US20220304148A9

US20220304148A9 - Camera Module with Compression-Molded Circuit Board and Manufacturing Method Thereof

Info

Publication number: US20220304148A9
Application number: US17/323,079
Authority: US
Inventors: Mingzhu Wang; Nan Guo; Feifan CHEN; Bojie ZHAO; Bo Peng; Zhen Huang
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2016-02-24
Filing date: 2021-05-18
Publication date: 2022-09-22
Also published as: KR102132512B1; CN105721749B; KR20170099764A; CN105721749A; US20170245363A1; WO2017144005A1; US11051400B2; US20210329781A1

Abstract

A camera module with compression-molded circuit board is manufactured by compression-molding that can obtain properties such as high flatness, ultra-thin, fine wiring width and high integration.

Description

CROSS REFERENCE OF RELATED APPLICATION

This application is a Continuation application that claims the benefit of priority under 35U.S.C. § 120 to a non-provisional application, application Ser. No. 15/057,078, filed Feb. 29, 2016, which is a non-provisional application that claims priority to China application number CN201610102572.X, filed Feb. 24, 2016, wherein the entire content of which is expressly incorporated herein by reference.

BACKGROUND OF THE PRESENT INVENTION

Field of Invention

The present invention relates to camera module, and more particularly to a camera module with compression-molded circuit board and the manufacturing method thereof.

Description of Related Arts

With the rapid development of the technology and the improvement of people's living standard, more and more smart electronic devices have been used in various fields and our daily life. In other words, smart electronic devices have been utilized everywhere. The application of smart device requires the use of all kinds of electronic components and optical products, wherein the camera module is one of the most essential components.
All smart devices are developed in the direction of being thinner and having higher performance. Accordingly, high-pixel, high quality imaging and ultra-thin become a demand of the camera module.
Conventional camera module, made by COB (Chip On Board) technology, usually comprises at least a rigid-flex board, a photosensitive chip, a lens holder, a driving motor, and an optical lens. All electrical and electronic parts are arranged on the surface of the circuit board without overlapping with each other. With the demand of high-pixel, high image quality and high performance, the number of electrical and electronic components on the circuit board is increasing, and the size of the chip is increasing for accepting more resistors, capacitors and driven parts, resulting that the overall size of the electrical and electronic components getting bigger and bigger, the difficulty in assemble being more and more, and the size of the camera module being bigger and bigger too.
Smart phone, for example, is updating models from day to day, and the camera module is developed accordingly. The development of the smart phone is mainly focused in two directions. One is to provide more functions and more stable performance for the smart phone. The other is to improve the appearance and thickness of the smart phone. It is apparent that, the photoelectric properties of the camera module greatly affects its image quality, such as photo taking or video taking. On the other hand, according to the arrangement of the conventional smart phone, the camera module is parallelly installed in the smart phone, and therefore, the thickness of the camera module greatly affects and determines the thickness of the smart phone, while the projection area of the camera module substantially affects the width of the smart phone. One skilled in the art would find that the main factor that limits the ultra-thinness development of the smart phone is the camera module to be used. It is so difficult for the camera modules applied to the current smart phones to have a balanced coordination between good performance and compact overall size thereof.
It is apparent that, on the basis of conventional manufacturing and assembling technologies of the camera module, the requirements of the high performance and ultra-thinness in size of the camera module is irreconcilable contradiction.
The implementation of a camera module relies on all related factors. The photosensitive performance including the pixel and quality of the image taken by the camera module is related to the electrical and electronic components and optical elements. The size, shape, quality and other physical properties of the camera module is related to the manufacturing process, the assembly method, the manufacturing material to be used, and etc.. How to more reasonably and appropriately manufacture and assemble more and more components to provide a camera module with outstanding performance like high-pixel, high image quality and etc., while fulfilling the requirement of lighter and thinner in size, is a problem remained to be solved.

SUMMARY OF THE PRESENT INVENTION

One object of the present invention is to provide a camera module with compression-molded circuit board, wherein the circuit board is manufactured using molding to minimize its size and to provide an integration structure, that is able to solve the contradiction between the configuration of the electrical and electronic components and the increased size of the circuit board.
Another object of the present invention is to provide a camera module with compression-molded circuit board, wherein molding method is used to obtain an innovative circuit board with high flatness, ultra-thin, highly integrated, and fine line width.
Another object of the present invention is to provide a camera module with compression-molded circuit board, wherein the circuit board is manufactured by using a compression-molding method, so that the circuit board structure is optimized and thus the camera module is optimized.
According to the present invention, the foregoing and other objects and advantages are attained by a camera module with compression-molded circuit board, which comprises a circuit and a circuit board body, wherein the circuit board body and the circuit are integrally manufactured by compression-molding method. The compression-molded circuit board is electrically connected with a light-sensitive sensor such as a photosensitive chip.
In one embodiment, the circuit board body is made of hot melting or hot setting material such as epoxy resin by means of compression-molding.
In one embodiment, the circuit board further comprises a reinforcing member, wherein the circuit board body is made based on the reinforcing member and formed by compressing hot melting or hot setting material such as laminated epoxy resin.
In one embodiment, the circuit board comprises one circuit board body or a plurality of circuit board bodies arranged to be aligned with each other.
In one embodiment, the circuit board comprises 2 to 10 layers of circuit board body.
In one embodiment, the thickness of the circuit board body is 0.1 mm to 0.6 mm.
In one embodiment, a wiring width of the circuit of the compression-molded circuit board is 0.01 mm to 0.09 mm. One skilled in the art can understand that the above-mentioned layers, thickness and the wiring width is exemplary only and not intended to limit the present invention.
In accordance with another aspect of the invention, the present invention comprises a camera module which comprises an optical lens, a light-sensitive sensor such as a photosensitive chip and a circuit board, wherein the circuit board is manufactured by molding method. The photosensitive chip is electrically connected with the circuit board. The optical lens is provided in a photosensitive path of the photosensitive chip.
In accordance with another aspect of the invention, the present invention comprises a manufacturing method of a camera module, wherein the manufacturing method comprises the following steps: obtaining a circuit board by compression-molding; electrically connecting a photosensitive chip to the circuit board; and assembling an optical lens in a photosensitive path of the photosensitive chip.
Still further objects and advantages will become apparent from a consideration of the ensuing description and drawings.
These and other objectives, features, and advantages of the present invention will become apparent from the following detailed description, the accompanying drawings, and the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrated a perspective view of a camera module according to a preferred embodiment of the present invention.

FIG. 2 illustrated an explosive view of the camera module according to the above mentioned preferred embodiment of the present invention.

FIG. 3 illustrated a perspective view of the circuit board when being compression-molded according to the above mentioned preferred embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The following description is disclosed to enable any person skilled in the art to make and use the present invention. Preferred embodiments are provided in the following description only as examples and modifications will be apparent to those skilled in the art. The general principles defined in the following description would be applied to other embodiments, alternatives, modifications, equivalents, and applications without departing from the spirit and scope of the present invention.
Those skilled in the art should understand that, in the disclosure of the present invention, terminologies of “longitudinal,” “lateral,” “upper,” “front,” “back,” “left,” “right,” “perpendicular,” “horizontal,” “top,” “bottom,” “inner,” “outer,” and etc. that indicate relations of directions or positions are based on the relations of directions or positions shown in the appended drawings, which are only to facilitate descriptions of the present invention and to simplify the descriptions, rather than to indicate or imply that the referred device or element is limited to the specific direction or to be operated or configured in the specific direction. Therefore, the above-mentioned terminologies shall not be interpreted as confine to the present invention.
Referring to FIGS. 1 to 3, a camera module according to a preferred embodiment of the present invention is illustrated. The camera module comprises a frame 10, a circuit board 20, a light-sensitive sensor such as a photosensitive chip 30, an optical lens 40, and a driver such as a motor 50. One skilled in the art can understand that without the motor 50, the camera module can be embodied as a fixed-focal camera module.
As shown in the figures, the photosensitive chip 30 is provided on the circuit board 20. The frame 10 is installed on the circuit board 20. The optical lens 40 is mounted on the motor 50 which is mounted on the frame 10. So that the optical lens 40 is supported and positioned above the circuit board 20 in such a manner that the emitting light traveling through the optical lens 40 can be sensed by the photosensitive chip 30.
Specifically, the optical lens 40 is mounted on the motor 50, and can be driven by the motor for auto-focusing. The circuit board 20 and the motor 50 are provided on the opposite side of the frame 10 respectively, which makes the optical lens 40 located along a photosensitive path of the photosensitive chip 30. When the camera module is used to capture image of an object, the reflect light of the object can be processed by the optical lens 40 and further be accepted by the photosensitive chip 30 for photoelectric conversion.
The circuit board 20 comprises a plurality of circuit board conductive members 21, a circuit board body 22 and a circuit 23, wherein the circuit board conductive members 21 are provided on the circuit board body 22 for electrically connecting the light-sensitive chip 30. The circuit 23 is provided on the circuit board body 22.
Specifically, the photosensitive chip 30 comprises a plurality of photosensitive chip conductive members and a photosensitive chip body, wherein the photosensitive chip conductive members are provided on the photosensitive chip body. The photosensitive chip conductive members are used to electrically connect the circuit board 20 and the circuit board conductive members 21, so as to ensure the electrical connection of the photosensitive chip 30 and the circuit board 20. Specifically, the photosensitive chip and the circuit board 20 are electrically connected by lead wires, or other electrical connection method such as soldering, ACP (anisotropic conductive paste) and hot-pressing. One skilled in the art would understand that the lead wire is for exemplary only and not intended to limit the present invention.
It is worth mentioning that, according to the present invention, the circuit board 20 is formed by compression-molding which is different from the conventional circuit board manufacturing method. More particularly, to manufacture the circuit board 20, layers of resin are laminated on a reinforced member 201 or copper board to form the circuit board body 22. In other words, the circuit board 21 is integrally formed by molding. During the molding process, different materials can be used for molding. In one embodiment of the present invention, it is preferably to use hot melting material or hot setting material such as epoxy resin. One skilled in the art can understand that the hot melting material or hot setting material such as epoxy resin is for exemplary only and not intended to limit the present invention.
More specifically, the compression-molded circuit board of the this embodiment is manufactured by means of compression-molding. Specifically, electroplating circuit and film/resin film are added into the molding die. Then, resin material is filled, such as filling in resin powder or by injection. And finally close the mold and press to form the circuit board.
More particularly, according to the preferred embodiment of the present invention, as shown in FIG. 3, the reinforcing member 201 is received in a molding die (not shown), and then conductive member 202 is added together with resin material 203 such as resin powder. Then, the molding die is heated to a predetermined temperature. When the resin powder is melted with heat and becomes viscous fluid, under the effect of pressure, the viscous fluid flows and fills the inner cavity of the entire molding die. Then, while the temperature is increased continuously, the resin is crosslinked and its molecular weight is increased, so that the viscous fluid further loses its flowability and is solidified. The electrical and electronic components 204, such as resistors, capacitors and driver chip, can further be attached and connected with the conductive member 202 to form a complete circuit board 20.
It is appreciated that when the resin material 203 is added, it is also feasible to inject the melted resin material 203 into the molding die directly, and then by applying pressure and heat, the resin material 203 is solidified. It is also feasible to add a layer of conductive member 202 and a layer of resin material 203 repeatedly and overlappedly to form a multi-layer structure. The conductive member 202 and the electrical components 204 form the circuit 23 of the circuit board 20. The above mentioned electrical frame and the integral circuit board member can also be manufactured using the similar manufacturing method.
It is worth mentioning that the circuit board 21 manufactured by such molding method have advantages such as high flatness, ultra-thin, high integration, fine wire width, and etc., so that the contraction of configuration of the circuit parts and the increasing size of the circuit board can be solved. In one embodiment of the present invention, the circuit board body 22 manufactured by compression-molding as mentioned above have a good flatness. The wiring width could be 0.01 mm to 0.09 mm. The thickness of the circuit board 20 could be 0.1 mm to 0.6 mm. The layers of the circuit board could be 2 to 10 layers. One skilled in the art will understand that all figures mentioned above is exemplary only and not intended to be limiting.
It is worth mentioning, the frame 10 could be manufactured in all predetermined shape according to the demands. In other words, the circuit board 20 with the photosensitive chip 30 can be assembled with a conventional frame, and the frame 10 can be further installed with an optical filter 70.
In addition, the frame 10 can be manufactured using above mentioned compression-molding technology. In other words, the circuit board 20 and the frame 10 can be manufactured using laminated resin as an integral. In compression-molding, a recess could be provided on the top of the circuit board 20 for mounting the photosensitive chip 30 therein.
It is worth mentioning that the circuit board 20 with the photosensitive chip 30 can be assembled with different types of camera module such as fixed-focal camera module, auto-focus camera module or zooming camera module. And further connected with a control panel in a variety of electrical device through a flexible PCB. One skilled in the art will understand the circuit board 20 is exemplary only and not intended to be limit the present invention.
It is also worth mentioning that, in the application of the circuit board 20, a single circuit board 20 can be manufactured independently to assemble together with other parts to constitute a camera module. A plurality of circuit boards 20 could be manufactured together using makeup method. That is forming an entire piece of the board with more than one piece of the circuit boards 20 by compression-molding process, and then the entire board is cut into multiple circuit boards 20. One skilled in the art will understand that the number of the circuit board 20 is exemplary only and not intended to be limit the present invention.
One skilled in the art will understand that the embodiment of the present invention as shown in the drawings and described above is exemplary only and not intended to be limiting.
It will thus be seen that the objects of the present invention have been fully and effectively accomplished. The embodiments have been shown and described for the purposes of illustrating the functional and structural principles of the present invention and are subject to change without departure from such principles. Therefore, this invention includes all modifications encompassed within the spirit and scope of the following claims.

Claims

What is claimed is:

1. A compression-molded circuit board of camera module, wherein the camera module comprises a photosensitive chip, wherein said compression-molded circuit board comprises a circuit and at least one circuit board body, wherein said circuit board body and said circuit are molded into an integral structure by compression-molding for electrically connecting with the photosensitive chip of the camera module, wherein said compression-molded circuit board comprises a plurality of conductive members and a resin material, wherein said conductive members are added together with said resin material and are being heated in a compression-molding process to form said at least one circuit board body, wherein said conductive members forms at least a part of said circuit.

2. The compression-molded circuit board, as recited in claim 1, wherein said at least one circuit board body comprises a reinforcing plate, wherein said resin material comprises one or more laminated epoxy resin members being integrally compression-molded on said reinforcing plate by compression-molding, wherein said conductive members are embedded in said one or more laminated epoxy resin members to form a multi-layer structure.

3. The compression-molded circuit board, as recited in claim 1, wherein a layer of said conductive members and a layer of said resin material are repeatedly and overlappedly added in the compression-molding process to form said multi-layer structure

4. The compression-molded circuit board, as recited in claim 2, wherein said circuit further comprises one or more electrical components mounted on said at least one circuit board body and connected with said conductive members.

5. The compression-molded circuit board, as recited in claim 1, wherein said circuit has a wiring width of 0.01 mm to 0.09 mm, wherein a thickness of said at least one circuit board body is 0.1 mm to 0.6 mm.

6. The compression-molded circuit board, as recited in claim 1, wherein the camera module further comprises an optical lens, wherein said compression-molded circuit board further comprises a recessed bracket integrally molded on said at least one circuit board body for mounting the optical lens.

7. The compression-molded circuit board, as recited in claim 1, wherein said resin material is a hot melting material.

8. The compression-molded circuit board, as recited in claim 1, wherein said resin material is a hot setting material.

9. A camera module, comprising:

an optical lens;

a photosensitive chip; and

a compression-molded circuit board, wherein said optical lens is supported above said compression-molded circuit board and is located in an optical path of said photosensitive chip, wherein said compression-molded circuit board comprises a circuit and at least one circuit board body, wherein said circuit board body and said circuit are molded into an integral structure by compression-molding and are electrically connecting with said photosensitive chip, wherein said compression-molded circuit board comprises a plurality of conductive members and a resin material, wherein said conductive members are added together with said resin material and are being heated in a compression-molding process to form said at least one circuit board body, wherein said conductive members forms at least a part of said circuit.

10. The camera module, as recited in claim 9, wherein said at least one circuit board body comprises a reinforcing plate, wherein said resin material comprises one or more laminated epoxy resin members being integrally compression-molded on said reinforcing plate by compression-molding, wherein said conductive members are embedded in said one or more laminated epoxy resin members to form a multi-layer structure.

11. The camera module, as recited in claim 10, wherein a layer of said conductive members and a layer of said resin material are repeatedly and overlappedly added in the compression-molding process to form said multi-layer structure

12. The camera module, as recited in claim 10, wherein said circuit further comprises one or more electrical components mounted on said at least one circuit board body and connected with said conductive members.

13. The camera module, as recited in claim 10, wherein said circuit has a wiring width of 0.01 mm to 0.09 mm, wherein a thickness of said at least one circuit board body is 0.1 mm to 0.6 mm.

14. The camera module, as recited in claim 10, wherein said compression-molded circuit board further comprises a recessed bracket integrally molded on said at least one circuit board body for mounting said optical lens.

15. The camera module, as recited in claim 14, further comprising a motor mounted on said recessed bracket, wherein said optical lens is mounted on said motor such that said compression-molded circuit board and said motor are provided on two opposite sides of said bracket respectively and said optical lens is able to be driven by said motor for auto-focusing.

16. The camera module, as recited in claim 10, wherein said camera module is a fixed-focal camera module.

17. The camera module, as recited in claim 10, wherein said conductive members and said one or more laminated epoxy resin members are molded on said reinforcing plate in such a manner one inner layer of said one or more laminated epoxy resin members is laminated on said reinforcing plate, at least one layer of said one or more conductive members is laminated on said inner layer of said one or more laminated epoxy resin members, and then one outer layer of said one or more laminated epoxy resin members is laminated on said at least one layer of said one or more conductive members while another one or more of said one or more conductive members are transversely extending from said reinforcing plate to outside of said outer layer of said one or more laminated epoxy resin members to selectively connect with said one or more electrical components and said at least one layer of said one or more conductive members to form said circuit.

18. The camera module, as recited in claim 14, wherein said conductive members and said one or more laminated epoxy resin members are molded on said reinforcing plate in such a manner one inner layer of said one or more laminated epoxy resin members is laminated on said reinforcing plate, at least one layer of said one or more conductive members is laminated on said inner layer of said one or more laminated epoxy resin members, and then one outer layer of said one or more laminated epoxy resin members is laminated on said at least one layer of said one or more conductive members while another one or more of said one or more conductive members are transversely extending from said reinforcing plate to outside of said outer layer of said one or more laminated epoxy resin members to selectively connect with said one or more electrical components and said at least one layer of said one or more conductive members to form said circuit

19. The camera module, as recited in claim 10, wherein said resin material is a hot melting material.

20. The camera module, as recited in claim 10, wherein said resin material is a hot setting material.