US20200395543A1 - Ink droplet volume measuring apparatus and ink droplet volume measuring method using the same, and thin film layer forming apparatus using the measuring apparatus, and manufacturing method of display apparatus using the thin film layer forming apparatus - Google Patents

Ink droplet volume measuring apparatus and ink droplet volume measuring method using the same, and thin film layer forming apparatus using the measuring apparatus, and manufacturing method of display apparatus using the thin film layer forming apparatus Download PDF

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US20200395543A1
US20200395543A1 US16/794,102 US202016794102A US2020395543A1 US 20200395543 A1 US20200395543 A1 US 20200395543A1 US 202016794102 A US202016794102 A US 202016794102A US 2020395543 A1 US2020395543 A1 US 2020395543A1
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Prior art keywords
ink droplet
substrate
ink
film layer
quantum dot
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US16/794,102
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English (en)
Inventor
Jeongwon HAN
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Samsung Display Co Ltd
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Samsung Display Co Ltd
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Assigned to SAMSUNG DISPLAY CO., LTD. reassignment SAMSUNG DISPLAY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HAN, JEONGWON
Publication of US20200395543A1 publication Critical patent/US20200395543A1/en
Abandoned legal-status Critical Current

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    • H01L51/0005—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/082—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to a condition of the discharged jet or spray, e.g. to jet shape, spray pattern or droplet size
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04535—Control methods or devices therefor, e.g. driver circuits, control circuits involving calculation of drop size, weight or volume
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/0456—Control methods or devices therefor, e.g. driver circuits, control circuits detecting drop size, volume or weight
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04593—Dot-size modulation by changing the size of the drop
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/026—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/28—Measuring arrangements characterised by the use of optical techniques for measuring areas
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
    • G01F23/28—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring the variations of parameters of electromagnetic or acoustic waves applied directly to the liquid or fluent solid material
    • G01F23/284—Electromagnetic waves
    • G01F23/292—Light, e.g. infrared or ultraviolet
    • H01L51/502—
    • H01L51/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/03—Specific materials used
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/50—Using chromatic effects to achieve wavelength-dependent depth resolution
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H10K50/115—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers comprising active inorganic nanostructures, e.g. luminescent quantum dots
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/70—Testing, e.g. accelerated lifetime tests

Definitions

  • Exemplary embodiments of the invention relate generally to an ink droplet volume measuring apparatus, a method of measuring an ink droplet volume by using the ink droplet volume measuring apparatus, a thin-film layer forming apparatus using the ink droplet volume measuring apparatus, and a method of manufacturing a display apparatus by using the thin-film layer forming apparatus.
  • each pixel comprises an organic light-emitting device generating single-colored light such as white or blue, and a quantum dot thin-film layer and a color filter as light-blocking units for converting the single-colored light into a desired color from among red, green, and blue and emit the converted light.
  • the organic light-emitting device of each pixel when the organic light-emitting device of each pixel generates a single-colored light, the single-colored light passing through the quantum dot thin-film layer and the color filer is converted into one color from among red, green, and blue and then is emitted.
  • An image of a desired color is realized by utilizing various combinations of colors of light emitted in appropriate colors.
  • a quantum dot thin-film layer is formed by dropping an ink droplet from an inkjet printer.
  • an ink droplet that is excessively large may get out of an appropriate position and form a stain, when the ink droplet is too small, the quantum dot thin-film layer may not properly function as a light-blocking unit.
  • Exemplary embodiments of the invention provide an ink droplet volume measuring apparatus, which is improved to more precisely measure the volume of the actual ink droplet and reflect the volume to be used in control, a method of measuring a volume of the ink droplet, a thin-film layer forming apparatus using the ink droplet volume measuring apparatus, and a method of manufacturing the display apparatus using the thin-film layer forming apparatus.
  • a plurality of the ink droplets may be dropped on the substrate.
  • the chromatic confocal sensor may scan the plurality of ink droplets, and the controller may calculate a three-dimensional shape for each of the plurality of droplets.
  • the ink droplet may include nanoparticles.
  • the ink may include ink for forming a quantum dot thin-film layer.
  • a thin-film layer forming apparatus including: an inkjet head including a nozzle dropping an ink droplet; a substrate on which the ink droplet is dropped; a chromatic confocal sensor irradiating light having a plurality of wavelengths to the ink droplet dropped on the substrate and scanning the ink droplet; and a controller feedback-controlling an ejection amount of the nozzle of the inkjet head by calculating the three-dimensional shape of the ink droplet from a signal scanned by the chromatic confocal sensor.
  • a plurality of the nozzles may be provided to drop a plurality of ink droplets on the substrate.
  • the chromatic confocal sensor may scan the plurality of ink droplets, and the controller may calculate a three-dimensional shape for each of the plurality of ink droplets to feedback-control the ejection amount of each of the plurality of nozzles.
  • the ink droplet may include nanoparticles.
  • the ink may include ink for forming a quantum dot thin-film layer.
  • Another exemplary embodiment of the invention provides a method of measuring a volume of an ink droplet including: dropping an ink droplet on a substrate; irradiating light having a plurality of wavelengths by a chromatic confocal sensor to the ink droplet dropped on the substrate and scanning the ink droplet; and calculating a three-dimensional shape of the ink droplet from a signal scanned by the chromatic confocal sensor.
  • a plurality of the ink droplets may be dropped on the substrate.
  • the chromatic confocal sensor may scan the plurality of ink droplets to calculate a three-dimensional shape for each of the plurality of ink droplets.
  • the ink droplet may include nanoparticles.
  • the ink may include ink for forming a quantum dot thin-film layer.
  • Another exemplary embodiment provides a method of manufacturing a display apparatus including forming a plurality of light-emitting devices on a first substrate, forming a plurality of quantum dot thin-film layers on a second substrate, and sealing the first substrate and the second substrate such that the plurality of emission devices and the plurality of quantum dot thin-film layers correspond to each other.
  • the forming of the quantum dot thin-film layers includes: dropping an ink droplet for forming the quantum dot thin-film layer on a test substrate by using a nozzle of an inkjet head; scanning and irradiating light having a plurality of wavelengths by a chromatic confocal sensor on the ink droplet dropped on the test substrate; obtaining a three-dimensional shape of the ink droplet from a signal scanned by the chromatic confocal sensor to feedback-control an ejection amount of the nozzle; and dropping the feedback-controlled ink droplet on the second substrate to be the quantum dot thin-film layer.
  • a plurality of the nozzle may be provided to drop a plurality of ink droplets on the test substrate.
  • the chromatic confocal sensor may scan the plurality of ink droplets to calculate a three-dimensional shape for each of the plurality of ink droplets and feedback-control an ejection amount of each of the plurality of nozzles.
  • the ink droplet may include nanoparticles.
  • the second substrate and the test substrate may be respectively mounted on different stages.
  • FIG. 1 is a schematic cross-sectional view of a configuration of a thin film layer forming apparatus including an ink droplet volume measuring apparatus according to an exemplary embodiment of the invention.
  • FIG. 2 and FIG. 3 are respectively a side view and a top-plan view showing a volume measuring principle of the ink droplet volume measuring apparatus shown in FIG. 1 .
  • FIG. 4 is a cross-sectional view of a display apparatus that is manufactured by using the thin film layer forming apparatus shown in FIG. 1 .
  • FIGS. 5A, 5B, 5C, 5D, and 5E are cross-sectional views sequentially showing a process of manufacturing the display apparatus shown in FIG. 4 .
  • the illustrated exemplary embodiments are to be understood as providing exemplary features of varying detail of some ways in which the inventive concepts may be implemented in practice. Therefore, unless otherwise specified, the features, components, modules, layers, films, panels, regions, and/or aspects, etc. (hereinafter individually or collectively referred to as “elements”), of the various embodiments may be otherwise combined, separated, interchanged, and/or rearranged without departing from the inventive concepts.
  • an element such as a layer
  • it may be directly on, connected to, or coupled to the other element or layer or intervening elements or layers may be present.
  • an element or layer is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element or layer, there are no intervening elements or layers present.
  • the term “connected” may refer to physical, electrical, and/or fluid connection, with or without intervening elements.
  • the D1-axis, the D2-axis, and the D3-axis are not limited to three axes of a rectangular coordinate system, such as the x, y, and z-axes, and may be interpreted in a broader sense.
  • the D1-axis, the D2-axis, and the D3-axis may be perpendicular to one another, or may represent different directions that are not perpendicular to one another.
  • Spatially relative terms such as “beneath,” “below,” “under,” “lower,” “above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), and the like, may be used herein for descriptive purposes, and, thereby, to describe one elements relationship to another element(s) as illustrated in the drawings.
  • Spatially relative terms are intended to encompass different orientations of an apparatus in use, operation, and/or manufacture in addition to the orientation depicted in the drawings. For example, if the apparatus in the drawings is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features.
  • the exemplary term “below” can encompass both an orientation of above and below.
  • the apparatus may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and, as such, the spatially relative descriptors used herein interpreted accordingly.
  • exemplary embodiments are described herein with reference to sectional and/or exploded illustrations that are schematic illustrations of idealized exemplary embodiments and/or intermediate structures. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, exemplary embodiments disclosed herein should not necessarily be construed as limited to the particular illustrated shapes of regions, but are to include deviations in shapes that result from, for instance, manufacturing. In this manner, regions illustrated in the drawings may be schematic in nature and the shapes of these regions may not reflect actual shapes of regions of a device and, as such, are not necessarily intended to be limiting.
  • each block, unit, and/or module may be implemented by dedicated hardware, or as a combination of dedicated hardware to perform some functions and a processor (e.g., one or more programmed microprocessors and associated circuitry) to perform other functions.
  • a processor e.g., one or more programmed microprocessors and associated circuitry
  • each block, unit, and/or module of some exemplary embodiments may be physically separated into two or more interacting and discrete blocks, units, and/or modules without departing from the scope of the inventive concepts.
  • the blocks, units, and/or modules of some exemplary embodiments may be physically combined into more complex blocks, units, and/or modules without departing from the scope of the inventive concepts.
  • FIG. 1 is a schematic cross-sectional view of a configuration of a thin film layer forming apparatus including an ink droplet volume measuring apparatus according to an exemplary embodiment.
  • the ink droplet volume measuring device includes: a test substrate 10 on an auxiliary stage 31 ; a chromatic confocal sensor 40 that measures a volume of an ink droplet that is dropped from a nozzle 51 of an inkjet head 50 to the test substrate 10 ; and a controller 60 that compares a value measured by the chromatic confocal sensor 40 with a reference value to feedback-control an ink ejection amount of the inkjet head 50 .
  • a thin film layer forming operation is actually performed on a subject substrate 20 on a main stage 30 , and the ink droplet volume measuring apparatus, before actually performing the thin film layer forming operation on the subject substrate 20 , first measures, on the test substrate 10 , whether an appropriate amount of ink droplets are dropped from a plurality of nozzles 51 of the inkjet head 50 , and adjusts each of the nozzles to have an appropriate ejection amount.
  • the thin film layer forming apparatus in addition to the ink droplet volume measuring apparatus, further includes the main stage 30 on which the subject substrate 20 is placed, the inkjet head 50 including the plurality of nozzles 51 that drop ink droplets, and the like.
  • FIG. 1 shows a structure in which the inkjet head 50 has two nozzles 51 , but the structure is merely an example, and more than the two illustrated nozzles 51 may be arranged in a plurality of rows.
  • an ink droplet is dropped on the test substrate 10 by the nozzle 51 of the inkjet head 50 , a volume of the ink droplet is measured by the ink droplet volume measuring apparatus, the controller 60 feedback-controls and adjusts an ejection amount of each nozzle 51 to drop an ink droplet of a desired volume.
  • the thin film layer forming operation is actually performed on the subject substrate 20 of the main stage 30 by the nozzle 51 of the inkjet head 50 . Accordingly, the thin film layer is formed on the subject substrate 20 by using the inkjet head 50 , which is set in advance to drop an ink droplet having an accurate volume, and a fine thin film layer may be formed.
  • the fine thin film layer may be formed only when the ink droplet volume measuring apparatus accurately measures a volume of an ink droplet.
  • the ink droplet volume measuring apparatus accurately measures a volume of an ink droplet.
  • the estimated value is calculated based on the assumption that the ink droplet is a hemisphere, but the actual ink droplet is not a perfect hemisphere and may be a shape having a dent spot. Therefore, the difference between the estimated value and the actual volume of the ink droplet further increases.
  • a volume of an ink droplet is measured by using the chromatic confocal sensor 40 , as described above.
  • FIGS. 2 and 3 are respectively a side view and a plan view schematically showing a principle of measuring a volume of an ink droplet 1 by using the chromatic confocal sensor 40 .
  • the chromatic confocal sensor 40 irradiates light L onto the ink droplet 1 and receives reflected light to identify a position of a surface.
  • the chromatic confocal sensor 40 does not irradiate light of a single wavelength but instead simultaneously irradiates light having a plurality of wavelengths L 1 , L 2 , and L 3 .
  • L 1 , L 2 , and L 3 a case in which the light has three wavelengths L 1 , L 2 , and L 3 are shown to provide a brief example, but light having a greater number of wavelengths may be simultaneously irradiated.
  • reflected light of light of a wavelength which is accurately focused on the surface of the ink droplet 1 is received, and a distance from the test substrate 10 to the surface of the ink droplet 1 , that is, a position in the Z direction, may be identified.
  • Volume measurement values of the ink droplets obtained by this method is transmitted to the controller 60 , and the controller 60 compares the values with a reference value, increases or decreases an ejection amount from each nozzle 51 , and feedback-controls such that each of the nozzles 51 ejects an ink droplet 1 having an appropriate volume.
  • the feedback-control operation may be performed one or more times until the ink droplets 1 each have an appropriate volume.
  • a thin-film layer is formed by adjusting the ejection amount of each nozzle 51 based on accurate volume measurement values of the ink droplets 1 , and thus, a thin-film layer, such as a quantum dot thin-film layer, may be very uniformly formed in a desired thickness.
  • FIG. 4 is a cross-sectional view of the display apparatus having the quantum dot thin-film layer. Although FIG. 4 only shows only one set of red, green, and blue pixels, it may be understood that an actual product of the inventive concepts includes a plurality of sets of the red, green, and blue pixels.
  • the structure of the display apparatus includes a first substrate 110 , on which an organic light-emitting device 120 is arranged, a second substrate 210 , on which quantum dot thin-film layers 230 R and 230 G and color filters 220 R, 220 G, and 220 W as light-blocking units are arranged.
  • the first substrate 110 and the second substrate 210 are sealed together with a filler 300 therebetween.
  • the inorganic film may include silicon oxide, silicon nitride, and/or silicon oxynitride
  • the organic film may include polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, hexamethyldisiloxane, an acryl-based resin (for example, polymethyl methacrylate, polyacrylic acid, and the like), or an arbitrary combination thereof.
  • the light-blocking unit includes the quantum dot thin-film layers 230 R and 230 G and the color filters 220 R, 220 G, and 220 W.
  • the quantum dot thin-film layers 230 R and 230 G convert the blue light generated from the organic light-emitting diode 120 into a desired color, such as red or green, and the color filter layers 220 R, 220 G, and 220 W filter stray light that may be partially mixed in the converted color to enhance color purity.
  • the red pixel and the green pixel include all of the quantum dot thin-film layers 230 R and 230 G and the color filters 220 R and 220 G, and on the contrary, the blue pixel only includes a white color filter layer 220 W, for the light generated from the organic light-emitting diode 120 is blue light.
  • the blue pixel since the blue pixel does not have to change the color of light and only transmits the light, the blue pixel only includes the white color filter layer 220 W for filtering the stray light.
  • the filler 300 is between the first substrate 110 and the second substrate 210 .
  • the filler 300 functions as a gap maintenance unit for maintaining an appropriate gap between the first substrate 110 and the second substrate 210 and also functions as a bonding material. Accordingly, by applying the filler 300 between the first substrate 110 and the second substrate 210 and bonding the first substrate 110 and the second substrate 210 together, the filler 300 appropriately maintains the gap between the first substrate 110 and the second substrate 210 and firmly bonds the first substrate 110 and the second substrate 210 to each other.
  • the quantum dot thin-film layers 230 R and 230 G may be formed by dropping ink droplets by using the inkjet head.
  • Quantum dots or cores which are light color conversion particles included in the ink for forming the quantum dot thin film layers 230 R and 230 G, may be selected from a Group II-VI compound, a Group III-V compound, a Group IV-VI compound, a Group IV element, a Group IV compound, and a combination thereof.
  • a Group II-VI compound may be selected from among: a two-element compound selected from among CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, MgS, and a combination thereof; a three-element compound selected from among AgInS, CuInS, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe, MgZnS, and a combination thereof; and a four-element compound selected from among HgZnTes, CdZnS
  • a Group III-V compound may be selected from among: a two-element compound selected from among GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, InSb, and a combination thereof; a three-element compound selected from among GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AINAs, AlNSb, AlPAs, AlPSb, InGaP, InNP, InNAs, InNSb, InPAs, InPSb, GaAlNP, and a combination thereof; and a four-element compound selected from among GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, InAlPSb, and a combination thereof.
  • a Group IV-VI compound may be selected from among: a two-element compound selected from among SnS, SnSe, SnTe, PbS, PbSe, PbTe, and a combination thereof; a three-element compound selected from among SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe, and a combination thereof; and a four-element compound selected from among SnPbSSe, SnPbSeTe, SnPbSTe, and a combination thereof.
  • a Group IV element may be selected from among Si, Ge, and a combination thereof.
  • a Group IV compound may include a two-element compound selected from among SiC, SiGe, and a combination thereof.
  • the two-element compound, the third-element compound, and the four-element compound may be included in particles in uniform concentrations, or be in a the same particle in a state of being partially divided according to different concentrations.
  • the quantum dot may also have a core-shell structure in which a quantum dot surrounds another quantum dot.
  • An interface between the core and the shell may have a concentration gradient in which a concentration of an element in the shell decreases toward a center.
  • the quantum dot may have a core-shell structure including a core, which includes nanocrystals, and a shell that surrounds the core.
  • the shell of the quantum dot may function as a protective layer for preventing chemical change of the core and maintain properties of the semiconductor and/or a charging layer for giving an electrophoretic property to the quantum dot.
  • the shell may include a single layer or multiple layers.
  • An interface between the core and the shell may have a concentration gradient in which a concentration of an element in the shell decreases toward a center.
  • the shell in the quantum dot may include, for example, an oxide of a metal or non-metal, a semiconductor compound, or a combination thereof.
  • the oxide of metal or non-metal may include a two-element compound, such as SiO 2 , Al 2 O 3 , TiO 2 , ZnO, MnO, Mn 2 O 3 , Mn 3 O 4 , CuO, FeO, Fe 2 O 3 , Fe 3 O 4 , CoO, Co 3 O 4 , NiO, or a three-element compound such as MgAl 2 O 4 , CoFe 2 O 4 , NiFe 2 O 4 , or CoMn 2 O 4 , but the inventive concepts are not limited thereto.
  • a two-element compound such as SiO 2 , Al 2 O 3 , TiO 2 , ZnO, MnO, Mn 2 O 3 , Mn 3 O 4 , CuO, FeO, Fe 2 O 3 , Fe 3 O 4 , CoO, Co 3 O 4 , NiO, or a three-element compound such as MgAl 2 O 4 , CoFe 2 O 4 , NiFe 2 O
  • the semiconductor compound may include, for example, Cds, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnSeS, ZnTeS, GaAs, GaP, GaSb, HgS, HgSe, HgTe, InAs, InP, InGaP, InSb, AlAs, AlP, AlSb, and the like, but the inventive concepts are not related thereto.
  • the quantum dot may have a full width of half maximum (FWHM) of about 45 nm or less, preferably about 40 nm or less, more preferably about 30 nm or less, and color purity or color gamut may be enhanced in the above-mentioned range.
  • FWHM full width of half maximum
  • a field angle of light may widen.
  • the shape of a quantum dot is commonly used in the technical field and is not particularly limited.
  • the shape of a quantum dot may include a sphere, a pyramid shape, a multi-arm shape or a cubic-shape nano particle, nano tube, nano wire, nano fabric, nano laminar particle, and the like.
  • the quantum dot may adjust the color of emitted light according to sizes of particles, and therefore, the quantum dot may have various emission colors, such as blue, red, and green.
  • the ink for forming the quantum dot thin-film layers 230 R and 230 G may contain nanoparticles, and the light irradiated from the chromatic confocal sensor 40 may be partially scattered due to the nanoparticles.
  • the chromatic confocal sensor 40 irradiates the light having various wavelengths L 1 , L 2 , and L 3 . Therefore, the scattering has a very small influence. In other words, light having a single wavelength, such as laser light, may have a great measurement error when the light is scattered due to nanoparticles.
  • the chromatic confocal sensor 40 irradiates the light having the various wavelengths L 1 , L 2 , and L 3 and measures the reflected light, the influence of the scattering breaks up and the scattering has a minimal influence on the measurement.
  • the display apparatus including the quantum dot thin-film layers 230 R and 230 G having the above-mentioned structure, may be manufactured in a process as shown in FIGS. 5A through 5E .
  • the organic light-emitting diodes 120 are formed on the first substrate 110 and covered by the thin-film encapsulation layer 130 .
  • the black matrix 250 and the color filter layers 220 R, 220 G, and 220 W are respectively formed on the second substrate 210 in a photolithography process.
  • the color filter layers 220 R, 220 G, and 220 W are formed to respectively correspond to the organic light-emitting diodes 120 .
  • the bank 240 is formed to build a boundary between the pixels, as shown in FIG. 5C .
  • the bank 240 may include a complex polymer, perfluoro polyether (PFPE), acryl, silicon, epoxy, or the like.
  • PFPE perfluoro polyether
  • the quantum dot thin-film layers 230 R and 230 G are selectively formed only in the red pixel and the green pixel except the blue pixel.
  • the quantum dot thin-film layers 230 R and 230 G are formed at positions to respectively overlap the color filter layers 220 R and 220 G.
  • the nozzles 51 of the inkjet head 50 drop ink droplets 1 at positions respectively overlapping the color filters 220 R and 220 G to form the quantum dot thin-film layers 230 R and 230 G.
  • the target substrate 20 described with reference to FIG. 1 is the second substrate 210 including the color filters 220 R and 220 G when manufacturing the display apparatus.
  • the second substrate 210 is mounted on the main stage 30 , a volume of the ink droplet 1 dropped on the test substrate 10 is measured by using the ink droplet volume measuring apparatus to adjust an ejection amount of each nozzle 51 , and ink droplets 1 having accurate volumes are dropped on the second substrate 210 to form the quantum dot thin-film layers 230 R and 230 G. Accordingly, the quantum dot thin-film layers 230 R and 230 G having very uniform thicknesses may be formed.
  • the filler 300 is applied between the first substrate 110 and the second substrate 210 , and the first substrate 110 and the second substrate 210 are bonded to each other.
  • the display apparatus in which the organic light-emitting device 120 , the quantum dot thin-film layers 230 R and 230 G, and the color filter layers 220 R, 220 G, and 220 W are realized.
  • the present exemplary embodiment shows a case in which the organic light-emitting diode 120 and the organic emission layer 123 are each formed as a common layer over an entire pixel area, but the organic light-emitting diode 120 and the organic emission layer 123 may be separately formed for each pixel. That is, the organic emission layer 123 may be formed as a common layer or separately formed for each pixel.
  • a volume of an actual ink droplet may be more precisely measured, feedback-control may be precisely performed, and therefore, stable quality and high productivity may be secured.

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US16/794,102 2019-06-17 2020-02-18 Ink droplet volume measuring apparatus and ink droplet volume measuring method using the same, and thin film layer forming apparatus using the measuring apparatus, and manufacturing method of display apparatus using the thin film layer forming apparatus Abandoned US20200395543A1 (en)

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