KR100818502B1 - A camera module package - Google Patents

Abstract

A camera module package is provided to prevent torsion of alignment during a thermal compression process, and to prevent defective flatness and burr generated when an anisotropic conduction film is used as adhesive by allowing a substrate to be mounted in a protrusion formed in the lower surface of a housing. A camera module package comprises a lens barrel(110), a housing(120), an image sensor(130), a substrate unit and a rigid printed circuit board(RPCB,141). The lens barrel includes at least one lens. The housing is assembled so as to allow the lens barrel to be moved along the optical axis of the lens barrel. The image sensor includes an image forming region for imaging light entered through the lens. The substrate unit, that is a soft printed circuit board(140), has an image sensor mounting region(142) and an outside connection portion extended from the image sensor mounting region, wherein the image sensor mounting region is fixed to the lower end of the housing. The rigid printed circuit board is bonded to the image sensor and mounted in the upper surface of the image sensor mounting region.

Description

Camera Module Package {A CAMERA MODULE PACKAGE}

1 is an exploded perspective view of a camera module package according to the prior art.

2 is a longitudinal sectional view of a camera module package according to the prior art.

3 is an exploded perspective view of the camera module package according to the first embodiment of the present invention.

4A and 4B are longitudinal and cross-sectional views of a camera module package according to a first embodiment of the present invention.

5A to 5C are perspective views showing the assembling process of the camera module package according to the first embodiment of the present invention.

6 is an exploded perspective view of the camera module package according to the second embodiment of the present invention.

7A and 7B are longitudinal and cross-sectional views of a camera module package according to a second embodiment of the present invention.

<Code Description of Main Parts of Drawing>

110: lens barrel 113: cap

120 housing 122 protrusion

125: IR filter 130: image sensor

140: flexible printed circuit board 141: rigid printed circuit board

142: sensor mounting area 154: connector

The present invention relates to a camera module package, and more particularly, to a camera module package that can prevent the alignment between the housing and the substrate is misaligned during thermal curing of the adhesive applied between the housing and the substrate.

Various portable terminal manufacturers are currently developing and producing a portable terminal with a built-in camera module package, and the built-in camera module package included in the portable terminal has been developed in various forms according to components and packaging methods.

In general, the camera module package is mainly composed of Chip On Film (COF), Chip On Board (COB), and Chip Scale Package (CSP) types. And reducing manufacturing costs.

Among the above manufacturing methods, the COB package of the wire bonding method is similar to the existing semiconductor production line, and the productivity is high by other package methods, but additional space is required because the wire must be electrically connected between the image sensor and the substrate. The disadvantage is that the overall package size is limited and the number of circuits to be processed is limited.

Since the flip chip type COF package does not need a separate space for connecting both ends of the wires to the image sensor and the substrate, the package area can be reduced in size and the height of the barrel can be reduced. Since it is possible to shorten and use a thin film or a flexible printed circuit board (FPCB) as a substrate, it is possible to manufacture a package that is reliable against external impact, and the process has a relatively simple advantage. In addition, the package can meet the trend of high-speed processing, high density, and multi-pinning due to the reduction of the package and the reduction of the resistance.

1 is an exploded perspective view showing a typical camera module package, Figure 2 is a longitudinal sectional view of a typical camera module package.

1 and 2, a conventional camera module package includes a lens barrel 10 in which a lens is disposed in an inner space, and a male screw part 11 is formed at an outer surface thereof, and an incident part is formed at an upper end thereof. The cap 13 in which the ball 13a is formed is assembled.

At least one lens is installed in the lens barrel 11 according to the function and performance of the camera module package to be implemented.

The housing 20 to be assembled with the lens barrel 10 has an internal hole formed in the inner surface of the female screw portion 21 is screwed to the male screw portion 11, the inner hole is provided with light passing through the lens An IR filter 25 for filtering is provided.

Accordingly, the lens barrel 10 screwed to the housing 20 is movable in the optical axis direction by a driving source not shown with respect to the fixed housing 20.

An image sensor 30 having an image imaging area in which an image of an object passing through the lens is imaged is electrically connected to one end of the substrate 40, and the display means, which is not shown, is connected to the other end of the substrate 40. It has a connector 45 that is electrically connected.

In this case, when the image sensor 30 is flip-chip bonded to one end of the substrate 40, one end of the substrate 40 may have a window portion for exposing the image imaging area of the image sensor 30 to the outside ( 42) is apertured.

On the other hand, the image sensor 30 is electrically connected to one end of the substrate 40 is bonded through the adhesive applied to the lower end of the housing 20, the adhesive is an anisotropic conductive film ( ACF: anisotropic conductive film (ACF) is used, followed by a step of curing the adhesive at a high temperature in order to increase the adhesive strength of the adhesive used in the bonding process.

In this curing process, the alignment of the housing and the substrate is misaligned, and a flatness problem between the substrate and the housing occurs. In addition, when using the anisotropic conductive film has a problem that occurs (burr) phenomenon occurs.

In order to solve the above problems, an object of the present invention is to provide a camera module package that can be easily aligned between the housing and the substrate to prevent misalignment during the curing process.

The present invention provides an image sensor including a lens barrel including at least one lens, a housing in which the lens barrel is movably assembled in an optical axis direction, and an image imaging area for forming light incident through the lens. A sensor mounting area in which the image sensor is mounted and an external connection extending from the sensor mounting area, and a substrate part fixed to the lower end of the housing, and an edge of the housing at the bottom of the housing. It provides a camera module package, characterized in that the protrusion is formed corresponding to the outer portion.

Preferably, the protrusion may be open at one side from the sensor mounting area toward the external connection portion.

The protrusion may be formed at the same height as the thickness of the substrate.

Preferably, the substrate portion may be a flexible printed circuit board (FPCB), in which case the camera module package is rigidly mounted on the upper surface of the sensor mounting area in which the image sensor is wire bonded. The printed circuit board may further include a rigid printed circuit board (RPCB).

In the camera module package, the image sensor may be flip-chip bonded to a bottom surface of the sensor mounting area of the substrate, and in this case, the image mounting area of the flip chip bonded image sensor may be upward. Preferably, the opening is formed to be exposed.

Hereinafter, the present invention will be described in detail with reference to the drawings.

3 is an exploded perspective view showing a first embodiment of a camera module package according to the present invention, and FIGS. 4A and 4B are longitudinal and cross-sectional views showing a first embodiment of a camera module package according to the present invention.

As shown in FIGS. 3 and 4, the camera module package 100 of the present invention includes a lens barrel 110, a housing 120, an image sensor 130, and a substrate unit 140.

The lens barrel 110 is a hollow lens-shaped lens accommodating part having at least one lens arranged along an optical axis and having a predetermined internal space.

A plurality of lenses disposed in the lens barrel 110 may include at least one spacer to maintain a predetermined size gap between the other lenses.

A male screw portion 111 is formed on an outer surface of the lens barrel 110, and an entrance hole 113a is formed at the front end of the lens barrel 110 to fix the position of the lens accommodated in the lens barrel 110. 113) is assembled.

In addition, the housing 120 has a barrel accommodating part in which the lens barrel 110 is accommodated internally by forming a female screw part 121 screwed to the male screw part 111 of the lens barrel 110 on the inner circumferential surface of the inner hole. to be.

Accordingly, the lens barrel 110 may be moved together with the lens L in the optical axis direction with respect to the housing 120 fixed by the screw coupling between the male screw portion 111 and the female screw portion 121. .

The housing 120 has an inner step protruding inwardly on an inner surface, and the inner step is provided with an adhesive bonding IR filter 125 for filtering infrared light of the light passing through the lens (L).

The IR filter 125 may be attached to the lower end of the lens barrel 110 screwed to the housing 120.

The image sensor 130 has an image imaging region on an upper surface thereof so as to form light incident through the lens L provided in the lens barrel 110, and at one end of the substrate 140. It is an imaging device mounted.

The image sensor 130 is electrically mounted on the printed circuit board 141 mounted on the upper surface of one end of the substrate unit 140 via a plurality of metal wires 135.

The plurality of connection pads exposed on the upper surface of the image sensor 130 are wire bonded to the upper end of the metal wire 135, and the lower end of the metal wire 135 is attached to the upper surface of the printed circuit board 141. Wire bonding is performed with the exposed connection terminals.

Accordingly, the image sensor 130 wire-bonded to the upper surface of one end of the substrate unit 140 is disposed in the inner space of the housing 120 when the housing 120 and the substrate unit 140 are bonded to each other.

The substrate unit 140 has a sensor mounting area 142 in which the image sensor 130 is mounted at one end thereof, and an external connection unit for connecting to an external circuit at the other end thereof. A rigid printed circuit board (RPCB) 141 on which the image sensor 130 is wire-bonded is mounted in the sensor mounting area 142.

The substrate unit 140 may be a flexible printed circuit board (FPCB).

The external connection part of the substrate unit 140 is provided with a contactor 145 to be electrically connected to the main substrate (not shown) to transmit and receive various signals.

The substrate unit 140 may include at least one passive element such as a capacitor and a resistor in order to reduce electrical noise on the upper surface.

On the other hand, the lower end of the housing 120 is formed with a protrusion 122 corresponding to the outer portion of the sensor mounting area 142 of the substrate portion.

As shown in FIGS. 4A and 4B, one side of the protrusion 122 is open toward the external connection part in the sensor mounting area 142 of the substrate part. That is, the protrusion 122 is formed to surround three surfaces of the sensor mounting region 142.

The protrusion 122 is formed by adding the thicknesses of the rigid printed circuit board 141 mounted on the sensor mounting area 142 and the sensor mounting area 142 so that the sensor mounting area 142 is not exposed to the outside. It is formed at the same height as the height.

In order to bond the sensor mounting area 142 of the housing 120 and the substrate unit 140, an anisotropic conductive film (ACF) is attached to an interface between the housing 120 and the sensor mounting area 142. The thermal compression process is performed. In the thermocompression bonding process, the housing 120 and the sensor mounting region 142 are bonded by the anisotropic conductive film (ACF).

In this embodiment, since the rigid printed circuit board 141 is mounted on the sensor mounting region 142, the anisotropic conductive film is formed at the interface between the rigid printed circuit board 141 and the lower end of the housing 120. Attach (ACF).

By forming the protrusion 122 at the bottom of the housing 120, the sensor mounting area 142 of the substrate portion is fixed to the bottom of the housing 120, the housing 120 and the sensor during the thermocompression bonding process The alignment of the mounting area 142 can be prevented from being misaligned.

A side fill may be performed to fill a space between the protrusion 122 formed at the bottom of the housing 120 and the outer portion of the sensor mounting region 142 using an epoxy-based sealant. In this case, it is possible to fundamentally prevent foreign substances from entering the interior of the housing 120 and contaminating the image sensor through the space between the housing 120 and the substrate.

5A to 5C are perspective views showing the steps of assembling the camera module package according to the first embodiment of the present invention.

5A is a bottom view of the housing 120 in which the protrusion 122 is formed at the lower end. One side of the protrusion is open.

FIG. 5B illustrates a rigid printed circuit board 141 in which an image sensor is wire-bonded to a lower end of the housing 120 to be seated and fixed.

The rigid printed circuit board 141 may be seated in accordance with a hole formed in the housing 120. In order to facilitate mounting of the rigid printed circuit board 141, holes may be formed in the rigid printed circuit board 141 in advance.

5C illustrates a step of seating one end 142 of the flexible printed circuit board 140 on which the rigid printed circuit board 141 may be mounted in the protrusion 122 of the housing 120. The one end becomes the sensor mounting area 142.

The sensor mounting area 142 of the flexible printed circuit board 140 is seated and fixed in the protrusion 122 formed at the lower end of the housing 120, thereby preventing the alignment of the substrate and the housing during the thermocompression bonding process. .

When the height of the protrusion 122 is formed at the height of the sensor mounting area 142 of the flexible printed circuit board 140, the sensor mounting area 142 directly contacts the housing 120, thereby providing flexibility. An anisotropic conductive film (ACF) may be attached to the sensor mounting region 142 of the printed circuit board 140 to perform a thermocompression bonding process.

In the present exemplary embodiment, the protrusion 122 is formed to have the same height as the height of the sum of the thicknesses of the sensor mounting area 142 and the rigid printed circuit board 141, thereby providing the rigid printed circuit board 141 and the sensor mounting area. 142 is located inside the housing 120.

6 is an exploded perspective view of a camera module package according to a second embodiment of the present invention, and FIGS. 7A and 7B are longitudinal cross-sectional and cross sectional views of the camera module package according to the second embodiment of the present invention.

As described above with reference to FIGS. 3 and 4, the camera module package 200 according to the present exemplary embodiment includes a lens barrel 210, a housing 220, an image sensor 230, and a substrate unit 240.

The substrate part 240 is a flexible printed circuit board (FBCB) provided at one end thereof to a sensor mounting area 242 in which the image sensor 230 is flip chip bonded, and the other end is connected to an external circuit. External connection. In the sensor mounting area 242 to which the image sensor 230 is flip chip bonded, an opening is formed to expose the image image forming area of the image sensor 230 upward.

A plurality of connection terminals are provided on a lower surface of the sensor mounting area 242 of the substrate unit 240, and a connection pad is provided on an upper surface of the image sensor 230 corresponding to the connection terminal. The connection terminal of the sensor mounting area 242 of 240 may flip chip bond the image sensor 230 via bumps mounted on the connection pad.

Such a connection terminal is preferably provided with a tin or tin alloy-based plating material so as to be connected to the connection pad by a thermal compression method or an ultrasonic bonding method through the bump.

Accordingly, the image sensor 230 flip-chip bonded to the bottom surface of the sensor mounting area 242 is exposed to the bottom of the substrate when the housing 220 and the substrate unit 240 are bonded to each other.

The substrate unit 240 may include at least one passive element such as a capacitor and a resistor in order to reduce electrical noise on the upper surface.

In the present exemplary embodiment, the protrusion formed at the lower end of the housing 220 is formed at the same height as the height of the sum of the heights of the sensor mounting area 242 and the image sensor 230 exposed to the lower side, so that the sensor The mounting area 242 and the image sensor 230 are located inside the housing 220.

As such, the present invention is not limited by the above-described embodiment and the accompanying drawings. That is, the shape of the substrate, the shape of the protrusion formed on the housing, and the like may be variously implemented. It is intended that the scope of the invention be defined by the appended claims, and that various forms of substitution, modification, and alteration are possible without departing from the spirit of the invention as set forth in the claims. Will be self-explanatory.

According to the present invention, when the substrate and the housing on which the image sensor is mounted are bonded to the housing when the camera module package is manufactured, the substrate may be seated in the protrusion formed on the lower surface of the housing, thereby preventing misalignment during the thermocompression bonding process. When the film (ACF) is used as an adhesive, it is possible to prevent poor flatness and burr phenomenon, and to obtain a camera module package with improved stripping force.

Claims (7)

A lens barrel having at least one lens; A housing in which the lens barrel is assembled to be movable in the optical axis direction; An image sensor having an image forming region for forming light incident through the lens; A substrate portion including a sensor mounting region on which the image sensor is mounted and an external connection portion extending from the sensor mounting region, and a flexible circuit board on which the sensor mounting region is fixed to a lower end of the housing; And A rigid printed circuit board (RPCB) in which the image sensor is wire bonded and mounted on an upper surface of the sensor mounting area. Including; Camera frame package, characterized in that the protrusion formed in the lower edge of the housing corresponding to the outer portion of the sensor mounting area. The method of claim 1, The protrusion, The camera module package, characterized in that one side is opened from the sensor mounting area toward the external connection portion. The method of claim 1, The protrusion, Camera module package, characterized in that formed in the same height as the thickness of the substrate portion. delete delete The method of claim 1, The camera module package, characterized in that the image sensor is flip-chip bonded to the lower surface of the sensor mounting area of the substrate portion. The method of claim 6, Sensor mounting area of the substrate portion, And an opening formed to expose the image imaging region of the flip chip bonded image sensor to an upper portion thereof.

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