US3522039A - Copper base alloy - Google Patents
Copper base alloy Download PDFInfo
- Publication number
- US3522039A US3522039A US648996A US3522039DA US3522039A US 3522039 A US3522039 A US 3522039A US 648996 A US648996 A US 648996A US 3522039D A US3522039D A US 3522039DA US 3522039 A US3522039 A US 3522039A
- Authority
- US
- United States
- Prior art keywords
- base alloy
- copper base
- alloys
- present
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000956 alloy Substances 0.000 title description 51
- 229910045601 alloy Inorganic materials 0.000 title description 51
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title description 32
- 229910052802 copper Inorganic materials 0.000 title description 32
- 239000010949 copper Substances 0.000 title description 32
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 22
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 13
- 239000011701 zinc Substances 0.000 description 13
- 229910052725 zinc Inorganic materials 0.000 description 13
- 229910052742 iron Inorganic materials 0.000 description 11
- 238000000137 annealing Methods 0.000 description 10
- 230000000704 physical effect Effects 0.000 description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 229910052698 phosphorus Inorganic materials 0.000 description 7
- 239000011574 phosphorus Substances 0.000 description 7
- 238000005275 alloying Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000005266 casting Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 238000007792 addition Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 229910000713 I alloy Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US64899667A | 1967-06-26 | 1967-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3522039A true US3522039A (en) | 1970-07-28 |
Family
ID=24603061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US648996A Expired - Lifetime US3522039A (en) | 1967-06-26 | 1967-06-26 | Copper base alloy |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3522039A (en:Method) |
| BE (1) | BE717175A (en:Method) |
| CH (1) | CH513983A (en:Method) |
| DE (1) | DE1758123B1 (en:Method) |
| FR (1) | FR1578133A (en:Method) |
| GB (1) | GB1186285A (en:Method) |
| SE (1) | SE340890B (en:Method) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3661568A (en) * | 1970-06-29 | 1972-05-09 | Olin Corp | Copper base alloy |
| US4269623A (en) * | 1978-09-19 | 1981-05-26 | Furukawa Metals Company, Ltd. | Copper alloy for reliable electrical connection |
| US4605532A (en) * | 1984-08-31 | 1986-08-12 | Olin Corporation | Copper alloys having an improved combination of strength and conductivity |
| DE3613594A1 (de) * | 1985-05-08 | 1986-11-13 | Tamagawa Kikai Kinzoku K.K., Tokio/Tokyo | Kupferlegierungs-leitermaterial fuer anschluesse von halbleitervorrichtungen |
| US4952531A (en) * | 1988-03-17 | 1990-08-28 | Olin Corporation | Sealing glass for matched sealing of copper and copper alloys |
| US5026433A (en) * | 1990-01-02 | 1991-06-25 | Olin Corporation | Grain refinement of a copper base alloy |
| US5043222A (en) * | 1988-03-17 | 1991-08-27 | Olin Corporation | Metal sealing glass composite with matched coefficients of thermal expansion |
| US5047371A (en) * | 1988-09-02 | 1991-09-10 | Olin Corporation | Glass/ceramic sealing system |
| US5120612A (en) * | 1990-09-04 | 1992-06-09 | Olin Corporation | Incorporation of ceramic particles into a copper base matrix to form a composite material |
| US5334346A (en) * | 1992-09-24 | 1994-08-02 | Poongsan Corporation | Copper alloys for electrical and electronic parts |
| US20030121573A1 (en) * | 2000-04-28 | 2003-07-03 | Takashi Miyoshi | Copper alloy suitable for an IC lead pin for a pin grid array provided on a plastic substrate |
| US6632300B2 (en) | 2000-06-26 | 2003-10-14 | Olin Corporation | Copper alloy having improved stress relaxation resistance |
| EP0995808A4 (en) * | 1998-03-10 | 2006-04-12 | Mitsubishi Shindoh Corp | COPPER ALLOY AND THIN FILM THEREOF WITH IMPROVED WEAR FOR A ROHUMFORM COCKLE |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2155406A (en) * | 1938-04-28 | 1939-04-25 | Chase Brass & Copper Co | Electrical conductor |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE891747C (de) * | 1942-05-12 | 1954-03-25 | Carl Dr Schaarwaechter | Bronzedraht und Verfahren zu seiner Herstellung |
| US3039867A (en) * | 1960-03-24 | 1962-06-19 | Olin Mathieson | Copper-base alloys |
-
1967
- 1967-06-26 US US648996A patent/US3522039A/en not_active Expired - Lifetime
-
1968
- 1968-04-05 DE DE19681758123 patent/DE1758123B1/de not_active Ceased
- 1968-05-07 CH CH674468A patent/CH513983A/de not_active IP Right Cessation
- 1968-05-23 GB GB24766/68A patent/GB1186285A/en not_active Expired
- 1968-06-20 FR FR1578133D patent/FR1578133A/fr not_active Expired
- 1968-06-24 SE SE08525/68A patent/SE340890B/xx unknown
- 1968-06-26 BE BE717175D patent/BE717175A/xx not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2155406A (en) * | 1938-04-28 | 1939-04-25 | Chase Brass & Copper Co | Electrical conductor |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3661568A (en) * | 1970-06-29 | 1972-05-09 | Olin Corp | Copper base alloy |
| US4269623A (en) * | 1978-09-19 | 1981-05-26 | Furukawa Metals Company, Ltd. | Copper alloy for reliable electrical connection |
| US4605532A (en) * | 1984-08-31 | 1986-08-12 | Olin Corporation | Copper alloys having an improved combination of strength and conductivity |
| DE3613594A1 (de) * | 1985-05-08 | 1986-11-13 | Tamagawa Kikai Kinzoku K.K., Tokio/Tokyo | Kupferlegierungs-leitermaterial fuer anschluesse von halbleitervorrichtungen |
| US5043222A (en) * | 1988-03-17 | 1991-08-27 | Olin Corporation | Metal sealing glass composite with matched coefficients of thermal expansion |
| US4952531A (en) * | 1988-03-17 | 1990-08-28 | Olin Corporation | Sealing glass for matched sealing of copper and copper alloys |
| US5047371A (en) * | 1988-09-02 | 1991-09-10 | Olin Corporation | Glass/ceramic sealing system |
| US5026433A (en) * | 1990-01-02 | 1991-06-25 | Olin Corporation | Grain refinement of a copper base alloy |
| US5120612A (en) * | 1990-09-04 | 1992-06-09 | Olin Corporation | Incorporation of ceramic particles into a copper base matrix to form a composite material |
| US5334346A (en) * | 1992-09-24 | 1994-08-02 | Poongsan Corporation | Copper alloys for electrical and electronic parts |
| EP0995808A4 (en) * | 1998-03-10 | 2006-04-12 | Mitsubishi Shindoh Corp | COPPER ALLOY AND THIN FILM THEREOF WITH IMPROVED WEAR FOR A ROHUMFORM COCKLE |
| US20030121573A1 (en) * | 2000-04-28 | 2003-07-03 | Takashi Miyoshi | Copper alloy suitable for an IC lead pin for a pin grid array provided on a plastic substrate |
| US7727344B2 (en) * | 2000-04-28 | 2010-06-01 | The Furukawa Electric Co., Ltd. | Copper alloy suitable for an IC lead pin for a pin grid array provided on a plastic substrate |
| US6632300B2 (en) | 2000-06-26 | 2003-10-14 | Olin Corporation | Copper alloy having improved stress relaxation resistance |
Also Published As
| Publication number | Publication date |
|---|---|
| BE717175A (en:Method) | 1968-12-27 |
| GB1186285A (en) | 1970-04-02 |
| CH513983A (de) | 1971-10-15 |
| SE340890B (en:Method) | 1971-12-06 |
| DE1758123B1 (de) | 1972-10-19 |
| FR1578133A (en:Method) | 1969-08-14 |
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