US3875029A - Plating bath for electrodeposition of bright tin and tin-lead alloy - Google Patents

Plating bath for electrodeposition of bright tin and tin-lead alloy Download PDF

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Publication number
US3875029A
US3875029A US443406A US44340674A US3875029A US 3875029 A US3875029 A US 3875029A US 443406 A US443406 A US 443406A US 44340674 A US44340674 A US 44340674A US 3875029 A US3875029 A US 3875029A
Authority
US
United States
Prior art keywords
bath
acid
tin
naphthalene
carboxylate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US443406A
Other languages
English (en)
Inventor
William E Rosenberg
William E Eckles
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hull R O and Co Inc
Original Assignee
Hull R O and Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hull R O and Co Inc filed Critical Hull R O and Co Inc
Priority to US443406A priority Critical patent/US3875029A/en
Priority to AU76208/74A priority patent/AU485084B2/en
Priority to CA217,157A priority patent/CA1046976A/en
Priority to FR7501951A priority patent/FR2261351B1/fr
Priority to DE19752506158 priority patent/DE2506158C3/de
Priority to SE7501711A priority patent/SE419104B/xx
Priority to BR985/75A priority patent/BR7500985A/pt
Priority to ES434856A priority patent/ES434856A1/es
Priority to JP50019994A priority patent/JPS581195B2/ja
Priority to US05/557,798 priority patent/US3956123A/en
Application granted granted Critical
Publication of US3875029A publication Critical patent/US3875029A/en
Priority to CA282,821A priority patent/CA1046977A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Definitions

  • R is carboxy, carboxamido, alkali carboxylate, ammonium carboxylate, amine carboxylate, or alkyl carboxylate
  • R R and R are hydrogen, methyl, or lower alkyl
  • the emulsifying agents that have been found to work best are cationics such as the alkyl tertiery heterocyclic amines and alkyl imadazolinium salts, amphoterics such as the alkyl imidazoline carboxylates, and nonionics such as the aliphatic alcohol ethylene oxide condensates, sorbitan alkyl ester ethylene oxide condensates, and alkyl phenol ethylene oxide condensates.
  • the nonionics are generally condensed with to moles of ethylene oxide per mole of lipophilic group.
  • Table l are the commercial names and manufacturers of these emulsifiers. This invention is not limited to the use of these emulsifiers only, it being pointed out that this is merely a list of preferred types.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
US443406A 1974-02-19 1974-02-19 Plating bath for electrodeposition of bright tin and tin-lead alloy Expired - Lifetime US3875029A (en)

Priority Applications (11)

Application Number Priority Date Filing Date Title
US443406A US3875029A (en) 1974-02-19 1974-02-19 Plating bath for electrodeposition of bright tin and tin-lead alloy
AU76208/74A AU485084B2 (en) 1974-02-19 1974-12-09 Plating baths and additives for electrodeposition of bright tin and tin-lead alloy
CA217,157A CA1046976A (en) 1974-02-19 1974-12-31 Naphthalene monocarboxaldehyde bath for electrolytically plating tin
FR7501951A FR2261351B1 (es) 1974-02-19 1975-01-22
DE19752506158 DE2506158C3 (de) 1974-02-19 1975-02-14 Wäßriges saures galvanisches Zinnbad beziehungsweise Zinn/Blei-Bad zur Erzeugung von halbglanzenden bzw. glänzenden Abscheidungen von Zinn bzw. Zinn-Blei-Legierungen und Glanzbildnerzusatz dafür
SE7501711A SE419104B (sv) 1974-02-19 1975-02-17 Vattenhaltigt, surt elektropleteringsbad for utfellning av tenn och tenn-blylegeringar
BR985/75A BR7500985A (pt) 1974-02-19 1975-02-18 Banhos eletroliticos e aditivos para a eletrodeposicao de estanho e liga de estanho-chumbo brilhantes
ES434856A ES434856A1 (es) 1974-02-19 1975-02-19 Perfeccionamientos en la produccion de banos acidos acuososde electro-deposicion de estano.
JP50019994A JPS581195B2 (ja) 1974-02-19 1975-02-19 コウタクノアルスズ オヨビ スズナマリゴウキンノデンチヤクヨウメツキヨク オヨビ テンカブツ
US05/557,798 US3956123A (en) 1974-02-19 1975-03-12 Additive for electrodeposition of bright tin and tin-lead alloy
CA282,821A CA1046977A (en) 1974-02-19 1977-07-15 Naphthalene monocarboxaldehyde brightening agents for electrolytically plating tin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US443406A US3875029A (en) 1974-02-19 1974-02-19 Plating bath for electrodeposition of bright tin and tin-lead alloy

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US05/557,798 Division US3956123A (en) 1974-02-19 1975-03-12 Additive for electrodeposition of bright tin and tin-lead alloy

Publications (1)

Publication Number Publication Date
US3875029A true US3875029A (en) 1975-04-01

Family

ID=23760674

Family Applications (1)

Application Number Title Priority Date Filing Date
US443406A Expired - Lifetime US3875029A (en) 1974-02-19 1974-02-19 Plating bath for electrodeposition of bright tin and tin-lead alloy

Country Status (7)

Country Link
US (1) US3875029A (es)
JP (1) JPS581195B2 (es)
BR (1) BR7500985A (es)
CA (1) CA1046976A (es)
ES (1) ES434856A1 (es)
FR (1) FR2261351B1 (es)
SE (1) SE419104B (es)

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3977949A (en) * 1975-07-07 1976-08-31 Columbia Chemical Corporation Acidic plating bath and additives for electrodeposition of bright tin
US4135991A (en) * 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead
US4207148A (en) * 1975-11-28 1980-06-10 Minnesota Mining And Manufacturing Company Electroplating bath for the electrodeposition of tin and tin/cadmium deposits
US4263106A (en) * 1979-12-31 1981-04-21 Bell Telephone Laboratories, Incorporated Solder plating process
US4376018A (en) * 1979-12-31 1983-03-08 Bell Telephone Laboratories, Incorporated Electrodeposition of nickel
US4377449A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic silver plating
US4377448A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic gold plating
DE3228911A1 (de) * 1981-09-08 1983-03-24 Occidental Chemical Corp., 48089 Warren, Mich. Bad fuer die galvanische abscheidung einer zinn-blei-legierung
US4379738A (en) * 1979-12-31 1983-04-12 Bell Telephone Laboratories, Incorporated Electroplating zinc
WO1983003266A1 (en) * 1982-03-15 1983-09-29 Gsp Metals Chemicals Corp Chelating metals
US4530741A (en) * 1984-07-12 1985-07-23 Columbia Chemical Corporation Aqueous acid plating bath and brightener composition for producing bright electrodeposits of tin
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US4586990A (en) * 1982-03-15 1986-05-06 Gsp Metals & Chemicals Corporation Chelating metals
EP0216531A1 (en) * 1985-08-29 1987-04-01 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
US4816070A (en) * 1985-08-29 1989-03-28 Techo Instruments Investments Ltd. Use of immersion tin and alloys as a bonding medium for multilayer circuits
US4871429A (en) * 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4880507A (en) * 1987-12-10 1989-11-14 Learonal, Inc. Tin, lead or tin/lead alloy electrolytes for high speed electroplating
US4885064A (en) * 1989-05-22 1989-12-05 Mcgean-Rohco, Inc. Additive composition, plating bath and method for electroplating tin and/or lead
US5066367A (en) * 1981-09-11 1991-11-19 Learonal Inc. Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5094726A (en) * 1981-09-11 1992-03-10 Learonal, Inc. Limiting tin sludge formation in tin or tin-lead electroplating solutions
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
US5545440A (en) * 1994-12-05 1996-08-13 At&T Global Information Solutions Company (Aka Ncr Corporation) Method and apparatus for polymer coating of substrates
US5597469A (en) * 1995-02-13 1997-01-28 International Business Machines Corporation Process for selective application of solder to circuit packages
US5698087A (en) * 1992-03-11 1997-12-16 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US5814202A (en) * 1997-10-14 1998-09-29 Usx Corporation Electrolytic tin plating process with reduced sludge production

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992004484A1 (en) * 1989-04-20 1992-03-19 Tokin Corporation Electroplating bath using organic solvent for plating permanent magnet of r2t14b intermetallic compound

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3361652A (en) * 1963-08-28 1968-01-02 Max Schlotter Dr Ing Electrodeposition of bright tin
US3471379A (en) * 1965-02-13 1969-10-07 Philips Corp Tin plating baths
US3769182A (en) * 1970-10-22 1973-10-30 Conversion Chem Corp Bath and method for electrodepositing tin and/or lead

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3361652A (en) * 1963-08-28 1968-01-02 Max Schlotter Dr Ing Electrodeposition of bright tin
US3471379A (en) * 1965-02-13 1969-10-07 Philips Corp Tin plating baths
US3769182A (en) * 1970-10-22 1973-10-30 Conversion Chem Corp Bath and method for electrodepositing tin and/or lead
US3785939A (en) * 1970-10-22 1974-01-15 Conversion Chem Corp Tin/lead plating bath and method

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3977949A (en) * 1975-07-07 1976-08-31 Columbia Chemical Corporation Acidic plating bath and additives for electrodeposition of bright tin
US4207148A (en) * 1975-11-28 1980-06-10 Minnesota Mining And Manufacturing Company Electroplating bath for the electrodeposition of tin and tin/cadmium deposits
US4135991A (en) * 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead
US4263106A (en) * 1979-12-31 1981-04-21 Bell Telephone Laboratories, Incorporated Solder plating process
US4376018A (en) * 1979-12-31 1983-03-08 Bell Telephone Laboratories, Incorporated Electrodeposition of nickel
US4377449A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic silver plating
US4377448A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic gold plating
US4379738A (en) * 1979-12-31 1983-04-12 Bell Telephone Laboratories, Incorporated Electroplating zinc
DE3228911A1 (de) * 1981-09-08 1983-03-24 Occidental Chemical Corp., 48089 Warren, Mich. Bad fuer die galvanische abscheidung einer zinn-blei-legierung
US5066367A (en) * 1981-09-11 1991-11-19 Learonal Inc. Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5094726A (en) * 1981-09-11 1992-03-10 Learonal, Inc. Limiting tin sludge formation in tin or tin-lead electroplating solutions
US4871429A (en) * 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4586990A (en) * 1982-03-15 1986-05-06 Gsp Metals & Chemicals Corporation Chelating metals
WO1983003266A1 (en) * 1982-03-15 1983-09-29 Gsp Metals Chemicals Corp Chelating metals
US4530741A (en) * 1984-07-12 1985-07-23 Columbia Chemical Corporation Aqueous acid plating bath and brightener composition for producing bright electrodeposits of tin
EP0196232A2 (en) * 1985-03-26 1986-10-01 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
EP0196232A3 (en) * 1985-03-26 1987-04-01 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
EP0216531A1 (en) * 1985-08-29 1987-04-01 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
US4715894A (en) * 1985-08-29 1987-12-29 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
US4816070A (en) * 1985-08-29 1989-03-28 Techo Instruments Investments Ltd. Use of immersion tin and alloys as a bonding medium for multilayer circuits
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
US4880507A (en) * 1987-12-10 1989-11-14 Learonal, Inc. Tin, lead or tin/lead alloy electrolytes for high speed electroplating
US4885064A (en) * 1989-05-22 1989-12-05 Mcgean-Rohco, Inc. Additive composition, plating bath and method for electroplating tin and/or lead
US5698087A (en) * 1992-03-11 1997-12-16 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US5545440A (en) * 1994-12-05 1996-08-13 At&T Global Information Solutions Company (Aka Ncr Corporation) Method and apparatus for polymer coating of substrates
US5597469A (en) * 1995-02-13 1997-01-28 International Business Machines Corporation Process for selective application of solder to circuit packages
US5814202A (en) * 1997-10-14 1998-09-29 Usx Corporation Electrolytic tin plating process with reduced sludge production

Also Published As

Publication number Publication date
ES434856A1 (es) 1976-12-01
JPS581195B2 (ja) 1983-01-10
CA1046976A (en) 1979-01-23
DE2506158B2 (de) 1976-12-02
BR7500985A (pt) 1976-11-16
DE2506158A1 (de) 1975-08-21
AU7620874A (en) 1976-06-10
JPS50118934A (es) 1975-09-18
SE419104B (sv) 1981-07-13
FR2261351A1 (es) 1975-09-12
SE7501711L (es) 1975-08-20
FR2261351B1 (es) 1979-09-28

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