US20230240087A1 - Integrated scaling and stretching platform for server processor and rack server unit - Google Patents
Integrated scaling and stretching platform for server processor and rack server unit Download PDFInfo
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- US20230240087A1 US20230240087A1 US18/099,677 US202318099677A US2023240087A1 US 20230240087 A1 US20230240087 A1 US 20230240087A1 US 202318099677 A US202318099677 A US 202318099677A US 2023240087 A1 US2023240087 A1 US 2023240087A1
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- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Semiconductor Integrated Circuits (AREA)
- Dram (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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US18/099,677 US20230240087A1 (en) | 2022-01-27 | 2023-01-20 | Integrated scaling and stretching platform for server processor and rack server unit |
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US202263303542P | 2022-01-27 | 2022-01-27 | |
US18/099,677 US20230240087A1 (en) | 2022-01-27 | 2023-01-20 | Integrated scaling and stretching platform for server processor and rack server unit |
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US (1) | US20230240087A1 (fr) |
EP (1) | EP4220711A3 (fr) |
JP (1) | JP2023109724A (fr) |
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US10672745B2 (en) * | 2016-10-07 | 2020-06-02 | Xcelsis Corporation | 3D processor |
CN110770898A (zh) * | 2019-04-15 | 2020-02-07 | 长江存储科技有限责任公司 | 具有处理器和动态随机存取存储器的键合半导体器件及其形成方法 |
JPWO2020245697A1 (fr) * | 2019-06-07 | 2020-12-10 | ||
WO2021237489A1 (fr) * | 2020-05-27 | 2021-12-02 | Yangtze Memory Technologies Co., Ltd. | Procédés de formation de dispositifs de mémoire tridimensionnels |
US11270917B2 (en) * | 2020-06-01 | 2022-03-08 | Alibaba Group Holding Limited | Scalable and flexible architectures for integrated circuit (IC) design and fabrication |
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KR20230115916A (ko) | 2023-08-03 |
JP2023109724A (ja) | 2023-08-08 |
EP4220711A3 (fr) | 2023-12-27 |
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