Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0313—Organic insulating material
  • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
  • C08L25/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D125/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Coating compositions based on derivatives of such polymers
  • C09D125/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen

Definitions

• the present invention relates to new resin compositions comprising polyhydroxystyrene and an epoxy resin and, in particular, to resin compositions which can be changed into hardened products having excellent heat resistance as well as to a method for hardening the resin compositions.
• thermosetting resin compositions comprising an epoxy resin and a phenol precondensate have been utilized in various fields such as paints and varnishes, castings, as well as in laminates and other composite articles.
• the resulting hardened products have limited heat resistance and cannot be used in fields which require heat resistance.
• these epoxy resin-phenol precondensate compositions are defective, particularly with respect to the heat resistance of the hardened products obtained therefrom.
• This composition becomes a hardened product only by heating the same composition with the addition of a catalyst such as a tertiary amine catalyst or a hardening accelerator, and the heat resistance of the resulting hardened product is limited to only about 100C or so, for example, with respect to heat deformation temperature.
• a catalyst such as a tertiary amine catalyst or a hardening accelerator
• a first object of the present invention is to provide resin compositions which can be changed into hardened products having excellent heat resistance.
• a second object of the present invention is to provide resin compositions which can be changed into hardened products having excellent heat resistance without the use in the heat-hardening of any catalyst or hardening accelerator.
• a third object of the present invention is to provide thermosetting resin compositions of less toxicity.
• a fourth object of the present invention is to provide thermosetting resin compositions which are particularly suitable for the preparation of copper clad laminates.
• compositions of the present invention comprise polyhydroxystyrene and an epoxy resin.
• the polyhydroxystyrene used in the compositions of the present invention can be a polyhydroxystyrene of various degrees of polymerization over a broad range of from tetramers to polymers having a degree of polymerization of about 70,000, the degree of polymerization is preferably in the range of from about tetramers to polymers of a degree of polymerization of about or so. If lower than a tetramer, a composition containing such lower polymer can often be changed into a hardened product of excellent heat resistance only with difficuIty.
• the monomer unit can be anyone of ohydroxystyrene, m-hydroxystyrene and phydroxystyrene as well as mixtures thereof.
• These polyhydroxystyrenes can easily be prepared, for example, by thermal polymerization, ionic polymerization or radical polymerization of these hydroxystyrene monomers, or can also easily be prepared by polymerizing an acyloxystyrene or an alkoxystyrene and then hydrolyzing the resulting polymers.
• the epoxy resins used with the polyhydroxystyrene can be anyone of the so-called epoxy resins which are generally used and which mainly comprise compounds having at least two epoxy groups per molecule. These epoxy resins can further be anyone of the saturated or unsaturated aliphatic, cycloaliphatic, aromatic or heterocyclic epoxy resins, and if desired, can be substituted by one or more substituents which have no influence on producing and hardening the composition, such as a halogen atom, a hydroxyl group, an ether group, an ester group and/or a metal atom.
• preferred epoxy resins are, for example, the following compounds:
• polyglycidylethers obtained by etherification of polyhydric alcohols or polyhydric phenols with epichlorohydrin or dichlorohydrin in the presence of alkaline agents, which include glycidylethers (bisphenol type epoxy resins) derived from bis-(phydroxyphenyl)-methane, bis-(p-hydroxyphenyl dimethylmethane, bis-(p-hydroxyphenyl methylphenylmethane, bis-(p-hydroxyphenyl tolylmethane, 4,4-dihydroxy-diphenyl, bis-(p-hydroxyphenyl)-sulfone, etc.; glycidylethers (polyhydroxybenzene type epoxy resins derived from resorcin, catechol, hydroquinone, etc.; glycidylethers (polyphenol type epoxy resins) derived from l,l,3-tris-(p-hydroxyphenyl)-propane, l, l ,2,
• Polyglycidyl esters formed by the reaction of polycarboxylic acids with epichlorohydrin or dichlorohydrin in the presence of alkaline agents; These polyesters are derived, for example, from aliphatic dicarboxylic acids such as succinic acid, adipic acid, etc.; aromatic dicarboxylic acids such as phthalic acid, terephthalic acid, etc.; or polymers of unsaturated fatty acids, such as linoleic acid, etc.
• Cycloaliphatic polyepoxides such as vinyl cyclohexenedioxide, limonenedioxide, dicyclopentadienedioxide, ethyleneglycol-bis-( 3 ,4-epoxy-tetrahydro-dicyclopentadiene-8- yl)-ether, (3,4-epoxy-tetrahydrodicyclopentadien-8- yl )-glycidylether, diethyleneglycol-bis-( 3 ,4-epoxycyclohexanecarboxylate bis-( 3 ,4-epoxycyclohexylmethyl)-succinate, 3,4-epoxy-6- methylcyclohexylmethyl-3,4-epoxy-6-methylcyclohexane-carboxylate, 3,4-epoxy-hexahydrobenzal-3,4- epoxy-cyclohexane- 1 1 -d
• Basic polyepoxy compounds obtained by the reaction of aliphatic or aromatic primary or secondary diamines such as aniline, toluidine, 4,4'-diamino-diphenylmethane, 4,4'-di- (monomethylamino)-diphenylmethane, 4,4'- diaminodiphenylsulfone, etc. with epichlorohydrin in the presence of alkaline agents.
• (Dienetype epoxy resins) such as epoxidized dienes, epoxidized polybutadiene or epoxidized copolymers of butadiene and ethylenically unsaturated compounds such as styrene or vinyl acetate with butadiene, etc.
• mixtures of these epoxy resins can be used.
• the bisphenol type epoxy resins are preferably used, since various kinds of these resins having various molecular weights are readily available and further the applications of these bisphenol epoxy resins is extremely broad.
• the composition of the present invention comprises a homogeneous mixture of polyhydroxystyrene and epoxy resin, and the polyhydroxystyrene and the epoxy resin can be employed together in any desired ratio depending on the desired end uses.
• the ratio of the number of hydroxyl groups contained in polyhydroxystyrene to the number of epoxy groups contained in epoxy resin herein referred to as the hydroxyl group/epoxy group ratio
• the hardened product obtained from the composition is a thermoplastic one, being less crosslinked, with the result that the physical properties of the resulting hardened product are not greatly different from the properties of the polyhydroxystyrene used.
• the hydroxyl group/epoxy group ratio is preferably in the range of P/ 0.6 (where i represents an average degree of polymerization of polyhydroxystyrene used), and it is desirable to appropriately select this ratio in this range depending on the desired end use.
• the hydroxyl group/epoxy group ratio is preferably in the range of 0.8-5.0 or so. Outside this range, the hardened product obtainable is insufficiently crosslinked with the result that the heat resistance thereof tends to be reduced.
• compositions of the present invention can be in various forms or phases. That is, the composition of the present invention can be a liquid or a solid, depending upon the phases of the polyhydroxystyrene and the epoxy resin used in the composition.
• the composition can be in the form of a solution in an organic solvent, e.g., at a concentration of about 3 to percent by weight, which dissolves both the polyhydroxystyrene and the epoxy resin but which does not react therewith.
• Suitable solvents are, for example, ketones such as acetone, methyl ethyl ketone and methyl isobutyl ketone, esters such as methyl acetate, ethyl acetate, butyl acetate and amyl acetate, ethers such as tetrahydrofuran and dioxane, etc.
• the composition of the present invention can further contain various kinds of dyestuffs and pigments as well as various kinds of adjuvants such as plasticizers, reinforcing agents, fillers,
• plasticizers can be used in the present invention. Suitable examples are glycerin, nitrobenzene, phthalic anhydride, benzoic anhydride, stearic acid, stearates, dibutylphthalate, tricresylphosphate, alkylphenols, alkyldiphenyl benzene, rosin, etc.
• An amount of the plasticizer employed is generally 0.5 to 20 wt percent based on the weight of the resin composition.
• reinforcing agents can be used in the present invention. Suitable examples of these reinforcing agents are papers, asbestos papers, synthetic fibers, glass fibers, graphite fibers, metallic fibers, etc. An appropriate amount of the reinforcing agent used is 20 to 900 phr. based on the weight of the resin composition.
• fillers can also be used in the present invention. Suitable examples of such are silicas, quartz, aluminas, calcium carbonate, mica, talc, graphite, cements, clays, asbestos, gypsum, metallic powders etc. An amount of the filler used is less than 900 phr based on the weight of the resin composition.
• the present composition can be hardened generally by heating at a temperature of about C or more for 10 minutes to 4 hours. In order to reduce the hardening time and to effectively attain the characteristic properties of the hardened product such as excellent heat resistance, it is preferable to heat at about to 250C. Higher hardening temperatures can be employed up to below the decomposition temperature of the resulting hardened product (generally about 310 to 390C).
• compositions of the present invention can be hardened simply by heating without the use of any catalyst or hardening accelerator.
• a catalyst or hardening accelerator generally used for the hardening of epoxide-phenol type compositions, for example, a secondary amine such as urea or diethanol amine, a tertiary amine such as triethanol amine, pdimethylaminobenzaldehyde or N,N-dimethylformamide, or the like.
• the amount of the hardening accelerator or catalyst added can be equal to or less than that added to conventional epoxide-phenol type compositions, e.g., generally an amount of accelerator or catalyst of 0.1 to 10 phr.
• compositions of the present invention can be widely used in various fields such as coating agents, moldings as well as laminates and other composite articles, and the compositions can be utilized in various forms.
• a solution the present composition dissolved in an appropriate solvent is applied on a support, dried at a temperature of about room temperature (2030C) to about 140C, preferably room temperature to about 100C and heated at the temperatures described above, or powders of the present composition are applied on a support by compression and heated, whereby a smooth film is formed on the support.
• the composition of the present invention can be cast in a mold, directly heated and melted at a temperature below the hardening temperature of the composition and then the cast melt is heated at the hardening temperature thereof to obtain a casting.
• the composition is, in general, first applied at a temperature below the hardening temperature thereof and then melted and hardened or is first dissolved in an organic solvent, and the resulting solution is impregnated into a reinforcing material such as organic fibers, graphite fibers, asbestos, slag wool or the like, and when the solution is used the organic solvent used is removed by evaporation after the impregnation, whereby an impregnated product such as a socalled bulk-molding compound, sheet-molding compound, prepreg mat or the like is obtained.
• a reinforcing material such as organic fibers, graphite fibers, asbestos, slag wool or the like
• the impregnated products thus obtained are free from any defect such as blocking which occurs at room temperature due to the adhesion thereof, as is seen in other impreg nated products in the formation of composite articles using polyester resins, and further the impregnated products of the present invention have excellent storage stability. That is, the impregnated products obtained from the compositions of the present invention are advantageous since they can be easily handled.
• the resulting impregnated product is put into a mold using any appropriate method depending upon the form or shape thereof and compressed and heated to harden the resin composition, whereby a composite article reinforced with the reinforcing material used is obtained.
• an inorganic filler or a like additive can of course be used in a manner analogous to the manufacture of reinforced plastics in general.
• compositions of the present invention have a variety of uses and can be easily hardened simply by heating without the use of any catalyst or hardening accelerator, and the resulting hardened products have excel-- lent heat resistance as will be concretely substantiated in the examples to follow.
• castings are manufactured from the compositions of the present invention they have a high heat deformation temperature, and when composite articles are prepared from the present compositions with heat resistant reinforcing materials, the strength thereof is not lowered even after heating for a long period of time and the hot strength thereof is fully maintained at a high level.
• thermosetting resin compositions of epoxy resins and phenol precondensates are not fully hardened without a catalyst or hardening accelerator, and, even though these conventional compositions are hardened with these agents, the resulting hardened products do not have the excellent heat resistance of the hardened products obtained from the compositions of the present invention.
• Another advantage of the present invention is the ability to provide epoxy-containing resin compositions of extremely low toxicity.
• known epoxy resin compositions are toxic, and various precautions have been taken therefor during the manufacture and processing of these known epoxy resin compositions.
• the toxicity of these compositions most greatly depends upon the toxicity of hardeners.
• amines which are predominantly used as hardeners or accelerators are extremely toxic, and in addition, it has been reported that acids, acid anhydrides, phenol resin precondensates, etc., which are used as hardeners have some degree of toxicity.
• the polyhydroxystyrene used in the composition of the present invention would be toxic since it is a phenol type compound, it has surprisingly been found after a great deal of experimentation on the toxicity thereof that the polyhydroxystyrene does not have any acute or sub-acute toxicity and further does not exhibit any toxicity in a skin stimulation effect test. Accordingly, the use of non-toxic polyhydroxystyrene as one component of resin compositions in the present invention is very advantageous in that not only are the precautions necessary in the preparing operation of the compositions decreased but also the toxicity of the prepared compositions themselves is greatly reduced due to the use of this non-toxic compound.
• the resin compositions of the present invention are suitable for use as insulating materials, particularly copper clad laminates for use as printed circuits (hereunder simply referred to as CCL), used in the electric and electronic industries.
• Paper/phenol resin CCLs prepared by high pressure molding has heretofore occupied almost all CCL of these fields, but the paper/- phenol resin CCL is defective in that the electrical properties thereof widely fluctuate depending upon variations in ambient temperature and humidity, with the result that the laminate tends to warp extensively due to heating and moisture absorption, causing a poor operation of the device due to an incomplete contact of the laminate with other part, and in that the laminate has poor heat resistance in solder immersion and poor chemical resistance.
• the manufacture of a substrate impregnated with the composition of polyhydroxystyrene and epoxy resin of the present invention can be by applying conventional techniques which have heretofore been employed in preparing conventional synthetic resin impregnated substrates, for example, phenol resin impregnated substrates, epoxy resin impregnated substrates, etc. More precisely, substrates impregnated with the above described resin compositions are prepared, for example, employing the following steps: The components of the resin composition to be impregnated are dissolved and the components, that is, both the polyhydroxystyrene and the epoxy resin, are dissolved in a solvent which does not react with the components.
• Suitable solvents which can be employed, for example, ketones such as acetone, methyl ethyl ketone and methyl isobutyl ketone, esters such as methyl acetate, ethyl acetate, butyl acetate, ethers such as tetrahydrofuran and dioxane, etc.
• a heat resistant substance such as paper, glass fabric, asbestos paper or a like substrate, and the thus impregnated substrate is dried at a temperature in a range such that the impregnated polyhydroxystyrene-epoxy resin composition is not as yet completely hardened.
• the concentration of the resin composition in the impregnating varnish is appropriately selected depending on the degree of the content of the resin composition in the resin composition impregnated substrate, and is preferably in the range of about to 80 percent by weight.
• the content of the resin composition in the resin composition impregnated substrate also is preferably in the range of about 10 to 80 percent by weight.
• the drying temperature of the resin composition impregnated substrate can be at any temperature which does not completely harden the resin composition, as mentioned above. In general, a suitable temperature is in the range of from about room temperatures to C) to 140C. When a catalyst or a hardening accelerator is used for the purpose of accelerating the hardening of the resin composition, this additive is generally incorporated in the impregnating varnish during the preparation thereof.
• any copper foil which has heretofore been manufactured and is commercially available for an epoxy resin CCL can be used as such, or if necessary, after an adhesive is applied thereon.
• Suitable adhesives which can be used are heat resistant thermosetting resins other than polyhydroxystyreneepoxy resin compositions used in the preparation of the synthetic resin impregnated substrates in the present invention, such as a mixture of a novolak epoxy resin and an amine hardener or the like. It is preferred to use as the adhesive a varnish of the above described polyhydroxystyrene-epoxy resin composition for the purpose of fully exhibiting the excellent characteristics of the polyhydroxystyrene-epoxy resin composition itself in the CCL.
• the shaping of the above described CCL can generally be carried out using the same methods as are employed in shaping conventional CCLs.
• an appropriate number of the above described polyhydroxystyrene-epoxy resin composition impregnated substrates are piled depending on the thickness of the CCL desired, a copper foil which has or has not been treated with an adhesive is superposed on one surface or both surfaces of the laminated substrate so that the adhesive surface of the copper foil is in contact with the substrate, and highly polished plates are placed on both the upper and lower surfaces thereof.
• the thus placed substrate is put between press-heat plates and is shaped there between under heat and pressure.
• the heating and pressing conditions are preferably a temperature of about 120 to 250C and a pressure of about 10 to kg/cm for the heating and a pressing time of about 10 minutes to 2 hours. It is especially preferred to post-cure for about l to 24 hours at about 150 to 250C after shaping.
• the previously prepared laminate may be one shaped by heating and pressing an appropriate number of the polyhydroxystyrene-epoxy resin composition impregnated substrates used in the present invention, or may be any other commercially available thermosetting resin laminates.
• a CCL prepared by using the resin composition of the present invention has particularly excellent solder heat resistance.
• the approximate limit of the solder heat resistance thereof is that no blister or peeling occurs under the conditions of 260C for seconds.
• CCLs prepared by using the resin compositions of the present invention have surprisingly higher solder heat resistance than the conventional CCl such that no change is noticed therein at 260C for 30 minutes or more, or in particular, at 300C for 30 minutes or more by appropriately selecting the components of the resin compositions, as seen in the Examples 9 and 13 to follow.
• the peeling strength (on peeling of the copper foil) of the present CCL after the soldering test is not substantially different from (or is almost the same as) that before the test, that is the adhesion of the copper foil is essentially the same before and after the soldering test.
• EXAMPLE 1 Polyparahydroxystyrene having an average molecular weight of 8000 and a bisphenol type epoxy resin DER331-J (trade name, a resin consisting of bisphenol A and epichlorohydrin and having an epoxy equivalent of 189, produced by the Dow Chemical Co.) or a peracetic acid type cycloaliphatic epoxide CX 221 (trade name, an epoxy resin having an epoxy equivalent of 137, produced by the Chisso Co.) were admixed together so that the hydroxyl group/epoxy group ratio (Ol-I/Ep) is 0.8, 1.3, 1.8 or 2.3, and the resulting mixture was heated and melted at to C.
• DER331-J trade name, a resin consisting of bisphenol A and epichlorohydrin and having an epoxy equivalent of 189, produced by the Dow Chemical Co.
• a peracetic acid type cycloaliphatic epoxide CX 221 trade name, an epoxy resin having an epoxy
• the resulting melt was cast into a glass mold (to which is applied a silicone grease as a releasing agent) and heated at 150C for 1 hour, and then further heated at C for 3 hours, after removal from the glass mold, thereby to obtain a casting of a transparent pale yellow color.
• Testing pieces cut from the obtained casting were subjected to a heat deformation test to determine the heat 11 deformation temperature (HDT) thereof, and the test results obtained are shown in Table 1 below.
• Example 1 The same polyparahydroxystyrene as that described in Example 1 and DER331-J or CX221 as an epoxy resin were admixed together so that the hydroxyl group/epoxy group ratio was 2, and the resulting mixture was processed in the same manner as described in Example 1 with the exception that the heating conditions were variously changed as shown in the following Table 3, to obtain various types of castings.
• the heat deformation temperature of each of the castings obtained was measured in a manner similar to Example 1, and the results obtained are shown also in Table 3.
• the resulting solution was coated on a tin plate or a glass plate, and, after the thus coated plate was dried for 4 hours at room temperature, it was heat-treated for 1 hour at 180C to form a coating film having a thickness of about 301-.
• the thus formed film on a glass support was immersed in methylethylketone for 24 hours at room temperature or left for 6 hours in methylethylketone at reflux, and thereafter the degree of hardening of the film was observed.
• the other film on a tin plate support was subjected to a cross-cut peeling test, pencil hardness test and bending resistance test. The results of these tests are shown in the following Table 4. In the Degree of Hardening column in Table 4, the designation 0 means that the film was not eroded.
• the bending resistance test in Table 4 was measured as follows: The bending resistance was measured using the following method according to JIS K- 5400-1970 A testing sample was applied to one surface of a tin plate (about 150mmX50mm 0.3mm) and the thus coated tin plate was inserted into a bending tester which is provided with a shaft having a determined diameter so that the coated surface was placed outside against the shaft, and then the plate was immediately bent around the shaft by 180 in the course of about 1 second. Afterwards, the bend area was observed by the naked eye to inspect any cracking or peeling of the coated film. In the Table 4 is given the minimum diameter of the shaft with which no abnormal phenomena such as cracking, peeling, etc. occured in the coated film.
• EXAMPLE The same polyparahydroxystyrene as that used in Example 1 and a bisphenol type epoxy resin DER664-J (a resin consisting of bisphenol A and epichlorohydrin and having an epoxy equivalent of 925, produced by the Dow Chemical Co.) were weighed out in such proportions that the hydroxyl group/epoxy group ratio was 1, 1.5, 2.0, 2.5 or 3.0, and these materials were pulverized with a pulverizer for 30 minutes and admixed together. Next, the resulting mixture was passed through a 65 mesh sieve and the part of the mixture passed was placed on a glass plate under compression in the thickness of about 100 p. and then heated at 120C, 150C or 180C each for 2 hours to form a film thereon. The
• Test pieces mm X80 mm were cut from each of the laminates obtained, and properties of these test pieces were tested under various conditions, with respect to weight loss, bending strength and bending elasticity. The results of these tests are shown in Tables 7 to 12.
• Laminate Bending Strength Bending Elasticity No. (kg/mm retention (kglmm retention Retention of bending strength is represented by the following:
• EXAMPLE 7 38.8 parts by weight of polyparahydroxystyrene (average molecular weight: 6800), 61.2 parts by weight of an epoxy resin DER331-J and, as a hardener,.l phr (parts per hundred resin) of pdimethylaminobenzaldehyde were dissolved in parts by weight of acetone to prepare a varnish.
• a glass cloth as described in Example 6 was immersed in the resulting varnish, left at room temperature (approx 20to 30C) for 12 hours and dried at C for 10 minutes to obtain a resin composition impregnated substrate.
• Sheets of the resulting substrates were piled in three layers or six layers, heated at C for 10 minutes and then subjected to heat-press molding at 120C and 50
• EXAMPLE 8 20.0 parts of weight of polyhydroxystyrene (average molecular weight: 6800), 80.0 parts by weight of a solid epoxy resin Epikote 1001 (trade name, a resin prepared from epichloro-hydrin and bisphenol A, epoxy equivalent 480, produced by Shell Corp.) and, as a hardener, 0.5 phr of p-dimethylaminobenzaldehyde row and the others relate to the other laminate of 1.6 10 Were dissolved n 1 10 Parts y gh of aCeIOne to mm thickness.
• the tracking resistance was measured according to the following method which is modified from the KA method of DIN 53480 (1964):
• a specimen was put on a supporting bed and a pair of electrodes were placed on the horizontal surface of the specimen with a distance between the electrodes of 4 t 0.1 mm.
• the circuit voltage was so adjusted that the short circuit current therein was 1 i 0. 1 A, and then 20-25mm of a test solution (iammonium chloride aqueous solution of 0.100i0.002 percent concentration) were dropped on the surface of the specimen in a central part between the electrodes, at a rate of one drop per fi seconds.
• a maximum depth of groove eroded on the surface of the specimen immediately after the dropping of 101 drops was measured with a micrometer, and the tracking resistance was graded according to following Table 14.
• Table 15 Properties Tested Temperature Data Insulating Resistance 25C 10 X 10 or more do. (boiling for 2 hours) do. 1.88 X 10 Surface Resistance ((1) do. 1.88 X 10 or more do. (moisture absorption treatment do. 1.56 X l0 for 96 hours) Volume Resistivity (II-cm) do. 3.3 X 10" do. (moisture absorption treatment do. 1.26 X 10 for 96 hours) do. (boiling for 2 hours) do. 4.2 X 10 Dielectric Constant (1 MHz) do. 4.55 do. (moisture absorption treatment do. 4.34
• the same glass cloth as that used in Example 6 was immersed in each of the resulting varnishes, left at room temperature for 12 hours and then dried at 80C for minutes to prepare three kinds of impregnated substrates or prepreg clothes.
• Solder was put in a steel container to a depth of 50 mm, and the temperature of the molten solder was adjusted to a specific temperature. A test piece was floated on the surface of the solder so that the copper surface thereof faced the solder and that the entire surface was fully immersed in the solder, and after a specific period of time the test piece was picked up with were used to prepare a resin composition, and a copper clad laminate was manufactured therefrom in a manner similar to laminate No. 2 of Example 9.
• EXAMPLE 13 20 parts by weight of polyparahydroxystyrene (average molecular weight: 4900), 80 parts by weight of the same epoxy resin Epikote 1001 (epoxy equivalentz480) as that used in Example 8 and 0.5 phr of pdimethylaminobenzaldehyde were dissolved in 75 partsby weight of acetone to prepare a varnish.
• the same glass cloth as that used in Example 6 was immersed in the resulting varnish, left at room temperature for one night, and then dried at 80C for minutes to obtain a prepreg cloth.
• EXAMPLE 14 20 parts by weight of polyparahydroxystyrene (average molecular weight: 4900), 80 parts by weight of the same solid epoxy resin Epikote 1001 as that used in Example 8 and 0.5 phr of p-dimethylaminobenzaldehyde were dissolved in l 10 parts by weight of acetone to prepare a varnish. The same glass cloth as that used in the Example 8 was immersed in the resulting varnish, left at room temperature for one night and then dried at 80C for 10 minutes to obtain Prepreg Cloth A.
• the specimen was pressed for 15 minutes at 165C and 50 kg/cm and then was post-cured for 45 minutes at 165C.
• thermosetting resin composition comprising a polyhydroxystyrene having a degree of polymerization of from 4 to 70,000 and an epoxy resin comprising an epoxy compound having at least 2 epoxy groups per molecule, wherein the ratio of the number of hydroxyl groups in said polyhydroxystyrene to the number of epoxy groups in said epoxy resin is in the range of 0.5
• thermosetting resin composition as claimed in claim 1, wherein said polyhydroxystyrene has a degree of polymerization of from 4 to 150.
• thermosetting resin composition as claimed in claim 1, wherein said epoxy resin is selected from the group consisting of bisphenol type epoxy resins, novolak type epoxy resins, resole type epoxy resins, polyphenol type epoxy resins, polyhydroxybenzene type epoxy resins, polyglycol type epoxy resins, carboxylic acid type epoxy resins, cycloaliphatic epoxy resins, nitrogen-containing epoxy resins and diene type epoxy resins, and wherein said polyhydroxystyrene is a polymer of o-hydroxystyrene, m-hydroxystyrene, phydroxystyrene or mixtures thereof.
• said epoxy resin is selected from the group consisting of bisphenol type epoxy resins, novolak type epoxy resins, resole type epoxy resins, polyphenol type epoxy resins, polyhydroxybenzene type epoxy resins, polyglycol type epoxy resins, carboxylic acid type epoxy resins, cycloaliphatic epoxy resins, nitrogen-containing epoxy resins and diene type epoxy resins, and wherein
• thermosetting resin composition as claimed in claim 3, wherein said epoxy resin is a bisphenol type epoxy resin.
• thermosetting resin composition as claimed in claim 8, wherein said epoxy resin has the following formula: O Q
• thermosetting resin composition as claimed in claim 8, wherein said epoxy resin has the following formula: 0
• thermosetting resin composition as claimed in claim 1, wherein said composition comprises an organic solvent solution of said polyhydroxystyrene and said epoxy resin.
• thermosetting resin composition as claimed in claim 1, wherein the ratio of the number of hydroxyl groups in said polyhydroxystyrene to the number of epoxy groups in said epoxy resin is in the range of 0.8 to 5.0.
• thermosetting resin composition as claimed in claim 1, wherein said composition contains at least one of a catalyst, a hardening accelerator, a dyestuff, a pigment, a plasticizer, a reinforcing agent or a filler.
• thermosetting resin composition as claimed in claim 1 1, wherein said composition contains at least one of a catalyst, a hardening accelerator, a dyestuff, a pigment, a plasticizer, a reinforcing agent and a filler.
• a method for preparing a heat resistant hardened product comprising heating a thermosetting resin composition comprising a polyhydroxystyrene having a degree of polymerization of 4 to 70,000 and an epoxy resin having at least two epoxy groups per molecule, wherein the ratio of the number of hydroxyl groups in said polyhydroxystyrene to the number of epoxy groups in said epoxy resin is in the range of 0.5 to 5.0, at a temperature ranging from C to below the decomposition temperature of said hardened product.

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• 1972
  • 1972-11-01 JP JP47109675A patent/JPS5229800B2/ja not_active Expired
• 1973
  • 1973-11-01 US US411874A patent/US3884992A/en not_active Expired - Lifetime

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