US2774747A - Electrically conducting cements containing epoxy resins and silver - Google Patents

Electrically conducting cements containing epoxy resins and silver Download PDF

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US2774747A
US2774747A US278527A US27852752A US2774747A US 2774747 A US2774747 A US 2774747A US 278527 A US278527 A US 278527A US 27852752 A US27852752 A US 27852752A US 2774747 A US2774747 A US 2774747A
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silver
cement
electrically conducting
conducting
epoxy resins
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US278527A
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English (en)
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Wolfson Henry
Elliott George
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International Standard Electric Corp
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International Standard Electric Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827—Materials
    • H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Definitions

  • the present invention relates to improvements in electrically conducting cements, and to the application of the cement according to the invention to the problem of fixing a semi-conducting crystal used for an electric rectifier or crystal triode, to a metal base or holder.
  • germanium rectifiers In the case of germanium rectifiers, it has been the usual practice to fix the germanium crystal to the base by plating and soldering. This, however, gives rise to difiiculties on account of the etchingtreatment which must be applied to the germanium to produce a satisfactory rectifier.
  • the principal object of the invention is to overcome these difficulties by using an improved type of conducting cement for fixing the crystal slice to the base.
  • the invention accordingly provides an electrically conducting cement comprising a thermosetting binding medium with which are incorporated fine electrically conducting particles in such proportion that when the binding medium sets, the said particles are brought into electrical contact with one another throughout the whole mass, the binding medium being of a type which adheres to the particles and occupies the interstices between the particles, thereby holding the whole solidly together.
  • the invention also provides a method of making an electrically conducting cement comprising intimately mixing together fine flake silver and ultra-fine precipitated silver, and gradually adding to the silver mixture a liquid thermosetting compound in sufficient quantity to form a very viscous paste in which all the silver particles are just coated with the compound.
  • the invention further provides a method of making an electric semi-conducting device which comprises fixing a semi-conducting crystal body to a metal base by means of a thermosetting conducting cement of the kind specified above.
  • Fig. 1 illustrates diagrammatically the preferred process of making the conducting cement according to the invention
  • Fig. 2 shows the stages in the process of fixing a crystal slice to a metal base using the cement.
  • the preferred formula for the conducting cement according to the invention includes a thermosetting coating resin sold under the registered trademark Araldite which is made up of a hardenable epoxy resin comprising the condensation product of 1chloro-2,3-epoxypropane with 4,4 isopropylidene diphenol.
  • the formula is 2,774,747 Patented Dec. 18, 1956
  • the Araldite mixture should preferably be prepared by mixing three parts of the main component with one part of the corresponding catalyst to give a medium containing about 50% solids, and the diacetone alcohol should be added.
  • the flake silver and the ultra-fine precipitated silver should be first intimately mixed.
  • the silver mixture should then be placed in a mortar, and the Araldite mixture should be added gradually, working it into the silver powder.
  • the resulting mass should be a very viscous paste. The procedure is very similar to the determination of an oil absorption of a pigment.
  • the conducting cement so prepared may be stored in a stoppered jar, and will keep for three months at normal temperature. The process just described is illustrated in Fig. 1.
  • the diacetone alcohol is used as a solvent for adjusting the viscosity of the mixture, and the proportion of this ingredient may be varied to produce a suitable viscosity for the particular circumstances of the use of the cement. Some addition of this solvent to the mixture may be necessary from time to time to make up for evaporation.
  • the ultra-fine precipitated silver used in the above formula should not contain any appreciable proportion of excessively large particles.
  • the preferred method of preparing it is as follows:
  • a blob of the cement is placed on the base, for example by dipping a wire 2 into the jar in which the mixture is stored, and picking up a blob 3 on the end as shown in Figs. 2 (a) and (b) and the crystal 4 is dropped on to the cement and pressed firmly down with the tip of a glass rod 5 (Fig. 2 (0)), and then the whole is baked in an oven 6 (Fig. 2 (a')) at about C. for 90 minutes. Shorter baking times can be used at higher temperatures. After baking, the crystal is found to be firmly fixed to the base, and cannot be removed without splintering the germanium.
  • the cement appears to have almost the conductivity of block silver.
  • This conducting cement may evidently be used for joining any two conductors, particularly when the use of plating, or solder, or the high temperature associated with soldering, are precluded.
  • silicon, or other semi-conducting materials could be mounted on metal bases with this cement.
  • the silver particles are just coated by the Araldite medium, which contains about 50% total solids. After polymerisation, 50% of the bulk of the medium is lost by evaporation of the solvent, and each silver particle is then no longer completely coated, but the cement occupies the interstice between the particles which are brought together in contact, yielding a conducting material.
  • Araldite is an extremely good electrical insulator and the conductivity is not usually much aifected by the addition of other matter.
  • the electrical properties of the Araldite have been profoundly altered without destroying the mechanical properties, by the introduction of the silver in such quantity that the silver particles come into contact only after the baking treatment.
  • Araldite is the preferred binding compound for the silver particles
  • other thermosetting compounds which will adhere satisfactorily to metals when set could be loaded up in like manner with fine conducting particles in such proportion that when the binding compound has set, the conducting particles are drawn together in contact throughout the whole mass.
  • An electrically conducting cement comprising 27% fine flake silver, 46% ultra fine precipitated silver, 24.5% hardenable resinous reaction product of epichlorohydrin with a diphenol and 2.5% diacetone alcohol.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Conductive Materials (AREA)
  • Chemically Coating (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
US278527A 1951-04-05 1952-03-25 Electrically conducting cements containing epoxy resins and silver Expired - Lifetime US2774747A (en)

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Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2909752A (en) * 1957-08-30 1959-10-20 Union Carbide Corp Resistance heating of plastic-metal fiber articles and articles made thereby
US2956039A (en) * 1956-06-19 1960-10-11 Union Carbide Corp Method of making quick curing metal containing epoxy resin composition
US2961416A (en) * 1958-06-09 1960-11-22 Du Pont Silver conductors
US2965930A (en) * 1957-08-21 1960-12-27 Union Carbide Corp Process for preparing polyepoxide solder
US3018260A (en) * 1955-01-03 1962-01-23 Chem Dev Corp Room temperature curing molding and forming composition
US3030237A (en) * 1959-09-15 1962-04-17 North American Aviation Inc Conductive coating
US3162551A (en) * 1962-12-07 1964-12-22 Du Pont Solder
US3206658A (en) * 1959-12-07 1965-09-14 Sprague Electric Co Solid electrolyte capacitor with surface-contacting cathode lead
US3291758A (en) * 1963-05-31 1966-12-13 Gen Electric Superconductive materials
US3346444A (en) * 1964-08-24 1967-10-10 Gen Electric Electrically conductive polymers and process of producing the same
US3359145A (en) * 1964-12-28 1967-12-19 Monsanto Res Corp Electrically conducting adhesive
US3410722A (en) * 1965-03-23 1968-11-12 Gen Dynamics Corp Welding method, composition and article
US3471310A (en) * 1965-05-24 1969-10-07 Eutectic Welding Alloys Welding process and product
US3834373A (en) * 1972-02-24 1974-09-10 T Sato Silver, silver chloride electrodes
US4127699A (en) * 1976-05-24 1978-11-28 E. I. Du Pont De Nemours And Company Electrically conductive adhesive
US4209358A (en) * 1978-12-04 1980-06-24 Western Electric Company, Incorporated Method of fabricating a microelectronic device utilizing unfilled epoxy adhesive
DE3001613A1 (de) * 1980-01-17 1981-07-23 Siemens AG, 1000 Berlin und 8000 München Verfahren zum einbau einer halbleitervorrichtung in ein gehaeuse
US4375606A (en) * 1978-12-04 1983-03-01 Western Electric Co. Microelectronic device
US4500377A (en) * 1981-12-31 1985-02-19 Thomson-Csf Process for the production of a block of piezoelectric macromolecular material
FR2662864A1 (fr) * 1990-06-05 1991-12-06 Aerospatiale Procede pour relier un conducteur electrique a une broche d'un connecteur, et liaison electrique obtenue par mise en óoeuvre de ce procede.
WO1998039395A1 (en) * 1997-03-03 1998-09-11 Diemat, Inc. High thermally conductive polymeric adhesive
US5918364A (en) * 1989-12-18 1999-07-06 Polymer Flip Chip Corporation Method of forming electrically conductive polymer interconnects on electrical substrates
US6108210A (en) * 1998-04-24 2000-08-22 Amerasia International Technology, Inc. Flip chip devices with flexible conductive adhesive
US6136128A (en) * 1998-06-23 2000-10-24 Amerasia International Technology, Inc. Method of making an adhesive preform lid for electronic devices
US6297564B1 (en) 1998-04-24 2001-10-02 Amerasia International Technology, Inc. Electronic devices employing adhesive interconnections including plated particles
US6316289B1 (en) 1998-11-12 2001-11-13 Amerasia International Technology Inc. Method of forming fine-pitch interconnections employing a standoff mask
US6399178B1 (en) 1998-07-20 2002-06-04 Amerasia International Technology, Inc. Rigid adhesive underfill preform, as for a flip-chip device
US6406988B1 (en) 1998-04-24 2002-06-18 Amerasia International Technology, Inc. Method of forming fine pitch interconnections employing magnetic masks
US6409859B1 (en) 1998-06-30 2002-06-25 Amerasia International Technology, Inc. Method of making a laminated adhesive lid, as for an Electronic device
US6428650B1 (en) 1998-06-23 2002-08-06 Amerasia International Technology, Inc. Cover for an optical device and method for making same
US6580035B1 (en) 1998-04-24 2003-06-17 Amerasia International Technology, Inc. Flexible adhesive membrane and electronic device employing same
US7743963B1 (en) 2005-03-01 2010-06-29 Amerasia International Technology, Inc. Solderable lid or cover for an electronic circuit
EP2388867A2 (en) 2010-05-21 2011-11-23 Amphenol Corporation Electrical connector having thick film layers
WO2018111949A1 (en) * 2016-12-12 2018-06-21 Neuronoff, Inc. Electrode curable and moldable to contours of a target in bodily tissue and methods of manufacturing and placement and dispensers therefor

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US1901391A (en) * 1932-03-08 1933-03-14 Forberg Christian Combination washer
US2137428A (en) * 1930-05-15 1938-11-22 Philips Nv Electrode system of unsymmetrical conductivity
US2173249A (en) * 1935-10-30 1939-09-19 Philips Nv Asymmetric electrode system
US2280135A (en) * 1940-02-21 1942-04-21 Theodore W H Ward Conductive coating for glass and method of application
US2324961A (en) * 1940-05-24 1943-07-20 Ohio Carbon Company Resistor
GB554972A (en) * 1941-09-11 1943-07-28 Philips Nv Improvements in or relating to blocking layer rectifiers
US2470352A (en) * 1944-03-21 1949-05-17 Hartford Nat Bank & Trust Comp Electrical resistor
US2473884A (en) * 1946-05-07 1949-06-21 Westinghouse Electric Corp Contact means
US2500600A (en) * 1948-02-28 1950-03-14 Shell Dev Compositions of matter containing epoxy ethers and diamines
US2506130A (en) * 1945-08-14 1950-05-02 Western Electric Co Metalized ceramic coating composition
US2570856A (en) * 1947-03-25 1951-10-09 Du Pont Process for obtaining pigmented films

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2137428A (en) * 1930-05-15 1938-11-22 Philips Nv Electrode system of unsymmetrical conductivity
US1901391A (en) * 1932-03-08 1933-03-14 Forberg Christian Combination washer
US2173249A (en) * 1935-10-30 1939-09-19 Philips Nv Asymmetric electrode system
US2280135A (en) * 1940-02-21 1942-04-21 Theodore W H Ward Conductive coating for glass and method of application
US2324961A (en) * 1940-05-24 1943-07-20 Ohio Carbon Company Resistor
GB554972A (en) * 1941-09-11 1943-07-28 Philips Nv Improvements in or relating to blocking layer rectifiers
US2470352A (en) * 1944-03-21 1949-05-17 Hartford Nat Bank & Trust Comp Electrical resistor
US2506130A (en) * 1945-08-14 1950-05-02 Western Electric Co Metalized ceramic coating composition
US2473884A (en) * 1946-05-07 1949-06-21 Westinghouse Electric Corp Contact means
US2570856A (en) * 1947-03-25 1951-10-09 Du Pont Process for obtaining pigmented films
US2500600A (en) * 1948-02-28 1950-03-14 Shell Dev Compositions of matter containing epoxy ethers and diamines

Cited By (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3018260A (en) * 1955-01-03 1962-01-23 Chem Dev Corp Room temperature curing molding and forming composition
US2956039A (en) * 1956-06-19 1960-10-11 Union Carbide Corp Method of making quick curing metal containing epoxy resin composition
US2965930A (en) * 1957-08-21 1960-12-27 Union Carbide Corp Process for preparing polyepoxide solder
US2909752A (en) * 1957-08-30 1959-10-20 Union Carbide Corp Resistance heating of plastic-metal fiber articles and articles made thereby
US2961416A (en) * 1958-06-09 1960-11-22 Du Pont Silver conductors
US3030237A (en) * 1959-09-15 1962-04-17 North American Aviation Inc Conductive coating
US3206658A (en) * 1959-12-07 1965-09-14 Sprague Electric Co Solid electrolyte capacitor with surface-contacting cathode lead
US3162551A (en) * 1962-12-07 1964-12-22 Du Pont Solder
US3291758A (en) * 1963-05-31 1966-12-13 Gen Electric Superconductive materials
US3346444A (en) * 1964-08-24 1967-10-10 Gen Electric Electrically conductive polymers and process of producing the same
US3359145A (en) * 1964-12-28 1967-12-19 Monsanto Res Corp Electrically conducting adhesive
US3410722A (en) * 1965-03-23 1968-11-12 Gen Dynamics Corp Welding method, composition and article
US3471310A (en) * 1965-05-24 1969-10-07 Eutectic Welding Alloys Welding process and product
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BE510386A (id) 1900-01-01
CH308100A (fr) 1955-06-30

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