US2057638A - Process and bath for depositing ruthenium - Google Patents

Process and bath for depositing ruthenium Download PDF

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Publication number
US2057638A
US2057638A US2050A US205035A US2057638A US 2057638 A US2057638 A US 2057638A US 2050 A US2050 A US 2050A US 205035 A US205035 A US 205035A US 2057638 A US2057638 A US 2057638A
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US
United States
Prior art keywords
ruthenium
nitroso
ammino
gms
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US2050A
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English (en)
Inventor
Zimmermann Fritz
Zschiegner Herbert Emil
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Baker and Co Inc
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Baker and Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL43163D priority Critical patent/NL43163C/xx
Priority to BE412665D priority patent/BE412665A/xx
Application filed by Baker and Co Inc filed Critical Baker and Co Inc
Priority to US2050A priority patent/US2057638A/en
Priority to GB31870/35A priority patent/GB466126A/en
Priority to FR799251D priority patent/FR799251A/fr
Priority to DEB172245D priority patent/DE647334C/de
Application granted granted Critical
Publication of US2057638A publication Critical patent/US2057638A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/50Electroplating: Baths therefor from solutions of platinum group metals

Definitions

  • This invention relates to methods of and baths for electroplating ruthenium.
  • An object of this invention is to deposit smooth and adherent coatings of ruthenium.
  • Ruthenium is a metal of the platinum group. It is white in color and very resistant to oxidation and atmospheric conditions. The metal is unaffected by mineral acids.
  • the electrodeposited ruthenium closely resembles the color of rhodium and in many instances may be substituted therefor. Also within the contemplation of our invention is the use of baths or electrolytes for depositing alloys of ruthenium with any of the other platinum metals or with other metals.
  • the ruthenium coatings or deposits may be used to protect tarnishable metal surfaces, such as silver or the like, which results in tarnishproofing the cheaper metals.
  • ruthenium may be deposited on non-tarnishing surfaces, such as jewelry, watch cases and similar articles, where a durable white surface is desired.
  • non-metallic articles such as, carbon and graphite, may be plated with ruthenium according to our invention. In some instances, also, it may be advisable to plate the metal with some other covering metal such as nickel or copper before plating with ruthenium to form an underplating of such metal or metals.
  • aqueous solutions of ruthenium compounds containing the nitroso (NO) group form valuable electroplating solutions. These compounds may be used in acid, alkaline or neutral baths for plating. More particularly we have found that aqueous solutions of ruthenium compounds containing the nitroso (N0) group and also the ammino (NHs) group may be used in acidic, alkaline or neutral condition to electroplate ruthenium. Instead of the ammino group we may substitute the radicals of organic bases, such as pyridine, or the like. The pH range of the baths is from 1 to 14. All of these plating solutions or baths are very stable and the plating efliciency stays substantially the same for several months. Other examples given in the specification broadly show ruthenium electroplating solutions and also additional examples show ruthenium electroplating solutions containing substituted ammino compounds.
  • Ruthenium nitroso hydroxide [RuNO(OH)3.- H2O] was dissolved in hydrochloric acid to form ruthenium nitroso chloride [RllNOClsl-IzO] This compound was dissolved in several acids and electroplating baths were made up as set forth below. Ruthenium was deposited from these baths under the following conditions using brass sheet cathodes of 1" x 3 and good platings were obtained. In the examples, amperes per square decimeter are given.
  • ruthenium nitroso chloride was prepared by dissolving 2.0i gms..
  • ruthenium as ruthenium nitroso hydroxide were dissolved in 20 cc. of acetic acid and evaporated to dryness to remove excess acetic acid. The residue was dissolved in 500 cc. of water containing cc. of sulphuric acid. The resulting bath was electrolyzed at 75 C. at 2.2 volts, 2.21 amperes per square decimeter for 5 minutes and a bright and smooth deposit of ruthenium was obtained.
  • Ruthenium-platinum alloy deposits may be obtained from the following alkaline and acid baths:
  • Ruthenium-palladium alloy deposits may be obtained from the following alkaline and acid baths: I
  • the simple ammonium salts are formed when the acid solutions of the ruthenium nitroso compounds are made ammoniacal. These ammonium salts act as conducting salts or agents. Of course, we are not to be restricted to ammonium salts as the conducting agents as other salts or compounds may be used. It is not absolutely necessary to have conducting salts present in the solutions and we may use the ammino nitroso compounds alone in ammoniacal solution without conducting salts. In general when conducting salts are added lower voltages and amperages may be used.
  • Tables III and IV do not contain all the compounds set forth in Table II.
  • the other compounds given in Table II may also be treated in the way set forth in connection with Tables 1121 and IV and electrolytes obtained from which ruthenium may be deposited.
  • Conducting salts may be used if desired but are not absolutely necessary.
  • ethylenediamine we may use other amine compounds such as triethanolamine. Also derivatives and homologs of pyridine and the amine compounds maybe used.
  • a process for electroplating bright and lustrous ruthenium for decorative or protective purposes which comprises passing a direct current of about 1 to 3 volts and about 2 to 4.5 ampjdm. through an electrolyte which maintains its stability and plating efliciency over an extended pe'- riod of time, said electrolyte containing about 4 gm. of ruthenium per liter as a ruthenium nitroso compound.
  • a process for electroplating ruthenium which comprises passing a current through an electrolyte containing a ruthenium nitroso compound, the pH of the electrolyte ranging from about 1 to about 14.
  • a process for electroplating ruthenium which comprises passing a current through an electrolyte containing a ruthenium nitroso amino compound, the pH of the electrolyte ranging from a about 1 to about 14.
  • a process for electrodepositing ruthenium which comprises passing a current of about 3 volts and about 2 amperes per square decimeter through an electrolyte containing ruthenium nitroso sulphate, and maintaining the temperature of the electrolyte at about 60 C.
  • a process for electrodepositing ruthenium which comprises passing a current of about 2 volts and about 2 amperes per square decimeter through an electrolyte containingruthenium nitroso ammino chloridepand maintaining the temperature of the electrolyte at about 75 C.
  • An electrolyte for plating a rutheniumrhodium alloy which contains a ruthenium nitroso compound and a rhodium compound.
  • An electrolyte for plating ruthenium which includes a solution of a ruthenium compound containing a nitroso group.
  • An electrolyte for plating ruthenium which comprises a solution containing an amino or organic base derivative of a ruthenium compound containing a nitroso group.
  • An electrolyte for electroplating ruthenium which contains a productformed by fusing ruthenium metal with an alkali and an alkali nitrate.
  • An electrolyte for electroplating ruthenium which is formed by fusing ruthenium metal with potassium hydroxide and potassium nitrate and dissolving the fusion in water.
  • a process for plating an alloy of ruthenium and one or more platinum metals which comprises passing a current through an electrolyte FRITZ ZIMMERMANN. HERBERT EMIL ZSCHIEGNER.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
US2050A 1935-01-16 1935-01-16 Process and bath for depositing ruthenium Expired - Lifetime US2057638A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
NL43163D NL43163C (en)) 1935-01-16
BE412665D BE412665A (en)) 1935-01-16
US2050A US2057638A (en) 1935-01-16 1935-01-16 Process and bath for depositing ruthenium
GB31870/35A GB466126A (en) 1935-01-16 1935-11-18 Electro-deposition of ruthenium
FR799251D FR799251A (fr) 1935-01-16 1935-12-05 Procédé de galvanoplastie et produits en résultant
DEB172245D DE647334C (de) 1935-01-16 1935-12-20 Elektrolyt zur Erzeugung elektrolytischer Niederschlaege von Ruthenium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US2050A US2057638A (en) 1935-01-16 1935-01-16 Process and bath for depositing ruthenium

Publications (1)

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US2057638A true US2057638A (en) 1936-10-13

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US2050A Expired - Lifetime US2057638A (en) 1935-01-16 1935-01-16 Process and bath for depositing ruthenium

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US (1) US2057638A (en))
BE (1) BE412665A (en))
DE (1) DE647334C (en))
FR (1) FR799251A (en))
GB (1) GB466126A (en))
NL (1) NL43163C (en))

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2600175A (en) * 1946-09-11 1952-06-10 Metals & Controls Corp Electrical contact
US3480523A (en) * 1964-03-04 1969-11-25 Int Nickel Co Deposition of platinum-group metals
US3625840A (en) * 1970-01-19 1971-12-07 Engelhard Ind Ltd Electrodeposition of ruthenium
US3793162A (en) * 1971-12-17 1974-02-19 Int Nickel Co Electrodeposition of ruthenium
US3892638A (en) * 1973-06-21 1975-07-01 Oxy Metal Industries Corp Electrolyte and method for electrodepositing rhodium-ruthenium alloys
US4082625A (en) * 1976-06-08 1978-04-04 The International Nickel Company, Inc. Electrodeposition of ruthenium
US4297178A (en) * 1979-04-10 1981-10-27 The International Nickel Company, Inc. Ruthenium electroplating and baths and compositions therefor
WO2010057573A1 (en) * 2008-11-21 2010-05-27 Umicore Galvanotechnik Gmbh Noble metal-containing layer sequence for decorative articles
CN115369461A (zh) * 2022-07-12 2022-11-22 永星化工(上海)有限公司 用于医疗、电子穿戴设备的铂族金属电镀液络合剂组合物

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3123544A (en) * 1961-04-18 1964-03-03 Electrodeposition of ruthenium
CH512590A (fr) * 1970-03-20 1971-09-15 Sel Rex Corp Procédé pour le dépôt électrolytique d'alliages de ruthénium, bain aqueux pour la mise en oeuvre de ce procédé, et article revêtu d'un alliage de ruthénium obtenu par ce procédé

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2600175A (en) * 1946-09-11 1952-06-10 Metals & Controls Corp Electrical contact
US3480523A (en) * 1964-03-04 1969-11-25 Int Nickel Co Deposition of platinum-group metals
US3625840A (en) * 1970-01-19 1971-12-07 Engelhard Ind Ltd Electrodeposition of ruthenium
US3793162A (en) * 1971-12-17 1974-02-19 Int Nickel Co Electrodeposition of ruthenium
US3892638A (en) * 1973-06-21 1975-07-01 Oxy Metal Industries Corp Electrolyte and method for electrodepositing rhodium-ruthenium alloys
US4082625A (en) * 1976-06-08 1978-04-04 The International Nickel Company, Inc. Electrodeposition of ruthenium
US4297178A (en) * 1979-04-10 1981-10-27 The International Nickel Company, Inc. Ruthenium electroplating and baths and compositions therefor
WO2010057573A1 (en) * 2008-11-21 2010-05-27 Umicore Galvanotechnik Gmbh Noble metal-containing layer sequence for decorative articles
EP2192210A1 (de) * 2008-11-21 2010-06-02 Umicore Galvanotechnik GmbH Edelmetallhaltige Schichtfolge für dekorative Artikel
US20110236720A1 (en) * 2008-11-21 2011-09-29 Joachim Grimm Noble metal-containing layer sequence for decorative articles
CN102224280A (zh) * 2008-11-21 2011-10-19 尤米科尔电镀技术有限公司 用于装饰制品的含贵金属的序列层
CN102224280B (zh) * 2008-11-21 2013-10-23 尤米科尔电镀技术有限公司 用于装饰制品的含贵金属的序列层
CN115369461A (zh) * 2022-07-12 2022-11-22 永星化工(上海)有限公司 用于医疗、电子穿戴设备的铂族金属电镀液络合剂组合物

Also Published As

Publication number Publication date
GB466126A (en) 1937-05-18
NL43163C (en))
FR799251A (fr) 1936-06-10
BE412665A (en))
DE647334C (de) 1937-07-12

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