KR100818486B1 - A Camera Module Package - Google Patents

Abstract

Provides a camera module package.

The present invention provides a lens barrel comprising at least one lens; An upper housing in which the lens barrel is assembled to be movable in the optical axis direction; A lower housing having the upper housing mounted on the upper surface and having a terminal portion formed on an inner surface of the body through which a window through which the optical axis of the lens passes; An image sensor electrically connected to a plurality of internal terminals provided in the terminal portion of the lower housing to externally expose an image imaging region through the window; And a substrate having one end electrically connected to the plurality of external terminals exposed to the outer surface of the lower housing.

According to the present invention, by connecting the substrate to the outer surface of the housing to reduce the height of the packaged product, it is possible to reduce the thickness, and to perform the process of connecting the substrate more easily to improve the work productivity.

Camera Module, Lens Barrel, Housing, Image Sensor, Ceramic, Pattern Circuit

Description

Camera Module Package {A Camera Module Package}

1 is a diagram illustrating a general camera module package.

2 is a cross-sectional view showing a general camera module package.

3 is an exploded perspective view showing a camera module package according to the present invention.

4 is a cross-sectional view showing a camera module package according to the present invention.

Figure 5 is a detailed view showing the bump of the image sensor employed in the camera module package according to the present invention.

Explanation of symbols on the main parts of the drawings

110: lens barrel 113: cap

120: upper housing 127: positioning groove

130: lower housing 133: window

134: terminal 135: IR filter

136: passive element 138: internal terminal

139: external terminal 140: image sensor

148: pad 148a: bump

150: substrate 151: connection terminal portion

The present invention relates to a camera module package, and more particularly, to simplify the assembly process by reducing the number of components, and to prevent image defects due to the mixing of foreign materials, to obtain an image of excellent quality, and to reduce the volume of the product, thereby miniaturization. It relates to a camera module package that can be planned.

Various portable terminal manufacturers are currently developing and producing a portable terminal with a built-in camera module package. Various types of built-in camera module packages included in the portable terminal are developed according to components and package methods.

In general, the camera module package is mainly composed of COF (Chip On Film), COB (Chip On Board), CSP (Chip Scale Package) type, and the development trend of such a camera module package is high pixel, multifunctional, and light and short. And low cost.

Among the above manufacturing methods, the COB package of the wire bonding method is a process similar to the existing semiconductor production line, which is more productive than other package methods, but additional space is required because the wire must be electrically connected between the image sensor and the substrate. The disadvantage is that the overall package size is limited and the number of circuits that must be processed.

Since the flip chip type COF does not need a separate space for connecting both ends of the wire to the image sensor and the substrate, the size of the package can be reduced, and the height of the barrel can be reduced. Since a thin film or a flexible PCB is used as a substrate, a reliable package against external impact is possible and the process is relatively simple. In addition, the package can meet the trend of high-speed processing, high density, and multi-pinning due to the reduction of the package and the reduction of the resistance.

On the other hand, CSP, which is one of the most effective methods for light and thin package, has a limitation for an image sensor that is expensive in process and manufacturing cost and unstable in delivery.

1 is a block diagram illustrating a general camera module package, and FIG. 2 is a cross-sectional view illustrating a general camera module package. The camera module package 1 includes a lens barrel 10, a housing 20, and an FPCB 30. And an image sensor 40.

The lens barrel 10 is a hollow cylindrical body in which a lens (not shown) is disposed in an inner space, and a male screw portion 11 is formed at an outer surface thereof, and a cap 13 is assembled at an upper end thereof.

At least one lens is installed in the lens barrel 11 according to the function and performance of the camera module package to be implemented.

The housing 20 has an inner hole for accommodating the lens barrel 10, and an inner threaded portion 21 screwed to the male threaded portion 11 of the lens barrel 10 is provided on an inner circumferential surface of the inner hole. Formed.

The housing 20 is provided with an IR filter 25 to filter the light passing through the lens.

Accordingly, the lens barrel 10 is screwed to the female screw portion 21 of the housing so as to be movable by a drive source not shown in the optical axis direction with respect to the housing 20 is fixed.

The flexible printed circuit board (FPCB) 30 opens the window 34 at one end thereof so that the image imaging area of the image sensor 40 through which the image of the subject passing through the lens is imaged is externally exposed. Bonded to the lower portion of the 20), it is configured to mount at least one passive element 39 on the upper surface.

The other end of the FPCB 30 is provided with a connector 35 connected to a connector (not shown) of the substrate to be connected to the display means not shown.

The image sensor 40 is coupled to the FPCB 30 in a flip chip bonding method, which includes a plurality of stud bumps 41 on an upper surface of the image sensor 40 and a vision in the corresponding bonding area. The conductive liquid polymer adhesive 36 is applied by applying a rectangular frame shape, and then thermocompression-bonded to the lower surface of the FPCB 30 so that the image imaging region of the image sensor 40 and the window portion 34 coincide with each other. Bonding.

Accordingly, the conductive particles are connected between the terminals corresponding to each other of the FPCB 30 and the image sensor 40 to exhibit conductivity in a single direction. Accordingly, conduction between the terminals is achieved and mechanical connection is also achieved. will be.

However, in order to invite the height of the product of the conventional camera module package 1, the distance between the upper portion of the lens barrel 10 and the image imaging surface of the image sensor 40 is approached to a physical limit value, thereby achieving thinning. However, there was a limitation in the application of processing technology in cutting the lower part of the image sensor as much as possible or reducing the height of the housing.

In addition, in the process of bonding and bonding the flip chip bonded FPCB 30 to the lower portion of the housing 20, the image imaging region of the image sensor 40 and the optical axis of the lens are perpendicular to each other. At the same time, the process of bonding and bonding the FPCB 30 to the limited lower space of the housing 20 is complicated, so that the center of the image imaging region and the center of the lens coincide with each other, and there is a problem of lowering work productivity.

The present invention has been made to solve the above-mentioned conventional problems, the object is to reduce the height of the packaged products by connecting the substrate to the outer surface of the housing to achieve a thinner, and to simplify the process of connecting the substrate To provide a camera module package that can improve work productivity.

In order to achieve the above object, the present invention, a lens barrel having at least one lens; An upper housing in which the lens barrel is assembled to be movable in the optical axis direction; A lower housing having the upper housing mounted on the upper surface and having a terminal portion formed on an inner surface of the body through which a window through which the optical axis of the lens passes; An image sensor electrically connected to a plurality of internal terminals provided in the terminal portion of the lower housing to expose the image imaging region through the window; And a substrate having one end electrically connected to the plurality of external terminals exposed to the outer surface of the lower housing.

Preferably, the lower housing is formed of a ceramic laminate provided by stacking a plurality of ceramic sheets printed with a pattern circuit on a surface thereof.

Preferably, the lower housing has a positioning boss on the upper surface that is correspondingly assembled with the positioning groove formed at the lower end of the upper housing.

Preferably, the lower housing is provided with a positioning groove in the upper surface that is correspondingly assembled with the positioning projection formed on the lower end of the upper housing.

Preferably, the terminal unit has an IR filter on the upper surface for filtering light incident to the image sensor side through the lens.

Preferably, the terminal unit is equipped with at least one passive element electrically connected to the upper surface.

Preferably, the image sensor is flip-chip bonded through the internal terminal and the bump of the terminal unit.

More preferably, the bump is provided with any one of a stud bump, an electroless bump and an electrolytic bump.

Preferably, the image sensor side-fills the thermosetting resin between its outer edge and the inner surface of the lower end of the lower housing.

Preferably, the substrate is provided with a stepped connection terminal portion whose one end portion is correspondingly connected to a plurality of external terminals provided at different heights on the outer surface of the lower housing.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is an exploded perspective view showing a camera module package according to the present invention, Figure 4 is a longitudinal sectional view showing a camera module package according to the present invention.

3 and 4, the camera module package 100 of the present invention includes a lens barrel 110, an upper housing 120, a lower housing 130, an image sensor 140, and a substrate 150. It is configured to include.

The lens barrel 110 is a hollow lens-shaped lens accommodating part having at least one lens 112 arranged along an optical axis and having a predetermined internal space.

The plurality of lenses 112 disposed in the lens barrel 110 may include a spacer 119 to maintain a predetermined size gap between the other lenses.

A male screw portion 111 is formed on an outer surface of the lens barrel 110, and an entrance hole 113a is formed at the front end of the lens barrel 110 so as to fix the position of the lens 112 accommodated in the lens barrel 110. The cap 113 is assembled.

The upper housing 120 accommodates the hollow barrel cylinder in which the lens barrel 110 is housed by forming an internal thread portion 121 of the inner hole of the lens barrel 110 that is screwed with the male thread portion 111 of the lens barrel 110. It is absent.

Accordingly, the lens barrel 110 is the lens in the optical axis direction by the driving force of the drive source not shown with respect to the upper housing 120 is fixed by the screw coupling of the male screw portion 111 and the female screw portion 121. It is moved with 112.

The lower housing 130 is mounted on the upper surface of the upper housing 120 to be assembled with the lens barrel 110, a constant that the center and the optical axis of the lens on the upper surface on which the upper housing 120 is mounted Through openings 131 of size are formed.

The lower housing 130 is a ceramic structure formed of a ceramic laminate formed by stacking a plurality of ceramic sheets printed with a pattern circuit on a surface thereof, and the circuit printed with a pattern printed on the ceramic sheet is connected to the image sensor 140. Are exposed to the outside through the internal terminals 138 and the plurality of external terminals 139 connected to the substrate 150.

Here, the pattern circuit of the ceramic sheet constituting the lower housing is provided by any one of electroplating or electroless plating.

The body of the lower housing 130 includes a terminal portion 134 having a plurality of internal terminals 138 electrically connected to the image sensor 140 on a lower surface thereof. The terminal portion 134 includes the lens. The optical axis of 112 passes through the window 133.

The upper surface of the terminal unit 134 is provided with a bonding adhesive bonding IR filter 135 for filtering the light incident to the image sensor 140 through the lens 112 as a bonding agent.

In addition, the center surface between the optical axis of the lens barrel 110 and the window 134 formed in the lower housing 130 while more easily performing assembly with the upper housing 120 on the upper surface of the lower housing 130. It is provided with a positioning boss 137 correspondingly assembled with the positioning groove 127 formed at the lower end of the upper housing 120 so as to match each other to determine the assembly position.

Here, the positioning boss 137 may be provided at the lower end of the upper housing 120 corresponding to the positioning groove 127 formed on the upper surface of the lower housing 130.

At least one passive element 136, such as a capacitor and a resistor, is provided on an upper surface of the terminal unit 134 provided with the IR filter 135, and the passive element 136 may include the terminal unit ( 134 is connected to the connection terminal exposed to the upper surface through the lead-free solder.

Here, the passive element may be embedded in the lower housing 130 by having an internal electrode pattern that functions as a resistor and a capacitor in a plurality of ceramic sheets.

The image sensor 140 is provided on the terminal portion 134 of the lower housing 130 at the same time as the image imaging area provided in the center area on the upper surface of the image is exposed to the outside through the window 133 of the lower housing 130. Flip chip bonding is performed via the internal terminal 138 and the bump 148a.

As illustrated in FIG. 5, the bump 148a flip-bonded with the inner terminal 138 of the terminal unit 134 is mounted on the pad 148 provided on the upper surface of the image sensor 140 and is upper part. It is provided with a stud type bump that the outer diameter is reduced to, the stud type bump is made of a plating material of tin or gold series and is electrically bonded to the inner terminal 138 by a high pressure or by an ultrasonic bonding method at the same time and electrically Connected.

Here, although the bump 148a is illustrated and described as being provided with stud type bumps, the bump 148a may be selectively used as an electroless bump and an electrolytic bump.

In addition, the image sensor 140 flip-chip bonded to the terminal portion 134 of the lower housing 130 has a side filling between the outer edge and the inner surface of the lower end of the lower housing 130. And, the side-filled resin is cured to further strengthen the bonding force between the image sensor 140 and the lower housing 130.

The substrate 150 includes a connection terminal 151 at one end electrically connected to a plurality of external terminals 139 exposed to the outer surface of the lower housing 130, and the other end is connected to a display means not shown. It is a flexible circuit board having a connector 152 as possible.

Here, the connection terminal unit 151 may be provided in a stepped shape so as to correspond to the plurality of external terminals 139 provided at different heights on the outer surface of the lower housing 130.

The connection terminal unit 151 is connected to the external terminal 139 of the lower housing 130 via a lead-free solder.

The process of manufacturing the camera module 100 having the above-described configuration is such that the at least one lens 112 has a built-in lens barrel 110 and the internal threaded portion 111 of the lens barrel 110 to be screwed together The upper housing 120 having the female screw portion 121 formed on the surface thereof is prepared and screwed together to move in the optical axis direction.

The upper housing 120 is mounted on the upper surface of the lower housing 130, which is a ceramic laminate in which a plurality of ceramic sheets are stacked, and then integrally bonded and bonded by a bonding agent applied to these boundary surfaces.

At this time, the coupling between the upper housing 120 and the lower housing 130 is a position provided on the upper surface of the positioning groove 127 and the lower housing 130 provided at the lower end of the upper housing 120. It is made precisely by the coupling between the bosses 137 for determination.

The lower housing 130 is a ceramic structure formed by stacking a ceramic sheet printed with a pattern circuit on a surface thereof, and an IR filter 135 on an upper surface of the terminal portion 134 provided on the inner surface of the body of the lower housing 130. ) And at least one passive element 136 is electrically mounted.

Continuously, a plurality of internal terminals 138 provided on the lower surface of the terminal portion 134 in a state in which the image sensor 140 is disposed directly below the terminal portion 134 of the lower housing 130, The bumps 148a raised for each of the pads 148 exposed on the upper surface of the image sensor 140 correspond to each other, and dispensing non-conductive paste (NCP), which is a non-conductive adhesive, between them. Next, the internal terminal 138 of the lower housing 130, which is a ceramic laminate, and the bump 148a of the image sensor 140 are correspondingly connected.

That is, while applying a pressing force of a certain intensity to the connection surface between the internal terminal 138 and the bump 148a, by providing a heat source and bonding them by a thermocompression bonding method, or by applying ultrasonic waves, they are bonded by an ultrasonic bonding method.

In this case, the image imaging region of the image sensor 140 is externally exposed through the window 133 formed through the terminal portion 134 of the lower housing 130 so as to correspond to the optical axis of the lens barrel 110.

On the other hand, the connection terminal portion 151, which is one end of the substrate 150 made of a flexible circuit board, is connected to the external terminal 139 exposed on the outer surface of the lower housing 130, the lead-free solder through Connect.

In this case, since the substrate 150 is connected to the outer surface of the lower housing 130 made of a ceramic laminate instead of being laminated to the housing together with the image sensor as in the prior art, the height of the package by the size corresponding to the thickness of the substrate Can be reduced.

While the invention has been shown and described in connection with specific embodiments, it is to be understood that various changes and modifications can be made in the art without departing from the spirit or scope of the invention as set forth in the claims below. It will be appreciated that those skilled in the art can easily know.

According to the present invention as described above, by stacking a ceramic sheet having a pattern circuit is provided with a lower housing, connecting the substrate electrically connected to the image sensor with an external terminal exposed on the outer surface of the lower housing, the height of the package Since it can be reduced by the thickness occupied by the substrate, it is possible to reduce the height of the package to be thinner than to laminate the substrate with the image sensor in the lower portion of the housing as in the prior art.

In addition, since the process of bonding the thin plate to the housing is performed on the outer surface of the lower housing alone, compared to the process of bonding and bonding the FPCB, in which the image sensor is flip-chip bonded to the lower portion of the housing, as compared with the conventional process. The effect which can reduce work load and improve work productivity is acquired.

Claims (10)

A lens barrel having at least one lens; An upper housing in which the lens barrel is assembled to be movable in the optical axis direction; A lower housing having the upper housing mounted on the upper surface and having a terminal portion formed on an inner surface of the body through which a window through which the optical axis of the lens passes; An image sensor electrically connected to a plurality of internal terminals provided in the terminal portion of the lower housing to externally expose an image imaging region through the window; And And a substrate having one end electrically connected to the plurality of external terminals exposed to the outer surface of the lower housing. The method of claim 1, The lower housing is a camera module package, characterized in that made of a ceramic laminate is provided by stacking a plurality of ceramic sheets printed with a pattern circuit on the surface. The method of claim 1, The lower housing is a camera module package, characterized in that the upper surface has a positioning boss that is correspondingly assembled with the positioning groove formed in the lower end of the upper housing. The method of claim 1, The lower housing has a camera module package, characterized in that the upper surface has a positioning groove that is assembled to correspond to the positioning projection formed in the lower end of the upper housing. The method of claim 1, The terminal unit has a camera module package, characterized in that the upper surface has an IR filter for filtering the light incident to the image sensor side through the lens. The method of claim 1, The terminal module package, characterized in that the at least one passive element is electrically connected to the upper surface is mounted. The method of claim 1, The image sensor is a camera module package, characterized in that the flip chip bonding via the inner terminal and the bump of the terminal unit. The method of claim 7, wherein The bump is a camera module package, characterized in that provided with any one of stud type bump, electroless bump and electrolytic bump. The method of claim 1, And the image sensor side-fills a thermosetting resin between an outer edge thereof and an inner surface of a lower end of the lower housing. The method of claim 1, The substrate has a camera module package, characterized in that one end thereof is provided with a stepped connection terminal portion corresponding to a plurality of external terminals provided at different heights on the outer surface of the lower housing.

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