US3839180A - Device for chromium plating - Google Patents

Device for chromium plating Download PDF

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Publication number
US3839180A
US3839180A US00327483A US32748373A US3839180A US 3839180 A US3839180 A US 3839180A US 00327483 A US00327483 A US 00327483A US 32748373 A US32748373 A US 32748373A US 3839180 A US3839180 A US 3839180A
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electrolyte
tank
disposed
auxiliary tank
main tank
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Expired - Lifetime
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US00327483A
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English (en)
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K Takaysu
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TAWKYSU K
TAWKYSU K JA
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TAWKYSU K
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor

Definitions

  • ABSTRACT Chromium plating apparatus comprising a main tank carrying the electrodes and an auxiliary tank adjacent the main tank and having fluid connections therewith.
  • the electrolyte is adapted to be circulated between tanks with filtering, pumping and temperature control being effected in the auxiliary tank while plating is effected in the main tank.
  • the main tank has platinum plated anode means which substantially decrease sludge formation during plating.
  • This invention relates to a device for chromium plating, and more particularly to a chromium plating device including an independent auxiliary tank disposed adjacent to a main electrolyte tank for circulating the electrolyte through the two tanks while filtering and temperature controlling the electrolyte.
  • Anodes in currently used chromium plating process are made of lead.
  • the lead anodes are easily consumed in the course of plating, so that the consumed lead precipitates at the bottom of an electrolyte tank sludge, which tends to deteriorate the efficiency of the plating process.
  • the plating electrolyte is discarded after using it for a given time period together with sludge thus formed.
  • an object of the present invention is to mitigate the aforesaid difficulties of the conventional chromium plating process. by providing an improved device therefor,
  • a chromium plating device which includes a main electrolyte tank having one or more platinum plated anode and an independent auxiliary tank disposed adjacent thereto.
  • the auxiliary tank includes a filter and a temperature controlling means. such as a heat exchanger or a heater. together with a pump means for circulating the electrolyte through the main electrolyte tank and the auxiliary tank. While performing the chromium plating. the electrolyte is continuously circulated through the side tank. for filtering the electrolyte and controlling the temperature thereof.
  • the inventor has found out that. by continuously cleaning the electrolyte and controlling the temperature thereof, the quality of the chromium plating is greatly improved.
  • One of the reasons for the improvement is the fact that the independent auxiliary tank with the filter installed therein facilitates the elimination of the sludge formation in the electrolyte tank.
  • the auxiliary tank according to the present invention also reduces the overall tank volume. namely, the main electrolyte tank volume plus the independent auxiliary volume, as compared with that of conventional processes.
  • the use of the platinum plated anode provides BRIEF DESCRIPTION OF THE DRAWING
  • FIG. 1 is a schematic plan view of a chromium plating device according to the present invention.
  • FIG. 2 is a partially cut away side view of the device of FIG. 1
  • FIGS. 3, 4, and 5 are diagrammatic illustrations of a pump, a filter, and an anode to be used in the device of FIG. 1;
  • FIG. 6 is a plan view of a different embodiment of the present invention.
  • FIG. 7 is a side view of the embodiment of FIG. 6.
  • a main electrolyte tank 1 carries chromium plating electrolyte, which can be any conventional electrolyte for such purpose.
  • a typical example of the electrolyte contains 250 g/liter of chromic anhydride (CrO 2-3 g/liter of sulfuric acid (H 50 and 1-5 g/liter of three valued chromium (Cr
  • An auxiliary tank 2 is disposed next to the main electrolyte tank 1, and a pump 2a is immersed in the auxiliary tank 2, so as to suck the electrolyte through a filter 4 and a connector conduit 6.
  • the pump 2a is separated from the electrolyte by a cylindrical wall, as shown in FIG. 3.
  • the auxiliary tank 2 also includes a temperature control means 3, which is a steam actuated heat exchanger in the illustrated embodiment.
  • a steam tube 8 delivers steam to the heat exchanger 3, while the drain therefrom is discharged to a drain tube 9.
  • a separate immersion type electric heater 3a may be used along with the heat exchanger 3, as shown in FIG. 1.
  • the levels of the electrolyte in the two tanks 1 and 2 are kept the same by a siphon pipe 6 with a vent valve 12.
  • the discharge from the pump 2a is delivered to the bottom of the electrolyte tank 1 by a conduit 7.
  • FIGS. 1 and 2 a plurality of anode plates 13 are suspended from anode buses 16, while works 14 to be plated are hung from a cathode bus 15 so as to act as counterelectrodes.
  • Two anode buses and one cathode bus are shown in the figure, which are connected to a DC. power source 19.
  • the present invention is not restricted to such number of buses.
  • a control panel 17 is mounted on the auxiliary tank 2, and a power cable 18 is connected to an AC. or DC power source 20 for receiving electric power for energizing the heater 3a.
  • a thermometer 11 is disposed in the electrolyte of the tank 1, which thermometer is connected to the control panel 17 through a control cable 10.
  • the electric heater 3a may be automatically controlled on the basis of temperature signals from the thermometer 11.
  • a means for such temperature responsive automatic control is known, so that no details of such means will be described here.
  • the anode plate 13 to be used in the device according to the present invention comprises a corrugated metal plate, for instance, niobium or titanium plate, and one or both surfaces of the metal plate are plated with platinum. It is an important finding of the inventor that such platinum plated anode is effective in eliminating the formation of sludge. as experienced with conventional lead anode.
  • the siphon pipe 6 In operation. when the siphon pipe 6 is evacuated through the vent valve 12 and sealed therby. the electrolytes in the two tanks 1 and 2 are communicated with each other. As the pump 2a delivers the electrolyte from the side tank 2 to the electrolyte tank 1, the siphon pipe returns the corresponding amount of the electrolyte from the main electrolyte tank I to the auxiliary tank 2.
  • the temperature control means such the heat exchanger 3 and the immersion type heater 3a, keeps the electrolyte at an optimal temperature for the plating, for instance, at about 50 to 55C. While the electrolyte circulates through the two tanks. the filter 4 removes any undesirable components therein. for instance, sludge is eliminated by the filter 4. Whereby, the electrolyte in the plating electrolyte tank 1 is kept clean and clear at the optimal temperature.
  • Chromium film formed by conventional chromium plating process inevitably involves pin holes therein.
  • the inventors has found out that. by keeping the electrolyte clean and controlling the electrolyte temperature at an optimal level, the formation of the pin holes can be suppressed.
  • the heat exchanger 3 is shown as a steam heater.
  • the heat exchanger can be a cooler. in which a suitable coolant is passed therethrough. when the ambient temperature and other op-. erating conditions require the cooling of the electrolyte.
  • FIGS. 6 and 7 illustrate a second embodiment of the present invention.
  • an auxiliary tank 2 having a partition wall la is used. so as to house a filter 4 in one of the two chambers thus partitioned, while a heat exchanger 3 and an immersible pump are disposed in the other chamber.
  • Major differences of this second embodiment from the aforesaid first embodiment of FIGS. 1 to 5 are as follows.
  • the filter l is on the intake side of the pump 2a.
  • the filter 4 is on the discharge side of the pump 2a.
  • FIGS. 1 to 5 The first embodiment of FIGS. 1 to 5 is primarily directed to automatic temperature control with the im mersion type heater 3a. but the second embodiment is not.
  • the filtered electrolyte is delivered to the bottom of the main electrolyte tank 1. so that an upwardly directed electrolyte flow is forcibly generated in the main electrolyte tank I.
  • This upwardly directed electrolyte causes agitation, especially in the proximity of the works 14, so that uni form chromium film can be plated thereon. Whereby, the quality of the chromium plating can be greatly improved.
  • air bubbles may be delivered together with the filtered electrolyte, for improving the agitation.
  • Temperature control, i.e., heating and cooling. and filtering of electrolyte can be carried out in an independent auxiliary tank. so that the main electrolyte tank can be made smaller than a conventional main electrolyte tank. and the overall volume of the electrolyte can be reduced.
  • the filter thus mounted on the auxiliary tank can easily be cleansed for regeneration, as compared with the case in which a filter is mounted on the main electrolyte tank.
  • the amount of electrolyte to be removed from the chromium plating device can be minimized. This means an economy of the electrolyte, for reducing the plating cost. Furthermore, it prevents environmental pollution.
  • the present invention makes it possible to reduce the tank depth by about 20 percent. Because the sludge is eliminated as far as the main electrolyte tank 1 is concerned. Thus, the tank can be made smaller, and the amount of the electrolyte is reduced, so as to cut down the plating cost. Furthermore, the reduced amount of the electrolyte simplifies the control thereof.
  • Thin and pin-hole-free chromium film can be plated. More particularly. a chromium film of medium thickness between a conventional hard chromium film (i.e., a thick pure chromium film) and a conventional double layer chromium film (i.e.. chromium film on copper or nickel coating) can be achieved at a low cost.
  • a conventional hard chromium film i.e., a thick pure chromium film
  • a conventional double layer chromium film i.e.. chromium film on copper or nickel coating
  • a device for chromium plating comprising, a main tank for carrying electrolyte containing chromium ions; at least one anode adapted to be disposed in the electrolyte of the main tank and comprising at least one platinum plated corrugated plate made of a metal selected from the group consisting of niobium and titanium; cathode bus means adapted to be disposed above the electrolyte and arranged to carry workpieces to be chromium plated and further adapted to provide for immersing the said workpieces in said electrolyte when the said main tank is properly filled with electrolyte whereby to enable such workpieces to serve as counterelcctrode means; an auxiliary tank disposed adjacent the main tank; a siphon connected between tanks and adapted to transfer electrolyte from said main tank to said auxiliary tank; heat exchanger means disposed in the auxiliary tank for heating and cooling electrolyte which may be carried therein; a filter disposed in said auxiliary tank; pump means
  • said heat exchanger means includes an immersion type electric I heater.
  • thermometer disposed in the electrolyte of said main tank, a control panel mounted on said auxiliary tank and having electric switching means, and a control cable connecting said switching means to said thermometer and to said electric heater, whereby said electric heater is so controlled as to keep the electrolyte at a predetermined temperature.
  • auxiliary tank has a partition wall defining two chambers therein, and said filter being housed in one of the two chambers.
  • a device wherein said filter is disposed at the intake side of said pump means.
  • a device according to claim 1, wherein said filter is disposed at the discharge side of the pump means.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
US00327483A 1972-01-31 1973-01-29 Device for chromium plating Expired - Lifetime US3839180A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47011266A JPS4880436A (ja) 1972-01-31 1972-01-31

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US3839180A true US3839180A (en) 1974-10-01

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JP (1) JPS4880436A (ja)
DE (1) DE2304406A1 (ja)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3959112A (en) * 1975-06-12 1976-05-25 Amax Inc. Device for providing uniform air distribution in air-agitated electrowinning cells
US4006072A (en) * 1975-06-02 1977-02-01 Takayasu Kyoteru Device for eliminating impure ions in chromium plating bath
US4125443A (en) * 1976-10-19 1978-11-14 British Nuclear Fuels Ltd. Electrolytic production of fluorine
US4595474A (en) * 1983-11-14 1986-06-17 Greco Bros., Inc. Electroplating solution recovery system
US5032235A (en) * 1988-07-27 1991-07-16 The Boeing Company Method and apparatus for plating through holes in graphite composites
US5149411A (en) * 1991-04-22 1992-09-22 Robert L. Castle Toxic fumes removal apparatus for plating tank
US5282934A (en) * 1992-02-14 1994-02-01 Academy Corporation Metal recovery by batch electroplating with directed circulation
US5766428A (en) * 1995-12-15 1998-06-16 Nichiei Hard Chrome Industrial Company Chromium plating solution, solution waste from chromium plating and closed recycling system for chromic acid cleaning water in chromium plating
WO2001079589A1 (en) * 2000-04-13 2001-10-25 Obducat Aktiebolag Method in and apparatus for etching or plating of substrates
US20020090047A1 (en) * 1991-10-25 2002-07-11 Roger Stringham Apparatus for producing ecologically clean energy
US6454922B1 (en) * 2000-06-23 2002-09-24 The Regents Of The University Of California Corrosion test cell for bipolar plates
WO2007142747A2 (en) * 2006-04-21 2007-12-13 Sifco Selective Plating Selective plating system
CN103469288A (zh) * 2013-09-02 2013-12-25 陈文智 一种带循环过滤装置的电镀槽
CN105755527A (zh) * 2016-04-02 2016-07-13 东北石油大学 一种基于plc控制的新型恒温电沉积镀槽
WO2017148119A1 (zh) * 2016-03-04 2017-09-08 四维尔丸井(广州)汽车零部件有限公司 粗化液电解装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2550173A1 (fr) * 1983-08-03 1985-02-08 Duvacquier Serge Chaine lineaire continue automatique, a elements multiples, pour traitement de pieces mecaniques et toles fines recuperables

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2710832A (en) * 1952-03-28 1955-06-14 Western Electric Co Electroplating of iron
US3397135A (en) * 1964-09-21 1968-08-13 Julius L Englesberg Integral pump and filter assembly including electrode means
US3649509A (en) * 1969-07-08 1972-03-14 Buckbee Mears Co Electrodeposition systems

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2710832A (en) * 1952-03-28 1955-06-14 Western Electric Co Electroplating of iron
US3397135A (en) * 1964-09-21 1968-08-13 Julius L Englesberg Integral pump and filter assembly including electrode means
US3649509A (en) * 1969-07-08 1972-03-14 Buckbee Mears Co Electrodeposition systems

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4006072A (en) * 1975-06-02 1977-02-01 Takayasu Kyoteru Device for eliminating impure ions in chromium plating bath
US3959112A (en) * 1975-06-12 1976-05-25 Amax Inc. Device for providing uniform air distribution in air-agitated electrowinning cells
US4125443A (en) * 1976-10-19 1978-11-14 British Nuclear Fuels Ltd. Electrolytic production of fluorine
US4595474A (en) * 1983-11-14 1986-06-17 Greco Bros., Inc. Electroplating solution recovery system
US5032235A (en) * 1988-07-27 1991-07-16 The Boeing Company Method and apparatus for plating through holes in graphite composites
US5149411A (en) * 1991-04-22 1992-09-22 Robert L. Castle Toxic fumes removal apparatus for plating tank
US20020090047A1 (en) * 1991-10-25 2002-07-11 Roger Stringham Apparatus for producing ecologically clean energy
US5282934A (en) * 1992-02-14 1994-02-01 Academy Corporation Metal recovery by batch electroplating with directed circulation
US5766428A (en) * 1995-12-15 1998-06-16 Nichiei Hard Chrome Industrial Company Chromium plating solution, solution waste from chromium plating and closed recycling system for chromic acid cleaning water in chromium plating
WO2001079589A1 (en) * 2000-04-13 2001-10-25 Obducat Aktiebolag Method in and apparatus for etching or plating of substrates
US6454922B1 (en) * 2000-06-23 2002-09-24 The Regents Of The University Of California Corrosion test cell for bipolar plates
WO2007142747A2 (en) * 2006-04-21 2007-12-13 Sifco Selective Plating Selective plating system
WO2007142747A3 (en) * 2006-04-21 2008-12-18 Sifco Selective Plating Selective plating system
CN103469288A (zh) * 2013-09-02 2013-12-25 陈文智 一种带循环过滤装置的电镀槽
WO2017148119A1 (zh) * 2016-03-04 2017-09-08 四维尔丸井(广州)汽车零部件有限公司 粗化液电解装置
CN105755527A (zh) * 2016-04-02 2016-07-13 东北石油大学 一种基于plc控制的新型恒温电沉积镀槽

Also Published As

Publication number Publication date
JPS4880436A (ja) 1973-10-27
DE2304406A1 (de) 1973-08-23

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