating has to be removed in an additional working step, before further processing is possible.
  • a process for directly bonding a metal component, the surface of which is covered by an oxide layer after preoxidation, to a ceramic substrate which comprises placing the metal component covered by an oxide layer on the ceramic substrate, heating the ceramic substrate with the metal component placed thereon to a temperature above the eutectic point of the metal and metal oxide but below the melting point of the metal, the combination therewith of forming parallel grooves, before said preoxidation on the surface of the metal component which is to be bonded to the ceramic substrate, and then effecting said heating to make the metal/ceramic bond.
  • FIG. 1 shows a metal component with one side with parallel grooves
  • FIG. 2 shows a metal component placed onto a ceramic substrate.
  • An advantageous result of parallel grooves on one side of the metal component is that, during the bonding process, more oxide is available on the metal side to be bonded to the substrate than on the free back of the metal component. This not only leads to a good bond, but also after-treatment of the free metal side becomes superfluous.
  • a further advantage is that the bond can be made either in a vacuum furnace or in a continuous furnace, with or without additional oxygen being supplied.
  • FIG. 1 illustrates a metal component 1 which, for example, can be a copper foil.
  • the surface 2 which is to be bonded to ceramics is roughened by means of striations or grooves 3 which run in parallel. This roughening can be carried out before the metal component 1 is punched out of a larger sheet, for example by means of a brush, or even after the metal component 1 has been produced, for example by grinding. Grooves of a depth and width of about 3 to 10 ⁇ m are particularly suitable.
  • the metal component 1 is preoxidized and placed, with the roughened side facing downwards, onto a ceramic substrate 4, as shown in FIG. 2.
  • the thickness of the oxide layer is selected or optimized in accordance with the further process.
  • the oxide layer can be very thin, if the bonding is carried out in a continuous furnace with a supply of small quantities of oxygen.
  • a continuous furnace is a furnace through which a ceramic substrate with a metal component placed thereon pass continuously and during such passage are heated to effect bonding of the component to the substrate.
  • a vacuum furnace is a furnace wherein a ceramic substrate covered by a metal component is heated under a vacuum to effect bonding of the metal component and ceramic substrate.
  • the bond can also be made in an advantageous manner in a continuous furnace without oxygen supply.
  • the greater quantity of oxygen available, due to the grooves 3, between the surfaces, which are to be bonded, of the metal component land the ceramic substrate 4, is then sufficient for perfect bonding. Bonding in a vacuum furnace can also be accomplished.
  • the metal/oxygen mixture must reach the state of a molten phase for direct bonding of the metal to ceramics.
  • a defined oxygen partial pressure depending on the temperature is necessary.
  • the thickness of the melt is dependent on the available oxygen, that is to say the more oxygen available, for example in the form of an oxide layer, the thicker the melt becomes.
  • the thickness of the melt is optimized if points of defective contacting due to blister formation are to be avoided. Both excessively thick and excessively thin layers of the melt lead to unsatisfactory bonding.
  • the grooves 3 on the surface 2 of the metal component 1 which is to be bonded to the ceramic substrate 4 have the result that, after the preoxidation, more oxide is present on the area thus enlarged than on the smooth back.
  • the thickness of the oxide layer is generally within the range of about 0.5 to about 1.5 ⁇ m. Adjustment to optimize the available oxygen, by changing the thickness of the oxide layer or the shape of the grooves is simply and easily accomplished by preliminarily running a few sample bondings and as a result thereof, if necessary, making the adjustment and continuing the operations thereafter on an adjusted or optimized basis.
  • the grooves 3 running in parallel provide good flow behavior of the molten liquid, so that virtually bubble-free wetting results. Due to the relatively small quantity of oxygen available on the smooth side of the metal component, no thicker oxide layer is formed there.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Products (AREA)
  • Manufacturing Of Printed Wiring (AREA)
US06/625,722 1983-07-08 1984-06-28 Process for the direct bonding of metal to ceramics Expired - Fee Related US4591401A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19833324661 DE3324661A1 (de) 1983-07-08 1983-07-08 Verfahren zum direkten verbinden von metall mit keramik
DE3324661 1983-07-08

Publications (1)

Publication Number Publication Date
US4591401A true US4591401A (en) 1986-05-27

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US06/625,722 Expired - Fee Related US4591401A (en) 1983-07-08 1984-06-28 Process for the direct bonding of metal to ceramics

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US (1) US4591401A (enrdf_load_stackoverflow)
JP (1) JPS6036383A (enrdf_load_stackoverflow)
DE (1) DE3324661A1 (enrdf_load_stackoverflow)

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4860939A (en) * 1987-11-10 1989-08-29 La Telemecanique Electrique Method for bonding a copper sheet to a substrate made of an electrically insulating material
US4985097A (en) * 1985-09-26 1991-01-15 Kabushiki Kaisha Toshiba Joined metal composite and method for production thereof
US5074941A (en) * 1990-12-10 1991-12-24 Cornell Research Foundation, Inc. Enhancing bonding at metal-ceramic interfaces
US5094150A (en) * 1989-04-29 1992-03-10 Hoechst Ceramtec Aktiengesellschaft Pump piston for axial piston pumps
US5155665A (en) * 1988-03-30 1992-10-13 Kabushiki Kaisha Toshiba Bonded ceramic-metal composite substrate, circuit board constructed therewith and methods for production thereof
US5474635A (en) * 1994-03-07 1995-12-12 United Technologies Corporation Joining non-coplanar panels and structures of fiber reinforced composites
US5876859A (en) * 1994-11-10 1999-03-02 Vlt Corporation Direct metal bonding
US5900097A (en) * 1996-10-30 1999-05-04 Brown; Dennis P. Method of fabricating a laminated composite material
US6039616A (en) * 1998-11-25 2000-03-21 Antaya Technologies Corporation Circular electrical connector
US6079276A (en) * 1995-02-28 2000-06-27 Rosemount Inc. Sintered pressure sensor for a pressure transmitter
US6484585B1 (en) 1995-02-28 2002-11-26 Rosemount Inc. Pressure sensor for a pressure transmitter
US6505516B1 (en) 2000-01-06 2003-01-14 Rosemount Inc. Capacitive pressure sensing with moving dielectric
US6508129B1 (en) 2000-01-06 2003-01-21 Rosemount Inc. Pressure sensor capsule with improved isolation
US6516671B2 (en) 2000-01-06 2003-02-11 Rosemount Inc. Grain growth of electrical interconnection for microelectromechanical systems (MEMS)
US6520020B1 (en) 2000-01-06 2003-02-18 Rosemount Inc. Method and apparatus for a direct bonded isolated pressure sensor
US6561038B2 (en) 2000-01-06 2003-05-13 Rosemount Inc. Sensor with fluid isolation barrier
US6599156B2 (en) 1998-11-25 2003-07-29 Antaya Technologies Corporation Circular electrical connector
US20030209080A1 (en) * 2002-05-08 2003-11-13 Sittler Fred C. Pressure sensor assembly
FR2862246A1 (fr) * 2003-10-17 2005-05-20 Eads Space Transp Gmbh Procede de brasage de surfaces ceramiques
US20070231590A1 (en) * 2006-03-31 2007-10-04 Stellar Industries Corp. Method of Bonding Metals to Ceramics
USRE39974E1 (en) * 1996-04-05 2008-01-01 Hipercon, Llc Management of contact spots between an electrical brush and substrate
US20090152237A1 (en) * 2007-12-18 2009-06-18 High Conduction Scientific Co., Ltd. Ceramic-Copper Foil Bonding Method

Families Citing this family (5)

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Publication number Priority date Publication date Assignee Title
DE3633907A1 (de) * 1986-08-02 1988-02-04 Altan Akyuerek Verfahren zum haftfesten verbinden eines kupferkoerpers mit einem substrat
DE3701108A1 (de) * 1987-01-16 1988-07-28 Akyuerek Altan Verfahren zum verbinden zweier metallteile
DE3812910A1 (de) * 1988-04-18 1989-10-26 Hanseatische Praezisions Und O Keramik-verbundwerkstoff und verfahren zu dessen herstellung
DE3930859C2 (de) * 1988-09-20 1997-04-30 Schulz Harder Juergen Verfahren zum Verlöten wenigstens zweier Elemente
CN100361935C (zh) * 2006-05-15 2008-01-16 西北工业大学 碳/碳或碳/碳化硅复合材料与耐热合金的连接方法

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US3034202A (en) * 1957-01-23 1962-05-15 Gibson Electric Company Contact for forge welding methods
US3766634A (en) * 1972-04-20 1973-10-23 Gen Electric Method of direct bonding metals to non-metallic substrates
US3911553A (en) * 1974-03-04 1975-10-14 Gen Electric Method for bonding metal to ceramic
US3970235A (en) * 1974-05-08 1976-07-20 Rca Corporation Method of anchoring metallic coated leads to ceramic bodies and lead-ceramic bodies formed thereby
US3994430A (en) * 1975-07-30 1976-11-30 General Electric Company Direct bonding of metals to ceramics and metals
GB2099742A (en) * 1981-06-05 1982-12-15 Philips Electronic Associated Bonding metals to non-metals

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US2225081A (en) * 1940-12-17 Method of forming a pimp valve
DE622005C (de) * 1934-01-25 1935-11-18 Champion Spark Plug Co Verfahren zur Verbindung der Einzelteile von mehrteiligen Gegenstaenden miteinander
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DE674734C (de) * 1937-01-26 1939-04-21 Porzellanfabrik Kahla Verfahren zur Vereinigung metallischer Teile mit Isolierkoerpern aus anorganischem, insbesondere keramischem Werkstoff
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Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3034202A (en) * 1957-01-23 1962-05-15 Gibson Electric Company Contact for forge welding methods
US3766634A (en) * 1972-04-20 1973-10-23 Gen Electric Method of direct bonding metals to non-metallic substrates
US3911553A (en) * 1974-03-04 1975-10-14 Gen Electric Method for bonding metal to ceramic
US3970235A (en) * 1974-05-08 1976-07-20 Rca Corporation Method of anchoring metallic coated leads to ceramic bodies and lead-ceramic bodies formed thereby
US3994430A (en) * 1975-07-30 1976-11-30 General Electric Company Direct bonding of metals to ceramics and metals
GB2099742A (en) * 1981-06-05 1982-12-15 Philips Electronic Associated Bonding metals to non-metals

Cited By (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4985097A (en) * 1985-09-26 1991-01-15 Kabushiki Kaisha Toshiba Joined metal composite and method for production thereof
US4860939A (en) * 1987-11-10 1989-08-29 La Telemecanique Electrique Method for bonding a copper sheet to a substrate made of an electrically insulating material
US5155665A (en) * 1988-03-30 1992-10-13 Kabushiki Kaisha Toshiba Bonded ceramic-metal composite substrate, circuit board constructed therewith and methods for production thereof
EP0596582A1 (en) * 1988-03-30 1994-05-11 Kabushiki Kaisha Toshiba Bonded ceramic-metal composite substrate and circuit board constructed therewith
US5094150A (en) * 1989-04-29 1992-03-10 Hoechst Ceramtec Aktiengesellschaft Pump piston for axial piston pumps
US5074941A (en) * 1990-12-10 1991-12-24 Cornell Research Foundation, Inc. Enhancing bonding at metal-ceramic interfaces
US5474635A (en) * 1994-03-07 1995-12-12 United Technologies Corporation Joining non-coplanar panels and structures of fiber reinforced composites
US5506018A (en) * 1994-03-07 1996-04-09 United Technologies Corporation Joining non-coplanar panels and structures of fiber reinforced composites
US5876859A (en) * 1994-11-10 1999-03-02 Vlt Corporation Direct metal bonding
US5938104A (en) * 1994-11-10 1999-08-17 Vlt Corporation Direct metal bonding
US6079276A (en) * 1995-02-28 2000-06-27 Rosemount Inc. Sintered pressure sensor for a pressure transmitter
US6082199A (en) * 1995-02-28 2000-07-04 Rosemount Inc. Pressure sensor cavity etched with hot POCL3 gas
US6089097A (en) * 1995-02-28 2000-07-18 Rosemount Inc. Elongated pressure sensor for a pressure transmitter
US6484585B1 (en) 1995-02-28 2002-11-26 Rosemount Inc. Pressure sensor for a pressure transmitter
USRE39974E1 (en) * 1996-04-05 2008-01-01 Hipercon, Llc Management of contact spots between an electrical brush and substrate
US5900097A (en) * 1996-10-30 1999-05-04 Brown; Dennis P. Method of fabricating a laminated composite material
US6945831B2 (en) 1998-11-25 2005-09-20 Antaya Technologies Corporation Circular electrical connector
US20070173085A1 (en) * 1998-11-25 2007-07-26 John Pereira Circular electrical connector
US7553204B2 (en) 1998-11-25 2009-06-30 Antaya Technologies Corporation Circular electrical connector
US7371083B2 (en) 1998-11-25 2008-05-13 Antaya Technologies Corporation Circular electrical connector
US6039616A (en) * 1998-11-25 2000-03-21 Antaya Technologies Corporation Circular electrical connector
US7226299B2 (en) 1998-11-25 2007-06-05 Antaya Technologies Corporation Circular electrical connector
US6599156B2 (en) 1998-11-25 2003-07-29 Antaya Technologies Corporation Circular electrical connector
US6599157B2 (en) 1998-11-25 2003-07-29 Antaya Technologies Corporation Circular electrical connector
US20060228953A1 (en) * 1998-11-25 2006-10-12 John Pereira Circular electrical connector
US6780071B2 (en) 1998-11-25 2004-08-24 Antaya Technologies Corporation Circular electrical connector
US20040248477A1 (en) * 1998-11-25 2004-12-09 Antaya Technologies Corporation Circular electrical connector
US7083481B2 (en) 1998-11-25 2006-08-01 Antaya Technologies Corporation Circular electrical connector
US20050239348A1 (en) * 1998-11-25 2005-10-27 Antaya Technologies Corporation Circular electrical connector
US6249966B1 (en) 1998-11-25 2001-06-26 Antaya Technologies Corporation Method of forming a circular electrical connector
US6561038B2 (en) 2000-01-06 2003-05-13 Rosemount Inc. Sensor with fluid isolation barrier
US6505516B1 (en) 2000-01-06 2003-01-14 Rosemount Inc. Capacitive pressure sensing with moving dielectric
US6520020B1 (en) 2000-01-06 2003-02-18 Rosemount Inc. Method and apparatus for a direct bonded isolated pressure sensor
US6516671B2 (en) 2000-01-06 2003-02-11 Rosemount Inc. Grain growth of electrical interconnection for microelectromechanical systems (MEMS)
US6508129B1 (en) 2000-01-06 2003-01-21 Rosemount Inc. Pressure sensor capsule with improved isolation
US6848316B2 (en) 2002-05-08 2005-02-01 Rosemount Inc. Pressure sensor assembly
US20030209080A1 (en) * 2002-05-08 2003-11-13 Sittler Fred C. Pressure sensor assembly
US20050145679A1 (en) * 2003-10-17 2005-07-07 Eads Space Transportation Gmbh Method for brazing ceramic surfaces
FR2862246A1 (fr) * 2003-10-17 2005-05-20 Eads Space Transp Gmbh Procede de brasage de surfaces ceramiques
US7478742B2 (en) 2003-10-17 2009-01-20 Eads Space Transportation Gmbh Method for brazing ceramic surfaces
US20070231590A1 (en) * 2006-03-31 2007-10-04 Stellar Industries Corp. Method of Bonding Metals to Ceramics
US20090152237A1 (en) * 2007-12-18 2009-06-18 High Conduction Scientific Co., Ltd. Ceramic-Copper Foil Bonding Method

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DE3324661C2 (enrdf_load_stackoverflow) 1988-06-23
JPS6036383A (ja) 1985-02-25
DE3324661A1 (de) 1985-01-17

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