US2143824A - Asymmetrical conductor - Google Patents
Asymmetrical conductor Download PDFInfo
- Publication number
- US2143824A US2143824A US178052A US17805237A US2143824A US 2143824 A US2143824 A US 2143824A US 178052 A US178052 A US 178052A US 17805237 A US17805237 A US 17805237A US 2143824 A US2143824 A US 2143824A
- Authority
- US
- United States
- Prior art keywords
- copper
- per cent
- lead
- oxide
- added
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 title description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 229910052802 copper Inorganic materials 0.000 description 17
- 239000010949 copper Substances 0.000 description 17
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 6
- 229940112669 cuprous oxide Drugs 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02425—Conductive materials, e.g. metallic silicides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02565—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02614—Transformation of metal, e.g. oxidation, nitridation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/16—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising cuprous oxide or cuprous iodide
- H01L21/161—Preparation of the foundation plate, preliminary treatment oxidation of the foundation plate, reduction treatment
Definitions
- This invention relates to electrical current conducting devices that offer a greater resistance to .fiow of current in one direction than in the opposite direction and more particularly to such devices of the copper-cuprous oxide type.
- An object of this invention is to improve the current-voltage characteristics of copper-cuprous oxide rectifiers by increasing the resistance in both the high and low current directions, the increase in the high current direction being for voltages below 0.5 volt.
- a feature of this invention comprises making copper-cuprous oxide type conduction devices from commercial copper having a high degree of purity to which has been added a small amount of another metal, more particularly lead.
- Fig. l is a cross-sectional view of a coppercuprous oxide rectifier in accordance with this invention.
- Fig. 2 is a top plan view of the device of Fig. 1.
- the oxide layer 2 which has been formed on the blank is then suitably treated to provide a low ohmic electrical contact surface thereon.
- An asymmetrical conducting device comprising a metallic body having an integral layer of an oxide of said body thereon, said body comprising copper to which has been added lead to the extent of slightly more than 0.1 per cent.
- a conductive device comprising a body substantially of copper having a layer of oxide integral therewith, that comprises adding to molten copper a small amount, slightly over 0.1 per cent, of lead, forming a 30 body from the resulting melt and heat treating said body to form the oxide layer thereon.
- a conductive device comprising a body substantially of copper having a layer of oxide integral therewith, that comprises adding to molten copper a. small amount, up to 0.4 per cent, of lead, forming a body from the resulting melt and heat treating said body to form the oxide layer thereon.
- a conductive device comprising a body substantially of copper having a layer of oxide integral therewith, that comprises adding to molten copper from over 0.1 per cent to 0.4 per cent of lead, forming a body from the resulting melt and heat treating said body to form the oxide layer thereon.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Conductive Materials (AREA)
- Chemical Treatment Of Metals (AREA)
Description
Jan. 10, 1939. O sMlTH 2,143,824
ASYMMETHICAL CONDUCTOR Filed Dec. 4, 1937 FIG.
COPPER WITH LEAD ADDED FIG. 2
INVENTOR a. 0.5m TH BY ATTORNEY Patented Jan. 10, 1939 ASYMIWIETRICAL CONDUCTOR George 0. Smith, Bloo Bell Telephone Labor infield, N. J., asslgnor to atories, Incorporated, New
York, N. Y., a corporation of New York Application December 4, 1937, Serial No. 178,052
6 Claims.
This invention relates to electrical current conducting devices that offer a greater resistance to .fiow of current in one direction than in the opposite direction and more particularly to such devices of the copper-cuprous oxide type. I
An object of this invention is to improve the current-voltage characteristics of copper-cuprous oxide rectifiers by increasing the resistance in both the high and low current directions, the increase in the high current direction being for voltages below 0.5 volt.
A feature of this invention comprises making copper-cuprous oxide type conduction devices from commercial copper having a high degree of purity to which has been added a small amount of another metal, more particularly lead.
Other and further objects and features will be apparent from the following detailed description taken in conjunction with the drawing in which:
Fig. l is a cross-sectional view of a coppercuprous oxide rectifier in accordance with this invention; and
Fig. 2 is a top plan view of the device of Fig. 1.
In the manufacture of copper-cuprous oxide rectifiers and the like it is considered good prac tice to employ commercial copper having a high degree of purity. Such copper may have traces of metallic impurities totalling about 0.04 per cent. In accordance with this invention there is added to such copper, when in the molten state, a small amount of lead. The resulting material is formed into sheets of suitable thickness and blanks or washers punched therefrom. The blanks may then be treated by various methods to produce metal-metal oxide rectifier .units. One such process comprises placing a blank I in a furnace having an oxidizing atmosphere at about 1000 centigrade for about eight minutes, then placing it in a second furnace maintained at about 500 centigrade for about five minutes and then quenching in cold water.
The oxide layer 2 which has been formed on the blank is then suitably treated to provide a low ohmic electrical contact surface thereon.
It has been roimd that the addition to copper of lead in an amount up to about 0.4 per cent by weight results in an asymmetrical conductor which has better characteristics than those made from commercial copper. The result of such ad dition is an increase in resistance in both the high and low current directions except at voltages of about ahalf-volt or more in the high current 5 direction. This result has been obtained in rectifiers made from copper melts to which about 0.05 per cent, 0.1 per cent, 0.2 per cent or 0.375 per cent of lead have been added.
It will be understood that this invention has been disclosed with reference to a particular, exemplary form thereof, andis to be considered as limited in scope by the appended claims only.
What is claimed is:
1. An asymmetrical conducting device comprising a metallic body having an integral layer of an oxide of said body thereon, said body comprising copper to which has been added lead to the extent of slightly more than 0.1 per cent.
2. A copper-cuprous oxide rectifier formed from 20 a copper body to which has been added from over 0.1 per cent to 0.4 per cent of lead.
3. A copper-cuprous oxide rectifier formed from a copper body to which has been added approximately 0.3 per cent of lead.
4. The method of making a conductive device comprising a body substantially of copper having a layer of oxide integral therewith, that comprises adding to molten copper a small amount, slightly over 0.1 per cent, of lead, forming a 30 body from the resulting melt and heat treating said body to form the oxide layer thereon.
5. The method of making a conductive device comprising a body substantially of copper having a layer of oxide integral therewith, that comprises adding to molten copper a. small amount, up to 0.4 per cent, of lead, forming a body from the resulting melt and heat treating said body to form the oxide layer thereon.
6. The method of making a conductive device comprising a body substantially of copper having a layer of oxide integral therewith, that comprises adding to molten copper from over 0.1 per cent to 0.4 per cent of lead, forming a body from the resulting melt and heat treating said body to form the oxide layer thereon.
GEORGE 0. SMITH.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US178052A US2143824A (en) | 1937-12-04 | 1937-12-04 | Asymmetrical conductor |
CH214269D CH214269A (en) | 1937-12-04 | 1938-11-23 | Copper-copper oxide rectifier. |
FR846918D FR846918A (en) | 1937-12-04 | 1938-12-01 | Devices with asymmetric conductivity |
GB35164/38A GB520005A (en) | 1937-12-04 | 1938-12-02 | Asymmetrical resistance |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US178052A US2143824A (en) | 1937-12-04 | 1937-12-04 | Asymmetrical conductor |
Publications (1)
Publication Number | Publication Date |
---|---|
US2143824A true US2143824A (en) | 1939-01-10 |
Family
ID=22650987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US178052A Expired - Lifetime US2143824A (en) | 1937-12-04 | 1937-12-04 | Asymmetrical conductor |
Country Status (4)
Country | Link |
---|---|
US (1) | US2143824A (en) |
CH (1) | CH214269A (en) |
FR (1) | FR846918A (en) |
GB (1) | GB520005A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2484252A (en) * | 1944-11-07 | 1949-10-11 | Bell Telephone Labor Inc | Asymmetrical conductor |
US3246979A (en) * | 1961-11-10 | 1966-04-19 | Gen Electric | Vacuum circuit interrupter contacts |
-
1937
- 1937-12-04 US US178052A patent/US2143824A/en not_active Expired - Lifetime
-
1938
- 1938-11-23 CH CH214269D patent/CH214269A/en unknown
- 1938-12-01 FR FR846918D patent/FR846918A/en not_active Expired
- 1938-12-02 GB GB35164/38A patent/GB520005A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2484252A (en) * | 1944-11-07 | 1949-10-11 | Bell Telephone Labor Inc | Asymmetrical conductor |
US3246979A (en) * | 1961-11-10 | 1966-04-19 | Gen Electric | Vacuum circuit interrupter contacts |
Also Published As
Publication number | Publication date |
---|---|
CH214269A (en) | 1941-04-15 |
FR846918A (en) | 1939-09-28 |
GB520005A (en) | 1940-04-11 |
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