BR7500985A - Banhos eletroliticos e aditivos para a eletrodeposicao de estanho e liga de estanho-chumbo brilhantes - Google Patents

Banhos eletroliticos e aditivos para a eletrodeposicao de estanho e liga de estanho-chumbo brilhantes

Info

Publication number
BR7500985A
BR7500985A BR985/75A BR7500985A BR7500985A BR 7500985 A BR7500985 A BR 7500985A BR 985/75 A BR985/75 A BR 985/75A BR 7500985 A BR7500985 A BR 7500985A BR 7500985 A BR7500985 A BR 7500985A
Authority
BR
Brazil
Prior art keywords
tin
bathrooms
electrolytic
additives
bright
Prior art date
Application number
BR985/75A
Other languages
English (en)
Inventor
W Rosenberg
W Eckles
Original Assignee
Hull & Co R O
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hull & Co R O filed Critical Hull & Co R O
Publication of BR7500985A publication Critical patent/BR7500985A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
BR985/75A 1974-02-19 1975-02-18 Banhos eletroliticos e aditivos para a eletrodeposicao de estanho e liga de estanho-chumbo brilhantes BR7500985A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US443406A US3875029A (en) 1974-02-19 1974-02-19 Plating bath for electrodeposition of bright tin and tin-lead alloy

Publications (1)

Publication Number Publication Date
BR7500985A true BR7500985A (pt) 1976-11-16

Family

ID=23760674

Family Applications (1)

Application Number Title Priority Date Filing Date
BR985/75A BR7500985A (pt) 1974-02-19 1975-02-18 Banhos eletroliticos e aditivos para a eletrodeposicao de estanho e liga de estanho-chumbo brilhantes

Country Status (7)

Country Link
US (1) US3875029A (pt)
JP (1) JPS581195B2 (pt)
BR (1) BR7500985A (pt)
CA (1) CA1046976A (pt)
ES (1) ES434856A1 (pt)
FR (1) FR2261351B1 (pt)
SE (1) SE419104B (pt)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3977949A (en) * 1975-07-07 1976-08-31 Columbia Chemical Corporation Acidic plating bath and additives for electrodeposition of bright tin
US4207148A (en) * 1975-11-28 1980-06-10 Minnesota Mining And Manufacturing Company Electroplating bath for the electrodeposition of tin and tin/cadmium deposits
US4135991A (en) * 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead
US4377448A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic gold plating
US4379738A (en) * 1979-12-31 1983-04-12 Bell Telephone Laboratories, Incorporated Electroplating zinc
US4376018A (en) * 1979-12-31 1983-03-08 Bell Telephone Laboratories, Incorporated Electrodeposition of nickel
US4263106A (en) * 1979-12-31 1981-04-21 Bell Telephone Laboratories, Incorporated Solder plating process
US4377449A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic silver plating
SE8204505L (sv) * 1981-09-08 1983-03-09 Occidental Chem Co Elektropletering for avsettning av tenn-blylegeringar pa olika underlag
US5066367B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5094726B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4871429A (en) * 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
JPS59500475A (ja) * 1982-03-15 1984-03-22 ジ−・エス・ピ−・メタルズ・アンド・ケミカルズ・コ−ポレイシヨン キレ−ト化金属
US4586990A (en) * 1982-03-15 1986-05-06 Gsp Metals & Chemicals Corporation Chelating metals
US4530741A (en) * 1984-07-12 1985-07-23 Columbia Chemical Corporation Aqueous acid plating bath and brightener composition for producing bright electrodeposits of tin
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US4715894A (en) * 1985-08-29 1987-12-29 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
US4816070A (en) * 1985-08-29 1989-03-28 Techo Instruments Investments Ltd. Use of immersion tin and alloys as a bonding medium for multilayer circuits
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
EP0652306B1 (en) * 1987-12-10 2000-09-27 LeaRonal, Inc. Tin, lead or tin/lead alloy electrolytes for high-speed electroplating
WO1992004484A1 (en) * 1989-04-20 1992-03-19 Tokin Corporation Electroplating bath using organic solvent for plating permanent magnet of r2t14b intermetallic compound
US4885064A (en) * 1989-05-22 1989-12-05 Mcgean-Rohco, Inc. Additive composition, plating bath and method for electroplating tin and/or lead
US5698087A (en) * 1992-03-11 1997-12-16 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US5545440A (en) * 1994-12-05 1996-08-13 At&T Global Information Solutions Company (Aka Ncr Corporation) Method and apparatus for polymer coating of substrates
US5597469A (en) * 1995-02-13 1997-01-28 International Business Machines Corporation Process for selective application of solder to circuit packages
US5814202A (en) * 1997-10-14 1998-09-29 Usx Corporation Electrolytic tin plating process with reduced sludge production

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL134963C (pt) * 1963-08-28
NL128321C (pt) * 1965-02-13
US3785939A (en) * 1970-10-22 1974-01-15 Conversion Chem Corp Tin/lead plating bath and method

Also Published As

Publication number Publication date
ES434856A1 (es) 1976-12-01
JPS581195B2 (ja) 1983-01-10
CA1046976A (en) 1979-01-23
DE2506158B2 (de) 1976-12-02
US3875029A (en) 1975-04-01
DE2506158A1 (de) 1975-08-21
AU7620874A (en) 1976-06-10
JPS50118934A (pt) 1975-09-18
SE419104B (sv) 1981-07-13
FR2261351A1 (pt) 1975-09-12
SE7501711L (pt) 1975-08-20
FR2261351B1 (pt) 1979-09-28

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